JP2005123239A - Electronic circuit equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit device composed of a vertical sub-board and a DIP-type IPM mounted on it which is used in an inverter control apparatus or the like, inexpensive, and excellent in assembly workability. <P>SOLUTION: Terminals 34c arranged in a row on the one side of the IPM 34 are connected to the vertical sub-board 31, and terminals 34d arranged in a row on the opposite side of the IPM 34 are connected direct to a main board 32 without interposing the board terminals 33 of the vertical sub-board 31 between them. Accordingly, the board can be reduced in a part mounting area, the IPM 34 is capable of having a large drive current value, and furthermore the electronic circuit device is inexpensive and remarkably improved in assembly workability. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic circuit device in which a DIP (Dual Inline Package) type IPM (Intelligent Power Module) semiconductor element used for an inverter control device or the like is mounted on a circuit board.

  In recent years, there are many devices using inverter control such as refrigerators. In the electronic circuit devices of these inverter devices, the inverter drive circuit such as a motor and the protection circuit against overcurrent of the drive circuit are made into one module. In general, an embedded IPM semiconductor element is used. Since these IPM semiconductor elements have a large number of input / output terminals, those having a DIP shape in which terminals are provided on both sides of the main body are often used (see, for example, Patent Documents 1 and 2).

  The conventional electronic circuit device will be described below with reference to the drawings.

  4 and 5 show a conventional electronic circuit device described in Patent Document 1. FIG.

  4 and 5, the IPM1, which is a DIP type semiconductor element in which the drive circuit 1a and the overcurrent detection circuit 1b are formed, is mounted on the main substrate 2, and the heat radiating plate 3 is attached to the IPM 1 with screws 4 It is attached so as to be closely attached.

  A rotation speed control circuit 5 and a power supply circuit 6 for controlling the IPM 1 are incorporated in the main board 2. The rotation speed control circuit 5 includes a microcomputer 5a that issues a command to the IPM 1 and a position detection circuit 5b that detects the rotor position of the three-phase motor 8.

  The power supply circuit 6 includes a motor drive power supply circuit 6a for generating a drive system voltage (for example, DC280V) for the IPM1 and a control power supply circuit 6b for generating a control system voltage (for example, DC5V) for the rotational speed control circuit 5. A connector 7 is attached to the main board 2, and the output of the IPM 1 is connected to the motor 8 via the main board 2 and the connector 7. The IPM 1, the main board 2, the heat sink 3, the mounting screw 4, the rotation speed control circuit 5, the power circuit 6, the connector 7, and the like constitute an electronic circuit device 10.

  The operation of the electronic circuit device configured as described above will be described below.

  The rotation speed control circuit 5 to which the three-phase position detection signal fed back from the motor 8 is input detects the rotation state of the motor 8 by the position detection circuit 5b and performs arithmetic processing by the microcomputer 5a. A drive signal is output to the IPM 1 so as to rotate at a rotational speed of. By the drive signal from the rotation speed control circuit 5, the drive circuit 1a inside the IPM 1 outputs a three-phase drive voltage waveform to the motor 8 so that the motor 8 operates at a predetermined rotation speed. It is driven by.

  The overcurrent detection circuit 1b monitors the output current value to the motor 8, and stops the drive output to the motor 8 when the current value exceeds a specified current value.

  Next, another conventional electronic circuit device will be described.

  6 and 7 show another form of conventional electronic circuit device described in Patent Document 2. FIG. 6 and 7, IPM 11, which is a DIP type semiconductor element in which drive circuit 11 a and overcurrent detection circuit 11 b are formed, is mounted on vertical sub-board 12, and heat sink 13 is attached to IPM 11. The screws 14 are attached so as to be in close contact with each other.

  A substrate terminal 15 is provided at the lower end of the vertical sub-board 12, and the vertical sub-board 12 mounted substantially vertically on the main board 16 is electrically connected to the main board 16 via the board terminal 15. It is connected.

  The main board 16 incorporates a rotation speed control circuit 17 and a power supply circuit 18 for controlling the IPM 11. The rotation speed control circuit 17 detects the rotor position of the microcomputer 17 a that issues a command to the IPM 11 and the three-phase motor 20. It is comprised from the position detection circuit 17b which performs.

  The power supply circuit 18 includes a motor drive power supply circuit 18a that generates a drive system voltage (for example, DC280V) for the IPM 11 and a control power supply circuit 18b that generates a control system voltage (for example, DC5V) for the rotation speed control circuit 17.

  A connector 19 is attached to the main board 16, and the output of the IPM 11 is connected to the motor 20 via the vertical sub-board 12, the board terminal 15, the main board 16 and the connector 19.

