JP2005157198A - Guide attached semiconductive belt and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a guide attached semiconductive belt having an adhesive layer which withstands meandering transverse pressure during belt running, withstands repetitive bending at a small diameter pulley, and ensures a little lowering of adhesive power even to a recent liquid toner. <P>SOLUTION: In the guide attached semiconductive belt, a guide member is formed by extrusion-molding a thermoplastic polyurethane elastomer having a JIS-A hardness of 65-90°, a surface of a belt body to which the guide member is bonded, an adhesive and the guide member each comprise a polyurethane, and the adhesive consists of a base resin comprising a polyurethane solution and a liquid curing agent. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductive belt used in an electrophotographic apparatus, in which meandering greatly affects image formation, and in particular, has excellent adhesion durability between a meander-preventing guide material and a belt body which is a thin cylindrical body, and is liquid The present invention relates to a semiconductive belt suitable for toner.

  In the semiconductive belt with guide according to the present invention, as shown in FIG. 1, guide members 22 having a rectangular cross section are bonded to both end faces in the width direction of the inner surface of the belt body 5 which is a thin cylindrical body. As will be described subsequently, the image formed on the photoreceptor is transferred to the outer surface of the guided semiconductive belt 25 and further transferred to a recording material.

  As shown in a side view in FIG. 2, a flat belt body 5 having no guide member is often used in an electrophotographic apparatus. The operation of the belt body 5 will be briefly described with reference to FIG. 2. The photosensitive member 1 is charged by the charging unit 2, and then a latent image is formed by the exposure unit 3 and a toner image is formed by the developing unit 4. It has become. A belt body 5 used as an intermediate transfer belt is stretched between a primary transfer roller 6, a secondary transfer roller 7, and a drive roller 8, and is sandwiched between the photoreceptor 1 and the primary transfer roller 6. The vehicle travels in the direction of the arrow x. The image formed on the photoreceptor 1 is transferred to the belt main body 5 that is an intermediate transfer belt at the position of the primary transfer port 1 and then transferred to the recording paper 12 at the position of the secondary transfer roller 7. Further, after the primary transfer, the toner remaining on the photosensitive member 1 is collected by the cleaning unit 10, and then the surface of the photosensitive member 1 is discharged by the eraser lamp 11.

  As described above, the belt body 5 travels over a plurality of small-diameter rollers, and therefore has a problem that meandering is likely to occur. Therefore, in a wide intermediate transfer belt, as shown in FIG. 1, a rib-shaped guide material 22 made of a flexible material for preventing meandering is often provided along both ends in the width direction of the inner peripheral surface of the belt body 5.

  As a method of providing a guide material made of such a soft material, it is ideal to form a belt main body (semiconductive belt) at the same time using the same material as the belt main body. Press the template that has a groove corresponding to the guide material to the end in the width direction of the inner surface, and inject the material of the guide member, such as silicon rubber or liquid urethane forming liquid, into the groove, and directly into the belt body Attempts have been made to provide guide members. However, in these injection methods, it is necessary to fix and hold the template until the injected material is cured, and there are few examples in which productivity is poor and practical use.

  Various attempts have been made to form a guide material in advance and bond it to the belt body using an adhesive. For example, a reinforcing base material is bonded to a sheet having a JIS-A hardness of 30 to 95 degrees and excellent taper wear. A technique of forming a narrow guide material with a base material using a slitter or the like and bonding it to an endless belt (belt body) is disclosed (for example, see Patent Document 1). Further, a concave portion is formed on the adhesive surface of a flexible guide material having a JIS-A hardness of 60 degrees or less, preferably 50 degrees or less, and irregularities are formed, and a reactive adhesive is applied and filled into the convex portions and concave portions. A technique for securing an initial adhesive force with a thin coating film and ensuring the adhesive force by gradually curing a reactive adhesive filled in a recess has been disclosed (for example, see Patent Document 2).

