JP2005116244A - Surface heater and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface heater in which temperature control in the same face can be performed, and temperature unevenness and pressurizing unevenness are minimized, and provide its manufacturing method. <P>SOLUTION: In the surface heater formed on the substrate face of a prescribed substrate, the heater is provided with a heater pattern and a temperature sensing resistor pattern to detect a temperature in an adjacent region of the heater pattern, and the thickness of the heater pattern in the perpendicular direction with respect to the substrate face is the same as the thickness of the temperature sensing resistor pattern in the perpendicular direction with respect to the substrate face. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a technical field such as a planar heater including a heater pattern and a resistance temperature detector pattern for detecting a temperature in a region in the vicinity of the heater pattern, and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, a planar heater in which a temperature measuring unit (thermocouple, resistance thermometer, thermistor, etc.) is arranged is known. Such a planar heater is, for example, a surface using radiant heat typified by floor heating. It can be used in all fields of heating element application. In general, such a planar heater is formed by etching a heater-adaptive material to form a heater (heating element) portion, and then additionally processing the temperature measuring portion separately.

  On the other hand, Patent Document 1 discloses a planar heater in which a nichrome wire or the like is arranged, which is not an etching method. In such a planar heater, a metal wire capable of measuring temperature is wired adjacent to the heater portion, and measurement control is performed. Is going.

Further, Patent Document 2 discloses a method of controlling the temperature of the planar heater while measuring the average temperature of the entire heater surface by adopting a structure in which a carbon fiber sheet is bonded to the heater portion of the planar heater. ing.
Japanese Patent Application No. 2-16596 Japanese Patent Application No.7-111184

  However, in the conventional planar heater using the etching method, it is difficult to arrange the temperature measuring portion in the same plane as the heating element portion, and the watt density has to be designed to be designed. In addition, since the temperature measuring section and the heating element section are processed and formed separately, manufacturing costs are incurred, and in pressure processing applications (for example, film laminating processing), it becomes a cause of temperature (heating) unevenness, etc. There was a problem. In addition, in pressurization processing of a planar heater, a predetermined heat capacity or elasticity is required in order to suppress pressure unevenness due to the arrangement of the temperature measuring part, or pressure and temperature unevenness due to the presence or absence of the heater part (heater pattern). In some cases, the material that was held was pasted, but none of the unevenness could be completely eliminated.

  On the other hand, in a planar heater with a nichrome wire or the like, unlike the etching method, the planar heater with a nichrome wire has a small line width, so the in-plane temperature unevenness increases, and its use is limited. Yes.

  In addition, in a planar heater having a layer for measuring the average temperature of the entire heater surface, it is difficult to individually measure the temperature of a heater region having two or more watt densities, which is a feature of the planar heater. Met.

  Therefore, the present invention has been made in view of the above problems, and a planar heater capable of realizing temperature control in the same plane and minimizing temperature unevenness and pressurization unevenness, and the like. An object is to provide a manufacturing method.

  In order to solve the above problems, the invention described in claim 1 is a planar heater formed on a substrate surface of a predetermined substrate, for detecting a heater pattern and a temperature in a region near the heater pattern. And the thickness of the heater pattern in the direction perpendicular to the substrate surface is the same as the thickness of the temperature measuring resistor pattern in the direction perpendicular to the substrate surface.

  According to the first aspect of the present invention, it is possible to realize temperature control in the same plane, eliminate temperature unevenness, and realize stable control of the planar heater itself.

  According to a second aspect of the present invention, in the planar heater of the first aspect, the heater pattern and the resistance temperature detector pattern are simultaneously formed by etching.

  According to the second aspect of the present invention, since the heater pattern and the resistance temperature detector pattern are formed at the same time, it is possible to process the planar heater with a minimum man-hour.

  According to a third aspect of the present invention, there is provided a planar heater formed on a substrate surface of a predetermined substrate, the heater pattern and a resistance temperature detector pattern for detecting a temperature in a region near the heater pattern. The heater pattern and the resistance temperature detector pattern are simultaneously formed by etching.