  These IPM 11, vertical sub-board 12, heat sink 13, mounting screw 14, board terminal 15, main board 16, rotation speed control circuit 17, power supply circuit 18, connector 19, etc. constitute an electronic circuit device 21.

  The operation of the electronic circuit device configured as described above will be described below.

  The rotation speed control circuit 17 to which the three-phase position detection signal fed back from the motor 20 is input detects the rotation state of the motor 20 by the position detection circuit 17b and performs calculation processing by the microcomputer 17a. A drive signal is output to the IPM 11 so as to rotate at the number of revolutions.

  Next, in response to the drive signal from the rotation speed control circuit 17, the drive circuit 11a inside the IPM 11 outputs a three-phase drive voltage waveform to the motor 20 so that the motor 20 operates at a predetermined rotation speed. It is operated at the number of revolutions.

The overcurrent detection circuit 11b monitors the output current value to the motor 20, and performs an operation to stop the drive output to the motor 20 when the current value exceeds a specified current value.
Japanese Patent Laid-Open No. 11-340389 JP-A-60-66498

  However, in the conventional configuration, when the IPM 1 is mounted on the main board 2, there is a problem that the area of the main board 2 becomes large. Further, in order to reduce the component mounting area of the main board 2, when the IPM 11 is mounted on the vertical sub board 12 and mounted on the main board 16, the board terminal provided on the lower end surface of the vertical sub board 12 15 has a problem that only the IPM 11 having a small drive current value can be handled because the connection current capacity is small.

  Further, when handling the IPM 11 having a large drive current value, the number of board terminals 15 must be increased, or a separate connector must be provided for connection, which increases the cost of parts materials and the poor assembly workability. Had.

  The present invention solves the above-described conventional problems, and even when a DIP type semiconductor element having a large drive current value is handled by reducing the component mounting area of the substrate, the electrical connection structure is inexpensive and the assembly workability is good. An object of the present invention is to provide an electronic circuit device in which a DIP type semiconductor element is mounted on a vertical sub-board.

  In order to solve the above-described conventional problems, the electronic circuit device of the present invention has a vertical sub-substrate mounted substantially vertically on a main substrate, and the terminals on one column of DIP semiconductor elements are connected to the vertical sub-substrate. In addition, the terminals on the opposite row are directly connected to the main substrate, and the vertical row sub-terminal is used to connect the terminals on one side of the DIP type semiconductor element to the vertical sub-board. It has the effect that it can be connected to the main board without going through the board terminals of the board.

  The electronic circuit device of the present invention can reduce the component mounting area of the substrate and can be inexpensive and have good assembly workability even when a DIP type semiconductor element having a large driving current value is handled.

  The invention according to claim 1 includes a main substrate, a vertical sub-substrate mounted substantially vertically on the main substrate, and a DIP type semiconductor element, and a terminal of a column on one side of the DIP type semiconductor element is a vertical type. A terminal connected to the sub-board and a terminal on the opposite side is directly connected to the main board, and the terminal on one side of the DIP-type semiconductor element is configured using the vertical sub-board. Can be connected to the main board without going through the board terminals of the vertical sub-board, so that the component mounting area of the board can be reduced, and a DIP type semiconductor device having a large driving current can be handled, and it can be assembled at low cost. Workability can be improved.

  According to the second aspect of the present invention, a spacer is disposed between the vertical sub-board and the DIP type semiconductor element. The DIP type semiconductor element is firmly attached to the vertical sub-board and connected to the main board. In addition to the effect of the invention according to claim 1, in addition to the effect of the invention according to claim 1, it is possible to prevent the positional deviation between the terminal of the DIP type semiconductor element to be formed and the substrate terminal below the vertical sub-substrate. This makes it easy to mount the mold sub-board, reduces the mechanical stress acting on the terminals of the DIP-type semiconductor element, improves the reliability of the components, and reduces the electrical connection failure.

  According to a third aspect of the present invention, there is provided a substrate terminal which is attached to the lower end of the vertical sub-substrate and electrically connects the vertical sub-substrate and the main substrate, and is a side directly connected to the main substrate of the DIP type semiconductor element Are formed in parallel with the vertical sub-substrate, and a substrate terminal for connecting the main substrate and the vertical sub-substrate is formed in parallel with the vertical sub-substrate, and the main terminals of the substrate terminal and the DIP-type semiconductor element are formed. In this embodiment, the positions of the tips of the terminals directly connected to the substrate are aligned, and the soldering connection allowance of each substrate terminal can be made constant, so that the effect of the invention according to claim 1 or 2 is achieved. In addition, it is possible to eliminate poor electrical connection between the board terminals.

