JP2005123455A - Metallic substrate structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metallic substrate structure for adhering a substrate to a metallic board with adhesive by preventing the adhesive from being substantially projected. <P>SOLUTION: This metallic substrate structure is provided with a substrate (20) and a metallic board (100) having a plurality of supporting parts (102, 103) for supporting the substrate, adhering parts (104) arranged between the plurality of supporting parts, and configured of differences in level from the plurality of supporting parts and grooves (105) formed between the plurality of supporting parts and the adhering parts. The substrate and the metallic board are adhered to each other with adhesive (30) between the substrate and the adhering parts and between the substrate and the grooves. In this metallic substrate structure, the adhesive is configured so as to be pushed out to a space formed between the supporting parts and the adhering parts, and so as not to be projected to the outside of the metallic board even when the substrate is pressurized/adhered. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a metal substrate structure composed of a metal plate and a substrate.

  When a high-power circuit board is commercialized, for example, an aluminum-based metal plate and a circuit board may be fixed in order to dissipate heat from the circuit board. Further, when a high-frequency circuit board constituting a planar antenna or the like is commercialized, for example, an aluminum-based metal plate and a circuit board may be fixed. Thus, when fixing a metal plate and a circuit board, after apply | coating an adhesive agent to a metal plate, a circuit board is pressurized / adhered and fixed.

  FIG. 5 shows an example of a state in which the circuit board 20 is pressure-bonded after applying the adhesive 30 on the metal plate 10. However, as shown in FIG. 5, the adhesive may protrude from the circuit board in order to pressurize the circuit board (see the protrusion 12 in FIG. 5).

  If the metal plate 10 is projected and enlarged with respect to the circuit board 20 in order to process the protrusion of the adhesive, there is a problem that the size of the final product increases.

  In addition, when the adhesive protrudes when the circuit board is pressed, the adhesive adheres to the pressurizing jig, and there is a problem that it takes time to maintain the jig.

  Furthermore, when using a conductive adhesive to improve the noise resistance of the circuit board, the problem is that the conductive adhesive that protrudes from the edge of the circuit board will short the pattern on the circuit board. was there.

  In addition, when fixing a semiconductor chip to a heat radiator with an adhesive, a technique is known in which a storage portion for storing the adhesive that protrudes from the outer peripheral portion of the heat radiator is provided (Patent Document 1). However, since the storage portion is provided in the outer peripheral portion of the object (semiconductor chip) to be fixed with the adhesive, there is a problem that the size of the radiator is further increased.

JP-A-9-205103

  Therefore, an object of the present invention is to provide a metal substrate structure that can solve the problems caused by the protruding adhesive even when the circuit board is fixed to the metal plate with an adhesive.

  Another object of the present invention is to provide a metal substrate structure that allows a circuit board to be fixed to a metal plate with an adhesive without substantially protruding the adhesive.

  In order to solve the above problems, in the metal substrate structure according to the present invention, a substrate, a plurality of support portions for supporting the substrate, and a step from the plurality of support portions are arranged between the plurality of support portions. A metal plate having a configured bonded portion and a plurality of support portions and a groove portion provided between the bonded portions, and the substrate and the metal plate are bonded by an adhesive between the substrate and the bonded portion and between the substrate and the groove portion. It is characterized by being. In this metal substrate structure, even if the substrate is pressed / bonded, the adhesive is only pushed out into the space formed between the support portion and the bonding portion, and does not protrude outside the metal plate. Has been.

  In the metal substrate structure according to the present invention, it is preferable to have a frame portion arranged with a predetermined height around the metal plate.

  In the metal substrate structure according to the present invention, the substrate is preferably supported in the frame portion. In the metal substrate structure according to the present invention, it is preferable that a tapered portion is provided at the end of the groove.

  According to the present invention, it is not necessary to make the metal plate large in anticipation of the sticking out of the adhesive, and the metal plate and the substrate are properly disposed without causing a problem that the adhesive adheres to the jig for pressing the substrate. It is possible to provide a metal substrate structure bonded to the substrate.

  A metal substrate structure according to the present invention will be described below with reference to the drawings.