  According to the third aspect of the present invention, temperature control in the same plane can be realized, temperature unevenness can be eliminated, stable control of the planar heater itself can be realized, and the planar heater can be realized with a minimum man-hour. Processing becomes possible.

  According to a fourth aspect of the present invention, in the planar heater according to any one of the first to third aspects, there are a plurality of regions heated by the heater pattern divided into each other, and the resistance temperature detector pattern Is provided corresponding to each of the regions.

  According to a fifth aspect of the present invention, in the planar heater of the fourth aspect, the watt density in each of the regions is different from each other.

  According to the invention described in claim 4 or 5, since temperature measurement can be performed individually for a specific part and a specific range, temperature (heating) control can be individually performed for the specific part and the specific range. it can.

  According to a sixth aspect of the present invention, in the planar heater according to the fourth aspect, a plate-like object having a predetermined heat capacity is affixed corresponding to each region.

  A seventh aspect of the invention is characterized in that in the planar heater of the fourth aspect, a plate-like object having a predetermined elasticity is affixed corresponding to each region.

  The invention according to claim 8 is the planar heater according to claim 6 or 7, wherein the plate-like object has a thickness in a direction perpendicular to the substrate surface for each of the regions. .

  According to the invention described in any one of claims 6 to 8, by using the planar heater for hot pressing, temperature unevenness can be minimized (heat equalization) or pressure unevenness can be minimized. Can be realized.

  The invention according to claim 9 is the planar heater according to any one of claims 1 to 8, wherein the constituent material of the heater pattern and the constituent material of the resistance temperature detector pattern are the same. It is characterized by.

  According to invention of Claim 9, a planar heater can be produced easily.

  The invention according to claim 10 is the planar heater according to any one of claims 1 to 9, wherein the heater pattern and the resistance temperature detector pattern are formed by removing only the edge portion. It is characterized by that.

  According to the tenth aspect of the present invention, the flatness of the planar heater, which has been difficult with the conventional planar heater, can be ensured by minimizing the portion removed by etching, and as a result, it can be used for pressure processing. It becomes an optimal planar heater and can be applied to highly accurate pressure processing.

  According to an eleventh aspect of the present invention, in the planar heater according to the planar heater according to any one of the first to third aspects, a plate-like object having a predetermined heat capacity is attached to the planar heater. It is characterized by being attached.

  The invention according to claim 12 is the planar heater according to any one of claims 1 to 3, wherein a plate-like object having a predetermined elasticity is affixed to the planar heater. It is characterized by.

  The invention according to claim 13 is a method of manufacturing a planar heater formed on a substrate surface of a predetermined substrate, and includes a heater pattern and a resistance temperature detector for detecting a temperature in a region near the heater pattern. The heater pattern and the resistance temperature detector pattern are simultaneously formed by etching using a resist patterned into a body pattern as an etching mask.

  According to the thirteenth aspect of the present invention, since the heater pattern and the resistance temperature detector pattern are formed at the same time, the planar heater can be processed with a minimum number of man-hours.

  As described above, according to the present invention, temperature control in the same plane can be realized, temperature unevenness can be eliminated, and stable control of the planar heater itself can be realized.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, embodiment described below is embodiment at the time of applying the planar heater which concerns on this invention with respect to a planar heater control system.

(First embodiment)
First, the planar heater control system in the first embodiment will be described.

  FIG. 1A is a diagram showing a schematic configuration of a planar heater control system including a top view of the planar heater in the first embodiment, and FIG. 1B is a diagram of the planar heater in the first embodiment. It is a cross section (AA cross section of FIG. 1 (A)).

  The planar heater 1a in the first embodiment is formed on a substrate surface 21 of a substrate (base) 2 as shown in FIGS. 1A and 1B, and includes a heater pattern 11 and the heater pattern. 11 and a resistance temperature detector pattern 12 for detecting a temperature in a region near 11.

