JP2005154846A - Composite metal particulate-dispersed liquid, and its production method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of producing composite metal particulates having excellent dispersibility. <P>SOLUTION: In the method of producing a composite metal particulate-dispersed liquid in which metal particulates (B) are carried on the surfaces of metal particulates (A), a mixed dispersion liquid of the metal particulates (A) having the average particle diameter (D<SB>A</SB>) of 50 nm to 5 μm and the metal particulates (B) which has standard electrode potential higher than that of the metal particulates (A) and the average particle diameter (D<SB>B</SB>) of 1 to 20 nm is stirred while the pH is kept 4 to 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for producing composite metal fine particles having excellent dispersibility. More specifically, the present invention relates to a method for producing a composite metal fine particle dispersion excellent in dispersibility and stability by modifying metal fine particles that do not necessarily have good dispersibility and stability.

  Conventionally, metal fine particles and composite metal fine particles have been widely used as conductive films for electronic component materials, coating materials, optical materials (infrared reflective films, ultraviolet shielding agents, etc.) or catalyst materials.

  For example, when a transparent conductive film containing these fine particles is formed on the surface of a display panel such as a cathode ray tube, a fluorescent display tube, or a liquid crystal display panel, the display panel can be prevented from being charged or electromagnetic waves can be shielded.

  In addition, these fine particles may have catalytic activity, and when these fine particles are dispersed in a colloidal form, light is easily transmitted and can be suitably used as a photoreaction catalyst.

Among such fine particles, when a conductive film is formed using composite fine particles having a core-cell structure (a layer of other metal (cell) is formed on the surface of fine particles serving as nuclei (core)) Thus, it is possible to form a film having excellent reliability and durability. Moreover, it is also known that the composite fine particles having such a core-cell structure have higher catalytic activity than the conventionally known metal fine particles (Non-patent Document 1: Toshima, Trends and Prospects of Catalyst Technology, Catalysis Society, 12 (1996)).
Trends and prospects of catalyst technology, Catalysis Society of Japan, 12 (1996)

  As a method for producing composite fine particles having a core-cell structure, an electrolytic plating method, a co-reduction method, a reduction plating method, a mechanical / physical method, and the like are known. However, since these methods are affected by the size of the core particles, it is difficult to obtain fine particles having a small particle size, and the shape and particle size of the obtained particles vary depending on the thickness of the formed cell layer. There was the disadvantage of being non-uniform. In addition, since such fine particles have low dispersibility and are likely to be aggregated particles, for example, even when a conductive coating is formed, there is a drawback that the electromagnetic shielding effect, reliability and durability are insufficient. .

  Furthermore, the co-reduction method and reduction plating method use alcohol, dimethylamine, formaldehyde, sodium phosphinate, trisodium citrate, ferrous sulfate, etc. as the reducing agent. There are disadvantages such as a large number of ions remaining and the resulting fine particles agglomerate. For this reason, organic stabilizers and surfactants such as gelatin, polyvinylpyrrolidone and citric acid are used to suppress aggregation and increase dispersibility and stability. These stabilizers and surfactants are metal fine particles. In some cases, sufficient conductivity could not be obtained because the conductivity was inhibited.

Accordingly, as a result of intensive studies, the present inventors have determined that metal fine particles having a high standard electrode potential can be obtained by dispersing metal fine particles having a large particle size or a small surface charge amount and insufficient dispersibility and stability even when the particle size is small. If the metal colloid is supported on the surface of the metal fine particles by treating with the liquid, the metal colloid is supported on the surface of the metal fine particles with insufficient stability, and a dispersion having excellent dispersion stability can be obtained. I found it.

That is, the method for producing a composite metal fine particle dispersion according to the present invention comprises:
The fine metal particles (A) having an average particle diameter (D _A ) in the range of 50 nm to 5 μm, the standard electrode potential is higher than the fine metal particles (A), and the average particle diameter (D _B ) is in the range of 1 nm to 20 nm. Stirring while maintaining the pH of the mixed dispersion with the metal fine particles (B) at 4-10.

The ratio of the average particle diameter (D _B ) to the average particle diameter (D _A ), (D _B ) / (D _A ) is preferably in the range of 1/5000 to 1/5.

  The difference in standard electrode potential between the metal fine particles (A) and the metal fine particles (B) is preferably in the range of 0.1 to 4.1V.

The metal fine particles (A) are Ni, Al, Mg, Ti, Fe, In, Co, Sn, Mo, Cu, Ru,
One or more metals selected from Rh, Pd, and Ag, and the metal fine particles (B) are Rh, Ru,
One or more metals selected from Pd, Ag, Pt, Ir, and Au are preferable.

  The weight ratio of the metal fine particles (A) to the metal fine particles (B) is preferably in the range of 1 to 50 parts by weight of the metal fine particles (B) with respect to 100 parts by weight of the metal fine particles (A).

  The flow potential of the obtained composite metal fine particles is preferably in the range of −400 to −50 mV when the concentration of the composite metal fine particles is 1% by weight.

The composite metal fine particle dispersion according to the present invention has a standard electrode potential higher than that of the metal fine particles (A) on the surface of the metal fine particles (A) having an average particle diameter (D _A ) in the range of 50 nm to 5 μm. It is characterized in that composite metal fine particles formed by supporting metal fine particles (B) having a diameter (D _B ) in the range of 1 nm to 20 nm are dispersed.

  As described above, according to the present invention, a dispersion of composite metal fine particles in which small metal colloidal fine particles are supported on the surface of larger metal fine particles and free metal colloidal fine particles are not dispersed is obtained. As described above, since the metal colloidal fine particles are supported on the surface, the composite metal fine particles have a high surface potential. Therefore, a composite metal fine particle dispersion having excellent dispersibility and stability can be obtained.