Further, a technique is disclosed in which a guide material previously formed of an elastic body is joined to a belt body made of a soft film by using a double-sided pressure-sensitive adhesive tape containing a core material and an adhesive in combination (for example, a patent document). 3, see Patent Document 4).
JP-A-8-99706 Japanese Patent Laid-Open No. 11-338175 Japanese Patent Publication No. 2000-75728 Japanese Patent Publication No. 2000-131999

  However, the guide member described in Patent Document 1 has a problem that its configuration is complicated, costly, and impractical, and a reinforcing base material is interposed in the bonded portion, so that cracks are likely to occur due to repeated bending. According to Patent Document 2, unevenness of the adhesive on the unevenness of the adhesive surface and unevenness of the curing reaction are likely to occur, it takes too long to complete the curing, and the guide material is flexible and cannot withstand meandering lateral pressure. There's a problem. In Patent Document 3 and Patent Document 4, the pressure-sensitive adhesive tape alone does not withstand repeated bending when used over a plurality of small-diameter rollers, and easily peels. Even those that use an adhesive also cause undulations on the belt surface on the side without the guide material due to differences in rigidity and thermal shrinkage from the belt body, or cracks occur at the boundary between the adhesive tape and adhesive due to the above-mentioned repeated bending. It has the problem of being easy.

  On the other hand, in recent years, the use of liquid toner has been studied due to the demand for higher resolution in electrophotography. In the guide material adhering method described in the above-mentioned patent documents and the like, there is a problem of lower adhesion to the solvent in which the toner is dispersed. It has become.

  In order to solve these problems, the present invention provides an adhesive layer that can withstand meandering lateral pressure during belt running, can withstand repeated bending with a small-diameter pulley, and has little decrease in adhesion to liquid toner. It is an object of the present invention to provide a semiconductive belt with guide and a method for manufacturing the same.

  In order to solve the above problems, the semiconductive belt with guide according to claim 1 is used in an electrophotographic apparatus by providing a guide material on the inner surface of a belt main body which is a thin cylindrical body, and the guide material is JIS- A thermoplastic polyurethane elastomer having an A hardness of 65 to 90 degrees is extruded, and this guide material is bonded to the inner surface of the belt body with a two-component polyurethane adhesive.

The purpose of the guide material is to prevent meandering during belt running, which causes disturbance in the transferred image. The semiconductive belt refers to a belt having a volume resistance value of 10 ⁴ to 10 ¹¹ Ω · cm between the inner surface and the outer surface of the belt body.

  Regarding the dimensional relationship between the thickness of the belt body and the guide material, when the thickness of the belt body is 0.1 to 1.0 mm, the guide material height h (mm) is 0.3 ≦ h ≦ belt body thickness × In particular, when the belt body thickness is 0.3 to 0.5 mm, it is preferable that the guide height (mm) = (belt body thickness) × 1.5 to 2.0. This is because when the belt is running, the guide material follows the belt body at the driving roller and the driven roller, that is, smoothly changes the shape of the outer surface of the belt body without causing any change (distortion).

  The cross-sectional shape of the guide material is not particularly limited as long as the belt can be prevented from meandering. For example, a rectangular shape, a trapezoidal shape, a semicircular shape, or the like is used. As the guide material hardness is lower than JIS-A 65 degrees, the belt is subject to the meandering lateral pressure of the belt, and is likely to be deformed and climbed, making it difficult to obtain a stable transfer image. Further, if the guide material hardness exceeds JIS-A 90 degrees, it is difficult to follow the small-diameter driving roller or the driven roller, and the traveling becomes unstable, so that it is difficult to obtain a stable image.

  As the guide material, an extruded product of thermoplastic polyurethane is used to obtain a guide material that has the above-mentioned hardness, high tensile strength, excellent bending resistance and wear resistance, good dimensional accuracy, and excellent mass productivity. It is easy.

  By using a two-component polyurethane adhesive as an adhesive for adhering this guide material to the belt body, it is easy to adhere to various belt materials (rubber, resin), has excellent adhesive strength and physical properties of the adhesive layer, and Adhesive that is flexible and resistant to repeated bending can be obtained.

  The electroconductive belt for an electrophotographic apparatus according to claim 2 is characterized in that at least the guide material bonding surface of the belt body is made of thermosetting polyurethane. Since the belt body, adhesive and guide all have urethane bonds, the adhesive strength between them is large and the difference in coefficient of linear expansion is small, so even if the ambient temperature (room temperature) changes from low to high, there is a difference in shrinkage. The appearance of the belt main body surface is not distorted and undulated, and the adhesive force is stabilized.

  The guide semiconductive belt according to claim 3, wherein the two-component polyurethane adhesive is a polyurethane composed of diphenylmethane diisocyanate, adipic acid ester and 1,4 butanediol, and a mixed solvent of ethyl acetate, methyl ethyl ketone, and toluene. And a curing agent obtained by dissolving tris- (rose isocyanate-phenyl) -thiophosphite in ethyl acetate.

