JP2005116452A - Plated contact for electronic part and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plated contact for various electronic parts securing electric connection by elastic contact and having a stable contact surface suppressing the roughness of a surface even if the height is increased from a surrounding flat surface to the top of a protrusion as a contact part. <P>SOLUTION: In this plated contact 12 for electronic parts, since the contact part 13 provided in an tip part extended like a belt is spherically projected in two steps with a first spherical protrusion 13A in which a base material is exposed but not cracked and a second protrusion 13B spherically projecting its periphery surrounding the first protrusion 13A while maintaining the shape of the first protrusion 13A, a stable one can be obtained because the roughness of the surface of the contact surface is suppressed even if the height is increased up to the top of the protrusion. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention is an electronic component made of a thin metal plate with plating used for a connection terminal such as a built-in antenna or an encoder in various electronic components to ensure electrical connection with an electric circuit portion of a device used. The present invention relates to a plating contact and a manufacturing method thereof.

  Many types of electronic components are provided with terminals for connection to an electric circuit part of an electronic device, and the terminals are often used by being electrically connected to the electric circuit part by soldering or the like.

  On the other hand, as a simple electrical connection method for electronic parts, instead of the above terminals, a plated contact made of a thin metal plate with elasticity provided with a highly conductive metal plating is used as a fixed side contact part of the corresponding electric circuit part. The method of making an electrical connection by elastic contact with the metal is also preferred because it is excellent in wearability and easy to remove.

  Such a conventional plating contact for electronic parts will be described with reference to FIGS.

  FIG. 7 is an external view of a conventional plated contact for electronic parts, and FIG.

  In the figure, reference numeral 1 denotes an electronic component main body, and a strip-shaped plating contact 2 extends outward from the side surface of the main body 1 in an inclined state.

  A contact portion 3 is provided at the tip portion of the plating contact 2 so as to protrude downward into a spherical shape.

  The contact portion 3 has a spherical shape so that it can be stably contacted even when it comes in contact with the stationary contact portion, which is the counterpart of the contact in the electric circuit portion of the mounted device, with a slight positional deviation from the relative positional relationship. It is processed to protrude.

  The strip-shaped plated contact 2 is provided with nickel plating on the surface of a strip-shaped substrate made of a phosphor bronze plate for spring (C5210-EH) in order to reduce contact resistance and maintain contact stability over a long period of time. Furthermore, it is made of a material obtained by repeatedly applying gold plating with the nickel plating as a base.

  The electronic component having the electronic component plating contact 2 configured as described above is, for example, as shown in FIG. 9 showing a state where the plating contact is mounted on an electronic device. It is positioned and held in a fixed state by a casing 7 or the like of the device.

  Further, a wiring board 8 of the device is provided at a side position where the electronic component is arranged, and the wiring board 8 is also positioned and fixed by the housing 7.

  Then, the plated contact 2 is elastically contacted with a spherical contact portion 3 provided at the tip portion with a predetermined elastic contact force with a fixed contact portion (not shown) of the electric circuit portion on the upper surface of the wiring board 8 provided side by side. It was intended to achieve electrical connection.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-11-330734

  However, in the above-described conventional plated contact 2 for electronic parts, the contact portion is maintained so as to maintain reliable contact even when it is configured to contact with the stationary contact portion that is the other party of contact in a slightly inclined state. It is also necessary to set the height of the spherical protrusion 3 to be relatively high. At this time, if the protrusion amount of the contact portion 3 is set to be large, the surface of the plating contact 2 extends and fine cracks are formed on the nickel plating and gold plating surfaces. In some cases, the ground surface may be exposed in the deep part of the crack. In this case, the exposed base material of the contact part 3 is oxidized and insulated depending on the usage environment of the electronic equipment and the passage of time. There is a problem that an object is formed and the electrical connection state with the fixed contact portion may become unstable.