  An electrical insulator such as silicon rubber or polyimide film can be applied to the substrate 2. In addition, the material of the board | substrate 2 should just be a material which has heat resistance, and is not specifically limited. The heater pattern 11 and the resistance temperature detector pattern 12 are simultaneously formed by etching a heater adaptable material that can measure the temperature coefficient of the resistance value, in other words, a heater adaptable material whose resistance value varies with temperature. . As the heater applicable material (heater material), for example, SUS (stainless steel) can be applied. For example, when SUS is applied as the heater adaptable material, the heater pattern 11 is formed into a wave pattern so that the resistance value of the heater pattern 11 is about 10Ω and the resistance value of the resistance temperature detector pattern 12 is about 50 to 100Ω.

  The position of the resistance temperature detector pattern 12 may be any position as long as the temperature in the region near the heater pattern 11 can be detected. You may comprise so that it may be located in between.

  Thus, since the heater pattern 11 and the resistance temperature detector pattern 12 are formed by simultaneously etching the heater adaptable material, the direction perpendicular to the substrate surface 21 of the heater pattern 11 as shown in FIG. The thickness Y1 of the RTD 12 is substantially the same as the thickness Y1 in the direction perpendicular to the substrate surface 21 of the resistance temperature detector pattern 12 (including an error range of several percent).

  In the example of FIG. 1A, four heater patterns 11 are formed on the substrate surface 21, and the end portions (111 to 118) of the heater patterns 11 are electrically connected to each other. The connection points X1 and X2 are connected to the power supply control device 3. As a result, power is supplied to each heater pattern 11 (current flows), the heater pattern 11 is heated, and the surrounding area is warmed.

  Further, the end portions 121 and 122 of the resistance temperature detector pattern 12 are connected to the signal converter 4. The signal converter 4 measures the resistance value of the resistance temperature detector pattern 12 (in other words, detects the temperature), converts it into a signal (temperature information) such as a voltage corresponding to the resistance value, and outputs it to the control device 5. (The resistance value may be converted to a digital value by an A / D converter and then output to the control device 5).

  The control device 5 has, for example, a voltage-temperature characteristic (curve) of the resistance temperature detector pattern 12, and P (proportional) I (integration) D based on a signal (temperature information) from the signal converter 4. Operation control of the power supply control device 3 is performed by feedback control such as (differentiation) control (control so that the measured value matches the target value). Thereby, heating control of the heater pattern 11 is performed, and stable and highly accurate temperature control is possible under free conditions. Such temperature control is a known technique and is not directly related to the present invention, so further detailed description is omitted.

  Next, the manufacturing method of the planar heater 1a in 1st Embodiment is demonstrated.

  First, for example, a SUS (stainless steel) heater material is bonded to the substrate surface 21 of the substrate 2 such as silicon rubber or polyimide film. Subsequently, with respect to the heater material formed on the substrate surface 21 of the substrate 2, the resist patterned on the heater pattern 11 and the resistance temperature detector pattern 12 is used as an etching mask, for example, by photoetching, and the heater pattern 11 and The portions other than the resistance temperature detector pattern 12 are removed, and the heater pattern 11 and the resistance temperature detector pattern 12 are formed simultaneously. Thus, the planar heater 1a is formed.

  As described above, according to the first embodiment, at the same time as the heater pattern 12 is formed, the temperature measuring resistor pattern 12 is formed, and the temperature measuring means using the characteristic based on the temperature coefficient of the resistance value is arranged to control the temperature. As a result, even in the etching type planar heater, the thickness Y1 in the direction perpendicular to the substrate surface 21 of the heater pattern 11 and the thickness Y1 in the direction perpendicular to the substrate surface 21 of the resistance temperature detector pattern 12 are obtained. Can be realized, and stable control of the planar heater itself can be realized.

  Furthermore, since the heater pattern 12 and the resistance temperature detector pattern 12 are simultaneously formed by etching, the planar heater can be processed with a minimum number of man-hours.

(Second Embodiment)
Next, the planar heater control system in 2nd Embodiment is demonstrated. Note that in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 2A is a diagram showing a schematic configuration of a planar heater control system including a top view of the planar heater in the second embodiment, and FIG. 2B is a diagram of the planar heater in the second embodiment. It is a cross section (AA cross section of FIG. 1 (A)).

