JP2005134198A - Ceramic structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic structure having high bonding strength and positioning accuracy of a connection part therein formed by bonding a plurality of ceramic bodies. <P>SOLUTION: In this large-sized ceramic structure 1 formed by bonding a plurality of frame bodies 1a, 1b comprising ceramics, a recessed part 3 and a projection part 4 are formed respectively on at least connection parts 2 of each frame body 1a, 1b, and the recessed part 3 and the projection part 4 are interfitted together, and the connection parts 2 are connected by a pin 5 comprising the ceramics. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a ceramic structure for a precision positioning device used for various precision processing machines or precision measuring instruments, semiconductors, liquid crystal exposure apparatuses, etc., and a device that repeats high-speed movement.

  Ceramic parts such as alumina are often used as structural parts of positioning devices used in semiconductors, liquid crystal manufacturing apparatuses, and the like as insulating parts, corrosion-resistant parts, and lightweight / high-rigidity members.

  FIG. 5 shows a basic structure of a typical positioning device. This is a stage component for sample loading, and the stage is composed of an X slide 13, a Y slide 14 and a top plate 15, and reflection mirrors 11 and 12 for position measurement in order to move in the X and Y directions.

  The drive is driven by a linear motor or the like with an air slide. These structural members have been made hollow by rib structures or joints, etc. to reduce the weight, and further to reduce the weight with aluminum metal, but because of insufficient rigidity, ceramic is used. It has become.

  In addition, the structural members of semiconductor and liquid crystal manufacturing apparatuses are becoming larger as generations progress, and these ceramic parts are also increasing in size year by year.

  However, in order to manufacture a large-sized ceramic component as a single unit, there is a technical problem in the size, and it has become difficult to cope with it.

  The conventional method for producing ceramic parts is to mold ceramic powder by die press molding, CIP molding which is a wet isostatic press, or cast molding, perform cutting, fire this, and then sinter the sintered body. The product is finished by grinding.

  Here, the size that can be molded is determined by the size of the press machine, and large press machines and dies are expensive, so if it is not a mass-produced product, the capital investment associated with the increase in size Is very difficult.

  Also, in CIP molding, there is a limit to the production size of the pressure water tank as well as the same reason as in press molding, and in casting molding, etc., cracking occurs due to insufficient strength at the time of demolding after molding or shrinkage during drying. There are various problems such as cracking during firing, cracking during processing due to the influence of internal stress after firing, etc., and it is difficult to produce large-sized and integral ceramic parts.

  Accordingly, it has been proposed that a ceramic structure formed by connecting a plurality of ceramic bodies is used. In Patent Document 1, as shown in FIG. 6A, a penetration shape including a penetration portion 22 and a beam 21 is provided. And a lid is joined to this and a hollow body is comprised, and it respond | corresponds to weight reduction and enlargement.

  When the ceramic structure is enlarged, generally, the flat surfaces 23 are bonded and fixed to each other with an adhesive 24 as shown in FIG. 6 (b), or as shown in FIG. 6 (c). There is a method in which a hole is made in a part, and a metal nut 25 is fixed through a metal bolt 25.

Further, Patent Document 2 proposes a ceramic structure composed of a plate-like body 31 and a beam 32 as shown in FIG. 7A and fixed with a metal bolt 33. As shown in FIG. 7 (b), this structure is composed of a divided lid 31a, bottom plate 31b, and side plate 31c, and an adhesive 35 is bonded to these abutting surfaces and screws are formed. A metal bush 34 is embedded and fastened with a bolt 33. In this joining, an adhesive and a bolt are used together to obtain a ceramic structure that has good vibration characteristics and is firmly fixed.
JP-A-11-142555 JP 2003-149363 A

  However, since the ceramic structure as shown in FIG. 6 (a) has a hollow shape, the ceramic structure is cut out from the solid body and processed, resulting in problems such as waste of raw materials and an increase in cutting time.

  In addition, when fixing what is joined only by bonding as shown in FIG. 6B, the method of fixing the one bonded with an adhesive with a tape or the like or fixing with a weight is used. The thickness is not stable, the thickness is increased to 0.2 to 0.5 m or more, and a sufficient bonding strength is not obtained due to the occurrence of an unbonded portion.

  Further, simply fixing with bolt fastening as shown in FIG. 6 (c) results in insufficient surface contact between the components, resulting in a reduction in vibration characteristics.

