JP2005164788A - Resonance label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-sized resonance label utilizing a metal oxide film without needing an inactivation using the physical dielectric breakdown of a dielectric layer, and to provide its manufacturing method. <P>SOLUTION: In the manufacturing method, a non-dielectric breakdown type IC loading label in which a resonance circuit is formed by making a circuit formed of a metal confront with a circuit formed by conductive ink or pattern evaporation through a metal oxide film, and the resonance label in which a circuit is formed on an oxide face whose one face is oxidized by conductive ink or pattern evaporation, a pattern of the circuit is pitch-adjusted with a pattern on an anode oxide face by etching resist and is printed on an opposite face, an insulating reinforcement film is laminated in an oxide face side, is etched, etching resist is removed and IC is loaded are manufactured. The resonance label can be used in a small electronic alarm system which is inactivated not by the physical dielectric breakdown of the dielectric layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a non-breakdown type IC mounted resonance label used in an electronic alarm system.

  Conventionally, a resonance label using a resonance circuit has been used as a resonance label (security tag) for electronic merchandise management. The resonance label includes a capacitor formed by electrodes on both sides of an organic insulating dielectric layer such as polyethylene and polypropylene, and a coil formed on one side or both sides of the organic insulating dielectric layer. The resonance label is usually used by being affixed to an article, and resonates with an electromagnetic wave or the like having a specific resonance frequency when passing through a monitoring device installed at a store outlet or the like. The monitoring device generates an alarm by detecting the absorption of electromagnetic waves accompanying the resonance. When it is taken out through regular procedures such as purchase, it is common to inactivate the dielectric layer by physically breaking the dielectric layer with a dedicated device so that the monitoring device does not issue an alarm and changing the resonance frequency to deactivate it It is.

  Since these resonance labels are usually used by being affixed to articles, it is preferable that they are small. In particular, in application to precision devices such as watches, memory cards, mobile phones, and small and expensive products such as jewelry and cosmetics, there is a need for smaller resonant labels than ever before.

As means for realizing a small resonance label, a method using a metal oxide film as an insulating dielectric layer is already known (Patent Documents 1 and 2). However, these methods have a disadvantage that dielectric breakdown of the dielectric layer for deactivation is difficult to occur. Patent Document 2 states that since the anodic oxide film is thin, it can be easily physically deactivated by destruction of the oxide film. However, for example, even if the insulating dielectric layer is an alumite sulfate film having a thickness of 1 μm and a relative dielectric constant of 10, a voltage of several tens of volts is required for dielectric breakdown, and an electrostatic capacitance of 1 nF is assumed to satisfy the resonance frequency of 13.56 MHz. Assuming a resonance label composed of a capacitor having a capacitance and a coil having an inductance of 5.4 μH, heat of several tens of watts is generated at the time of dielectric breakdown. Since the heat capacity of a small resonant label using an anodized film is about 0.001 J / K, even if the time required for destruction is 1/10000 second, it is locally heated to several tens of degrees C. There are cases.
Japanese Patent Laid-Open No. 2-166594 JP-A-8-225824

  An object of the present invention is to provide a small-sized resonant label using a metal oxide film and a method for manufacturing the same, which does not require the deactivation of the physical dielectric layer by dielectric breakdown as described above. .

The present inventor has arrived at the present invention by conceiving that in a small-sized resonant label using a metal oxide film, the resonant label is deactivated without using physical breakdown by using an IC. .
That is, the present invention is as follows.
1. Non-breakdown type IC mounted resonance label in which a resonance circuit is formed by at least partly facing a circuit formed of the metal and a circuit formed of conductive ink or pattern vapor deposition through a metal oxide film ,
2. The circuit formed of the metal and the circuit formed of conductive ink or pattern deposition, one of the resonance labels according to the item 1, wherein at least one is composed of a dielectric coil and a capacitor electrode, and the other is composed of at least a facing capacitor electrode.
3. A circuit is formed on the oxidized surface of a metal foil that has been oxidized on one side by conductive ink or pattern vapor deposition, and the circuit pattern is printed on the opposite side by pitch-registration with the pattern of the oxidized surface using an etching resist. The method for producing a resonant label according to 1 or 2 above, wherein the reinforcing film is laminated, then etched, the etching resist is removed, and an IC is mounted.
4). A circuit is formed on the oxidized surface of a metal foil that has been oxidized on one side by conductive ink or pattern vapor deposition, and the circuit pattern is printed on the opposite side by pitch-registration with the pattern of the oxidized surface using an etching resist. 3. A method for producing a resonance label according to item 1 or 2, wherein an insulating reinforcing film is laminated, and then etched.
5). A circuit is formed on the oxidized surface of a metal foil that has been oxidized on one side by conductive ink or pattern vapor deposition, and the circuit pattern is printed on the opposite side by pitch-registration with the pattern of the oxidized surface using an etching resist. After manufacturing, the insulating reinforcing film is laminated, then etched, the etching resist is removed, and an IC different from the previous one is mounted. Law.

