JP2005118944A - Micromachine - Google Patents

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JP2005118944A
JP2005118944A JP2003357186A JP2003357186A JP2005118944A JP 2005118944 A JP2005118944 A JP 2005118944A JP 2003357186 A JP2003357186 A JP 2003357186A JP 2003357186 A JP2003357186 A JP 2003357186A JP 2005118944 A JP2005118944 A JP 2005118944A
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micromachine
vibrating
substrate
support
vibration
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Toyohiro Tsunakawa
豊廣 綱川
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Sony Corp
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Sony Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a micromachine capable of improving reliability and a yield, and drivable in lower electric power consumption, by preventing irreversible deformation in lifting operation of a vibrating part. <P>SOLUTION: This micromachine 10 has support parts 12 erected on both sides of a lower electrode 3 arranged on a base board 2, and the belt-like vibrating part 13 extended via a space part A above the base board 2 from the upper end of the support parts 12 and extended between the support parts 12. A projecting part 15 projecting to at least one of the base board 2 side and the inverse side of this side in the width direction of a belt shape, is arranged in an end part in the vicinity of a joining part with the support parts 12 in the vibrating part 13. Thus, the projecting part 15 is made to act as a spring, to facilitate vibrating operation of the vibrating part 13 for approaching and separating to the lower electrode 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明はマイクロマシンに関し、基板上に空間部を介して振動部を設けてなるマイクロマシンに関する。   The present invention relates to a micromachine, and more particularly to a micromachine having a vibrating portion provided on a substrate via a space portion.

微細技術の進展に伴い、いわゆるマイクロマシン（Micro Electro Mechanical Systems：ＭＥＭＳ）、およびマイクロマシンを組み込んだ小型機器が注目されている。   With the progress of micro technology, so-called micro electro mechanical systems (MEMS) and small devices incorporating micro machines are drawing attention.

マイクロマシンは、シリコン基板、ガラス基板等の基板上に微細構造体として形成され、機械的駆動力を出力する駆動体と、駆動体を制御する半導体集積回路等とを、電気的・機械的に結合させた素子である。マイクロマシンの基本的な特徴は、機械的構造として構成されている駆動体が素子の一部に組み込まれていることであって、駆動体の駆動は、電極間のクーロン引力などを応用して電気的に行われる。   A micromachine is formed as a microstructure on a substrate such as a silicon substrate or a glass substrate, and electrically and mechanically connects a driver that outputs mechanical driving force and a semiconductor integrated circuit that controls the driver. Element. The basic feature of a micromachine is that a drive body configured as a mechanical structure is incorporated in a part of the element, and the drive of the drive body is performed by applying Coulomb attractive force between electrodes. Done.

このようなマイクロマシンの一例として、いわゆる両持ち梁方式の静電駆動型マイクロマシンの構成を図５の断面図に示す。この図に示すマイクロマシン１は、基板２上に形成された下部電極３を覆う状態で層間絶縁膜４が設けられ、この層間絶縁膜４上に下部電極３を跨ぐ状態で上部電極５が設けられている。この上部電極５は、下部電極３を挟んだ両側の層間絶縁膜４上に立設された支持部６と、下部電極３を跨ぐ状態で支持部６間に掛け渡された振動部７とで構成されている。振動部７は、ビームと呼ばれる平板のリボン状（帯状）に形成され、層間絶縁膜４と平行をなす状態で当該層間絶縁膜４との間に空間部Ａを有して設けられている。この振動部７は、例えば、図示したように、支持部６の上端から延設されて支持部６と一体の構造体として構成されている。   As an example of such a micromachine, a configuration of a so-called doubly-supported electrostatic drive type micromachine is shown in a cross-sectional view of FIG. In the micromachine 1 shown in this figure, an interlayer insulating film 4 is provided so as to cover a lower electrode 3 formed on a substrate 2, and an upper electrode 5 is provided on the interlayer insulating film 4 so as to straddle the lower electrode 3. ing. The upper electrode 5 includes a support portion 6 erected on the interlayer insulating film 4 on both sides of the lower electrode 3 and a vibration portion 7 spanned between the support portions 6 across the lower electrode 3. It is configured. The vibrating portion 7 is formed in a flat ribbon shape (band shape) called a beam, and is provided with a space A between the interlayer insulating film 4 and in parallel with the interlayer insulating film 4. For example, as shown in the figure, the vibrating portion 7 is configured as a structure that extends from the upper end of the support portion 6 and is integrated with the support portion 6.

