JP2005142580A5 - - Google Patents

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Publication number
JP2005142580A5
JP2005142580A5 JP2004359309A JP2004359309A JP2005142580A5 JP 2005142580 A5 JP2005142580 A5 JP 2005142580A5 JP 2004359309 A JP2004359309 A JP 2004359309A JP 2004359309 A JP2004359309 A JP 2004359309A JP 2005142580 A5 JP2005142580 A5 JP 2005142580A5
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JP
Japan
Prior art keywords
electronic device
heat conducting
electronic
support means
conducting means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004359309A
Other languages
Japanese (ja)
Other versions
JP2005142580A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2004359309A priority Critical patent/JP2005142580A/en
Priority claimed from JP2004359309A external-priority patent/JP2005142580A/en
Publication of JP2005142580A publication Critical patent/JP2005142580A/en
Publication of JP2005142580A5 publication Critical patent/JP2005142580A5/ja
Pending legal-status Critical Current

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Claims (8)

回路を有する回路基板と、
前記回路で発生した熱を伝導する熱伝導手段と、
前記回路で発生した熱による前記熱伝導手段の温度よりも使用環境温度が低い電子素子と、
前記回路基板と前記熱伝導手段と前記電子素子とを支持する支持手段と、を有し、
前記支持手段は、前記熱伝導手段と前記電子素子との間に配置され、
前記支持手段への前記熱伝導手段の投影面と、前記支持手段への前記電子素子の投影面とが重ならないような配置である電子機器。
A circuit board having a circuit;
Heat conduction means for conducting heat generated in the circuit;
An electronic element having a use environment temperature lower than the temperature of the heat conducting means due to heat generated in the circuit;
A support means for supporting the circuit board, the heat conducting means, and the electronic element;
The support means is disposed between the heat conducting means and the electronic element;
An electronic apparatus having an arrangement such that a projection surface of the heat conducting means on the support means and a projection surface of the electronic element on the support means do not overlap .
回路を有する回路基板と、
前記回路で発生した熱を伝導する熱伝導手段と、
前記回路で発生した熱による前記熱伝導手段の温度よりも使用環境温度が低い電子素子と、
前記回路基板と前記熱伝導手段と前記電子素子とを支持する支持手段と、を有し、
前記支持手段は、前記熱伝導手段と前記電子素子との間に配置され、
記録媒体たる光ディスクへの前記熱伝導手段の投影面と、前記記録媒体たる光ディスクへの前記電子素子の投影面とが重ならないような配置である電子機器
A circuit board having a circuit;
Heat conduction means for conducting heat generated in the circuit;
An electronic element having a use environment temperature lower than the temperature of the heat conducting means due to heat generated in the circuit;
A support means for supporting the circuit board, the heat conducting means, and the electronic element;
The support means is disposed between the heat conducting means and the electronic element;
An electronic apparatus having an arrangement such that a projection surface of the heat conducting means on an optical disc as a recording medium and a projection surface of the electronic element on the optical disc as a recording medium do not overlap .
請求項1又は2に記載の電子機器であって、
前記電子素子はレーザである電子機器
The electronic device according to claim 1 or 2,
An electronic device in which the electronic element is a laser .
請求項1に記載の電子機器であり、
前記熱伝導手段は、端部に突起部を形成し、
前記熱伝導手段の突起部は、前記支持手段と平行な面と略垂直な面へ曲がっており、前記電子機器の筐体と接触している電子機器
The electronic device according to claim 1,
The heat conducting means forms a protrusion at the end,
The protrusion of the heat conducting means is an electronic device that is bent to a surface substantially perpendicular to a surface parallel to the support means and is in contact with a housing of the electronic device .
請求項2に記載の電子機器であり、
前記熱伝導手段は、端部に突起部を形成し、
前記熱伝導手段の突起部は、前記光ディスクと平行な面と略垂直な面へ曲がっており、前記電子機器の筐体と接触している電子機器
The electronic device according to claim 2,
The heat conducting means forms a protrusion at the end,
The protrusion of the heat conducting means is an electronic device that is bent to a surface substantially perpendicular to a surface parallel to the optical disk and is in contact with a housing of the electronic device .
請求項1乃至5いずれか記載の電子機器であって、
前記電子機器はDVDに情報を記録するDVDカメラであり、
前記熱伝導手段は、銅板であり、
前記支持手段は、ステンレス板である電子機器
An electronic device according to any one of claims 1 to 5,
The electronic device is a DVD camera that records information on a DVD;
The heat conducting means is a copper plate,
The support means is an electronic device that is a stainless steel plate .
請求項1乃至5いずれか記載の電子機器であって、
前記電子機器は、撮影レンズを有し、
前記撮影レンズを支持する第二の支持手段を有する電子機器
An electronic device according to any one of claims 1 to 5,
The electronic device has a photographic lens,
Electronic equipment having second support means for supporting the photographing lens .
請求項7に記載の電子機器であって、
前記第二の支持手段は前記撮影レンズの種類に応じて交換できる電子機器

The electronic device according to claim 7,
The second support means is an electronic device that can be exchanged according to the type of the photographing lens .

JP2004359309A 2002-12-26 2004-12-13 Electronic apparatus Pending JP2005142580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004359309A JP2005142580A (en) 2002-12-26 2004-12-13 Electronic apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002375853 2002-12-26
JP2004359309A JP2005142580A (en) 2002-12-26 2004-12-13 Electronic apparatus

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003074798A Division JP2004253752A (en) 2002-12-26 2003-03-19 Electronic apparatus

Publications (2)

Publication Number Publication Date
JP2005142580A JP2005142580A (en) 2005-06-02
JP2005142580A5 true JP2005142580A5 (en) 2006-03-23

Family

ID=34702768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004359309A Pending JP2005142580A (en) 2002-12-26 2004-12-13 Electronic apparatus

Country Status (1)

Country Link
JP (1) JP2005142580A (en)

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