  Moreover, in the ceramic structure as shown in FIG. 7A composed of the plate-like body and the beams which are divided along with the increase in size, metal bolts 33 and metal bushes 34 are used. The effect of weight reduction will be reduced.

  The specific gravity of ceramics is about 3.8 for alumina ceramics, and 3.0 to 4.0 for other non-oxide ceramics, whereas the specific gravity of metal materials is about 8.0, approximately twice the weight. Therefore, adding a metal bolt 33, a metal bush 34, or the like for a firm joint will hinder weight reduction.

  Further, when the metal bolts 33 are fastened, the difference in thermal expansion from the ceramics often becomes a problem. Therefore, the ceramic structure shown in FIG. However, when these ceramic structures are used in semiconductors and liquid crystal manufacturing apparatuses, they particularly dislike dust and dust, so they are often heat-treated for dust adhesion before use, and heat is applied to 100 to 200 ° C. or higher. Sometimes.

For example, a typical alumina ceramic has a thermal expansion coefficient of about 7 × 10 ⁻⁶ / ° C., but a metal material is as large as about 12 × 10 ⁻⁶ / ° C. Elongation exceeds the elongation of ceramics, and loosening is likely to occur. When heat is applied in this way, due to the difference in thermal expansion of the material, the force due to the elongation of the metal bolts 33 causes the adhesion to peel off and the joint to be displaced, or the ceramic is stressed to break. There was a problem.

  In addition, when used in a device that is repeatedly heated, the metal bolt 33 is loosened by vibration during operation of the device, and the metal bolt 33 and nut are removed, causing a problem such as failure of the device. .

  The present invention has been made in view of the above-described problems, and the object thereof is a semiconductor composed of a structure composed of a plurality of ceramic parts, a large-sized structural part for a liquid crystal manufacturing apparatus, the weight reduction of its constituent members, The object is to provide a ceramic structure that achieves high rigidity and the like.

  The present invention is a large-sized ceramic structure formed by combining a plurality of ceramic frame bodies, each of which has a concave portion and a convex portion at least at a coupling portion, and the concave portion and the convex portion are fitted to each other. A ceramic structure is characterized in that the coupling portion is positioned by a pin made of ceramic.

  In addition, a plurality of concave portions and convex portions are formed in the coupling portion.

  Further, the pin is arranged at the center of the fitting portion of the concave portion and the convex portion.

  Furthermore, the pin has a truncated cone shape whose diameter decreases from the upper end toward the lower end.

  Still further, the coupling portion is joined through an adhesive, and an adhesive reservoir is provided around the fitting portion of the concave portion and the convex portion.

  Moreover, it is used as a manufacturing member for liquid crystal manufacturing apparatuses.

  The present invention is a large-sized ceramic structure formed by combining a plurality of ceramic frame bodies, each of which has a concave portion and a convex portion at least at a coupling portion, and the concave portion and the convex portion are fitted to each other. At the same time, since the coupling portion is positioned by the ceramic pin, the vertical displacement of the coupling portion of each frame can be prevented. Furthermore, it is possible to prevent lateral displacement by positioning the coupling portion with a ceramic pin. As a result, there is no deviation between the frames, and the adhesive layer of the joint portion can be kept small, so that stable strength can be maintained.

  In addition, since a plurality of concave portions and convex portions are formed in the coupling portion, the coupling portion can be fitted more stably. In addition to improving the bonding strength by increasing the bonding area when filling the adhesive, the concave and convex joints increase the resistance when the adhesive is applied and fixed during the bonding operation, and it becomes difficult to shift, Furthermore, rattling can be reduced by increasing the number of fittings between the ceramic pins and the pin holes of the frame when positioning with ceramic pins.

  Furthermore, since the said pin is arrange | positioned in the center of the fitting part of a recessed part and a convex part, each thickness in a coupling | bond part can be hold | maintained equally. If this pin is shifted to either side, when the bending force is applied to this joint, the thickness necessary to support the stress applied to the pin is not maintained, and the fitting part of the concave part and convex part is damaged. Therefore, the maximum strength of the fitting portion can be obtained by arranging in the center.

  Furthermore, since the pin has a truncated cone shape whose diameter decreases from the upper end to the lower end, the gap between the pin and the hole of the frame body can be minimized, so that the positioning accuracy during adhesive fixing is improved. It becomes possible to do.

  Furthermore, since the joint portion is joined via an adhesive and an adhesive reservoir is provided around the fitting portion of the concave portion and the convex portion, a stable supply of the adhesive is possible, and a gap between the adhesive layers is further provided. Can be kept as small as possible, so that the vibration characteristics of the respective frames can be made uniform, and variations in the natural vibration value can be prevented.