The resonant label of the present invention can be reduced in size to 400 mm ² or less, for example, 20 mm × 20 mm or less. In addition, since the IC is mounted, it can be suitably used for an electronic alarm system that is deactivated without physical breakdown. Further, when this resonant label is manufactured by the method of the present invention, the circuit alignment on both surfaces of the dielectric layer can be easily and accurately performed.

  In the resonance label of the present invention, by using an IC mounting label having a metal oxide film as a dielectric layer, it is possible to achieve deactivation without physically breaking down the dielectric layer of the resonance label itself. it can. Such a deactivation method is disclosed, for example, in JP-T-2001-511574. This deactivation means is generally the following method. First, unique information is assigned to a large number of articles, the articles are stored in a computer database, a label is attached to each article, and information unique to the article is stored in an IC mounted on the label. When the resonant label passes through the monitoring device, it reads a signal specific to the article emitted from information stored by the IC, compares it with a computer database, and issues an alarm if it matches or does not match. In regular carrying-out such as purchase, the information of the article or the database is changed at the time of checking, so that an alarm is not issued when the signal from the label does not match the database. This method is an example, and the resonance label having the resonance circuit of the present invention and mounting an IC can be applied to various methods of deactivating without causing dielectric breakdown of a physical dielectric layer.

  For the resonance label of the present invention, the surface of a metal foil such as Al, Ti, Zr, Nb, Hf, and Ta is oxidized and used. The oxidation may be performed by a known method capable of controlling the thickness of the oxide film and its dielectric constant, such as an anodic oxidation method or boehmite treatment.

The resonance circuit of the resonance label of the present invention is formed by, for example, a circuit including a dielectric coil and a capacitor electrode formed on one surface of the label, and a circuit including an opposing capacitor counter electrode formed on the other surface. Normally, a circuit including a dielectric coil and a capacitor electrode is formed by etching a metal foil, and a circuit including a capacitor counter electrode is formed by applying conductive ink or pattern deposition on a metal oxide film. If the resonance current sufficient to drive the IC can be passed during communication with the device, the reverse is acceptable. In addition, the coil and the electrode may be formed opposite to each other on both sides of the insulating film. In this case, the opposed coil serves as part or all of the capacitor.
An IC is mounted on the resonance label of the present invention. The IC stores information unique to the article in advance. At the time of checking, the check device reads the information unique to the article stored in the IC, compares it with the computer database, and stores the article information or the database. By changing it, the label is deactivated electronically or virtually.

Hereinafter, the present invention will be described with reference to the drawings.
FIG. 1 is an example of a circuit pattern of a resonance label according to the present invention. FIG. 1A is a circuit pattern side formed by etching a metal foil and an IC mounting surface, and FIG. It is the pattern side formed with ink. In FIG. 1A, black portions are metal foil circuit patterns, 11 is a coil, and 12 is a capacitor electrode portion. The hatched portion in FIG. 1B is a counter capacitor electrode pattern 13 formed of conductive ink. The IC is mounted on a portion 14 surrounded by a dotted line.

  FIG. 2 is an equivalent circuit of the resonance label of FIG. In FIG. 2, ANT is a dielectric electromotive force input terminal, MOD is a signal output terminal, and GND is a power feedback terminal. This is an example, and if necessary, a terminal for storing information may be provided separately, or a plurality of signal output terminals may be provided.

