JP2005116814A - Resin molded winding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin-molded winging whose electrical, mechanical, and thermal performance is improved. <P>SOLUTION: The resin-molded wiring has an enamel layer 8 of thermosetting resin or thermoplastic resin around a conductor 7 of a winding of a wire made of the conductor 7 by casting or impregnation. The enamel layer 8 comprises a 1st coating film 9 formed by coating the outer periphery of the conductor 7 of polyester imide resin, and a 2nd coating layer 10 formed by coating the outer periphery of the 1st coating layer 9 with paint obtained by nearly equally mixing a flat inorganic filling material with polyamide resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention is formed by casting or impregnating a thermosetting or thermoplastic resin in a winding wound with a wire that is a conductor with an insulating coating, for example, a resin mold transformer or a resin mold VT. The present invention relates to a resin mold winding applied to CT or the like.

  The resin mold winding is applied to, for example, a resin mold transformer, a resin mold VT / CT, and the like (for example, see Patent Document 1). This type of resin-molded winding uses a wire made of a magnet wire with an insulating layer made of enamel paint on the conductor surface, or an insulated wire that has been insulated with a polymer film or synthetic paper. The wire is cast or impregnated with a thermosetting resin or a thermoplastic resin.

  For example, as shown in the cross-sectional view of FIG. 4, a resin mold winding 1 manufactured by a resin casting method has a mold resin 4 in a mold in which a winding 3 configured by winding a wire material 2 in advance is disposed. Is integrated by casting and curing.

  Further, as shown in the cross-sectional view of FIG. 5, the resin mold winding 1 manufactured by the resin impregnation method has a non-woven fabric around the winding 3 when the wire material 2 is wound to form the winding 3. The impregnated base material 5 and the end member 6 that can be impregnated / held with the resin are configured, and are integrated by impregnating and curing the resin.

The resin mold winding configured as described above is cast or impregnated with resin in a vacuum so that voids and peeling such as peeling, which cause a decrease in insulation performance, do not occur.
JP 2001-307557 A

  However, the resin-molded winding configured as described above is subject to thermal degradation due to internal heat generation during operation of a device to which it is applied (hereinafter referred to as “resin-molded device”), start / stop of the device, Deteriorated over time due to thermal stress caused by changes in ambient temperature.

  Normally, when the product life of resin mold equipment approaches, a minute gap is generated at the interface between the wire inside the winding and the resin due to a decrease in fixing force due to deterioration of material over time. Deterioration due to partial discharge leads to dielectric breakdown.

  Since the deterioration of insulation performance due to such internal partial discharge progresses more rapidly than aging thermal deterioration, the improvement of the discharge resistance performance of the insulation material used will extend the life of the resin mold winding. It is an important issue above.

  In addition, internal partial discharge detection is important to prevent insulation accidents, but the timing of internal partial discharge due to deterioration over time varies depending on the usage environment and load factor of the equipment. It is difficult to detect internal discharge at inspection intervals. For this reason, it is important to improve the discharge resistance performance of insulating materials and to extend the period from the occurrence of internal partial discharge until dielectric breakdown, in order to prevent insulation accidents and ensure stable power supply. It is a problem.

  On the other hand, in order to reduce the size, weight, and cost of resin mold equipment, high stress design such as improvement of electric field stress and thinning of resin is required. For this purpose, in addition to the above-mentioned discharge resistance performance, it is indispensable to improve electrical, mechanical and thermal performance such as withstand voltage performance, heat resistance, heat transfer performance and mechanical strength of the insulating material used. .

  The present invention has been made in view of the above circumstances, and in order to realize a resin mold device that is small, low-cost, and has high insulation reliability, the electrical, mechanical, and thermal performance of the insulating material is improved. An object of the present invention is to provide an improved resin mold winding.

  In order to achieve the above object, the present invention takes the following measures.

  That is, the invention of claim 1 is a resin mold winding in which an enamel layer is formed on the outer periphery of a strand by casting or impregnating the winding around which the strand is wound with a thermosetting resin or a thermoplastic resin. Then, a flat inorganic filler material is compounded almost uniformly in the enamel layer.