このような構成のマイクロマシンにおいては、電空間部Ａによって絶縁された下部電極３と上部電極５との間に微小電圧を印加すると、図６に示すように、静電現象によって振動部７が下部電極３に向かって下降（接近）し、また電圧の印加を停止すると振動部７が上昇（離間）し、図５に示した元の状態に戻る。そして、このような振動部７の動作（振動）により、当該振動部７表面で反射する光を強度変調させることができるため、このマイクロマシンを複数配列することで回折格子ライトバルブを構成することができる（以上下記特許文献１参照）。   In the micromachine having such a configuration, when a minute voltage is applied between the lower electrode 3 and the upper electrode 5 insulated by the electric space portion A, as shown in FIG. When the voltage is lowered (approached) toward the electrode 3 and the application of the voltage is stopped, the vibration unit 7 is raised (separated) and returns to the original state shown in FIG. Since the light reflected from the surface of the vibration part 7 can be intensity-modulated by such an operation (vibration) of the vibration part 7, a diffraction grating light valve can be configured by arranging a plurality of micromachines. Yes (see Patent Document 1 below).

特開２００２−１１３７００号公報（特に図７参照）JP 2002-113700 A (refer to FIG. 7 in particular)

ところで、上述した構成のマイクロマシンにおいては、静電現象によって下部電極に対する振動部の昇降動作（接近、離間）を繰り返し行う過程において、上部電極及び下部電極への電圧の印加を停止しても、振動部が下部電極側に接近した状態（図６に示す状態）に留まり、元の離間した位置に戻らなくなる不具合が発生している。これは、マイクロマシンおよびこれを用いた回折格子ライトバルブなどの小型機器の寿命特性を悪化させ、信頼性および歩留まりの低下を引き起こす要因となっている。   By the way, in the micromachine having the above-described configuration, even when the application of voltage to the upper electrode and the lower electrode is stopped in the process of repeatedly raising and lowering the moving portion (approaching and separating) with respect to the lower electrode due to an electrostatic phenomenon, There is a problem that the portion remains in the state approaching the lower electrode side (the state shown in FIG. 6) and cannot return to the original separated position. This deteriorates the life characteristics of small devices such as a micromachine and a diffraction grating light valve using the micromachine, and causes a decrease in reliability and yield.

また、このようなマイクロマシンにおいては、より低消費電力での駆動が求められており、これを実現するためには、振動部を下部電極側に下降させる場合により少ない電力で所定状態にまで振動部を下降可能な構成が求められている。   Further, in such a micro machine, driving with lower power consumption is required, and in order to realize this, the vibrating unit is brought to a predetermined state with less power when the vibrating unit is lowered to the lower electrode side. The structure which can descend | fall is required.

そこで本発明は、振動部の昇降動作における不可逆的な変形を防止できこれによって信頼性および歩留まりの向上を図ることが可能であると共に、より低消費電力での駆動が可能なマイクロマシンを提供することを目的とする。   Accordingly, the present invention provides a micromachine that can prevent irreversible deformation in the raising and lowering operation of the vibration part, thereby improving reliability and yield, and capable of being driven with lower power consumption. With the goal.

このような目的を達成するための本発明は、基板上に立設された支持部と、当該支持部から前記基板の上方に空間部を介して延設された帯状の振動部とを備えたマイクロマシンにおいて、振動部が凸部を有していることを特徴としている。この凸部は、振動部における支持部との接合部付近の端部に帯状の幅方向にわたって設けられている。また、凸部は、基板側およびこれとは逆側の少なくとも一方に突出していれば良い。   In order to achieve such an object, the present invention includes a support portion erected on a substrate and a belt-like vibration portion extending from the support portion above the substrate via a space portion. The micromachine is characterized in that the vibrating part has a convex part. This convex part is provided over the strip | belt-shaped width direction in the edge part vicinity of a junction part with the support part in a vibration part. Moreover, the convex part should just protrude at least one of the board | substrate side and the opposite side.