  In addition, because it is used as a liquid crystal manufacturing equipment building member, large structural parts can be manufactured, and by using a structural member that achieves lightweight and high rigidity, high-speed sliding and product stabilization can be achieved. it can.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  The ceramic structure of the present invention is a large-sized ceramic structure that is less deformed by a load and its own weight, is light and has high natural vibration, is made of a highly rigid ceramic material, and is a combination of a plurality of ceramic materials.

  FIG. 1 shows an embodiment of a ceramic structure of the present invention. FIG. 1A shows a ceramic structure 1 formed by combining square frames 1a and 1b each having a side of 500 mm and a thickness of 50 mm. FIG. 1B is an enlarged partial sectional view of the connecting portion 2 in FIG.

  The ceramic structure 1 is formed by combining a plurality of frame bodies 1a and 1b made of ceramics. Recesses 3 and protrusions 4 are formed in at least the connection portions 2 of the frame bodies 1a and 1b, respectively. The convex part 4 is fitted, and the coupling part 2 is connected to the center part of the fitting part 8 by a pin 5 made of ceramics.

  Accordingly, the vertical displacement of the coupling portion 2 of each frame 1a, 1b can be prevented, and the fitting portion 8 of the concave portion 3 and the convex portion 4 is positioned by the ceramic pin 5, whereby It is possible to prevent the lateral displacement of the connecting portion 2 of the bodies 1a and 1b.

  The pin 5 has the same outer diameter as that of the pin 5 and the diameter of the pin hole, and is inserted by applying pressure or by heating each frame body 1a, 1b to about 300 to 500 ° C., for example, by thermal expansion. The pin hole is inserted with a shrink fit that increases the diameter of the pin hole and inserts the pin 5.

  If this method is used, in addition to high accuracy in positioning, it can be firmly connected without using an adhesive, and therefore, it can be used in a high temperature atmosphere exceeding 300 ° C. This is because a resin adhesive having a relatively high adhesive strength usually has a heat resistance limit of 200 to 250 ° C., and therefore, in a high temperature atmosphere exceeding 300 ° C. when no adhesive is used. Use is also possible.

  Further, the frames 1a and 1b may be joined using an adhesive, or a ceramic screw may be used as the pin 5. In the case where the pin 5 is a ceramic screw, it is possible to connect the pin 5 by processing the female screw in at least one of the pin holes and inserting the pin 5 with the male screw.

  Further, when the number of the pins 5 is fixed in combination with an adhesive, positioning can be performed by providing at least two locations in one set of frame bodies 1a and 1b. For example, when one side of the frame bodies 1a and 1b is 500 mm, the positioning of the pins 5 can be set to about 200 to 300 mm, and the positioning can be further increased by disposing them apart.

  Further, when the pins 5 are fixed by press fitting, shrink fitting, or the like, the strength of the pins 5 is the strength of the coupling portion 2, and therefore it is desirable to provide as many pins 5 as possible. In this case, the pitch is 20 mm to 100 mm, and the pins 5 may be arranged so that the bending strength of the pins 5 is increased in consideration of the load applied to the frames 1a and 1b and the bending strength of the pins 5.

  In addition, a slight gap is provided at the boundary in the joint portion 2 of each frame 1a, 1b, and 0.02 to 0.05 mm when the adhesive is not used, when the adhesive is used. Is preferably 0.05 to 0.1 mm.

  In addition, as shown in FIG. 2, it is preferable that a plurality of concave portions 3 and convex portions 4 are formed in the coupling portion 2.

  As a result, the coupling portion 2 can be fitted in a more stable state, and when joining with an adhesive, the variation of the adhesive layer can be reduced, and the adhesive strength can be improved by increasing the adhesive area. Further, rattling of the pin 5 and the pin holes of the frame bodies 1a and 1b when positioning with the pin 5 can be reduced.

  In addition, since the number of the concave portions 3 and the convex portions 4 increases, the bonding area that provides the bonding strength increases. Therefore, the bonding strength is improved, and contact with the pins 5 when positioning with the ceramic pins 5 is performed. Since the sectional area of the pin hole of the concave portion 3 and the convex portion 4 to be increased increases, the shearing force from the pin hole of the concave portion 3 and the convex portion 4 acting on the pin 5 is dispersed, and the diameter of the pin 5 and the diameter of the pin hole are reduced. Since the length 7 of the coupling portion can be reduced by this, the weight can be reduced.