  According to a second aspect of the present invention, in the resin mold winding according to the first aspect of the present invention, the enamel layer is made of polyvinyl formal (PVF), polyester (PE), polyesterimide (EI), polyamideimide (AI), and polyimide (PI). ).

  According to a third aspect of the present invention, in the resin mold winding according to the first aspect of the present invention, the enamel layer is flattened with a first coating layer formed by coating a polyesterimide resin on the outer periphery of the strand. The second coating layer is formed by coating a coating formed by substantially uniformly combining an inorganic filler material with a polyamide-imide resin on the outer periphery of the first coating layer.

  According to a fourth aspect of the present invention, there is provided a resin mold obtained by casting or impregnating a thermosetting resin or a thermoplastic resin in a winding having a wire made of a conductor having a surface insulated by a polymer film or synthetic paper. It is a winding, and a flat inorganic filler material is almost uniformly combined with a polymer film or synthetic paper.

  According to a fifth aspect of the present invention, in the resin mold winding according to the fourth aspect of the present invention, the inorganic filling material is a powder having an average particle size of 1 μm or less, and a weight ratio to the polymer film or synthetic paper is 0.5% or more and 15 % To be combined.

  The invention according to claim 6 is a resin mold winding obtained by casting or impregnating a thermosetting resin or a thermoplastic resin around a winding wound with a wire, and thermosetting a flat and fine inorganic filling material The resin or thermoplastic resin is compounded almost uniformly.

  According to a seventh aspect of the present invention, in the resin mold winding according to the sixth aspect of the present invention, the inorganic filling material is a powder having an average particle size of 1 μm or less, and the weight ratio to the thermosetting resin or the thermoplastic resin is 0.5%. It is combined so that it becomes 15% or less.

  The invention according to claim 8 is the resin mold winding according to any one of claims 1 to 7, wherein the inorganic filling material is a layered clay compound.

  According to a ninth aspect of the present invention, in the resin mold winding according to the eighth aspect of the present invention, the layered clay compound contains at least one of a smectite group, a mica group, and a vermiculite group.

  A tenth aspect of the present invention is the resin mold winding according to any one of the first to seventh aspects of the present invention, wherein the inorganic filling material is boron nitride (BN).

  The invention according to an eleventh aspect is the resin mold winding according to any one of the first to seventh aspects, wherein a layered clay compound having a metal cation between layers is used as the inorganic filling material, and further a metal cation. Is replaced with a quaternary ammonium salt.

  The invention of claim 12 is a resin mold winding in which an enamel layer is formed on the outer periphery of a winding by casting or impregnating a winding around which a wire is wound with a thermosetting resin or a thermoplastic resin. A first coating layer formed by coating a coating formed by combining a flat inorganic filler material with a polyesterimide resin on the outer periphery of the strand, and an enamel layer; It comprises with the 2nd coating film layer formed by coating polyamideimide resin on the outer periphery.

  According to a thirteenth aspect of the present invention, in the resin mold winding according to the twelfth aspect of the present invention, the polyamideimide resin is composed of a flat inorganic filling material that is almost uniformly combined.

  The invention according to claim 14 is the resin mold winding according to any one of claims 1 to 3 and claims 12 to 13, wherein the inorganic filling material is a powder having an average particle size of 1 μm or less, and an enamel layer Are combined so that the ratio by weight to 0.5 to 15%.

  According to the resin mold winding of the present invention, the electrical, thermal and mechanical performance of the insulator can be improved. Thereby, it is possible to realize a small, lightweight, long-life and highly reliable resin mold device.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  In addition, the code | symbol in the figure used for description of each following Example attaches | subjects and shows the same code | symbol about the same part as FIG. 4 and FIG.

  A first embodiment of the present invention will be described with reference to FIG.

  FIG. 1 is a longitudinal cross-sectional view illustrating a configuration example of enameled wires constituting the resin mold winding according to the first embodiment.

  In this enamel wire, an enamel coating 8 is applied around a conductor 7 made of a conductive strand material. Further, the enamel coating 8 is composed of a first coating 9 applied directly around the conductor 7 and a second coating 10 laminated on the outer periphery thereof.

  As the first coating film 9, a polyester imide (EI) resin solution is uniformly coated with a flat and fine inorganic filler, and as the second coating film 10, polyamideimide (AI) is coated. It is a thing.