このような構成のマイクロマシンによれば、振動部の端部に帯状の幅方向にわたる凸部を設けたことにより、支持部に支持された振動部が基板側に対して接近、離間する振動動作を行う際に、この凸部がバネとして作用する。これにより、振動部を基板側に向かって接近（下降）させる際には、帯状の振動部が弾性変形して振動部が下降し易くなり、振動部を所定状態にまで下降させるために必要となる力が小さくなる。また、振動部が弾性変形により基板側に下降し易くなったことにより、振動部が基板側に下降した状態において振動部と支持部とに加わる力が削減され、振動部が不可逆的に変形することが防止される。しかも、凸部で構成されるバネの弾性によって、基板側に下降した状態の振動部が元の位置に上昇するための張力が生じることにもなり、振動部が元の位置に上昇し易くなる。   According to the micromachine having such a configuration, by providing the band-shaped convex portion at the end of the vibration part, the vibration part supported by the support part performs a vibration operation that approaches and separates from the substrate side. When performing, this convex part acts as a spring. As a result, when the vibrating part is approached (lowered) toward the substrate side, the band-like vibrating part is elastically deformed so that the vibrating part is easily lowered, and is necessary for lowering the vibrating part to a predetermined state. The power to become smaller. In addition, since the vibration part is easily lowered to the substrate side due to elastic deformation, the force applied to the vibration part and the support part when the vibration part is lowered to the substrate side is reduced, and the vibration part is irreversibly deformed. It is prevented. Moreover, due to the elasticity of the spring formed by the convex portion, a tension is generated for the vibrating portion lowered to the substrate side to rise to the original position, and the vibrating portion is likely to rise to the original position. .

この結果、本発明のマイクロマシンによれば、振動部を基板側に下降させる力が小さくなりかつ振動部が元の位置に上昇し易くなるため低消費電力での駆動が可能となると共に基板側に下降した状態での振動部の不可逆的な変形が防止されることから安定した駆動状態を保つことができ、信頼性および歩留まりの向上を図ることが可能になる。   As a result, according to the micromachine of the present invention, the force for lowering the vibration part to the substrate side becomes small and the vibration part easily rises to the original position, so that it can be driven with low power consumption and the substrate side. Since the irreversible deformation of the vibration part in the lowered state is prevented, a stable driving state can be maintained, and reliability and yield can be improved.

以下、本発明のマイクロマシンの実施の形態を図面に基づいて詳細に説明する。尚、以下の各実施形態で説明するマイクロマシン（いわゆるＭＥＭＳ素子）は、基板上に空間部を介して振動部を設けてなるマイクロマシンであり、例えば光変調素子を構成するものであることとする。また、図５および図６に示した従来のマイクロマシンと同様の構成要素には同一の符号を付して説明を行うこととする。   Embodiments of a micromachine according to the present invention will be described below in detail with reference to the drawings. Note that a micromachine (so-called MEMS element) described in each of the following embodiments is a micromachine in which a vibrating part is provided on a substrate via a space, and constitutes, for example, a light modulation element. Further, the same components as those of the conventional micromachine shown in FIGS. 5 and 6 are denoted by the same reference numerals for description.

図１（１）は、実施形態のマイクロマシンの構成を示す斜視図であり、図１（２）は図１（１）のＳ面の断面図である。これらの図に示す実施形態のマイクロマシン１０が、図４および図５を用いて説明した従来のマイクロマシンと異なるところは、上部電極１１の構成にあり、他の部分の構成は従来と同様であることとする。   FIG. 1A is a perspective view showing the configuration of the micromachine of the embodiment, and FIG. 1B is a cross-sectional view of the S plane of FIG. The micromachine 10 of the embodiment shown in these drawings differs from the conventional micromachine described with reference to FIGS. 4 and 5 in the configuration of the upper electrode 11 and the configuration of the other parts is the same as the conventional one. And

すなわち、この図に示すマイクロマシン１０は、シリコン基板などからなる基板２、この上部にパターン形成された下部電極３、下部電極３を埋め込む状態で形成された層間絶縁膜４、層間絶縁膜４上に設けられた上部電極１１で構成されている。   That is, the micromachine 10 shown in this figure includes a substrate 2 made of a silicon substrate, a lower electrode 3 patterned on the upper portion, an interlayer insulating film 4 formed in a state of embedding the lower electrode 3, and an interlayer insulating film 4 The upper electrode 11 is provided.