Furthermore, the number of the concave portions 3 and the convex portions 4 is desirably about half of the total thickness T of the ceramic structure 1 divided by the length 6 of the fitting portion. For example, when the thickness of the ceramic structure is 50 mm and the length 6 of the fitting portion is 10 mm,
(Thickness T of each frame 1a, 1b / length of fitting portion 6) / 2 = (50/10) /2=2.5
In this case, it is desirable to configure the number of the concave portions 3 and the convex portions 4 at two locations.

  The above formula indicates that the thickness t of the concave portion 3 and the convex portion 4 is substantially equal to the length 6 of the fitting portion, and the concave portion when the thickness t is larger than the length 6 of the fitting portion. Since the number of 3 and the convex portions 4 is small, the bonding area cannot be increased and the bonding strength cannot be increased. In addition, when the thickness t of the concave portion 3 and the convex portion 4 is smaller than the length 6 of the fitting portion, the strength of the concave portion 3 and the convex portion 4 forming the fitting portion 8 is lowered, and it is broken by bending stress. May be damaged.

  Moreover, it is preferable that the uneven | corrugated pitch of the recessed part 3 and the convex part 4 is equal. If the uneven pitch is not uniform, it will be difficult to machine, and the shape will be uneven in strength. When a load is applied, the difference between the strong and weak parts will increase, resulting in a large difference. It is conceivable that damage is likely to occur first from the weak part.

  Further, the corners and corners of the concave portion 3 and the convex portion 4 are preferably chamfered on the C surface and the R surface, so that stress concentration is avoided and the shape is not easily damaged. In this case, the chamfer size is preferably about 0.3 to 1.0 mm.

  In addition, this chamfering process should just be formed in any one of the recessed part 3 and the convex part 4 to fit.

  Further, the length 6 of the fitting portion of the concave portion 3 and the convex portion 4 is preferably about 50% of the length 7 of the coupling portion of each frame 1a, 1b, and is uniform to each frame 1a, 1b. Since force acts, it can fit firmly. When the length 6 of the fitting portion is 70% or more of the length 7 of the coupling portion, the thickness other than the length 6 of the fitting portion is reduced to 30% or less, so that the strength of the frames 1a and 1b can be maintained. Since it disappears, it is more preferable to set it to less than 70%. Further, when the length 6 of the fitting portion is as small as 30% or less, the fitting effect is reduced and the bonding area is also reduced, so that the strength sufficient to support each frame 1a, 1b may not be maintained. In addition, since the range in which the ceramic pin 5 is inserted becomes small, the thin pin 5 having low rigidity is inserted, and sufficient strength of the pin 5 for positioning at the time of bonding cannot be provided. .

  The pin 5 is preferably arranged at the center of the fitting portion 8 of the concave portion 3 and the convex portion 4.

  Thereby, the thickness of each frame 1a, 1b in the coupling | bond part 2 can be hold | maintained uniformly, and stress acts equally and can connect more firmly.

  The pin 5 is preferably made of the same material as the ceramics constituting the frames 1a and 1b. However, when the frames 1a and 1b are made of a combination of different materials, the different ceramic materials are used. It is preferable to form with ceramics having a substantially intermediate thermal expansion coefficient.

For example, one of the frames 1a and 1b is made of cordierite having a thermal expansion coefficient of 7.1 × 10 ⁻⁶ / ° C. and the other being low thermal expansion (thermal expansion coefficient of 1.0 × 10 ⁻⁶ / ° C. or less). In the case of a ceramic structure, silicon carbide (thermal expansion coefficient: 4.0 × 10 ⁻⁶ / ° C.) or silicon nitride (thermal expansion coefficient: 3.2 × 10 ⁻⁶ / ° C.) should be used as the pin material. Thus, it is possible to minimize the generated stress in the joint portion 2 of both the frame bodies 1a and 1b.

  Further, the diameter of the pin 5 is preferably about 30 to 50% of the length 6 of the fitting portion, and is a positioning for the purpose of preventing the lateral displacement of each frame 1a, 1b, and the adhesive is appropriate. Each frame 1a, 1b is pressed against each other until it becomes a proper adhesive layer, and is designed and manufactured so that it can be inserted when it comes to the correct position. Therefore, if it is too thin and weak, it will break and cannot be positioned. Moreover, when too large, since the thickness of the pin hole part of the fitting part 8 will decrease, it will be worried about the intensity | strength of each frame 1a, 1b.