  By using this adhesive, sufficient initial adhesive force can be obtained in a short time when the belt body and the guide material are bonded, and the adhesive layer itself after aging has good physical properties such as tear resistance and tensile strength, Moreover, it becomes rich in flexibility, and hardly follows the bending of a driving roller or a driven roller having a small outer diameter of 15 to 25 mm, and hardly causes adhesive peeling.

  This adhesive is mixed with the main agent and curing agent just before use, applied to the belt body or the adhesive part of the guide material, and dried to a semi-dry state where it does not stick to the fingers (referred to as non-stick to the touch). By doing so, it is possible to obtain an initial adhesive force that does not cause “displacement” even if they are pressed and stored for a predetermined period. A strong adhesive force can be obtained by aging this in an atmosphere of room temperature or 40 to 70 ° C.

  The semiconductive belt with guide according to claim 4 is characterized in that the electrophotographic apparatus is used as an intermediate transfer belt in a system using liquid toner. The belt body, the adhesive, and the guide material are all materials that are difficult to be affected by n-dodecane used as a solvent for the liquid toner, and are particularly preferably used as an intermediate transfer belt in direct contact with the liquid toner.

  The method for producing a semiconductive belt with guide according to claim 5 is a method for producing a semiconductive belt with guide used in an electrophotographic apparatus in which a guide material is provided on the inner surface of a belt main body which is a thin cylindrical body. In advance, a guide material is formed by extruding a thermoplastic polyurethane elastomer with a JIS-A hardness of 65 to 90 degrees, and then the belt main body is formed with a horizontal moving part whose lower surface is supported by a slide plate. The two-component polyurethane adhesive formed by mixing the main agent and the curing agent along the widthwise end portion of the inner surface of the belt main body in the horizontal moving portion while running over a plurality of guide rollers. Is applied, and hot air is blown and semi-dried, and the guide material is bonded to the semi-dried adhesive surface while running through a pressure roller.

  According to this manufacturing method, when the guide material is bonded to the belt body, the guide material is not heated at 70 ° C. or more, can be bonded almost at normal temperature, and pressurization is instantaneously terminated. Since there is no undulation or heat deterioration, and the heating / cooling time is unnecessary, the guide material can be efficiently bonded to the belt body.

  The method for manufacturing a semiconductive belt with guide according to claim 6 is characterized in that a linear pressure for pressing the guide material against the belt body by the pressure roller is 10 to 20 N / cm, and the temperature of the hot air is 25 to 75 ° C. It is characterized by being semi-dry to the touch-free adhesive. If the force for pressing the guide material against the belt body, that is, the linear pressure between the pressure roller and the slide plate is less than 10 N / cm, the guide material may be displaced during the movement or the contact may be insufficient. If it exceeds cm, the guide material may be deformed. Further, when the hot air temperature is less than 25 ° C., it takes a long time to be semi-dried, and when it exceeds 75 ° C., the belt body may be wavy.

  As is apparent from the above description, the semiconductive belt for an electrophotographic apparatus of the present invention is less deformed with respect to the lateral force when the belt travels by increasing the hardness of the guide material, and is meandering. Can be prevented. The adhesive material of the belt body, the guide material, and the adhesive layer are unified with urethane material, so that the adhesive strength is high, the durability against repeated bending by running is excellent, and the electrophotographic apparatus using liquid toner Even when used as an intermediate transfer belt, it is not affected by the dispersion solvent.

  Furthermore, in the method for manufacturing a semiconductive belt with a guide according to claim 5, since it can be bonded at a temperature of 75 ° C. or less, the belt main body is not corrugated or the guide material is not thermally deteriorated. The guide material can be well adhered to the belt body.

  The semiconductive belt for an electrophotographic apparatus of the present invention forms a belt body which is a thermosetting polyurethane having a JIS-A hardness of 65 to 90 degrees by centrifugal molding, and the JIS-A hardness is 65 to 90 degrees. A guide material obtained by extruding a thermoplastic polyurethane elastomer having a rectangular cross section is bonded to the inner surface of the belt body with a two-component polyurethane adhesive. This two-component polyurethane adhesive is composed of a main agent obtained by dissolving polyurethane composed of diphenylmethane diisocyanate, adipic acid ester and 1,4 butanediol in a mixed solvent of ethyl acetate, methyl ethyl ketone and toluene, and tris- (baraisocyanate-phenyl). -Consisting of a curing agent in which thiosophate was dissolved in ethyl acetate. Because the guide material mounting surface, guide material, and adhesive layer of the belt body are made of the same material, it is excellent in repeated bending durability, and is particularly suitable as an intermediate transfer belt for electrophotographic apparatuses using liquid toner. .