  According to the present invention, when preparing the composite metal fine particle dispersion liquid, since no organic stabilizer or the like is used, there is no conductivity inhibition by the organic stabilizer, and the composite metal fine particles obtained by the present invention are used. It is possible to provide a conductive adhesive, a conductive film, a circuit, an electrode and the like excellent in conductivity.

  Furthermore, it is possible to provide a conductive adhesive, a conductive film, a circuit, an electrode, and the like that are superior in weather resistance, heat resistance, chemical resistance, and the like as compared with the case where an organic conductive material is used.

  Hereinafter, the method for producing a composite fine particle dispersion according to the present invention will be specifically described.

Method for Producing Composite Metal Fine Particles In the method for producing composite metal fine particles according to the present invention, the average particle diameter (D _A ) is 50 nm to 5 μm.
Of a mixed dispersion of fine metal particles (A) in the range of 1 and a fine metal particle (B) having a standard electrode potential higher than that of the fine metal particles (A) and an average particle diameter (D _B ) in the range of 1 nm to 20 nm. It is characterized by stirring while maintaining the pH in the range of 4-10.

  That is, large metal fine particles (A) and small metal fine particles (B) are used.

The fine metal particles (A) used in the present invention are Ni, Al, Mg, Ti, Fe, In, Co, Sn, Mo.
, Cu, Ru, Rh, Pd, and Ag. Although the metal fine particles (A) made of these metals have electrical conductivity, the surface charge amount is small and the dispersibility in the liquid is not always good. For this reason, it is easy to agglomerate or settle, and it is difficult to obtain a stable dispersion of metal fine particles.

The average particle diameter (D _A ) of the metal fine particles (A) is 50 nm to 5 μm, preferably 100 to 1.
It is in the range of μm.

When the average particle size of the fine metal particles _(A) (D A) is less than 50nm, in addition to the metal tends to be easily oxidized, highly conductive for oxidizable by small particle size complex It is difficult to obtain metal fine particles.

If the average particle size of the fine metal particles _(A) (D A) is more than 5 [mu] m, the particles becomes too large, the particles are easily precipitated, conductive film-forming coating liquid containing composite metal particles by the method of the present invention Even if the composite metal particles are prepared, the composite metal fine particles are liable to settle and do not uniformly disperse, and even if a conductive film is formed, the film formation is poor and the desired conductivity cannot be obtained or the film strength is poor. May be sufficient.

  The metal fine particles (A) are not necessarily monodispersed metal fine particles (hereinafter sometimes referred to as primary particles). , Sometimes referred to as secondary particles). In the case of chain particles, they are usually chain particles in which two or more primary particles, preferably about 5 to 50, are connected. When such chain particles are used, since the particles are connected in advance, the grain boundary resistance tends to be small and high conductivity tends to be obtained.

  As the metal fine particles (A) used in the present invention, metal particles obtained by a conventionally known production method can be used without particular limitation.

  For example, primary particles (monodispersed particles) and secondary particles (chain particles) disclosed in JP 2000-196287 A can be suitably used.

Next, the metal fine particles (B) used in the present invention are preferably one or more metals selected from Rh, Ru, Pd, Ag, Pt, Ir, and Au. These fine metal particles have a large surface charge amount and are excellent in dispersibility and stability.

The average particle diameter (D _B ) of such metal fine particles ( _B ) is 1 nm to 20 nm, and further 2
It is preferably in the range of 10 nm.

An average particle size of the fine metal particles (B) (D _B) is less than 1nm is difficult to obtain, tend to aggregate as the resulting metal a dispersion of fine metal particles (B) microparticles Even if it is mixed with the dispersion liquid (A), it may not be uniformly supported on the surface of the metal fine particles (A), and composite metal fine particles (dispersion liquid) having dispersibility and stability may not be obtained.

If the average particle size of the fine metal particles _(B) (D B) exceeds 20 nm, less effect be supported on the metal fine particles (A) to increase the surface charge amount of the composite metal fine particles, dispersibility, stability The composite metal fine particles (dispersion liquid) may not be obtained.

The metal fine particles (B) used in the present invention are not particularly limited as long as they have the above particle diameter, and conventionally known metal particles can be used.
(For example, metal fine particles disclosed in JP-A No. 2002-294301 and the like can be suitably used.)
The metal fine particles (A) and (B) used in the present invention may be two or more kinds of alloys.

The ratio of the average particle diameter (D _B ) to the average particle diameter (D _A ), and (D _B ) / (D _A ) is in the range of 1/5000 to 1/5, and further 1/500 to 1/10. Preferably there is.

When (D _B ) / (D _A ) is less than 1/5000, the metal fine particles (B) tend to be unevenly supported on the surface of the metal fine particles (A). The amount cannot be increased effectively, and the effect of improving the dispersibility and stability of the obtained composite metal fine particles may not be sufficiently obtained.

When (D _B ) / (D _A ) exceeds 1/5, the supporting force of the metal fine particles (B) on the metal fine particles (A) is reduced, and the number of particles supported on the metal fine particles (B) is small. The surface charge amount of the fine particles (A) cannot be effectively increased, and the resulting composite metal fine particles may not be sufficiently improved in dispersibility and stability.

Further, the fine metal particles (B) have a higher standard electrode potential than the fine metal particles (A), and the difference between the standard electrode potentials of the fine metal particles (A) and the fine metal particles (B) is 0.1 to 4.1 V, more preferably, 0.1. It is preferably in the range of 2 to 4.0V. If there is such a potential difference, metal fine particles (B
) Is easily supported on the metal fine particles (A).