  Moreover, about the diameter of the pin 5 and a pin hole, when fixing using an adhesive agent, it is preferable to process the diameter of a pin hole 0.1-0.2 mm larger than the diameter of the pin 5, and strong adhesion | attachment Strength is obtained. In the case of press-fitting or shrink-fitting, it is preferable to provide a fitting margin of about 0.2% or less, although it depends on the ceramic material. For example, when the diameter of the pin 5 is 5.0 mm It is preferable to manufacture the pin hole with 4.99 mm which is 0.2% smaller. In addition, it is desirable to keep it at about 0.1% for materials with relatively low strength and materials with low fracture toughness that are susceptible to chipping.

  Moreover, it is preferable to chamfer about 1 mm at the corners of the upper end surface and the lower end surface of the pin 5 and the opening portion of the pin hole. Even when there is a deviation, it is possible to smoothly insert the pin 5 into the pin hole.

  Further, as shown in FIG. 3, the pin 5 preferably has a truncated cone shape whose diameter decreases from the upper end toward the lower end.

  A pin hole provided in the center of the length 6 of the fitting portion of the concave portion 3 of the coupling portion 2 and the convex portion 4 of the coupling portion 2 with the outer diameter of the pin 5 for positioning and connecting each frame body 1a, 1b. Inserted into and fixed. Thereby, since the clearance gap between the pin 5 and a pin hole can be suppressed to the minimum, the positioning accuracy at the time of adhesion | attachment can be improved.

  Moreover, it is preferable that the diameter of an upper end surface is 15% or less of the length 6 of the fitting part of the recessed part 3 of the frame bodies 1a and 1b, and the convex part 4, and the part 5 will have each part. This is because the thickness of the film becomes too thin, which causes anxiety about strength.

  Such a truncated cone-shaped pin 5 is subjected to a small taper process with an inclination of 5 ° or less by an NC universal grinder, and an electrodeposition shape diamond tool inclined by a machining center in accordance with this angle is used to make a hole. The pin hole 5b is obtained by processing.

  Here, the inclination angle is determined in consideration of the length 7 of the connecting portion of each frame body and the thickness of the frame body, so long as the pin 5 does not penetrate when the pin 5 is inserted. However, the gradient is preferably 1 to 3 °.

  In addition, when the pin 5 has a truncated cone shape, even if the upper end of the pin 5 has a slightly larger diameter, the length of the pin 5 can be made longer, It is also possible to perform cutting by adjusting the long end of the pin, and since the pin 5 is joined in contact with the pin hole, the positioning accuracy can be further improved.

  Further, when connecting the frame bodies 1a and 1b using an adhesive, as shown in FIG. 4, an adhesive reservoir 9 is formed at the boundary between the recesses 3 and the fitting parts of the projections 4 of each frame 1a and 1b. 10 is preferably provided.

  As a result, the adhesive can be supplied stably and uniformly, and the gap between the adhesive layers can be kept small. Therefore, the natural vibration characteristics of the frames 1a and 1b become uniform, and variations in natural vibration values are prevented. be able to.

  At this time, the adhesive reservoir 9 is formed at the corner of the concave portion 3 of the frame 1b, and the adhesive reservoir 10 is formed at the corner of the convex portion 4 of the frame 1a, and the positions of the respective adhesive reservoirs 9, 10 do not overlap. As shown in FIG. 4, it is preferable to provide four recesses 3 and four protrusions 4 in total, two for each.

  The adhesive reservoirs 9 and 10 have a depth of 0.05 to 0.1 mm, and are formed to be an adhesive layer of 0.05 to 0.1 mm when the concave portion 3 and the convex portion 4 are joined. .

  Further, by arranging the adhesive reservoirs 9 and 10 at the corners, it is easy to process, and before joining the frames 1a and 1b, it can be processed using a blast process or a surface grinder.

  Further, as the type of adhesive, it is preferable to use an epoxy organic adhesive having a relatively high strength.

  A general organic adhesive has a reduced adhesive strength as the thickness increases. However, even if the amount is too small, anxiety is caused in the strength, and therefore, in general surface bonding, it is often performed at about 0.1 to 0.3 mm. However, the highest adhesive strength is in the vicinity of 0.05 to 0.1 mm, and this range is more preferable if the adhesive layer can be controlled.

  Here, when the thickness of the adhesive layer 8 is less than 50 μm, the adhesive strength may be extremely reduced. On the other hand, when it exceeds 100 μm, the adhesive strength is lowered and the maximum strength cannot be obtained.