  The present invention solves such a conventional problem, and even if the protrusion processing height of the spherical contact portion is set high, the plating surface is cracked so that the substrate is exposed on the contact surface. It is an object of the present invention to provide a plating contact for electronic parts that can be prevented from occurring and a method for manufacturing the same.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention is a first metal plate that is made of a thin metal plate that is plated and has a spherical shape so as not to cause cracks that expose the substrate of the plated surface. A two-stage protrusion comprising a protrusion and a second protrusion that is provided with a spherical protrusion around the first protrusion while maintaining the shape of the first protrusion. It is a plating contact for electronic parts with a contact portion configured in a state, and by adjusting the protruding height of the second protruding portion on the outer peripheral side, the height from the surrounding flat surface to the protruding portion apex Even in the case where the contact surface portion is set high, the first protruding portion at the center serving as the contact surface portion can be formed into a spherical shape in which the base material is not exposed without cracking or the like on the plating surface, thereby forming the contact portion. one Roughness of the surface of the protruding part can be suppressed and a stable contact state can be maintained, and since the first protruding part protrudes in a spherical shape, the fixed side contact part of the electric circuit part of the equipment used Even when the relative positional relationship is shifted, the surface of the spherical surface can be elastically contacted and the electrical connection state can be maintained stably.

  In the invention according to claim 2, in order to form a two-step protruding contact portion from a flat metal sheet having elasticity that has been plated, there is no crack that exposes the substrate on the plating surface. A step of projecting the first protruding portion into a spherical shape, and surrounding the first protruding portion while maintaining the shape of the first protruding portion, the periphery is further protruded as a spherical second protruding portion The method of manufacturing a plating contact for electronic parts having a step of processing, and a flat surface surrounding the first protruding portion at the center as a contact surface portion without causing cracks that expose the substrate. On the other hand, the height position is also high, and it can be easily formed by only two simple processes.

  As described above, according to the present invention, even when the height of the spherical protrusion is set high, the occurrence of cracks on the plating surface at which the substrate is exposed is suppressed in the central first protrusion as the contact surface. In addition, an advantageous effect is obtained that a plated contact for electronic parts having a stable electrical connection over a long period of time and a method for manufacturing the same can be obtained.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  In addition, the same code | symbol is attached | subjected to the part of the structure same as the structure demonstrated in the term of the prior art, and detailed description is abbreviate | omitted.

(Embodiment)
FIG. 1 is an external view of a plated contact for an electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the main part, in which 11 is an electronic component body having a predetermined internal circuit, From the side surface of the main body 11, a strip-shaped plating contact 12 connected to the internal circuit is extended outward.

  The plated contact 12 is provided with a contact portion 13 that is protruded downward in a spherical shape at a tip portion of a flat surface that extends downward in an inclined state.

  In addition, as a material of the said strip-shaped plated contact 12, the surface of the strip | belt-shaped base material which consists of a phosphor bronze board for springs is used, and what is further plated with the gold plating on the nickel plating is used. This is the same as the case described in the section of the prior art.

  The plated contact 12 for an electronic component according to the present invention is different from the conventional one in that the contact portion 13 that is protruded at the tip portion extending in a band shape has a two-stage protrusion shape in a spherical shape. Is.

  In other words, the contact portion 13 of the plating contact 12 has a first protrusion 13A that protrudes in a spherical shape to such an extent that a crack that exposes the substrate does not occur, and the first protrusion 13A while maintaining the shape of the first protrusion 13A. In order to surround the one protruding portion 13A, the periphery is further protruded in two steps by a second protruding portion 13B protruding in a spherical shape.

  And, as shown in FIG. 3, the manufacturing method of the plating contact 12 for electronic parts provided with the contact portion 13 is as follows. First, the belt-shaped spring phosphor bronze plate subjected to plating is positioned on the first die 15. Then, the first punch 16 is extruded into a spherical shape to form the first protruding portion 13A.

  During the processing of the spherical surface of the first protruding portion 13A, the processing of the first protruding portion 13A is performed with a spherical shape that does not expose the substrate to the plated surface, that is, does not crack the plated surface.