  In addition, the method for producing a semiconductive belt with a guide is such that the two-component polyurethane adhesive is applied to the adhesive surface of the guide material or the adhesive surface of the belt body, and warm air is blown to obtain a semi-dried state to obtain the initial adhesive strength. The guide material is pressure-fed through a pressure roller and temporarily bonded, and then aged and completely bonded.

  Examples of the semiconductive belt for an electrophotographic apparatus according to the present invention and comparative examples will be described below.

  First, the belt body was made as follows. 70 parts by weight of polyester polyol (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name: NIPPOLAN 141, hydroxyl value = 108 KOHmg / g) and 3 parts by weight of conductive carbon black (trade name: 3030B, manufactured by Mitsubishi Kasei Co., Ltd.) as a conductive filler After mixing and dispersing, 30 parts by weight of a low molecular weight aromatic diamine compound (manufactured by Sumika Bayer Urethane Co., Ltd., trade name: Vitec 1604, amine equivalent = 120) as a chain extender is mixed and heated and dissolved at 100 ° C. And vacuum dehydration at 100 ° C. for 12 hours.

  As a curing agent, a blend of fatty acid isocyanate (made by Mitsui Takeda Urethane Co., Ltd., trade name: NBDI and Sumika Bayer Urethane Co., Ltd., trade name: Sumijoule N3300), NBDI / Sumijoule N3300 by weight ratio = 65/35 blended) was heated and mixed at 40 ° C. and injected into a cylindrical mold (inner diameter = 170 mm, width = 400 mm) of a centrifugal molding machine heated to 120 ° C. and rotated at 1000 rpm. After 10 minutes, the rotation speed was reduced to 500 rpm, and the rotation was continued for 20 minutes. After that, the mold was removed, aged at 120 ° C. for about 12 hours, cut into a width of 270 mm, an elastic body having a thickness of 0.5 mm, an outer peripheral length. A belt main body having a thin cylindrical body of 780 mm was obtained.

  Separately, as a guide material, a thermoplastic polyurethane elastomer (manufactured by Nippon Milactran Co., Ltd., trade name: Elastollan / ET680) is extruded into a rectangular cross section (thickness: 1 mm, width: 5 mm), and JIS-A hardness = 80 degrees. A guide material was obtained.

  Further, as an adhesive, a main agent obtained by dissolving urethane composed of diphenylmethane diisocyanate, adipic acid ester and 1,4 butanediol in a mixed solution of ethyl acetate, methyl ethyl ketone and toluene, and an ethyl acetate solution of tris- (paraisocyanate phenyl) thiophosphate The main component and the curing agent are mixed at a weight ratio of 1: 1 using a two-component polyurethane adhesive (trade name: Sunpat C # 1000 set, manufactured by Bando Chemical Co., Ltd.).

  A method of manufacturing a guided semiconductive belt in which the guide material is bonded to the inner surface side end portion of the belt body via the adhesive will be described with reference to a side view of the bonding jig shown in FIG.

  The slide plate 30 is provided so that the upper surface is substantially horizontal, and above this, three guide rollers 35, 36, 37 (outer diameter = 30 mm) whose axis is parallel are disposed, and the two lower guide rollers 35, 37 can contact and be separated from the slide plate 30, and the other guide roller 36 is arranged above the guide rollers 35, 37 at a position where these shaft centers form a triangle when viewed from the side. Yes. Furthermore, a pressure roller 31, a coating machine 32 for applying an adhesive, and a dryer 33 for drying the adhesive are provided inside these three guide rollers. The pressure roller 31 has an outer diameter = 30 mm and a width = 5 mm, and has a groove portion with a width = 5 mm and a depth = 0.9 mm at a position where the guide material 22 is pressure-bonded, and can move up and down in the direction of the arrow y. .

  The adhering procedure using them is as follows. First, the belt main body 5 is suspended around three guide rollers and the lower guide rollers 35 and 37 are brought close to the slide plate 30, so that a part of the belt main body 5 is moved to the slide plate 30. (This portion is called a horizontal moving portion 38, about 180 cm in length), the position of the upper guide roller 36 is adjusted, and the belt is tensioned to rotate and run.