そして、本発明の特徴である上部電極１１は、基板２上に層間絶縁膜４を介して立設された支持部１２と、両端部が支持部１２の上端で支持された帯状の振動部１３とで構成されている。これらの支持部１２による振動部１３の支持状態は従来と同様であって良く、例えば、ここでの図示は省略したが、振動部１３および振動部の両側の支持部１２は、絶縁性の下地膜上に光反射性の電極膜を設けた積層膜をパターニングしてなる一体構造であることとする。そして、支持部１２は、下部電極４を挟んだ両側において層間絶縁膜４に接合された積層膜部分を上方に立ち上げた形状を有している。また、振動部１３は、各支持部１２を構成する積層膜の上端部分を屈曲させて延設し、さらに帯状に成形した膜部分を下部電極４上を跨ぐ状態で支持部１２−１２間に掛け渡したブリッジ状とすることで、層間絶縁膜４上に中空部Ａを介して配置されている。   The upper electrode 11, which is a feature of the present invention, includes a support portion 12 erected on the substrate 2 via an interlayer insulating film 4, and a belt-like vibrating portion 13 whose both ends are supported by the upper end of the support portion 12. It consists of and. The support state of the vibration part 13 by these support parts 12 may be the same as in the prior art. For example, although illustration is omitted here, the vibration part 13 and the support parts 12 on both sides of the vibration part are not insulated. Suppose that it is the integral structure formed by patterning the laminated film which provided the light-reflective electrode film on the ground film. The support portion 12 has a shape in which the laminated film portions bonded to the interlayer insulating film 4 are raised upward on both sides of the lower electrode 4. In addition, the vibrating portion 13 is formed by bending and extending the upper end portion of the laminated film constituting each support portion 12, and further, between the support portions 12-12 in a state where the film portion formed in a strip shape straddles the lower electrode 4. It is arranged on the interlayer insulating film 4 via the hollow portion A by forming a bridge shape.

尚、このマイクロマシン１０が、例えば光変調素子を構成するものである場合、上部電極１を構成する導電膜は、例えばアルミニウムのような光反射性の良好な材料を用いて構成することが好ましい。   When the micromachine 10 constitutes, for example, a light modulation element, the conductive film constituting the upper electrode 1 is preferably constituted by using a material having good light reflectivity such as aluminum.

そして、特に本実施形態のマイクロマシン１０においては、振動部１３における、各支持部１２との接合部付近の端部に、凸部１５が設けられている。この凸部１５は、振動部１３を構成する帯状材部分を基板２と反対側に突出させてなる部分であり、振動部１３を構成する帯状の幅方向にわたる状態で設けられていることとする。   In particular, in the micromachine 10 of the present embodiment, the convex portion 15 is provided at the end portion of the vibrating portion 13 in the vicinity of the joint portion with each support portion 12. The convex portion 15 is a portion formed by projecting the strip-shaped material portion constituting the vibrating portion 13 to the side opposite to the substrate 2, and is provided in a state extending in the band-shaped width direction constituting the vibrating portion 13. .

また、このマイクロマシン１０が、例えば光変調素子を構成するものである場合、振動部１３の上面が光反射面として用いられる。このため、上述した凸部１５は、光変調素子としての機能に影響を及ぼすことのないように、その高さや大きさの範囲が設定されていることとする。   Further, when the micromachine 10 constitutes, for example, a light modulation element, the upper surface of the vibration unit 13 is used as a light reflecting surface. For this reason, the height and the size range of the convex portion 15 described above are set so as not to affect the function as the light modulation element.