  FIG. 1 shows a metal substrate structure 110 according to a first embodiment of the present invention. 1A is a plan view of the metal plate 100, FIG. 1B is a cross-sectional view taken along line AA ′ of the metal plate 100, and FIG. 1C is a circuit board that forms a planar antenna on the metal plate 100. A cross-sectional view of a metal substrate structure 110 with 20 attached thereto is shown.

  As illustrated, the metal plate 100 includes an end-side support portion 102 and a central support portion 103 for supporting the substrate 20 constituting the planar antenna, an adhesive portion 104 provided between the support portions, and a metal substrate structure 110. It has the fixing | fixed part 106 for fixing to another element. Further, a groove 105 is provided between the end-side support portion 102, the center support portion 103, and the bonding portion 104 (the grooves are indicated by hatching in the drawing).

  In the present embodiment, the width (W) of the metal plate 100 is 100 mm, the length (L) is 80 mm, the height (H) of the end side support part 102 and the center support part 103 is 2 mm, and the depth (D) of the groove is The step (S) between the end support portion 102 and the center support portion 103 and the bonding portion 104 is set to 0.5 mm. In the present embodiment, the width and length of the substrate 20 constituting the planar antenna are the same size as the metal plate 100, and the height (T) is set to 0.2 mm.

  The metal plate 100 is formed from a single metal plate having a predetermined size by a cutting method, but may be formed by a pressing method, a die casting method, or the like. The same applies to other metal plates 200, 300 and 400 described later.

  Next, a method for manufacturing the metal substrate structure 110 will be described.

  First, the adhesive 30 is applied to the groove 105 of the metal plate 100 by a dispenser (not shown) (see FIG. 1B), and the substrate 20 constituting the planar antenna is placed thereon, and a jig (not shown). To complete the metal substrate structure 110 (see FIG. 1C). The adhesive 30 is preferably conductive in order to improve noise resistance, but is not limited thereto. Even if the substrate 20 is pressurized, the adhesive 30 is only pushed out into the space between the end support portion 102 and the central support portion 103 and the bonding portion 104 and does not protrude outside the metal plate. Therefore, it is not necessary to make the metal plate large in anticipation of the adhesive sticking out, and it is possible to appropriately bond the metal plate and the substrate without causing a problem that the adhesive adheres to the jig for pressing the substrate. It becomes possible.

  In order to prevent the adhesive 30 from protruding outside the metal plate 100 even under pressure, the space between the end support part 102 and the central support part 103 and the adhesive part 104 is appropriately set. That is, it is important to set the step (S) appropriately. In the present embodiment, the step (S) is set to 0.5 mm, but is preferably set to a range of 0.5 to 1.0 mm.

  Further, the central support portion 103 is particularly useful for maintaining the flatness after the substrate 20 is bonded. Even if the central support 103 is not provided, it is possible to bond the metal plate and the substrate while preventing the adhesive 30 from protruding, but in this case, the bonded substrate 20 may bend and maintain flatness. There are cases where it cannot be done. In the case of a planar antenna (W: 100 mm, L: 80 mm) that is used for in-vehicle use and detects the presence of a front object, setting the amount of warpage of the antenna to 0.5 mm or less The ratio to the side lobe can be suppressed to a predetermined value or less, and is necessary for maintaining good antenna characteristics. For this purpose, it is necessary to provide an appropriate number of central support portions 103. For example, 2 to 3 are optimal per 100 mm, but 4 to 6 are preferably provided.

  FIG. 2 shows a metal substrate structure 210 in a second embodiment according to the present invention. 2A is a plan view of the metal plate 200, FIG. 2B is a cross-sectional view taken along the line AA ′ of the metal plate 200, and FIG. 2C is a metal in which the substrate 20 is bonded to the metal plate 200. A cross-sectional view of the substrate structure 210 is shown. The size of the metal substrate structure shown in FIG. 2 is the same as that of the first embodiment shown in FIG.

  As illustrated, the metal plate 200 includes an end support 202 and a center support 203 for supporting the substrate 20 constituting the planar antenna, an adhesive 204 provided between the supports, and a metal substrate structure 210. A fixing portion 206 for fixing to another structure is provided. Further, a groove 205 is provided between the end-side support part 202, the center support part 203, and the bonding part 204 (the groove is indicated by hatching in the drawing).