  The planar heater 1b in the second embodiment is basically the same as the configuration of the planar heater 1a in the first embodiment. However, as shown in FIGS. 2A and 2B, the planar heater 1b has a heater pattern. The region (zone) to be warmed is different in that the region Z1 and the region Z2 are divided (separated) from each other. In this embodiment, the region Z1 is a low temperature region warmed by the low temperature heater pattern 11a, the region Z2 is a high temperature region warmed by the high temperature heater pattern 11b, and the watt densities in the region Z1 and the region Z2 are different from each other. . Further, the planar heater 1b is provided with a resistance temperature detector pattern corresponding to each region. Specifically, as shown in FIG. 2 (A), in the vicinity of the low temperature heater pattern 11a. There are provided a low temperature region resistance thermometer pattern 12a for detecting the temperature in the region and a high temperature region resistance thermometer pattern 12b for detecting the temperature in the region in the vicinity of the high temperature heater pattern 11b. Yes.

  The low-temperature heater pattern 11a, the high-temperature heater pattern 11b, the low-temperature region resistance temperature detector pattern 12a, and the high-temperature region resistance temperature detector pattern 12b are formed by simultaneously etching the heater applicable material. Therefore, as shown in FIG. 2B, the thickness Y1 in the direction perpendicular to the substrate surface 21 of the low temperature heater pattern 11a and the high temperature heater pattern 11b is the low temperature region resistance temperature detector pattern 12a and the high temperature region temperature measurement. The resistor pattern 12b is substantially the same as the thickness Y1 in the direction perpendicular to the substrate surface 21 (including an error range of several percent).

  In the example of FIG. 2A, the substrate surface 21 has two low temperature heater patterns 11a and two high temperature heater patterns 11b. The end portions (111 a to 114 a) of the low-temperature heater pattern 11 a are electrically connected to each other, and the connection points X 3 and X 4 are connected to the power supply control device 3. Further, the end portions (115 a to 118 a) of the high-temperature heater pattern 11 b are also electrically connected to each other, and the connection points X 5 and X 6 are connected to the power supply control device 3. Thus, power is supplied to each of the low temperature heater pattern 11a and the high temperature heater pattern 11b (current flows), and the surrounding area is warmed.

  Further, the end portions 121a and 122a of the low temperature region resistance temperature detector pattern 12a and the end portions 121b and 122b of the high temperature region resistance temperature detector pattern 12b are connected to the signal converter 4, respectively. The signal converter 4 measures the resistance values of the low temperature region resistance temperature detector pattern 12a and the high temperature region resistance temperature detector pattern 12b, and signals such as voltages corresponding to the resistance values ( Temperature information) and output to the control device 5. Thereby, the control device 5 performs operation control of the power supply control device 3 by feedback control such as PID control based on the signal (temperature information) from the signal converter 4. As a result, the low-temperature heater pattern 11a and the high-temperature heater pattern 11b are independently heated.

  Next, the manufacturing method of the planar heater 1b in the second embodiment is basically the same as that of the planar heater 1a in the first embodiment. However, the low temperature heater pattern 11a and the high temperature heater pattern are used as etching masks. 11b, a low temperature region resistance temperature detector pattern 12a, and a high temperature region resistance temperature detector pattern 12b are used in a resist pattern. By performing etching using such an etching mask, the low-temperature heater pattern 11a, the high-temperature heater pattern 11b, the low-temperature region resistance temperature detector pattern 12a, and the high-temperature region resistance temperature detector pattern 12b are simultaneously formed. The sheet heater can be formed with minimum man-hours.

  As described above, according to the second embodiment, temperature control in the same plane can be realized, stable control of the planar heater itself can be realized, and in addition to a specific part and a specific range. Since temperature measurement can be performed individually, heating control can be individually performed on a specific part and a specific range (for example, a low temperature region and a high temperature region).

  In the second embodiment, the portions other than the low temperature heater pattern 11a, the high temperature heater pattern 11b, the low temperature region resistance temperature detector pattern 12a, and the high temperature region resistance temperature detector pattern 12b are formed by etching. These patterns are formed so as to be removed, but as another example, the low temperature heater pattern 11a, the high temperature heater pattern 11b, the low temperature region resistance temperature detector pattern 12a, and the high temperature region temperature measurement. Only the edge (groove) portion of the resistor pattern 12b may be removed to form these patterns.