ところで、振動部１３の端部にこのような凸部１５を設けたことにより、振動部１３の振動動作において凸部１５がバネとして作用するようになる。このため、凸部１５の形状は、後に述べるように、上述した高さや大きさの範囲内において適宜選択された形状で形成されることとする。   By the way, by providing such a convex portion 15 at the end of the vibration portion 13, the convex portion 15 acts as a spring in the vibration operation of the vibration portion 13. For this reason, the shape of the convex part 15 shall be formed in the shape selected suitably in the range of the height and magnitude | size mentioned above so that it may mention later.

このような構成のマイクロマシン１０は、電空間部Ａによって絶縁された下部電極３と上部電極１１との間に微小電圧を印加すると、図２の断面図に示すように、静電現象によって振動部１３が下部電極３に向かって下降（接近）し、また電圧の印加を停止すると振動部１３が上昇（離間）し、図１に示した元の状態に戻る。   When a micro voltage is applied between the lower electrode 3 and the upper electrode 11 insulated by the electric space portion A, the micro machine 10 having such a configuration causes a vibrating portion due to an electrostatic phenomenon as shown in a cross-sectional view of FIG. 13 descends (approaches) toward the lower electrode 3, and when the voltage application is stopped, the vibration unit 13 rises (separates) and returns to the original state shown in FIG. 1.

図３には、このようなマイクロマシン１０を光変調素子として用いた回折格子ライトバルブの一構成例を示す。この図に示す回折格子ライトバルブ（いわゆるGrating Light Valve：ＧＬＶ）３０は、基板２上に、１本の下部電極３を跨ぐように６本の上部電極１１が１組として配置されており、これらの上部電極１１のうちの１つ置きに配置された３本の上部電極１１が上述した上述した静電現象による昇降動作を行うものである。このような回折格子ライトバルブ３０は、これを１画素として同一面上に配列形成し、レーザと組み合わせることにより、レーザーデジタルプロジェクターシステムを実現することができる。   FIG. 3 shows a configuration example of a diffraction grating light valve using such a micromachine 10 as a light modulation element. In the diffraction light valve (GLV) 30 shown in this figure, six upper electrodes 11 are arranged as a set on a substrate 2 so as to straddle one lower electrode 3. The three upper electrodes 11 arranged every other one of the upper electrodes 11 perform the lifting operation by the above-described electrostatic phenomenon. Such a diffraction grating light valve 30 can be arranged on the same surface as one pixel and combined with a laser to realize a laser digital projector system.

次に、上述した構成のマイクロマシンの製造手順を説明する。先ず、基板２上に下部電極３をパターン形成して層間絶縁膜４で覆い、次いでこの層間絶縁膜４上に下部電極３上を覆う形状の犠牲層パターン（図示省略）を形成する。この際、犠牲層パターンにおける両側端部に凸条を設ける。次に、犠牲層パターンを覆う状態で絶縁膜および光反射性の導電膜からなる積層膜を形成し、この積層膜をパターニングすることにより、犠牲層パターンを跨ぐ帯状の上部電極１１を形成する。この際、犠牲層パターンの２本の凸条に交差させて、上部電極１１を形成することにより、これらの凸条に位置する部分に凸部１５が形成される。以上の後、層間絶縁膜４および上部電極１１に対して選択的に犠牲層パターンを除去することにより、上部電極１１と層間絶縁膜４との間に空間部Ａを形成する。   Next, a manufacturing procedure of the micromachine having the above-described configuration will be described. First, the lower electrode 3 is patterned on the substrate 2 and covered with the interlayer insulating film 4, and then a sacrificial layer pattern (not shown) having a shape covering the lower electrode 3 is formed on the interlayer insulating film 4. At this time, ridges are provided on both side ends of the sacrificial layer pattern. Next, a laminated film made of an insulating film and a light-reflective conductive film is formed so as to cover the sacrificial layer pattern, and the laminated film is patterned to form a strip-shaped upper electrode 11 straddling the sacrificial layer pattern. At this time, by forming the upper electrode 11 so as to intersect with the two ridges of the sacrificial layer pattern, the ridges 15 are formed at portions located on these ridges. Thereafter, the sacrificial layer pattern is selectively removed from the interlayer insulating film 4 and the upper electrode 11 to form a space A between the upper electrode 11 and the interlayer insulating film 4.