FIG. 3 shows an example of manufacturing the resonance label.
FIG. 3A shows a metal foil 31 such as aluminum, and one side thereof is anodized to form a metal oxide film 32 (b). The metal foil is preferably about 1 to 300 μm. The thickness of the oxide film is preferably 10 nm to 10 μm. Next, the counter electrode pattern 13 is printed with the conductive ink 33 on the oxidized surface of the metal foil, and the pattern 11 of the circuit including the coil and the capacitor electrode is pitch-matched with the pattern on the oxidized surface with the etching resist ink 34 on the opposite surface. And printing (c). Preferably, the conductive ink printing on one side and the etching resist ink on the other side are printed on the same continuous printing machine so that the circuit alignment on both sides of the dielectric layer is accurate. This is preferable. The conductive ink is cured by heating or the like according to the type. A reinforcing film 35 is laminated on the surface on which the conductive ink is printed in order to reinforce and protect the conductive ink in the next etching step (d). Reference numeral 36 denotes an adhesive layer. As the reinforcing film, plastic films such as polyethylene, polypropylene and polyester are usually used. Next, etching is performed (e), the resist ink 34 is peeled off (f), and a metal foil pattern is formed. Finally, the IC 37 is mounted at a predetermined position on the metal foil pattern surface (g). There may be a plurality of ICs. The protective film 38 is laminated to obtain a resonance label (h). Reference numeral 39 denotes an adhesive layer. The protective film can be made of the same material as the reinforcing film (d).

  In the above method, one circuit is formed with conductive ink, but it may be formed by metal vapor deposition. In this case, in the step (c), the negative pattern of the circuit is masked and printed instead of the conductive ink, and vapor deposition is performed. In this case as well, printing with the same continuous printing machine is preferable in terms of alignment of the circuits on both sides of the dielectric layer. In the method described in Patent Document 2, pattern deposition is performed first, and then a photoresist is applied to the metal foil, and then the pattern is transferred and etched. Therefore, accurate alignment is difficult. Further, the IC may be mounted on conductive ink or pattern deposition. In this case, the IC is mounted at a predetermined position after the printing in the step (c) and before the lamination of the reinforcing film in the step (d). The resist ink (f) is not required to be peeled off. Further, ICs may be mounted on both sides of the dielectric layer.

  The resonance label of the present invention can be used by being affixed to an article, and can resonate with an electromagnetic wave having a specific resonance frequency to generate an alarm with a sensing device, and is useful for preventing theft in libraries and retail stores. is there. Since its size can be reduced, it is particularly suitable for use in small articles.

It is a figure showing an example of the circuit pattern of a resonance label. It is an equivalent circuit of a resonance label. It is a figure showing the manufacturing process of the resonance label.

Explanation of symbols

11 Coil 12 Electrode 13 Counter electrode 14 IC mounting portion 31 Metal foil 32 Oxide film 33 Conductive ink 34 Resist ink 35 Reinforcement film 36 Adhesive layer 37 IC
38 Reinforcing film 39 Adhesive layer

Claims (5)

Non-breakdown type IC mounted resonance label in which a resonance circuit is formed by at least partly facing a circuit formed of the metal and a circuit formed of conductive ink or pattern vapor deposition through a metal oxide film . 2. The resonance label according to claim 1, wherein one of the circuit formed of the metal and the circuit formed of conductive ink or pattern deposition is composed of at least a dielectric coil and a capacitor electrode, and the other is composed of at least a facing capacitor electrode. A circuit is formed on the oxidized surface of the oxidized metal foil on one side by conductive ink or pattern vapor deposition, and the circuit pattern is printed on the opposite side with the etching resist in pitch alignment with the etching resist, and insulated on the anodized side. A method for producing a resonance label according to claim 1 or 2, wherein an reinforced reinforcing film is laminated, then etched, the etching resist is removed, and an IC is mounted. A circuit is formed on the oxidized surface of a metal foil that has been oxidized on one side by conductive ink or pattern vapor deposition, and the circuit pattern is printed on the opposite side by pitch-registration with the pattern of the oxidized surface using an etching resist. A method for producing a resonant label according to claim 1 or 2, wherein an insulating reinforcing film is laminated after etching, and then etched. A circuit is formed on the oxidized surface of a metal foil that has been oxidized on one side by conductive ink or pattern vapor deposition, and the circuit pattern is printed on the opposite side by pitch-registration with the pattern of the oxidized surface using an etching resist. 3. A method for manufacturing a resonant label according to claim 1, wherein an insulating reinforcing film is laminated, then etching is performed, the etching resist is removed, and an IC different from the previous one is mounted. Law.

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