  A pressure roller 31 is provided downstream of the horizontal movement portion 38 in the belt traveling direction (arrow x), and the inner surface of the belt body 5 can be pressed against the slide plate 30 with a linear pressure of 15 N / cm. And press-contacting the slide plate 30. The applicator 32 filled with the adhesive is on the upstream side in the belt running direction of the pressure roller 31 of the horizontal moving part, and is on the inner surface of the belt body 5 and one end in the width direction (bonding position of the guide material 22, see FIG. 1). Along the line, an adhesive is applied to a width of about 5.5 mm. The applied adhesive 38 is semi-dried so as not to touch with the hot air (temperature: about 50 ° C.) ejected from the dryer 33. The guide material 22 is supplied onto the semi-dried adhesive layer 39 and bonded to the belt body 5 by the pressure roller 31. The guide material 22 is bonded to the inner surface of the belt main body 5 once to cut the remainder of the guide material 22, and then the guide material 22 is bonded to the other end of the belt main body 5 in the same manner as described above. The belt body 5 to which the guide material 22 is bonded is removed from the bonding jig, and is aged at about 60 ° C. for about 12 hours to be a semiconductive belt with a guide (width = 270 mm, inner peripheral length = 700 mm, thickness = 0.5 mm, With both end guides).

  The evaluation method of the semiconductive belt 5 to which the guide material is bonded is as follows.

  1) Adhesive strength was obtained by cutting out a test piece having a width = 5 mm and a length = 150 mm from the width direction end portion (portion where the guide material was bonded) of the obtained semiconductive belt with guide, and reducing the adhesive length by 50 mm. Then, it was peeled off with a knife to form an adhesive test piece, attached to a tensile tester in a 180 degree peeled state, pulled at a pulling speed of 100 mm / min, and the highest peak was read from the stress chart. The results are shown in Table 1. The test piece was immersed in n-dodecane, which is a typical dispersion solvent for liquid toner, and the adhesive strength was measured after 1 day and 1 week after immersion. The results are shown in Table 1.

  2) Bending durability was obtained by using the obtained semiconductive belt with guide, two rollers (driving roller, driven roller) having an outer diameter = 25 mm, a length = 260 mm, and outer diameters at both ends of 23 mm. ), Stretched by about 5%, run at a belt speed of 5 m / min while spraying liquid toner on the belt body, and check the condition of the bonded part every hour for up to 100 hours. The time until peeling occurred was measured. The results are shown in Table 1. In addition, the case where it did not peel even if 100 hours passed was displayed as 100 <.

  3) The belt surface at the time of winding was evaluated by visually observing the belt surface of the roller portion having an outer diameter of 25 mm and both outer diameters of 23 mm when the belt was attached to a biaxial testing machine for bending durability evaluation. Those without undulation were evaluated as OK, and those with undulation were evaluated as x.

  4) With respect to the meandering prevention, the presence or absence of the guide material on the outer diameter 25 mm of the roller when the biaxial testing machine is moved by shifting the center in the width direction by 2 mm is observed. It was evaluated.

  As a guide material, a semiconductive belt with a guide was produced in the same manner as in Example 1 except that a thermoplastic polyurethane elastomer having a JIS-A hardness of 90 degrees was used. The results of evaluation in the same manner as in Example 1 are shown in Table 1. Shown in

  A semiconductive belt with a guide was produced in the same manner as in Example 1 except that a thermoplastic polyurethane elastomer having a JIS-A hardness = 90 degrees was used as a guide material. It is shown in 1.

  As a belt body, NBR (made by Nippon Zeon Co., Ltd., trade name: Nipol “DN401LL” = 100 parts by weight, conductive carbon = 10 parts by weight, calcium carbonate = 50 parts by weight, zinc white = 5 parts by weight, stearic acid, oil NBR rubber composition kneaded with 1 part by weight of sulfur and accelerator TET, transfer molded into a cylindrical mold consisting of an inner mold and an outer mold, vulcanized, and cut to a width of 270 mm A semiconductive belt with a guide was produced in the same manner as in Example 1 except that was used, and evaluated in the same manner as in Example 1 and the results are shown in Table 1.

(Comparative Example 1)
A semiconductive belt with a guide was produced in the same manner as in Example 1 except that a thermoplastic polyurethane elastomer having a JIS-A hardness of 60 degrees was used as the guide material, and an evaluation was conducted in the same manner as in Example 1. The results are shown in Table 2.