以上説明した構成のマイクロマシン１０によれば、帯状の振動部１３の端部に帯状の幅方向にわたる凸部１５を設けたことにより、支持部１２に支持された振動部１３が基板２側に対して接近、離間する振動動作を行う際に、この凸部１５がバネとして作用する。これにより、振動部１３を基板２側に向かって接近（下降）させる際には、帯状の振動部１３が弾性変形して振動部１３が下降し易くなり、振動部１３を所定状態にまで下降させるために必要となる力が小さくなる。また、振動部１３が弾性変形により基板２側に下降し易くなったことにより、振動部１３が基板２側に下降した状態において振動部１３と支持部１２とに加わる力が削減され、振動部が不可逆的に変形することが防止される。しかも、凸部１５で構成されるバネの弾性によって、基板２側に下降した状態の振動部１３が元の位置に上昇するための張力が生じることにもなり、振動部１３が元の位置に上昇し易くなる。   According to the micromachine 10 having the configuration described above, the protrusion 15 extending in the width direction of the band is provided at the end of the band-like vibration part 13, so that the vibration part 13 supported by the support part 12 is opposed to the substrate 2 side. When performing a vibration operation that approaches and separates, the convex portion 15 acts as a spring. As a result, when the vibrating part 13 approaches (descends) toward the substrate 2 side, the belt-like vibrating part 13 is elastically deformed and the vibrating part 13 is likely to descend, and the vibrating part 13 is lowered to a predetermined state. The force required to make it small. Further, since the vibration part 13 is easily lowered to the substrate 2 side due to elastic deformation, the force applied to the vibration part 13 and the support part 12 in a state where the vibration part 13 is lowered to the substrate 2 side is reduced, and the vibration part Is prevented from irreversibly deforming. In addition, the elasticity of the spring formed by the convex portion 15 causes a tension for the vibrating portion 13 in the state of being lowered toward the substrate 2 to rise to the original position, and the vibrating portion 13 is brought to the original position. It becomes easy to rise.

このため、凸部１５の形状は、光変調素子としての機能に影響を及ぼすことのない範囲において、必要とされる張力および弾性が得られるように設定されることとする。図４には、図１（２）のＢ部の拡大断面図を示す。これらの図に示すように、例えば、凸部１５の形状が頂部を有する場合、この頂部の内角θが小さいほど、すなわち図４（１）、図４（２）、図４（３）の順に、凸部１５の張力および弾性が大きくなる。したがって、実施形態のマイクロマシン１０においては、この内角θを適宜の角度に調整することにより、所望の張力と弾性を有する振動部を得ることが可能なのである。   For this reason, the shape of the convex part 15 shall be set so that the required tension | tensile_strength and elasticity may be acquired in the range which does not affect the function as a light modulation element. FIG. 4 is an enlarged cross-sectional view of a portion B in FIG. As shown in these drawings, for example, when the shape of the convex portion 15 has a top portion, the smaller the inner angle θ of the top portion, that is, in the order of FIGS. 4 (1), 4 (2), and 4 (3). Further, the tension and elasticity of the convex portion 15 are increased. Therefore, in the micromachine 10 of the embodiment, it is possible to obtain a vibrating portion having desired tension and elasticity by adjusting the inner angle θ to an appropriate angle.

以上の結果、実施形態のマイクロマシン１０によれば、振動部１３を基板２側に下降させるために必要な力が小さくなりかつ振動部１３が元の位置に上昇し易くなるため低消費電力での駆動が可能となり、かつ基板２側に下降した状態での振動部１３の不可逆的な変形が防止されることから安定した駆動状態を保つことができ、信頼性および歩留まりの向上を図ることが可能になる。   As a result of the above, according to the micromachine 10 of the embodiment, the force required to lower the vibration part 13 to the substrate 2 side becomes small and the vibration part 13 easily rises to the original position, so that the power consumption is low. Driving is possible, and irreversible deformation of the vibration part 13 in a state where it is lowered toward the substrate 2 is prevented, so that a stable driving state can be maintained, and reliability and yield can be improved. become.