  According to a fourth aspect of the present invention, a DIP type semiconductor element is fixed to a heat sink fixed on a main board, and the vertical sub board and the main board of the DIP type semiconductor element are fixed by fixing the main board and the heat sink. In addition to the effects of the invention according to claims 1 to 3, the mechanical stress acting on the terminal of the DIP type semiconductor element and the substrate terminal of the vertical sub-board can be reduced by strengthening the connection strength to The reliability of the components can be improved, and poor electrical connection can be reduced. Moreover, the temperature rise of a DIP type semiconductor element can be suppressed by a heat sink, and the reliability of a DIP type semiconductor element improves.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is a perspective view of an electronic circuit device according to Embodiment 1 of the present invention, and FIG. 2 is a block diagram of an electric circuit of the electronic circuit device according to the embodiment.

  1 and 2, the vertical sub-board 31 is mounted substantially vertically on the main board 32, and a substrate terminal 33 is provided at the lower end of the vertical sub-board 31, thereby the vertical sub-board 31. And the main board 32 are electrically connected.

  In the IPM 34, which is a DIP type semiconductor element in which the drive circuit 34a and the overcurrent detection circuit 34b are formed, the terminal 34c in one column is connected to the vertical sub-board 31, and the terminal 34d in the opposite column is the main. It is connected directly to the substrate 32.

  The power supply circuit 35 includes a motor drive power supply circuit 35a that outputs a drive system voltage (for example, DC280V) for the IPM 34 and a control power supply circuit 35b that outputs a control system voltage (for example, DC5V) for the rotation speed control circuit 36. It is incorporated on the main board 32.

  The vertical sub-board 31 incorporates a rotation speed control circuit 36 for controlling the IPM 34. The rotation speed control circuit 36 detects the rotor position of the microcomputer 36a and the three-phase motor 39 that give a command to the IPM 34. The circuit 36b is configured.

  A spacer 37 is disposed below the vertical sub-board 31 between the vertical sub-board 31 and the IPM 34. When the board terminals 33 and the terminals of the IPM 34 are mounted on the main board 32 in the manufacturing process, the IPM 34 The vertical sub-board 31 is positioned and fixed.

  At the lower end of the vertical sub-board 31, there is a step between the mounting portion 31a of the board terminal 33 and the other portion 31b. The dimension of this step is the same at both terminals of the board terminal 33 and the terminal 34d of the IPM 34. The positions of the terminal tips with respect to the mounting surface of the substrate 32 are determined to be aligned.

  A connector 38 is attached to the main board 32, and the output of the IPM 34 is connected to the motor 39 via the main board 32 and the connector 38. These vertical sub-board 31, main board 32, board terminal 33, IPM 34, power circuit 35, rotation speed control circuit 36, spacer 37, connector 38, etc. constitute an electronic circuit device 40.

  The operation and action of the electronic circuit device configured as described above will be described below.

  The rotation speed control circuit 36 to which the three-phase position detection signal fed back from the motor 39 is input detects the rotation state of the motor 39 by the position detection circuit 36b and performs calculation processing by the microcomputer 36a. A drive signal is output to the IPM 34 so as to rotate at a rotational speed of. Next, in response to a drive signal from the rotation speed control circuit 36, the drive circuit 34a inside the IPM 34 outputs a three-phase drive voltage waveform to the motor 39 so that the motor 39 operates at a predetermined rotation speed. It is operated at the rotational speed.

  The overcurrent detection circuit 34b monitors the output current value to the motor 39 and operates to stop the drive output to the motor 39 when the current value exceeds a specified current value.

  In the above electronic circuit device, the vertical sub-board 31 is used, but the terminals 34d on one side of the IPM 34 are connected to the main board 32 without passing through the board terminals 33 of the vertical sub-board 31. The component mounting area of the substrate can be reduced, and a DIP semiconductor element having a large drive current can be handled. In addition, since it is not necessary to increase the number of board terminals for handling a large drive current or to provide a separate connector for connection, the assembly workability can be reduced and the workability can be improved.

  Further, the spacer 37 can firmly attach the IPM 34 to the vertical sub-board 31 and can be connected to the main board 32 when the board terminals 33 and the terminals of the IPM 34 are mounted on the main board 32 in the manufacturing process. Misalignment between the terminal of the IPM 34 and the board terminal 33 below the vertical sub board 31 can be prevented, and the mounting work of the vertical sub board 31 on the main board 32 can be facilitated. The mechanical stress acting on the terminal 34c can be reduced. As a result, the reliability of the IPM 34 is improved, and the electrical failure of the terminal 34c can be reduced.