When the difference in the standard electrode potential between the metal fine particles (A) and the metal fine particles (B) is less than 0.1 V, a desired amount may not be supported depending on the size of the metal fine particles (B). is there.

  For this reason, a dispersion of fine composite metal particles having excellent dispersibility and stability may not be obtained.

  The difference in standard electrode potential between the metal fine particles (A) and the metal fine particles (B) does not exceed 4.1 V as long as the metal component is selected.

The combination of the metal fine particles (A) and the metal fine particles (B) used in the present invention is not particularly limited as long as the above conditions are satisfied. Examples of suitable combinations include (A)-(B) (potential difference = V), Au-Ni (3.96V), Pt-Ni (3.47V), Pd-Ni (3.20V), Ag-Ni (3.08V), Ru-Ni (2.74V). ), Au-Fe (2.12 V), Pd-Fe (
1.36V), Au-Ag (0.88V) and the like.

  In the method for producing composite metal fine particles according to the present invention, the dispersion of the metal fine particles (A) and the dispersion of the metal fine particles (B) are mixed, and the pH of the mixed dispersion is 4 to 10, preferably 5 to 5. Adjust to 9 range. At this time, it is preferable to stir to such an extent that the metal fine particles (A) do not settle.

  The mixing ratio of the dispersion of the metal fine particles (A) and the dispersion of the metal fine particles (B) is 1 to 50 parts by weight, more preferably 5 to 30 parts by weight of the metal fine particles (B) with respect to 100 parts by weight of the metal fine particles (A). It is preferably in the range of parts by weight.

  When the amount of the metal fine particles (B) is less than 1 part by weight with respect to 100 parts by weight of the metal fine particles (A), the surface charge amount of the metal fine particles (A) is not increased although it depends on the particle diameter of the metal fine particles (B). In some cases, a dispersion of fine composite metal particles having sufficient dispersibility and stability cannot be obtained.

  Even when the amount of the metal fine particles (B) exceeds 50 parts by weight with respect to 100 parts by weight of the metal fine particles (A), the surface charge amount does not further increase and aggregated composite metal fine particles may be generated.

  The entire amount of the metal fine particles (B) is not supported on the metal fine particles (A), but a part of the metal fine particles (B) may remain unsupported in the dispersion (free metal fine particles (B)).

  The concentration of the metal fine particles in the dispersion of the metal fine particles (A) is preferably in the range of approximately 1 to 30% by weight. The concentration of the metal fine particles in the dispersion of the metal fine particles (B) is also preferably in the range of about 1 to 30% by weight.

  The concentration of the mixed dispersion obtained by mixing the dispersions of metal fine particles (A) and (B) is preferably in the range of 1 to 30% by weight, more preferably 5 to 20% by weight. When the concentration of the mixed dispersion is less than 1% by weight, the proportion of the metal fine particles (B) supported on the metal fine particles (A) is reduced, and it takes a long time.

  When the concentration of the mixed dispersion exceeds 30% by weight, aggregated composite metal fine particles may be generated.

Next, the pH of the mixed dispersion is adjusted to 4-10. By this pH adjustment, the metal fine particles (B) are supported on the surface of the metal fine particles (A).

  When the pH of the mixed dispersion is less than 4, the metal fine particles (A) and the metal fine particles (B) are ionized and dissolved, and in this case, aggregated composite metal fine particles may be generated.

  When the pH of the mixed dispersion exceeds 10, a part of the metal fine particles (A) and the metal fine particles (B) may become oxides or hydroxides, and the conductivity of the resulting composite metal fine particles decreases. There is.

Moreover, although an acid or a base is used as the pH adjuster, HCl, HNO ₃ or the like is used as the acid, and NaOH, NH ₃ , an organic amine or the like is used as the base.

  The dispersion of the metal fine particles (A) and / or the dispersion of the metal fine particles (B) is used for improving the dispersibility of the metal fine particles (A) and / or the metal fine particles (B) or after mixing in advance. PH adjustment (addition of acid or base) may be carried out so that the pH of the dispersion liquid falls within the above range, and it can also be used in combination with pH adjustment of the dispersion liquid after mixing.

  The pH of the metal fine particle (A) dispersion when it is preliminarily adjusted varies depending on the type of metal fine particles, but the pH of the metal fine particle (B) dispersion is preferably in the range of 4-7.

When adjusting the pH, stirring is usually performed. The stirring is not particularly limited as long as it can be uniformly mixed.

  The dispersion after mixing is continuously stirred for 10 minutes to 10 hours at ordinary temperature after adjusting the pH.

  At this time, pH adjustment, stirring, and the like are preferably performed in an inert gas atmosphere and / or a reducing gas atmosphere in order to prevent oxidation of the metal.

  Furthermore, after the above stirring, a dispersion treatment can be performed by nanomizer, homogenizer, ultrasonic irradiation or the like in order to promote dispersion as necessary.

  Then, the obtained dispersion can be used as it is, but if necessary, the composite metal fine particles can be separated and recovered by centrifugation, filtration separation, magnetic separation, etc., and then redispersed in pure water. Good. Furthermore, you may perform an ion exchange process as needed.

  Although the concentration of the composite metal fine particle dispersion finally prepared varies depending on the application, it may be adjusted to a desired concentration and is 1 to 30% by weight.

  Depending on the application, the dispersion medium may be replaced with an organic solvent. Examples of organic solvents include alcohols such as methanol, ethanol, propanol, butanol, diacetone alcohol, furfuryl alcohol, ethylene glycol and hexylene glycol; esters such as methyl acetate and ethyl acetate; diethyl ether and ethylene glycol monomethyl Examples include ethers such as ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, and diethylene glycol monoethyl ether; ketones such as acetone, methyl ethyl ketone, acetylacetone, and acetoacetate. These may be used singly or in combination of two or more.