尚、上述した実施形態においては、振動部１３における、各支持部１２との接合部付近の端部に、凸部１５を一箇所ずつ設けた構成を説明した。振動部１３における、各支持部１２との接合部付近の端部には、必要に応じて複数の凸部１５を設けても良く、各端部に配置する凸部１５の個数によっても、所望の張力と弾性を有する振動部を得ることが可能である。また、各凸部１５の突出方向も、基板２と反対側に突出させた構成に限定されることはなく、基板２側に突出させた構成であっても良い。   In the above-described embodiment, the configuration in which the convex portions 15 are provided one by one at the end portion in the vicinity of the joint portion with each support portion 12 in the vibration portion 13 has been described. A plurality of convex portions 15 may be provided at the end portion of the vibrating portion 13 in the vicinity of the joint portion with each support portion 12 depending on the number of the convex portions 15 arranged at each end portion as desired. It is possible to obtain a vibration part having the following tension and elasticity. Further, the protruding direction of each convex portion 15 is not limited to the configuration protruding to the opposite side of the substrate 2, and may be a configuration protruding to the substrate 2 side.

さらに、本実施形態においては、支持部１２の上端から振動部１３を延設した一体形の上部電極１１の構成を説明した。しかしながら、本発明のマイクロマシンは、支柱形状の支持部の上方に別体として振動部１３を載置した構成であっても良く、同様の効果を得ることができる。さらに、上述した実施形態においては、振動部１３の両端が支持部１２によって支持されたいわゆる両持ち梁構造のマイクロマシンに本発明を適用した構成を説明した。しかしながら、本発明は、振動部の一端側のみが支持部によって支持された、いわゆる方持ち梁構造のマイクロマシンにも適用可能であり、同様の効果を得ることができる。   Furthermore, in the present embodiment, the configuration of the integrated upper electrode 11 in which the vibration part 13 is extended from the upper end of the support part 12 has been described. However, the micromachine of the present invention may have a configuration in which the vibration unit 13 is placed separately above the support portion in the form of a column, and the same effect can be obtained. Furthermore, in the above-described embodiment, the configuration in which the present invention is applied to a micromachine having a so-called doubly supported beam structure in which both ends of the vibration unit 13 are supported by the support unit 12 has been described. However, the present invention can also be applied to a so-called cantilever beam micromachine in which only one end side of the vibration part is supported by the support part, and the same effect can be obtained.

また、本発明のマイクロマシンは、図３を用いて説明したような回折格子ライトバルブとして機能するものに限定されることはなく、特定の周波数で振動部１３を振動させる周波数フィルタとして機能させることもできる。この場合であっても、振動部１３に凸部を設けたことにより、安定した駆動状態と低消費電力での駆動が可能となる。尚、この場合、振動部１３における凸部１５の大きさは、振動部１３の表面側における反射を妨げない範囲に制限されることはない。また、上部電極１１を構成する導電膜が、特に光反射性の良好な材料を用いる必要もない。   Further, the micromachine of the present invention is not limited to the one functioning as a diffraction grating light valve as described with reference to FIG. 3, and may function as a frequency filter that vibrates the vibration unit 13 at a specific frequency. it can. Even in this case, the projecting portion is provided on the vibrating portion 13, so that it is possible to drive with a stable driving state and low power consumption. In this case, the size of the convex portion 15 in the vibrating portion 13 is not limited to a range that does not hinder reflection on the surface side of the vibrating portion 13. Further, the conductive film constituting the upper electrode 11 does not have to use a material having particularly good light reflectivity.

本発明の実施形態のマイクロマシンの構成を示す図である。It is a figure which shows the structure of the micromachine of embodiment of this invention. 図１のマイクロマシンの駆動を説明する断面図である。It is sectional drawing explaining the drive of the micromachine of FIG. 実施形態のマイクロマシンを用いた回折格子ライトバルブの斜視図である。It is a perspective view of the diffraction grating light valve using the micromachine of an embodiment. 本発明のマイクロマシンにおける振動部の設計事項を説明する図である。It is a figure explaining the design matter of the vibration part in the micromachine of this invention. 従来のマイクロマシンの構成を示す断面である。It is a cross section which shows the structure of the conventional micromachine. 従来のマイクロマシの駆動を説明する断面図である。It is sectional drawing explaining the drive of the conventional micromachining.