  In the present embodiment, as shown in FIG. 2A, tapered portions 208 are provided at the upper and lower ends of each groove 205 in the drawing. Further, the central support portion 203 and the adhesive portion 204 have a triangular cross section.

  Next, a method for manufacturing the metal substrate structure 210 will be described.

  First, the adhesive 30 is applied to the groove 205 of the metal plate 200 by a dispenser (not shown) (see FIG. 2B), and the substrate 20 constituting the planar antenna is placed thereon, and a jig (not shown). To complete the metal substrate structure 210 (see FIG. 2C). Even if the substrate 20 is pressurized, the adhesive 30 is only pushed out into the space between the end support portion 102 and the central support portion 103 and the bonding portion 104 and does not protrude outside the metal plate. Furthermore, in the present embodiment, since the tapered portions 208 are provided at the upper and lower end portions of the groove portion 205, it is possible to further prevent the adhesive 30 from protruding outside the metal plate 200. Therefore, it is not necessary to make the metal plate large in anticipation of the adhesive sticking out, and it is possible to appropriately bond the metal plate and the substrate without causing a problem that the adhesive adheres to the jig for pressing the substrate. It becomes possible.

  FIG. 3 shows a metal substrate structure 310 according to the third embodiment of the present invention. 3A is a plan view of the metal plate 300, FIG. 3B is a cross-sectional view taken along the line AA ′ of the metal plate 300, and FIG. 3C is a metal in which the substrate 22 is bonded to the metal plate 300. A cross-sectional view of the substrate structure 310 is shown.

  As illustrated, the metal plate 300 includes an end side support portion 302 and a center support portion 303 for supporting the substrate 22 constituting the planar antenna, an adhesive portion 304 provided between the support portions, and a metal substrate structure 310. A fixing portion 306 for fixing to another structure is provided. In addition, a groove 305 is provided between the end side support portion 302, the center support portion 303, and the bonding portion 304 (the grooves are indicated by hatching in the drawing).

  In the present embodiment, the frame portion 308 that facilitates the positioning of the substrate 22 and further prevents the adhesive from protruding is provided on the entire periphery of the metal plate 300. When the main purpose is only the positioning of the substrate, the frame portion 308 need not be provided around the entire periphery of the metal plate 300, and may be, for example, only four corners.

  In the present embodiment, the width (W1) of the metal plate 300 is set to 100 mm, the length (L1) is set to 80 mm, and the height (H2) of the frame portion 308 is set to 2.2 mm. Further, the inner width (W2) of the frame portion 308 is set to 90 mm, and the length (L2) is set to 70 mm. Furthermore, the height (H1) of the end side support part 302 and the center support part 303 is 2.0 mm, the depth (D) of the groove from the end side support part 302 and the center support part 303 is 0.5 mm, and the end side support. The step (S) between the part 302 and the center support part 303 and the adhesive part 304 is set to 0.5 mm, and the difference (F) between the frame part 308 and the end support part 302 is set to 0.2 mm.

  In this embodiment, the inner dimension of the frame portion 308 corresponds to the outer shape of the substrate 22 constituting the planar antenna, and its height (T) is set to 0.2 mm.

  Next, a method for manufacturing the metal substrate structure 310 will be described.

  First, the adhesive 30 is applied to the groove 305 of the metal plate 300 by a dispenser (not shown) (see FIG. 3B), the substrate 22 constituting the planar antenna is placed in the frame portion 308, and a jig (not shown) is placed. The metal substrate structure 310 is completed by applying pressure (see FIG. 3) (see FIG. 3C). Even if the substrate 20 is pressurized, the adhesive 30 is only pushed out into a space formed between the end side support portion 302 and the central support portion 303, the adhesive portion 304 and the frame portion 308. It doesn't stick out. Therefore, it is not necessary to make the metal plate large in anticipation of the adhesive sticking out, and it is possible to appropriately bond the metal plate and the substrate without causing a problem that the adhesive adheres to the jig for pressing the substrate. It becomes possible.

  FIG. 4 shows a metal substrate structure 410 according to the fourth embodiment of the present invention. 4A is a plan view of the metal plate 400, FIG. 4B is a cross-sectional view taken along the line AA ′ of the metal plate 400, and FIG. 4C is a metal in which the substrate 22 is bonded to the metal plate 400. A cross-sectional view of the substrate structure 410 is shown. Each dimension of the metal substrate structure 410 shown in FIG. 4 is substantially the same as that of the third embodiment shown in FIG.