  Moreover, even if the thickness of the adhesive layer of the coupling part 2 of the frames 1a and 1b is 50 to 100 μm, if the effective adhesion surface is less than 65% of the entire area of the fitting part 8, the natural vibration characteristic of the ceramic structure 1 is obtained. It falls and falls from the characteristics of the monolith.

  In addition, compared to the case where the entire surface of the fitting portion 8 is bonded, the frames 1a and 1b are partially in direct contact with each other, or when the adhesive layer has a small portion of 0.05 mm or less, If the adhesion area can be secured at 60% or more, high natural vibration characteristics can be maintained.

  For parts where dimensional accuracy is important, it is effective to provide an adhesive pool 8 and provide a part of contact between ceramics.

  Moreover, it is preferable that the surface of the adhesive reservoirs 9 and 10 is processed by lowering the portion to which the adhesive reservoirs 9 and 10 are applied by grinding or sandblasting by about 50 to 100 μm, and the adhesive is applied to this surface.

  A method for producing such a ceramic structure is that a predetermined ceramic raw material is formed by a general powder forming means such as CIP forming which is a wet isostatic pressing method, and is processed into a predetermined shape by cutting. In the case of a furnace or gas furnace or non-oxide ceramics, it is fired in a vacuum furnace or the like and finished by grinding.

  The recesses 3 of the frame bodies 1a and 1b and the fitting portions 8 of the protrusions 4 are cut as much as possible by cutting before firing, considering the polishing allowance after firing to be about 0.3 to 1.0 mm. It is preferable to process. This shape processing is processing that requires accuracy, and the fact that the grinding load can be reduced as much as possible leads to a reduction in processing time.

  The ceramic used here is made of a ceramic having a Young's modulus of 250 GPa or more or a specific rigidity of 90 GPa or more and a specific gravity of 3.9 or less, and each frame body 1a, 1b preferably has a hollow shape for weight reduction.

  A method for assembling such a ceramic structure 1 will be described.

  Here, the assembly method of the ceramic structure 1 of the present invention will be described.

  First, the frame 1 a formed with the convex portions 4 processed into a predetermined dimension and the frame 1 b formed with the concave portions 3 are joined by the fitting portion 8.

  Next, the pin 5 is inserted into the pin hole 5b and fixed so that the displacement of the coupling portion does not occur.

  In the case of using an adhesive, the adhesive is previously applied to the fitting portion 8 of the concave portion 3 and the convex portion 4, the frames 1a and 1b are pressed together, and the pin 5 is inserted into the pin hole 5b to be coupled. .

  When the pin 5 is press-fitted, the concave portion 3 and the convex portion 4 are joined by the fitting portion 8, and after confirming that the pin holes 5b of the frames 1a and 1b are aligned, Fixed by inserting under pressure.

  When the pins 5 are shrink-fitted, the frame bodies 1a and 1b are expanded in advance by, for example, about 400 ° C. with a dryer or the like, and heat treatment is applied to the pin holes 5b whose diameter has been increased by thermal expansion. It fixes by inserting the pin 5 which is not, and allowing it to cool. At this time, it is preferable to cool in the dryer so that cracking does not occur due to heat shock or the like.

  Moreover, when the adhesive reservoir 9 is given to the fitting part 8 of the recessed part 3 and the convex part 4, an adhesive is applied only to the part which gave the adhesive reservoir 9 of the fitting part 8 of each frame 1a, 1b. After applying and bonding to each other, the pin 5 is inserted into the pin hole 5b and fixed.

  When fixing the coupling portion 2 using an adhesive, it is preferable to take care not to move or vibrate until the adhesive is cured.

  FIG. 5 shows a configuration diagram of a stage portion of a positioning device using the ceramic structure 1 of the present invention.

  The stage includes an X slide 13, a Y slide 14, a top plate 15, a reflection mirror 11, and a reflection mirror 12 in order to move in the X and Y directions. The stage has a structure that allows air to float and move with a linear motor or the like.

  In these positioning devices such as an exposure apparatus, these ceramic structures are repeatedly moved and stopped at high speeds. Due to recent demands for high-speed positioning, the acceleration during acceleration and deceleration becomes very large. Small aluminum alloys and the like have large deformation and low rigidity, so it takes time to attenuate vibrations, and the vibration width is large, so the positioning accuracy is poor.

  Therefore, this problem can be solved by using a highly rigid material such as ceramic to reduce the deformation and to form a member having a small vibration width. Further, even if a shape that cannot be manufactured as an integral shape with an increase in size is divided into two or more small parts to obtain the ceramic structure 1 as in the present invention, the increase in size can be satisfied.