  The aqueous dispersion of fine composite metal particles thus obtained may have a streaming potential in the range of −400 to −50 mV, more preferably −300 to −100 mV, when the composite metal fine particle concentration is 1% by weight. preferable.

  When the streaming potential is less than −400 mV, the surface charge amount of the composite metal fine particles becomes excessive, and the composite metal fine particles may aggregate.

  When the streaming potential exceeds −50 mV, the surface charge of the composite metal fine particles may disappear and the composite metal fine particles may aggregate.

  The streaming potential was measured using a Particle Charge Detector manufactured by Mutek.

Composite Metal Fine Particle Dispersion The composite metal fine particle dispersion according to the present invention has a standard electrode potential from the metal fine particles (A) on the surface of the metal fine particles (A) having an average particle diameter (D _A ) in the range of 50 nm to 5 μm. It is characterized in that composite metal fine particles on which metal fine particles (B) having a high average particle diameter (D _B ) in the range of 1 nm to 20 nm are supported are dispersed. The metal fine particles (A) and (B) and the dispersion medium are the same as described above. The concentration of such a composite metal fine particle dispersion varies depending on the application, but may be 1 to 30% by weight. Further, as described above, it is preferable that the flow potential of the dispersion when it is% by weight is in the range of −40 to −500 mV, more preferably −300 to −100 mV.

The ratio of the average particle diameter (D _B ) to the average particle diameter (D _A ), and (D _B ) / (D _A ) is in the range of 1/5000 to 1/5, and further 1/500 to 1/10. Preferably there is.

  The difference in standard electrode potential between the metal fine particles (A) and the metal fine particles (B) is preferably in the range of 0.1 to 4.1 V, more preferably 0.2 to 4.0 V.

The weight ratio of the metal fine particles (A) to the metal fine particles (B) is in the range of 1 to 50 parts by weight and 5 to 30 parts by weight of the metal fine particles (B) with respect to 100 parts by weight of the metal fine particles (A). Is preferred.

In such a composite metal fine particle dispersion, the metal fine particles (B) having a small and large surface charge are supported on the surface of the metal fine particles (A) having a large and small surface charge as described above. For this reason, a charge is imparted to the composite metal fine particles from the metal fine particles (B), and a dispersion having excellent dispersibility, which was difficult with the metal fine particles (A), can be obtained. In addition to the metal fine particles (B) supported on the metal fine particles (A), they are dispersed in the dispersion in a free state. Although the reason is not clear, it is considered that the dispersibility and stability of the composite metal fine particles are improved by the free metal fine particles (B).

  Therefore, such composite metal fine particles are excellent in dispersibility and stability without using an organic stabilizer. For this reason, there is no conductivity inhibition by the organic stabilizer. In addition, when the composite metal fine particle dispersion obtained by the present invention is used, a conductive adhesive or conductive film excellent in conductivity can be obtained by blending it into an adhesive or film by utilizing its conductivity. On the other hand, if it is used as a coating solution, it is possible to provide a circuit, an electrode, etc. having high conductivity and low resistance.

  Furthermore, it is possible to provide a conductive adhesive, a conductive film, a circuit, an electrode, and the like that are superior in weather resistance, heat resistance, chemical resistance, and the like as compared with the case where an organic conductive material is used.

EXAMPLES Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

Example 1 (Au / Ni)
Preparation of composite metal fine particle (1) dispersion In a metal salt aqueous solution in which 19 g of chloroauric acid tetrahydrate (9 g as Au) was dissolved in 16000 g of pure water, citric acid 3 having a concentration of 1.0% by weight as a complexing stabilizer 1660 g of an aqueous sodium solution and 140 g of sodium borohydride having a concentration of 0.1% by weight as a reducing agent were added.
The mixture was stirred at 20 ° C. for a time to obtain a dispersion of metal fine particles. The obtained dispersion was purified by ultra-cleaning and then concentrated to obtain a dispersion of 5.0 wt% Au fine particles (metal fine particles (B-1)) in terms of metal.

  The pH of the metal fine particle (B-1) dispersion was 6, and the average particle size was 5 nm.

Next, 9 g of nickel powder (Sumitomo Electric Industries, Ltd .: average particle size 200 nm) is added to 71 g of pure water, and after mixing and stirring, the pH is adjusted to 9 to obtain a dispersion of nickel particles (metal fine particles (A-1)). It was. To this was added 20 g of a metal fine particle (B-1) dispersion (1 g as Au), and the mixture was stirred for 1 hour at 20 ° C. in a nitrogen atmosphere, and then dispersed with a nanomizer to disperse Au / Ni composite metal fine particles. A liquid was obtained. The obtained dispersion was separated and collected by a centrifuge, dispersed again in pure water, adjusted to pH 6 and used as a dispersion of 10% by weight of Au / Ni composite metal fine particles (1) in terms of solid content. .

The obtained Au / Ni composite metal fine particles (1) have an Au content of 10% by weight and a streaming potential of -1.
It had a surface potential at 30 mV, and the average particle size of the composite metal fine particles (1) was 210 nm.

  In addition, the average particle diameter measured the 100 particle | grains, image | photographed the transmission electron micrograph (TEM), and used the average value. In addition, the flow potential was measured using a particle charge detector manufactured by Mutek Co., Ltd., with a composite metal fine particle dispersion having a metal fine particle concentration of 1 wt%.

  The stability of the obtained Au / Ni composite metal fine particle (1) dispersion was evaluated according to the following criteria.