  3A is a top view of the planar heater 1b, and FIG. 3B is an enlarged view of the high-temperature region resistance thermometer pattern 12b in part A of FIG. 3A. (C) is sectional drawing in the BB cross section of FIG. 3 (B). As shown in FIGS. 3B and 3C, the high-temperature region resistance thermometer pattern 12b is formed by removing only the edge portion. Note that the low temperature heater pattern 11a, the high temperature heater pattern 11b, and the low temperature region resistance temperature detector pattern 12a are not shown, but only the edge portions are removed as in the high temperature region resistance temperature detector pattern 12b. Is formed. Even in this case, the low-temperature heater pattern 11a, the high-temperature heater pattern 11b, the low-temperature region resistance temperature detector pattern 12a, and the high-temperature region resistance temperature detector pattern 12b are separated from the edge portions of these patterns (insulating spacing Can be formed simultaneously by etching the heater-adaptive material using an etching mask that is only removed.

  In this way, the flatness of the planar heater, which was difficult with conventional planar heaters, is ensured by minimizing the portion removed by etching (the heater pattern and the resistance temperature detector pattern, and the portions other than those patterns). Therefore, it becomes a sheet heater that is optimal for pressure processing, and can be applied to high-precision pressure processing.

  Needless to say, such a configuration in which only the edge portion of the pattern is removed can also be applied to the first embodiment.

(Third embodiment)
Next, a planar heater control system in the third embodiment will be described. Note that in the third embodiment, identical symbols are assigned to components similar to those in the second embodiment, and duplicate description is omitted.

  FIG. 4A is a diagram showing a schematic configuration of a planar heater control system including a top view of the planar heater in the third embodiment, and FIG. 4B is a diagram of the planar heater in the third embodiment. It is a cross section (AA cross section of FIG. 1 (A)).

  As shown in FIG. 4B, the planar heater 1c according to the third embodiment includes a low temperature heater pattern 11a, a high temperature heater pattern 11b, a low temperature region resistance temperature detector pattern 12a, An electrical insulating material 6 is bonded to one surface of the high temperature region resistance temperature detector pattern 12b (an adhesive coating or the like may be used). Furthermore, as shown in FIGS. 4A and 4B, the sheet heater 1c is overlaid with metal foils 7a and 7b as plate-like objects for hot pressing on one surface of the electrical insulating material 6. ing. This superposition can be realized by an adhesive or a laminate through the electrical insulating material 6. Moreover, SUS foil, copper foil, etc. which have a predetermined heat capacity can be applied to the metal foils 7a and 7b.

  Here, as shown in FIGS. 4A and 4B, the metal foil 7a is bonded to correspond to a region Z1 which is a low temperature region heated by the low temperature heater pattern 11a. On the other hand, the metal foil 7b is bonded corresponding to the region Z2 which is a high temperature region heated by the high temperature heater pattern 11b. Further, as shown in FIG. 4B, the thickness Y3 of the metal foil 7a in the direction perpendicular to the substrate surface 21 is smaller (thinner) than the thickness Y4 of the metal foil 7b in the direction perpendicular to the substrate surface 21 ( The thickness is different for each region).

  FIG. 5 shows an example of pressure processing using the planar heater 1c to which a metal foil is attached. Specifically, foreign matter (for example, an IC chip or the like) placed on the cradle 9a is shown. A state in which hot pressing is performed on a sandwiched (embedded) film (for example, a tag or a card) 8 by using a planar heater 1c is shown. As shown in FIG. 5, the low-temperature region Z1 to which the metal foil 7a is attached is opposed to the region where the foreign material is sandwiched on the film 8 surface, and the region where the foreign material is not sandwiched on the film 8 surface. Thus, the planar heater 1c is positioned so that the high temperature region Z2 to which the metal foil 7b is attached faces each other.