  As shown in the figure, the metal plate 400 includes an end-side support portion 402 and a central support portion 403 for supporting the substrate 22 constituting the planar antenna, an adhesive portion 404 provided between the support portions, and a metal substrate structure 410. A fixing portion 406 for fixing to another structure is provided. Further, a groove 405 is provided between the end side support portion 402, the center support portion 403, and the bonding portion 404 (the grooves are indicated by hatching in the drawing). In the present embodiment, the frame portion 408 that facilitates the positioning of the substrate 22 and further prevents the adhesive from protruding is provided on the entire periphery of the metal plate 400. Furthermore, in this embodiment, as shown in FIG. 4A, tapered portions 409 are provided at the upper and lower ends of each groove 405 in the drawing. The central support portion 203 and the bonding portion 204 have a triangular cross section.

  Next, a method for manufacturing the metal substrate structure 410 will be described.

  First, the adhesive 30 is applied to the groove 405 of the metal plate 400 by a dispenser (not shown) (see FIG. 4B), the substrate 22 constituting the planar antenna is placed in the frame portion 408, and a jig (not shown) is placed. The metal substrate structure 410 is completed by applying pressure (see FIG. 4). Even if the substrate 22 is pressurized, the adhesive 30 is only pushed out into a space formed between the end side support portion 402, the center support portion 403, the adhesion portion 404, and the frame portion 408, and the outside of the metal plate. It doesn't stick out. Further, in the present embodiment, since the tapered portions 409 are provided at the upper and lower end portions of the groove portion 405, it is possible to further prevent the adhesive 30 from protruding outside the metal plate 400. Therefore, it is not necessary to make the metal plate large in anticipation of the adhesive sticking out, and it is possible to appropriately bond the metal plate and the substrate without causing a problem that the adhesive adheres to the jig for pressing the substrate. It becomes possible.

  Although the four embodiments have been described above, the numbers, widths, and intervals of the end support portions, the central support portions, and the connection portions are not limited to these, and are appropriately set depending on the type of the substrate to be bonded and the like. Can be done.

  In a metal substrate structure constituted by adhering a substrate to a metal plate, it can be applied to prevent the adhesive from protruding.

(A) is a plan view of the metal plate, (b) is a cross-sectional view of the metal plate of (a), and (c) is a cross-sectional view of the metal substrate structure in the first embodiment according to the present invention. . (A) is a plan view of the metal plate, (b) is a cross-sectional view of the metal plate of (a), and (c) is a cross-sectional view of the metal substrate structure in the second embodiment according to the present invention. . (A) is a plan view of the metal plate, (b) is a cross-sectional view of the metal plate of (a), and (c) is a cross-sectional view of the metal substrate structure in the third embodiment according to the present invention. . (A) is a plan view of the metal plate, (b) is a cross-sectional view of the metal plate of (a), and (c) is a cross-sectional view of the metal substrate structure in the fourth embodiment according to the present invention. . It is a figure which shows the conventional metal substrate structure.

Explanation of symbols

20, 22 ... Substrate 30 ... Adhesives 100, 200, 300, 400 ... Metal plates 102, 202, 302, 402 ... End support parts 103, 203, 303, 403 ... Central support parts 104, 204, 304, 404 ... Bonding part 105, 205, 305, 405 ... Groove part 208, 409 ... Taper part 308, 408 ... Frame part 110, 210, 310, 410 ... Metal substrate structure

Claims (4)

A metal substrate structure,
A substrate,
A plurality of support portions for supporting the substrate; an adhesive portion disposed between the plurality of support portions and configured to have a step from the plurality of support portions; and between the plurality of support portions and the adhesive portion And a metal plate having a groove provided in the
The metal substrate structure, wherein the substrate and the metal plate are bonded by an adhesive between the substrate and the bonding portion and between the substrate and the groove portion.   The metal substrate structure according to claim 1, wherein the metal plate has a frame portion arranged with a predetermined height around the metal plate.   The metal substrate structure according to claim 2, wherein the substrate is supported in the frame portion.   The metal substrate structure as described in any one of Claims 1-3 in which the taper part is provided in the edge part of the said groove part.

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