After stopping the stirring of the dispersion, no sediment was observed for 60 minutes or more: ◎
After stopping the stirring of the dispersion, sediment was observed in less than 30-60 minutes:
After stopping the stirring of the dispersion, a precipitate was observed in less than 3 to 30 minutes: Δ
After stopping the stirring of the dispersion, sediment was observed in 0 to 3 minutes or less: ×
The results are shown in Table 1.

Preparation of conductive film (1) Water-soluble polyester resin having a resin concentration of 34% by weight (10 g) in a dispersion of composite metal fine particles (1) (
Toyobo Co., Ltd .: 2.9 g of Vylonal MD-1200) was added to prepare a conductive film-forming paint (1). Next, the conductive film-forming paint (1) was applied onto the PET film by a bar coater method and dried at 120 ° C. for 30 minutes to prepare a conductive film (1). About the electroconductive film (1), it measured with the surface resistance measuring apparatus (Mitsubishi Chemical Corporation make: Lorestar).

  The results are shown in Table 1.

Example 2 (Pt / Ni)
Preparation of composite metal fine particle (2) dispersion In a metal salt aqueous solution in which 25 g of chloroplatinic acid hexahydrate (9 g as Pt) is dissolved in 16000 g of pure water, citric acid 3 having a concentration of 1.0% by weight as a complexing stabilizer 1660 g of an aqueous sodium solution and 140 g of sodium borohydride having a concentration of 0.1% by weight as a reducing agent were added, and 1 in a nitrogen atmosphere.
The mixture was stirred at 20 ° C. for a time to obtain a dispersion of metal fine particles. The obtained dispersion was purified by ultra-cleaning and concentrated to obtain a dispersion of Pt fine particles (metal fine particles (B-2)) having a concentration of 5.0% by weight in terms of metal. The pH of the metal fine particle (B-2) dispersion was 6, and the average particle size was 2 nm.

Subsequently, 20 g (1 g as Pt) of the metal fine particle (B-2) dispersion was added to the metal fine particle (A-1) dispersion prepared in the same manner as in Example 1, and stirred at 20 ° C. for 1 hour in a nitrogen atmosphere. After that, dispersion treatment was performed with a nanomizer to obtain a dispersion of Pt / Ni composite metal fine particles. The resulting dispersion is
It was separated and collected by a centrifugal separator, dispersed in pure water, adjusted to pH 6, and used as a dispersion of 10 wt% Pt / Ni composite metal fine particles (2) in terms of solid content. The obtained Pt / Ni composite metal fine particles (2) had a Pt content of 10% by weight, a streaming potential of −120 mV, a surface potential, and an average particle size of 204 nm. Further, the stability of the Pt / Ni composite metal fine particle (2) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (2) A conductive film (2) was prepared in the same manner as in Example 1 except that 10 g of the dispersion of composite metal fine particles (2) was used. The surface resistance value of the conductive film (2) was measured.

  The results are shown in Table 1.

Example 3 (Pd / Ni)
Preparation of composite metal fine particle (3) dispersion In a metal salt aqueous solution in which 22.5 g of palladium nitrate dihydrate (9 g as Pt) was dissolved in 230 g of pure water, trisodium citrate having a concentration of 30% by weight as a complexing stabilizer 460 g of an aqueous solution and 187 g of ferrous sulfate heptahydrate having a concentration of 25% by weight as a reducing agent were added and stirred at 20 ° C. for 20 hours in a nitrogen atmosphere to obtain a dispersion of metal fine particles. Metal fine particles were separated and recovered from the obtained dispersion by a centrifugal separator, and redispersed in pure water to obtain a dispersion of Pd fine particles (metal fine particles (B-3)) having a concentration of 5.0% by weight in terms of metal. . The pH of the metal fine particle (B-3) dispersion is 5, and the average particle size is 3.
nm.

Next, 20 g (1 g as Pd) of the metal fine particle (B-3) dispersion was added to the metal fine particle (A-1) dispersion prepared in the same manner as in Example 1, and the mixture was stirred at 20 ° C. for 1 hour in a nitrogen atmosphere. After that, dispersion treatment was performed with a nanomizer to obtain a dispersion of Au / Ni composite metal fine particles. The resulting dispersion is
It was separated and collected by a centrifugal separator, dispersed in pure water, adjusted to pH 6, and used as a dispersion of 10 wt% Pd / Ni composite metal fine particles (3) in terms of solid content. The obtained Pd / Ni composite metal fine particles (3) had a Pd content of 10% by weight, a streaming potential of -98 mV and a surface potential, and the composite metal fine particles (3) had an average particle size of 206 nm. . In addition, the stability of the Pd / Ni composite metal fine particle (3) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (3) A conductive film (3) was prepared in the same manner as in Example 1, except that 10 g of the dispersion of composite metal fine particles (3) was used. About the conductive film (3), the surface resistance value was measured.

  The results are shown in Table 1.

Example 4 (Ag / Ni)
Preparation of composite metal fine particle (4) dispersion In a metal salt aqueous solution in which 14.2 g of silver nitrate (9 g as Ag) is dissolved in 230 g of pure water, 460 g of a trisodium citrate aqueous solution with a concentration of 30% by weight as a complexing stabilizer and a reducing agent As a result, 93 g of ferrous sulfate heptahydrate having a concentration of 25% by weight was added and stirred at 20 ° C. for 1 hour in a nitrogen atmosphere to obtain a dispersion of metal fine particles. Metal fine particles were separated and recovered from the obtained dispersion by a centrifugal separator and redispersed in pure water to obtain a dispersion of Ag fine particles (metal fine particles (B-4)) having a concentration of 5.0% by weight in terms of metal. . The pH of the metal fine particle (B-4) dispersion was 5, and the average particle size was 4 nm.