符号の説明Explanation of symbols

２…基板、３…下部電極、１０…マイクロマシン、１１…上部電極、１２…支持部、１３…振動部、１５…凸部、Ａ…空間部   DESCRIPTION OF SYMBOLS 2 ... Board | substrate, 3 ... Lower electrode, 10 ... Micromachine, 11 ... Upper electrode, 12 ... Support part, 13 ... Vibrating part, 15 ... Convex part, A ... Space part

Claims (3)

基板上に立設された支持部と、当該支持部から前記基板の上方に空間部を介して延設された帯状の振動部とを備えたマイクロマシンにおいて、
前記振動部は、前記支持部との接合部付近の端部に、前記帯状の幅方向にわたって前記基板側およびこれとは逆側の少なくとも一方に突出する凸部が設けられている
ことを特徴とするマイクロマシン。 In a micromachine comprising a support portion erected on a substrate, and a belt-shaped vibration portion extending from the support portion above the substrate via a space portion,
The vibrating portion is provided with a protruding portion that protrudes at least one of the substrate side and the opposite side across the width direction of the belt at the end portion near the joint portion with the support portion. Micromachine to do. 請求項１記載のマイクロマシンにおいて、
前記支持部は、前記基板上に立設された支持部間に掛け渡されており、これらの各支持部との接合部付近の端部に前記凸部が設けられている
ことを特徴とするマイクロマシン。 The micromachine according to claim 1,
The support portion is spanned between support portions erected on the substrate, and the convex portion is provided at an end portion near a joint portion with each of the support portions. Micro machine. 請求項１記載のマイクロマシンにおいて、
前記振動部は、前記基板に設けられた下部電極を跨ぐ状態で設けられており、
前記振動部と前記支持部とで上部電極が構成されている
ことを特徴とするマイクロマシン。
The micromachine according to claim 1,
The vibrating portion is provided in a state straddling the lower electrode provided on the substrate,
An upper electrode is constituted by the vibration part and the support part.
JP2003357186A 2003-10-17 2003-10-17 Micromachine Pending JP2005118944A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007090488A (en) * 2005-09-29 2007-04-12 Sony Corp Diaphragm and micromachine device, and manufacturing method of micromachine device
JP2013524287A (en) * 2010-04-09 2013-06-17 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド Mechanical layer of electromechanical device and method for forming the same
US8963159B2 (en) 2011-04-04 2015-02-24 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US9134527B2 (en) 2011-04-04 2015-09-15 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000090801A (en) * 1998-09-09 2000-03-31 Denso Corp Nonalithic microwave integrated circuit and its manufacture
JP2002258178A (en) * 2001-03-05 2002-09-11 Ricoh Co Ltd Optical modulator
JP2002328318A (en) * 2001-04-27 2002-11-15 Ricoh Co Ltd Optical modulator and its manufacturing method, image forming device equipped with the optical modulator, and image projection/display device equipped with optical modulator
JP2002350751A (en) * 2001-05-30 2002-12-04 Sony Corp Optical multi-layer structure and its manufacturing method, optical switching element, and image display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000090801A (en) * 1998-09-09 2000-03-31 Denso Corp Nonalithic microwave integrated circuit and its manufacture
JP2002258178A (en) * 2001-03-05 2002-09-11 Ricoh Co Ltd Optical modulator
JP2002328318A (en) * 2001-04-27 2002-11-15 Ricoh Co Ltd Optical modulator and its manufacturing method, image forming device equipped with the optical modulator, and image projection/display device equipped with optical modulator
JP2002350751A (en) * 2001-05-30 2002-12-04 Sony Corp Optical multi-layer structure and its manufacturing method, optical switching element, and image display device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007090488A (en) * 2005-09-29 2007-04-12 Sony Corp Diaphragm and micromachine device, and manufacturing method of micromachine device
JP2013524287A (en) * 2010-04-09 2013-06-17 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド Mechanical layer of electromechanical device and method for forming the same
US8817357B2 (en) 2010-04-09 2014-08-26 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of forming the same
US8963159B2 (en) 2011-04-04 2015-02-24 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US9134527B2 (en) 2011-04-04 2015-09-15 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same

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