  Examples of the flat and fine inorganic filler added to the polyesterimide resin solution include a layered clay compound and boron nitride (BN). The layered clay compound may be at least one selected from a mineral group consisting of a smectite group, a mica group, and a verculite group. For example, in the smectite group, montmorillonite, hectorite, saponite, soconite, beidellite, stevensite, nontronite and the like can be mentioned. Examples of the mica group include chlorite, phlogopite, lepidrite, mascobite, biotite, paragonite, margarite, teniolite, and tetrasilicic mica. Examples of the vermiculite group include trioctahedral vermiculite and dioctahedral vermiculite.

  The size of the inorganic filling material needs to be fine particles of 1 μm or less, and particularly preferably 0.1 μm or less. In order to uniformly combine these layered clay compounds in the polymer compound for enameled wire, it is desirable to stir and disperse with high shearing force applied with a ball mill, attritor, roll mixer or the like.

  In addition, when the organic layered clay compound in which the metal cation between the laminated silicate layers is replaced with an organic compound such as a quaternary ammonium salt is used as the layered clay compound, the affinity with the polymer compound for enameled wire is improved. More uniform dispersibility can be obtained.

  According to this configuration, the polyesterimide layer as the first coating film 9 contributes to the improvement of partial discharge resistance and heat resistance due to the effect of the dispersed flat and fine inorganic filling material, The polyamide-imide layer contributes to the prevention of scratches during winding and the improvement of workability due to the elongation and slipperiness of the coating film, so it has high resistance to internal partial discharge due to minute defects generated inside the winding due to deterioration over time, and high reliability It is possible to provide a resin mold winding of the same.

  A second embodiment of the present invention will be described with reference to FIG.

  FIG. 2 is a longitudinal sectional view showing a configuration example of a wire constituting the resin mold winding according to the second embodiment. The same parts as those in FIG. Only the differences are described.

  The strand is composed of a conductor 7 which is a conductive strand material, and is covered and insulated by coating a polymer film or synthetic paper 11 around the conductor 7. In the polymer film or synthetic paper 11, the flat and fine inorganic filler material such as the layered viscosity compound described in Example 1 or boron nitride is uniformly mixed and dispersed in advance at the raw material stage.

  In the resin mold winding configured as described above, partial discharge resistance and heat resistance are improved by the effect of the flat and fine inorganic filler material dispersed in the polymer film or synthetic paper 11. Thereby, the tolerance with respect to the internal partial discharge by the micro defect which arises inside a coil | winding by aged deterioration is high, and it can aim at the improvement of reliability.

  A third embodiment of the present invention will be described with reference to FIG.

  FIG. 3 is a cross-sectional view illustrating a configuration example of the resin mold winding according to the third embodiment, and portions that have already been described are denoted by the same reference numerals to avoid redundant description.

  In FIG. 3, a winding 3 formed by winding a wire material 2 with an insulating coating is integrated by casting and curing an inorganic filling resin 12 around it. As the inorganic filling resin 12 to be cast, a layered clay compound described in Example 1 or an inorganic filling material such as boron nitride previously mixed and dispersed is used.

  The inorganic filling resin 12 finely disperses the filled flat and fine inorganic filler, so that Joule heat generated from the winding 3 is efficiently transmitted to the surface of the winding 3 and the heat of the winding 3 is obtained. Improves dissipation. Further, the filled inorganic filling resin 12 is very fine and suppresses the diffusion and permeability of the gas to the inside. For this reason, oxidative degradation at high temperatures is suppressed, and heat resistance is improved. Further, the densely dispersed inorganic filling resin 12 improves insulation performance such as partial discharge resistance and dielectric strength, and mechanical characteristics such as bending strength and tensile strength at high temperatures.

  These improvements in electrical, mechanical, and thermal material performance provide long-life and highly reliable resin-molded windings for high-stress designs that are required to reduce the size and weight of resin-molded equipment. It becomes possible to do.

  The best mode for carrying out the present invention has been described above with reference to the accompanying drawings, but the present invention is not limited to such a configuration. Within the scope of the invented technical idea of the scope of claims, a person skilled in the art can conceive of various changes and modifications. The technical scope of the present invention is also applicable to these changes and modifications. It is understood that it belongs to.