Next, 20 g (1 g as Ag) of the metal fine particle (B-4) dispersion was added to the metal fine particle (A-1) dispersion prepared in the same manner as in Example 1, and the mixture was stirred at 20 ° C. for 1 hour in a nitrogen atmosphere. After that, dispersion treatment was performed with a nanomizer to obtain a dispersion of Au / Ni composite metal fine particles. The resulting dispersion is
It was separated and collected by a centrifugal separator, dispersed in pure water, adjusted to pH 6 and used as a dispersion of Ag / Ni composite metal fine particles (4) of 10% by weight in terms of solid content. The resulting Ag / Ni composite metal fine particles (4) have an Ag content of 10% by weight, a flow potential of -80 mV and a surface potential.
The average particle size was 208 nm. Further, the stability of the Ag / Ni composite metal fine particle (4) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (4) A conductive film (4) was prepared in the same manner as in Example 1, except that 10 g of the dispersion of composite metal fine particles (4) was used. The surface resistance value of the conductive film (4) was measured.

  The results are shown in Table 1.

Example 5 (Ag-Pd / Ni)
Preparation of composite metal fine particle (5) dispersion In 230 g of pure water, complexed with a metal salt aqueous solution in which 11.3 g of palladium nitrate dihydrate (4.5 g as Pt) and 7.1 g of silver nitrate (4.5 g as Ag) were dissolved. 460 g of a trisodium citrate aqueous solution having a concentration of 30% by weight as a stabilizer and ferrous sulfate heptahydrate 187 having a concentration of 25% by weight as a reducing agent
g was added and stirred at 20 ° C. for 20 hours under a nitrogen atmosphere to obtain a dispersion of metal fine particles. Metal fine particles are separated and recovered from the obtained dispersion liquid by a centrifugal separator, redispersed in pure water, and dispersed in a metal-converted Ag-Pd alloy fine particle (metal fine particle (B-5)) having a concentration of 5.0% by weight. Liquid. The pH of the metal fine particle (B-5) dispersion was 5, and the average particle size was 5 nm.

Next, 20 g of the metal fine particle (B-5) dispersion (1 g as Ag-Pd) was added to the metal fine particle (A-1) dispersion prepared in the same manner as in Example 1, and the mixture was heated at 20 ° C. for 1 hour in a nitrogen atmosphere. Then, the dispersion was processed with a nanomizer to obtain a dispersion of Ag-Pd / Ni composite metal fine particles. The obtained dispersion was separated and collected by a centrifugal separator, dispersed in pure water, adjusted to pH 6 and 10% by weight of Ag-Pd / Ni composite metal fine particles (5) in terms of solid content. did. The obtained Ag—Pd / Ni composite metal fine particles (5) have an Ag—Pd content of 10% by weight, a streaming potential of −160 mV and a surface potential, and the average particle size of the composite metal fine particles (5) is It was 210 nm. In addition, the stability of the Ag—Pd / Ni composite metal fine particle (5) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (5) A conductive film (5) was prepared in the same manner as in Example 1, except that 10 g of the dispersion of composite metal fine particles (5) was used. The surface resistance value of the conductive film (5) was measured.

  The results are shown in Table 1.

Example 6 (Ag-Pd / Fe)
Preparation of Composite Metal Fine Particle (6) Dispersion An Ag—Pd alloy fine particle (B-5) dispersion was prepared in the same manner as in Example 5.

Next, 9 g of iron powder (manufactured by Vacuum Metallurgical Co., Ltd .: average particle size 200 nm) was added to 71 g of pure water, and after mixing and stirring, the pH was adjusted to 9 to obtain a dispersion of iron particles (metal fine particles (A-2)). Next, 20 g of Ag-Pd alloy fine particle (B-5) dispersion (1 g as Ag-Pd) was added to the metal fine particle (A-2) dispersion and stirred at 20 ° C. for 1 hour in a nitrogen atmosphere. Then, a dispersion of Ag—Pd / Fe composite metal fine particles was obtained. The obtained dispersion was separated and collected by a centrifuge, dispersed in pure water, adjusted to pH 6 and 10% by weight of Ag-Pd / Fe composite metal fine particles (6) in terms of solid content. did. The obtained Ag—Pd / Fe composite metal fine particles (6) have an Ag—Pd content of 10% by weight, a streaming potential of −97 mV and a surface potential. The average particle size of the composite metal fine particles (6) is 210 nm. Further, the stability of the Ag—Pd / Fe composite metal fine particle (6) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (6) A conductive film (6) was prepared in the same manner as in Example 1 except that 10 g of the dispersion of composite metal fine particles (6) was used. The surface resistance value of the conductive film (6) was measured.

  The results are shown in Table 1.

Example 7 (Au / Ag)
Preparation of Composite Metal Fine Particle (7) Dispersion A metal fine particle (B-1) dispersion was prepared in the same manner as in Example 1.

Next, 9 g of Ag powder (manufactured by Tokuroku Honten Co., Ltd .: average particle size 500 nm) was added to 71 g of pure water, and after mixing and stirring, the pH was adjusted to 6 to obtain a dispersion of Ag particles (metal fine particles (A-3)).

Next, 20 g of the metal fine particle (B-1) dispersion (1 g as Au) is added to the metal fine particle (A-3) dispersion, and the mixture is stirred for 1 hour at 20 ° C. in a nitrogen atmosphere. As a result, a dispersion of Ag-Pd / Ni composite metal fine particles was obtained. The obtained dispersion was separated and collected by a centrifuge, dispersed in pure water, adjusted to pH 6 and used as a dispersion of 10% by weight of Au / Ag composite metal fine particles (7) in terms of solid content. The obtained Au / Ag composite metal fine particles (7) have an Au content of 10% by weight, a streaming potential of -78 mV and a surface potential, and the composite metal fine particles (7) have an average particle size of 510.
nm. In addition, the stability of the Au / Ag composite metal fine particle (7) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (7) A conductive film (7) was prepared in the same manner as in Example 1, except that 10 g of the dispersion of composite metal fine particles (7) was used. The surface resistance value of the conductive film (7) was measured.