(Comparative Example 2)
A semiconductive belt with a guide was produced in the same manner as in Example 1 except that a thermoplastic polyurethane elastomer with a JIS-A hardness of 95 degrees was used as the guide material, and the same was evaluated as in Example 1. The results are shown in Table 2.

(Comparative Example 3)
As a guide material, a sheet having a total thickness of 1.0 mm obtained by bonding a PET film having a thickness of 0.2 mm to a thermoplastic polyurethane sheet having a JIS-A hardness of 80 degrees and cut to a width of 5 mm (trade name: manufactured by Eiwa Co., Ltd.) Except for using HJ-0240), a semiconductive belt with a guide was manufactured in the same manner as in the example, and evaluated in the same manner as in Example 1 and the results are shown in Table 1.

(Comparative Example 4)
A semiconductive belt with a guide was produced in the same manner as in Example 1 except that an acrylic pressure-sensitive adhesive tape (manufactured by Sumitomo 3M, trade name: Y-4950) was used as an adhesive between the belt body and the guide material. Evaluation was conducted in the same manner as in Example 1, and the results are shown in Table 2.

(Comparative Example 5)
A semiconductive belt with a guide was manufactured in the same manner as in Example 1 except that polycarbonate was extruded into a tube shape instead of an elastic body as the belt body, and the results were evaluated and evaluated in the same manner as in Example 1. Is shown in Table 2.

The perspective view of the semiconductive belt with a guide concerning the Example of this invention is shown. FIG. 3 is a side view of an electrophotographic apparatus in which a guided semiconductive belt (intermediate transfer belt 5) according to an embodiment of the present invention is incorporated. It is a side view explaining the outline | summary of the adhesion jig used for the manufacturing method of the semiconductive belt with a guide concerning the Example of this invention.

Explanation of symbols

1: Photosensitive member 5: Belt body 6, 6 ': Guide roll 12: Recording material 22: Guide material 25: Semiconductive belt with guide 30: Slide plate 31: Pressure roller 32: Adhesive applicator 33: Dryer 35 36, 37: Guide roller 38: Horizontal moving part 39: Adhesive

Claims (6)

A semiconductive belt with a guide used in an electrophotographic apparatus in which a guide material is provided on the inner surface of a belt body which is a thin cylindrical body,
The guide material is formed by extruding a thermoplastic polyurethane elastomer having a JIS-A hardness of 65 to 90 degrees, and the guide material is bonded to the inner surface of the belt body with a two-component polyurethane adhesive. Guided semi-conductive belt.   The semiconductive belt with guide according to claim 1, wherein at least the guide material adhesion surface of the belt body is made of thermosetting polyurethane.   The two-component polyurethane adhesive comprises a main agent obtained by dissolving polyurethane composed of diphenylmethane diisocyanate, adipic acid ester and 1,4 butanediol in a mixed solvent of ethyl acetate, methyl ethyl ketone, and toluene; and tris- (baraisocyanate-phenyl). The semiconductive belt with guide according to claim 1 or 2, comprising: a curing agent obtained by dissolving thiosophate in ethyl acetate.   4. The semiconductive belt with guide according to claim 1, wherein the electrophotographic apparatus is used as an intermediate transfer belt in a system using liquid toner. A method for producing a semiconductive belt with a guide used in an electrophotographic apparatus provided with a guide material on the inner surface of a belt body which is a thin cylindrical body,
A guide material is formed by extruding a thermoplastic polyurethane elastomer having a JIS-A hardness of 65 to 90 degrees in advance, and then the belt main body is formed with a horizontal moving portion in which a lower surface is supported by a slide plate. The two-component polyurethane adhesive formed by mixing the main agent and the curing agent is applied along the widthwise end portion of the inner surface of the belt main body in the horizontal moving portion while running over a plurality of guide rollers. A method for producing a semiconductive belt with guide, characterized in that hot air is blown and semi-dried, and the guide material is pressure-bonded to the semi-dried adhesive surface while running through a pressure roller. The guide according to claim 5, wherein a linear pressure for pressing the guide material against the belt main body by the pressure roller is 10 to 20 N / cm, the temperature of the hot air is 25 to 75 ° C, and it is semi-dried to the extent that it does not adhere to the finger. Method for manufacturing a semiconductive belt with a tape.

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