  In addition, it is ideal that the ceramic structure 1 is made of a combination of two or more different materials, so that it would be ideal to make the whole with a high-rigidity material. It is also possible to obtain a satisfactory effect by reducing the cost by increasing the rigidity of the portion.

  For example, by combining 99% alumina and 95% silicon carbide, if only alumina is used, the specific rigidity is 90 GPa, but silicon carbide can be 128 GPa. Therefore, the center portion is made of alumina, and the outer peripheral portion is made of silicon carbide, so that the weight of the outer peripheral portion can be reduced and the rigidity can be increased, so that a large structure having higher rigidity and weight can be provided. .

  In addition, the balance of the apparatus weight can be adjusted by combining with members having different specific gravities, and the vibration characteristic UP can be designed.

  In addition, it can be used to manufacture large structural parts by using it as a component for exposure equipment and liquid crystal manufacturing equipment, and by using structural members that have achieved light weight and high rigidity, high-speed sliding and product stabilization can be achieved. Can be planned.

  Next, various examples of the present invention were evaluated.

  First, each frame as shown in FIG. 1 was made of alumina ceramics having a size of 500 mm × 500 mm × height 60 mm and thickness 20 mm.

  As shown in Table 1, the number of concave portions or convex portions is formed in the joint portion of each frame body, and the length of the fitting portion is 10 mm, which is 50% of the length of the joint portion of the frame body.

  When using a pin, two places are provided at a pitch of 150 mm in the center of the fitting portion, and a hole having a diameter of 4.01 mm is provided in the central portion of the concave portion and the convex fitting portion having a length of 10 mm. The holes were connected by inserting pins made of alumina ceramics having a diameter of 3.99 mm and the same as the frame.

  In the case of using an adhesive, a curable resin such as an epoxy resin was used as a main ingredient and an elastic modulus of 40 GPa or more was used so that vibration characteristics were hardly affected. The adhesive layer at this time was set to be 0.05 to 0.1 mm.

  Further, as a comparative example, Sample 1 was manufactured by providing a frame without a step without providing a concave portion and a convex portion at the coupling portion and bonding and fixing it on a flat surface. Furthermore, as a comparative example, only the concavo-convex portion was not connected with the pin, the concave portion, the number of the convex portion was changed and the adhesion area was changed, and the diameter of the upper end surface of the pin and pin hole was 3.99 mm, A frustoconical shape with a lower end surface diameter of 3 mm, and four adhesive reservoirs of 0.05 to 0.1 mm at the boundary between the concave and convex fitting portions, 70% of the total adhesion area A sample was made as a sample.

  Each sample was evaluated for positional deviation at the time of bonding work, thickness of the adhesive layer, bending strength of the joint, and natural vibration value.

  In addition, the positional deviation at the time of adhesion | attachment work measured the positional deviation of the coupling | bond part of each frame after the adhesive agent hardened | cured.

  The thickness of the adhesive layer was determined by measuring the length of the joint portion of each frame in advance and measuring it again after adhesive curing.

  Further, the bending strength of the joint was measured by providing a metal fulcrum with a span of 500 mm on the lower side and applying a load to the joint from the upper side to measure the strength of the three-point bending.

  In addition, the natural vibration value was measured by measuring the resonance frequency with an FFT analyzer.

The evaluation results of each sample are shown in Table 1.

  As is clear from Table 1, sample No. No. 1 is a conventional flat surface on which concave and convex portions are not formed, which is a coupling portion. When pressure is applied to thin the adhesive layer during the bonding operation, positional displacement occurs and the tape is temporarily fixed with tape. However, a positional deviation of 0.5 mm occurred. Furthermore, when the adhesive layer was measured from the length of the original joint part, it was thick and varied as 0.2 to 0.5 mm, and the adhesive strength was as low as 516 MPa. In addition, the natural vibration value is as low as 237 Hz, indicating that the adhesion area is small. It is expected that the cause is that the adhesive layer is thick overall, there are variations, and there are partially unbonded portions.

  Sample No. 2, No. 7, no. No. 12 is a conventional coupling portion in which a concave portion and a convex portion are formed from a flat surface, and the number thereof is one, two, and three.

  By forming the concave and convex portions, the positional deviation was reduced to about 0.1 to 0.2. This is considered to be due to the increase in resistance due to the increase in the adhesion area during the adhesive curing, and the occurrence of positional deviation is less likely.