  Then, as shown in the figure, the planar heater 1c is pressed from above by the pressure plate 9b, whereby the film 8 placed on the cradle 9a is pressed, and in particular, the planar shape. Since the thickness of the metal foil 7b affixed to the high temperature region Z2 is larger than the thickness of the metal foil 7a affixed to the low temperature region Z1 in the heater 1c, the low temperature region Z1 has a lower pressure than the high temperature region Z2. It will take. That is, the low temperature region Z1 is a low pressure region, and the high temperature region Z2 is a high pressure region. At this time, the control device 5 individually controls the heating of the low temperature region Z1 and the high temperature region Z2 in the planar heater 1c.

  FIG. 6 (A) is a graph showing the relationship between pressure and time for the film 8 when the planar heater 1c is used, and FIG. 6 (B) is for the film 8 when the planar heater 1c is used. It is a graph which shows the relationship between temperature and time.

  As described above, since the unevenness of the planar heater 1c is very small, as shown in FIG. 6A, the pressure unevenness in each metal foil is small, and the pressure applied to the film 8 is the thickness of the metal foil (low pressure region). And the difference in the thickness of the metal foil in the high pressure region) (pressure control can be performed for each region (part) of the planar heater 1c). Further, as shown in FIG. 6B, temperature control is possible for each region (part) of the planar heater 1c (for each of the low temperature region Z1 and the high temperature region Z2). For example, as shown in FIG. Control and heating time can be controlled.

  Thereby, since only the area | region with respect to the foreign material pinched | interposed into the film 8 can be controlled independently at low temperature and low pressure, the efficient hot-pressure process which suppressed the damage to a foreign material is realizable.

  As described above, according to the third embodiment, by using the planar heater 1c for hot pressing, it is possible to minimize temperature unevenness (uniform temperature) or minimize pressure unevenness. In other words, stable and highly accurate temperature control can be realized under uniform conditions with uniform pressure.

  In the third embodiment, the thickness of the metal foil 7a is smaller than the thickness of the metal foil 7b so that the local pressure on the foreign matter can be eliminated to some extent. The thickness of the foil 7a and the metal foil 7b may be the same.

  Moreover, in the said 3rd Embodiment, although the plate-shaped object which is the metal foils 7a and 7b which have a predetermined | prescribed heat capacity was demonstrated on the 1st surface of the electrical insulation material 6, instead of this metal foil, A plate-like object such as a rubber material such as silicon having a predetermined elasticity is used as a low temperature heater pattern 11a, a high temperature heater pattern 11b, a low temperature region resistance temperature detector pattern 12a, and a high temperature region resistance temperature detector pattern 12b. In this case, the same effect as that of the third embodiment can be obtained. Also in this case, the thickness of the plate-like object may be changed for each region (low temperature region Z1 and high temperature region Z2).

  In the third embodiment, a desired heating area is selected in advance (by a heater pattern having a predetermined watt density and a heating area as a design item), and the plate-like object is pasted only in that area. Alternatively, a region to be heated and pressed may be formed in the planar heater 1c to perform individual control.

  In the first to third embodiments, the heater pattern and the resistance temperature detector pattern are the same constituent material, but the heater pattern and the resistance temperature detector pattern may be different constituent materials. In this case, for example, SUS is pasted on the substrate 2 in the portion where the heater pattern is formed, and platinum (or copper) is pasted in the portion where the resistance temperature detector pattern is formed. The heater pattern and the resistance temperature detector pattern can be formed at the same time by performing the etching process in the same manner as the embodiment.

  Moreover, in the said 1st-3rd embodiment, although comprised so that one resistance temperature detector pattern might be provided with respect to one area | region in a planar heater, it is not limited to this, One area | region (For example, a high temperature region Z2) may be configured to form a plurality of resistance temperature detector patterns (for example, a high temperature region resistance temperature detector pattern 12b) (can be easily formed by etching). Thus, the accuracy of temperature detection can be improved.

  In the first to third embodiments, the heater pattern and the resistance temperature detector pattern are formed simultaneously by etching, but may be formed simultaneously by other methods.