  Further, when the vertical sub board 31 is mounted on the main board 32, both the board terminal 33 and the IPM terminal 34c attached to the vertical sub board 31 in advance are inserted into predetermined positions on the main board and soldered. I do. At this time, a mounting portion 31a for the substrate terminal 33 is provided at the lower end portion of the vertical sub-board 31 so that both the board terminal 33 and the terminal 34c of the IPM 34 are aligned with respect to the mounting surface of the main board 32. The step size with respect to the other portion 31b is determined.

  Therefore, when the board terminal 33 and the terminal 34c of the IPM 34 are mounted on the main board 32, the allowance of the board terminal 33 and the terminal 34c of the IPM 34 from the bottom surface of the main board 32 becomes uniform, so the terminals of the board terminal 33 and the IPM 34 The connection cost of the soldering of 34c can be made constant, and the connection by soldering becomes good. As a result, poor connection due to poor soldering of the terminals of the board terminal 33 and the IPM 34 can be reduced.

In the present embodiment, by providing a step at the lower end of the vertical sub-substrate 31,
In both terminals of the board terminal 33 and the terminal 34d of the IPM 34, the positions of the terminal tips with respect to the mounting surface of the main board 32 are aligned, but if the tips of both the board terminals 33 and the terminals 34d of the IPM 34 can be aligned, other It may be a means.

  Therefore, it is possible to reduce the component mounting area of the substrate, handle a DIP type semiconductor element having a large driving current, and can be made inexpensive and have good assembly workability, and the reliability of the component is improved. Thus, it is possible to obtain an effect that the connection failure is reduced and the soldering connection failure can be reduced.

(Embodiment 2)
FIG. 3 is a cross-sectional view of the electronic circuit device according to Embodiment 2 of the present invention.

  Hereinafter, the form of a present Example is demonstrated based on FIG. In addition, about the same structure as Embodiment 1, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  A heat radiating plate 41 is attached to the IPM 34 by a mounting screw 42 for heat dissipation. A mounting leg 43 is attached to the lower portion of the heat sink 41, and the heat sink 41 is fixed to the main board 32 by soldering.

  The operation and action of the electronic circuit device configured as described above will be described below.

  In the first embodiment, the IPM 34 and the vertical sub-board 31 are fixed only by the terminal 34d of the IPM 34. In the present embodiment, the mounting legs of the heat sink 41 mechanically fixed to the IPM 34 are used. 43 is added, and the mechanical attachment strength between the vertical sub-board 31 to which the IPM 34 or the IPM 34 is attached and the main board 32 is improved.

  Accordingly, mechanical stress acting on the terminal 34d of the IPM 34 and the board terminal 33 of the vertical sub-board 31 can be reduced, so that the reliability of components can be improved and electrical connection failure can be reduced.

  As described above, since the electronic circuit device according to the present invention can use a DIP type semiconductor element having a small board mounting area and a large driving current value, not only the inverter control device but also the DIP type shape is used. The present invention can also be applied to other electronic circuit devices using semiconductor elements.

The perspective view of the electronic circuit device in Embodiment 1 of this invention 1 is an electric circuit block diagram of an electronic circuit device according to Embodiment 1 of the present invention. Sectional side view of the electronic circuit device in Embodiment 2 of this invention Side sectional view of a conventional electronic circuit device Electric circuit block diagram of a conventional electronic circuit device Side sectional view of another conventional electronic circuit device Electrical circuit block diagram of another conventional electronic circuit device

Explanation of symbols

31 Vertical Sub Board 32 Main Board 33 Board Terminal 34 IPM
37 spacer 41 heat sink 40 electronic circuit device

Claims (4)

A main substrate; a vertical sub-substrate mounted substantially vertically on the main substrate; and a DIP (Dual In-line Package) type semiconductor element, and a terminal in a column on one side of the DIP type semiconductor element An electronic circuit device that is connected to a mold sub-board and in which the terminals in the opposite row are directly connected to the main board. The electronic circuit device according to claim 1, wherein a spacer is disposed between the vertical sub-substrate and the DIP semiconductor element. A substrate terminal is provided at a lower end of the vertical sub-substrate to electrically connect the vertical sub-substrate and the main substrate, and a terminal on the side directly connected to the main substrate of the DIP type semiconductor element is the vertical sub-substrate. A substrate terminal for connecting the main substrate and the vertical sub-substrate is formed in parallel with the vertical sub-substrate, and the substrate terminal and the side directly connected to the main substrate of the DIP semiconductor element 3. The electronic circuit device according to claim 1, wherein the positions of the tips of the terminals are aligned. The electronic circuit device according to any one of claims 1 to 3, wherein a DIP type semiconductor element is fixed to a heat sink fixed on the main substrate.

Images