  Subsequently, as shown in FIG. 4, the first protruding portion 13A is processed on the second die 17 having a relief portion 17A such as a depression so that the portion corresponding to the first protruding portion 13A does not contact. In order to position the work in progress and maintain the shape of the first protruding portion 13A, the second protruding portion 18A is further protruded in the same direction in the same direction around the first protruding portion 13A. The second protrusion 13B is formed.

  The plated contact 12 for electronic parts can be formed as having a spherical two-stage protruding contact portion 13 by two simple steps as described above.

  When the second protruding portion 13B of the contact portion 13 of the plating contact 12 is protruded, the second punch is also provided with a relief recess or hole in a portion corresponding to the first protruding portion 13A. It may be processed.

  And the height position of the first protrusion 13A that becomes the contact surface from the surrounding flat surface can be set higher than the conventional one by adjusting the height of the protrusion processing of the second protrusion 13B, etc. Even if the position is set high, the contact surface of the first protruding portion 13A is provided with a protruding contact portion 13 that does not generate cracks or the like that expose the substrate to the gold plating and nickel plating portions. Easy to form.

  In the electronic component having the electronic component plating contact 12 configured as described above, the electronic component body 11 is positioned and held in the casing 7 of the electronic device as shown in the mounting state of FIG. To be fixed.

  Further, the plating contact 12 extending from the side surface of the main body 11 has a substantially spherical first protruding portion 13A in the contact portion 13 provided at the tip portion, and the wiring substrate 8 fixed to the housing 7 together. It is attached to the fixed contact portion of the electric circuit portion on the upper surface so as to be elastically contacted to make an electrical connection while being bent.

  At this time, since the contact portion 13 of the plating contact 12 for electronic parts is formed by a two-stage protrusion in a spherical shape, the height of the contact portion 13 can be easily set high, and in that case However, the surface of the first protruding portion 13A, which becomes the contact surface, can be configured to suppress the surface roughness of the contact surface without cracking, so that a stable contact state is maintained regardless of the usage environment of the electronic device and the passage of time. It will be possible.

  In addition, as shown in FIG. 6, even if the contact surface is slightly inclined due to the relative positional relationship with the fixed contact portion provided on the wiring board 8 which is the contact partner, the contact surface Since the first protruding portion 13A is formed in a spherical shape without cracks on the surface, a stable electrical connection state can be maintained.

  The plated contact for electronic parts and the manufacturing method thereof according to the present invention are such that even if the height from the surrounding flat surface to the top of the protruding portion is set as the contact portion, the plating surface is rough so that the substrate is exposed at the contact surface. It is useful for adapting to various electronic parts that have plated contacts that ensure electrical connection by elastic contact. .

1 is an external view of a plated contact for an electronic component according to an embodiment of the present invention. Cross section of the main part The figure explaining the processing process of the contact part The figure explaining the processing process of the contact part The figure which shows the mounting state to the electronic equipment of the plating contact The figure which shows the state which the contact part inclined and contacted the other party External view of conventional plating contacts for electronic components Cross section of the main part The figure which shows the mounting state to the electronic equipment of the plating contact

Explanation of symbols

7 Electronic Device Case 8 Wiring Board 11 Electronic Component Body 12 Plating Contact 13 Contact Part 13A First Protrusion Part 13B Second Protrusion Part 15 First Die 16 First Punch 17 Second Die 17A Escape Part 18 Second Punch of

Claims (2)

It consists of a thin metal plate that has been plated and has a first protruding portion that is formed by protruding into a spherical shape so that cracks that expose the substrate of the plated surface do not occur, and the shape of the first protruding portion An electronic component having a contact portion configured in a two-stage protruding state including a second protruding portion provided by further protruding into a spherical shape so as to surround the first protruding portion while maintaining Plating contacts. In order to form a two-stage protruding contact part from a flat metal sheet with elasticity that has been plated, the first protruding part has a spherical shape so as not to cause cracks that expose the substrate on the plated surface. An electronic component comprising: a step of performing a protrusion process; and a step of performing a protrusion process with the periphery of the first protrusion portion as a spherical second protrusion portion so as to surround the first protrusion portion while maintaining the shape of the first protrusion portion. Method of plating contact for use.

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