  Although one embodiment of the present invention has been described above, the specific configuration of the present invention is not limited to the first to third embodiments described above, and design changes and the like within a scope that does not depart from the gist of the present invention. Is included in the scope of the present invention.

(A) is a figure which shows schematic structure of the planar heater control system containing the top view of the planar heater in 1st Embodiment, (B) is sectional drawing of the planar heater in 1st Embodiment. . (A) is a figure which shows schematic structure of the planar heater control system containing the top view of the planar heater in 2nd Embodiment, (B) is sectional drawing of the planar heater in 2nd Embodiment. . (A) is a top view of the planar heater 1b, (B) is an enlarged view of the high-temperature region resistance thermometer pattern 12b in part A of (A), and (C) is (B). It is sectional drawing in the BB cross section. (A) is a figure which shows schematic structure of the planar heater control system containing the top view of the planar heater in 3rd Embodiment, (B) is sectional drawing of the planar heater in 3rd Embodiment. . It is the figure which showed the example of pressurization using the planar heater 1c with which metal foil was affixed. (A) is a graph which shows the relationship between the pressure with respect to the film 8 at the time of using the planar heater 1c, and time, (B) is the temperature and time with respect to the film 8 at the time of using the planar heater 1c. It is a graph which shows the relationship.

Explanation of symbols

1a, 1b, 1c planar heater 2 substrate (base)
DESCRIPTION OF SYMBOLS 3 Power supply control device 4 Signal converter 5 Control device 6 Electrical insulation material 7a, 7b Metal foil 8 Film 9a Base 9b Pressure plate 11 Heater pattern 11a Low-temperature heater pattern 11b High-temperature heater pattern 12 Resistance temperature detector pattern 12a Low-temperature region RTD pattern for temperature 12b RTD pattern for high temperature region 21 Substrate surface

Claims (13)

A planar heater formed on a substrate surface of a predetermined substrate,
A heater pattern, and a resistance temperature detector pattern for detecting a temperature in a region near the heater pattern,
The thickness of the heater pattern in the direction perpendicular to the substrate surface is the same as the thickness of the resistance temperature detector pattern in the direction perpendicular to the substrate surface. The planar heater according to claim 1,
The planar heater, wherein the heater pattern and the resistance temperature detector pattern are formed simultaneously by etching. A planar heater formed on a substrate surface of a predetermined substrate,
A heater pattern, and a resistance temperature detector pattern for detecting a temperature in a region near the heater pattern,
The planar heater, wherein the heater pattern and the resistance temperature detector pattern are formed simultaneously by etching. In the planar heater according to any one of claims 1 to 3,
There are a plurality of regions that are heated by the heater pattern, divided from each other,
The said resistance temperature element pattern is provided corresponding to each said area | region, The planar heater characterized by the above-mentioned. The planar heater according to claim 4, wherein
The planar heater, wherein the watt density in each of the regions is different from each other. The planar heater according to claim 4, wherein
A planar heater, wherein a plate-like object having a predetermined heat capacity is attached corresponding to each of the regions. The planar heater according to claim 4, wherein
A planar heater, wherein a plate-like object having a predetermined elasticity is affixed corresponding to each region. In the planar heater according to claim 6 or 7,
The planar heater is characterized in that a thickness in a direction perpendicular to the substrate surface is different for each region. In the planar heater as described in any one of Claims 1 thru | or 8,
The planar heater, wherein the constituent material of the heater pattern and the constituent material of the resistance temperature detector pattern are the same. The planar heater according to any one of claims 1 to 9,
The planar heater, wherein only the edge portion of the heater pattern and the resistance temperature detector pattern is removed. In the planar heater according to any one of claims 1 to 3,
A sheet heater having a predetermined heat capacity is attached to the sheet heater. In the planar heater according to any one of claims 1 to 3,
A sheet heater having a predetermined elasticity attached to the sheet heater. A method of manufacturing a planar heater formed on a substrate surface of a predetermined substrate,
The heater pattern and the resistance temperature detector pattern are simultaneously formed by etching using a heater pattern and a resist patterned as a resistance temperature detector pattern for detecting the temperature in the region in the vicinity of the heater pattern. A method for manufacturing a planar heater.

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