  The results are shown in Table 1.

Example 8 (Au / Fe)
Preparation of composite metal fine particle (8) dispersion A metal salt aqueous solution in which 19 g of chloroauric acid tetrahydrate (9 g as Au) was dissolved in 16000 g of pure water was reduced with 800 g of a trisodium citrate aqueous solution having a concentration of 1.0% by weight. As an agent, 140 g of sodium borohydride having a concentration of 0.1% by weight was added and stirred at 20 ° C. for 1 hour in a nitrogen atmosphere to obtain a dispersion of metal fine particles. The obtained dispersion was purified by ultra-cleaning and then concentrated to obtain a dispersion of Au fine particles (metal fine particles (B-6)) having a concentration of 5.0% by weight in terms of metal. The pH of the metal fine particle (B-6) dispersion was 6, and the average particle size was 15 nm.

Next, 20 g (1 g as Au) of a metal fine particle (B-6)) was added to the metal fine particle (A-1) dispersion prepared in the same manner as in Example 1, and the mixture was heated at 20 ° C. for 1 hour in a nitrogen atmosphere. After stirring, the dispersion process was performed with a nanomizer to obtain a dispersion of Au / Fe composite metal fine particles. The obtained dispersion was separated and collected by a centrifuge, dispersed in pure water, adjusted to pH 6 and used as a dispersion of 10% by weight of Au / Fe composite metal fine particles (8) in terms of solid content. The obtained Au / Fe composite metal fine particles (8) had an Au content of 10% by weight, a flow potential of -82 mV and a surface potential, and the composite metal fine particles (8) had an average particle size of 230 nm. . In addition, the stability of the Au / Fe composite metal fine particle (8) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (8) A conductive film (8) was prepared in the same manner as in Example 1, except that 10 g of the dispersion of composite metal fine particles (8) was used. The surface resistance value of the conductive film (8) was measured.

  The results are shown in Table 1.

Comparative Example 1
Preparation of metal fine particle (R-1) dispersion A metal fine particle (A-1) dispersion was prepared in the same manner as in Example 1.

20 g of a polyvinyl pyrrolidone aqueous solution having a concentration of 5.0% by weight (polyvinyl pyrrolidone is 20% by weight with respect to the weight of the nickel metal) was added to the metal fine particle (A-1) dispersion, followed by stirring at 20 ° C. for 1 hour in a nitrogen atmosphere. Then, the dispersion process of the surfactant process metal microparticles was obtained by carrying out the dispersion process with a nanomizer. The obtained dispersion was separated and collected by a centrifugal separator, dispersed in pure water, adjusted to pH 6 and dispersed with 10% by weight of a surfactant in terms of solid content. Liquid. The flow potential of the obtained Ni metal fine particle (R-1) dispersion was substantially zero. The average particle size of the Ni metal fine particles (R-1) was 200 nm.

  In addition, the stability of the Ni metal fine particle (R-1) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (R-1) A conductive film (R-1) was prepared in the same manner as in Example 1, except that 10 g of the dispersion of metal fine particles (R-1) was used. The surface resistance value of the conductive film (R-1) was measured.

  The results are shown in Table 1. .

Comparative Example 2
Preparation of metal fine particle (R-2) dispersion In a metal salt aqueous solution in which 19 g of chloroauric acid tetrahydrate (9 g as Au) was dissolved in 16000 g of pure water, 800 g of a trisodium citrate aqueous solution having a concentration of 1.0 wt. As a reducing agent, 140 g of sodium borohydride having a concentration of 0.1% by weight was added and stirred at 50 ° C. for 1 hour in a nitrogen atmosphere to obtain a dispersion of metal fine particles. The obtained dispersion was purified by ultra-cleaning and then concentrated to obtain a dispersion of Au fine particles (metal fine particles (B-7)) having a concentration of 5.0% by weight in terms of metal. The pH of the metal fine particle (B-7) dispersion was 6, and the average particle size was 60 nm.

Next, 20 g (1 g as Au) of the metal fine particles (B-7)) was added to the metal fine particle (A-1) dispersion prepared in the same manner as in Example 1, and the mixture was heated at 20 ° C. for 1 hour in a nitrogen atmosphere. Then, the dispersion was performed with a nanomizer to obtain a dispersion of Au / Ni composite metal fine particles. The obtained dispersion was separated and collected by a centrifugal separator, dispersed in pure water, adjusted to pH 6 and a dispersion of 10 wt% Au / Ni composite metal fine particles (R-2) in terms of solid content. did. The obtained Au / Fe composite metal fine particles (R-2) had an Au content of 10% by weight, a streaming potential of −30 mV, and the composite metal fine particles (R-2) had an average particle size of 320 nm. In addition, the stability of the Au / Fe composite metal fine particle (R-2) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (R-2) A conductive film (R-2) was prepared in the same manner as in Example 1, except that 10 g of the dispersion of composite metal fine particles (R-2) was used. The surface resistance value of the conductive film (R-2) was measured.

  The results are shown in Table 1.

Comparative Example 3
Preparation of metal fine particle (R-3) dispersion A metal fine particle (A-2) dispersion was prepared in the same manner as in Example 6.