However, these samples were not of such a level that the adhesion thickness was 0.1 to 0.3 mm, the strength of the joint portion, and the natural vibration value were low and could be used.

  In addition, Sample No. 3-No. No. 6 has one concave portion and one convex portion and is provided with a ceramic pin for positioning.

  Since this sample has no misalignment, the thickness of the adhesive layer is also in the range of 0.05 to 0.1, the strength of the joint and the natural vibration value are high, and it has the same level of vibration characteristics as an integrated object. It was.

  As for the shape of the positioning ceramic pin, the frustum shape is more stable and thinner than the cylindrical shape, and the strength and natural vibration value of the joint portion are slightly higher. .

  Sample No. 5, no. In the case where the adhesive pool was formed in the concave portion of the 6 coupling portion and the fitting portion of the convex portion, the strength and natural vibration of the coupling portion were both high and particularly good.

  This is because the adhesive reservoir is partially provided and bonded around 0.05 mm of the adhesive layer having the highest adhesive strength, and the ceramics are in direct contact with each other at the portion where the adhesive reservoir is not provided. It is conceivable that the vibration characteristics are improved due to the area.

  Sample No. 8-No. 11, Sample No. 13-No. No. 16 has two concave portions and two convex portions, and three concave portions and three convex portions.

The evaluation result shows the same tendency as that in which one concave portion and one convex portion are formed,
The thickness of the adhesive layer was stable at a thinner thickness of 0.05 to 0.07 mm, and the strength of the joint and the natural vibration value tended to be upward.

  This is because increasing the concave and convex portions of the coupling portion increases the adhesion area, and also increases the area that is in direct contact with the coupling portion, so it can be considered that it has become closer to an integrated object in a more characteristic manner. .

  As described above, in the large ceramic structure formed by joining a plurality of frames made of ceramics, a recess and a projection are formed at least at the coupling portion of each frame, and the recess and the projection are fitted. By positioning the coupling portion with the ceramic pin, it is possible to obtain a ceramic structure in which there is no displacement of the coupling portion, the adhesive layer is appropriate, and the strength and natural vibration value of the coupling portion is high.

(A) is the schematic and sectional drawing of the example of the ceramic structure of this invention. It is sectional drawing of the ceramic structure which consists of a coupling | bond part which provided two or more recessed parts and convex parts of this invention. It is sectional drawing of the ceramic structure whose ceramic pin for positioning and hole of this invention are truncated cone shape. It is sectional drawing of the ceramic structure which provided the adhesion pool in the fitting part of the recessed part and convex part of invention. A basic structure of a typical positioning device, which is a stage component for sample loading. (A) is a perspective view which shows the conventional ceramic structure, (b), (c) is the elements on larger scale. (A) is a perspective view which shows the conventional ceramic structure, (b) is the sectional drawing.

Explanation of symbols

1: Ceramic structure 1a: Frame 1b having a concave portion in the coupling portion: Frame body having a convex portion in the coupling portion 2: Coupling portion 3: Concavity 4: Convex portion 5: Pin 5b: Pin hole 6: Length 7: Joint length 8: Fitting portion 9: Recessed adhesive reservoir 10: Convex adhesive reservoir 11: Y direction reflecting mirror 12: X direction reflecting mirror 13: X slide 14: Y slide 15 : Top plate 21: Beam 22: Meat penetration part 23: Flat surface 24: Adhesive layer 25: Bolt 26: Nut 31: Plate body 31a: Lid 31b: Bottom plate 31c: Side plate 32: Beam 33: Bolt 34: Bush 35 : Adhesive T: Thickness of ceramic structure t: Thickness of recess or protrusion

Claims (5)

A large ceramic structure formed by bonding a plurality of frames made of ceramics, each of which has a recess and a protrusion formed at least at a connecting portion, and the recess and the protrusion are fitted and made of ceramic. A ceramic structure characterized in that a coupling portion is connected by a pin. The ceramic structure according to claim 1, wherein a plurality of concave portions and convex portions are formed in the joint portion. 3. The ceramic structure according to claim 1, wherein the pin is arranged in a central portion of a fitting portion of the concave portion and the convex portion. The ceramic structure according to claim 1, wherein the pin has a truncated cone shape whose diameter decreases from the upper end toward the lower end. The ceramic structure according to any one of claims 1 to 4, wherein the coupling portion is bonded through an adhesive and has an adhesive reservoir at a boundary between the fitting portion of the concave portion and the convex portion.

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