The longitudinal cross-sectional view which shows the structural example of the enameled wire which comprises the resin mold coil | winding which concerns on Example 1 of this invention. The longitudinal cross-sectional view which shows the structural example of the strand which comprises the resin mold winding which concerns on Example 2 of this invention. Sectional drawing which shows the structural example of the resin mold winding which concerns on Example 3 of this invention. Sectional drawing which shows the structural example of the resin mold coil | winding manufactured by the resin casting method. Sectional drawing which shows the structural example of the resin mold coil | winding manufactured by the resin impregnation method.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Resin mold winding, 2 ... Wire material, 3 ... Winding, 4 ... Mold resin, 5 ... Impregnation base material, 6 ... End member, 7 ... Conductor, 8 ... Enamel coating, 9 ... 1st coating DESCRIPTION OF SYMBOLS 10 ... 2nd coating film, 11 ... Synthetic paper, 12 ... Inorganic filling resin

Claims (14)

A resin-molded winding in which an enamel layer is formed on the outer periphery of the strand by casting or impregnating a thermosetting resin or a thermoplastic resin into the winding around which the strand is wound,
A resin mold winding in which a flat inorganic filler material is almost uniformly combined with the enamel layer. In the resin mold winding according to claim 1,
A resin mold winding in which the enamel layer is formed of a resin using any of polyvinyl formal (PVF), polyester (PE), polyester imide (EI), polyamide imide (AI), and polyimide (PI). In the resin mold winding according to claim 1,
The enamel layer,
A first coating layer formed by coating a polyesterimide resin on the outer periphery of the strand;
Resin mold winding constituted by a second coating layer formed by coating a coating formed by substantially uniformly combining a flat inorganic filling material with a polyamideimide resin on the outer periphery of the first coating layer line. A resin mold winding formed by casting or impregnating a thermosetting resin or a thermoplastic resin on a winding wound with a wire made of a conductor that has been insulated with a polymer film or synthetic paper on its surface,
A resin mold winding in which a flat inorganic filler material is substantially uniformly combined with the polymer film or synthetic paper. In the resin mold winding according to claim 4,
The inorganic filler material is a resin mold winding which is a powder having an average particle diameter of 1 μm or less and is compounded so that a weight ratio with respect to the polymer film or synthetic paper is 0.5% or more and 15% or less. It is a resin mold winding formed by casting or impregnating a thermosetting resin or a thermoplastic resin around a winding wound with a wire,
A resin mold winding in which a flat and fine inorganic filling material is combined with the thermosetting resin or thermoplastic resin almost uniformly. In the resin mold winding according to claim 6,
The inorganic filling material is a resin mold winding that is a powder having an average particle size of 1 μm or less and is compounded so that a weight ratio with respect to the thermosetting resin or thermoplastic resin is 0.5% or more and 15% or less. In the resin mold winding according to any one of claims 1 to 7,
A resin mold winding in which the inorganic filling material is a layered clay compound. In the resin mold winding according to claim 8,
The layered clay compound is a resin mold winding containing at least one of a smectite group, a mica group, and a vermiculite group. In the resin mold winding according to any one of claims 1 to 7,
A resin mold winding in which the inorganic filling material is boron nitride (BN). In the resin mold winding according to any one of claims 1 to 7,
A resin mold winding in which a layered clay compound having a metal cation between layers is used as the inorganic filling material, and the metal cation is further substituted with a quaternary ammonium salt. A resin-molded winding in which an enamel layer is formed on the outer periphery of the winding by casting or impregnating a thermosetting resin or a thermoplastic resin into the winding around which the wire is wound,
The enamel layer,
A first coating layer formed by coating a coating formed by combining a flat inorganic filler material with a polyesterimide resin on the outer periphery of the strand;
A resin mold winding comprising a second coating layer formed by coating a polyamide-imide resin on the outer periphery of the first coating layer. In the resin mold winding according to claim 12,
A resin mold winding in which a flat inorganic filler material is almost uniformly combined with the polyamide-imide resin. In the resin mold winding according to any one of claims 1 to 3 and claims 12 to 13,
The inorganic filler material is a resin mold winding that is a powder having an average particle diameter of 1 μm or less and is compounded so that a weight ratio with respect to the enamel layer is 0.5% or more and 15% or less.

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