20 g of a polyvinyl pyrrolidone aqueous solution having a concentration of 5.0% by weight (20% by weight of polyvinyl pyrrolidone with respect to the weight of iron metal) is added to the metal fine particle (A-2) dispersion,
After stirring at 0 ° C., dispersion treatment was performed with a nanomizer to obtain a dispersion of surfactant-treated metal fine particles. The obtained dispersion was separated and collected by a centrifugal separator, dispersed in pure water, adjusted to pH 6 and dispersed with 10% by weight of a surfactant in terms of solid content. Liquid. The flow potential of the obtained Fe metal fine particle (R-3) dispersion was substantially zero. The average particle size of the Fe metal fine particles (R-3) was 200 nm. Moreover, the stability of the Fe metal fine particle (R-3) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (R-3) A conductive film (R-3) was prepared in the same manner as in Example 1, except that 10 g of the dispersion of Fe metal fine particles (R-3) was used. The surface resistance value of the conductive film (R-3) was measured.

  The results are shown in Table 1.

Comparative Example 4
Preparation of metal fine particle (R-4) dispersion A metal fine particle (A-3) dispersion was prepared in the same manner as in Example 7.

20 g of a polyvinyl pyrrolidone aqueous solution having a concentration of 5.0% by weight (20% by weight of polyvinyl pyrrolidone with respect to the weight of silver metal) was added to the metal fine particle (A-3) dispersion, and the mixture was stirred at 20 ° C. for 1 hour in a nitrogen atmosphere. Then, the dispersion process of the surfactant process metal microparticles was obtained by carrying out the dispersion process with a nanomizer. The obtained dispersion was separated and collected by a centrifugal separator, dispersed in pure water, adjusted to pH 6 and treated with 10% by weight of surfactant in terms of solid content to disperse fine metal particles (R-4). Liquid. The flow potential of the obtained Ag metal fine particle (R-4) dispersion was substantially zero. The average particle diameter of the Ag metal fine particles (R-4) was 500 nm. In addition, the stability of the Ag metal fine particle (R-4) dispersion was evaluated.

  The results are shown in Table 1.

Preparation of conductive film (R-4) A conductive film (R-4) was prepared in the same manner as in Example 1 except that 10 g of the dispersion of Fe metal fine particles (R-4) was used. The surface resistance value of the conductive film (R-4) was measured.

  The results are shown in Table 1.

Claims (12)

The fine metal particles (A) having an average particle diameter (D _A ) in the range of 50 nm to 5 μm, the standard electrode potential is higher than the fine metal particles (A), and the average particle diameter (D _B ) is in the range of 1 nm to 20 nm. Stirring while maintaining the pH of the mixed dispersion with the metal fine particles (B) at 4 to 10, the composite metal fine particle dispersion having the metal fine particles (B) supported on the surface of the metal fine particles (A) Manufacturing method. The ratio between the average particle diameter (D _B ) and the average particle diameter (D _A ), (D _B ) / (D _A ) is in the range of 1/5000 to 1/5. A method for producing the described composite metal fine particle dispersion.   3. The composite metal fine particle dispersion according to claim 1, wherein a difference in standard electrode potential between the metal fine particles (A) and the metal fine particles (B) is in the range of 0.1 to 4.1 V. 4. Method. The metal fine particles (A) are Ni, Al, Mg, Ti, Fe, In, Co, Sn, Mo, Cu, Ru,
One or more metals selected from Rh, Pd, and Ag, and the metal fine particles (B) are Rh, Ru,
2. One or more metals selected from Pd, Ag, Pt, Ir, and Au
The manufacturing method of the composite metal microparticle dispersion liquid in any one of -3.   The weight ratio of the metal fine particles (A) to the metal fine particles (B) is in the range of 1 to 50 parts by weight of the metal fine particles (B) with respect to 100 parts by weight of the metal fine particles (A). The manufacturing method of the composite metal microparticle dispersion liquid in any one of 1-4.   The flow potential of the obtained composite metal fine particle dispersion is in the range of -400 to -50 mV when the concentration of the composite metal fine particles is 1% by weight. A method for producing a composite metal fine particle dispersion. On the surface of the metal fine particles (A) having an average particle diameter (D _A ) in the range of 50 nm to 5 μm, the standard electrode potential is higher than that of the metal fine particles (A), and the average particle diameter (D _B ) is in the range of 1 nm to 20 nm. A composite metal fine particle dispersion, wherein the composite metal fine particles on which the metal fine particles (B) are supported are dispersed.   8. The composite metal fine particle dispersion according to claim 7, wherein the flow potential of the dispersion when the concentration of the composite metal fine particles is 1% by weight is in the range of −40 to −500 mV. The ratio between the average particle diameter (D _B ) and the average particle diameter (D _A ), (D _B ) / (D _A ) is in the range of 1/5000 to 1/5. The composite metal fine particle dispersion described.   10. The composite metal fine particle dispersion according to claim 7, wherein a difference in standard electrode potential between the metal fine particles (A) and the metal fine particles (B) is in the range of 0.1 to 4.1 V. 10. liquid. The metal fine particles (A) are Ni, Al, Mg, Ti, Fe, In, Co, Sn, Mo, Cu, Ru,
One or more metals selected from Rh, Pd, and Ag, and the metal fine particles (B) are Rh, Ru,
8. One or more metals selected from Pd, Ag, Pt, Ir, and Au
The composite metal fine particle dispersion according to any one of 10 to 10.   The weight ratio of the metal fine particles (A) to the metal fine particles (B) is in the range of 1 to 50 parts by weight of the metal fine particles (B) with respect to 100 parts by weight of the metal fine particles (A). The composite metal fine particle dispersion according to any one of 7 to 11.