JP2005106977A - Method for measuring mounting position of semiconductor device and substrate for electro-optical device, substrate for electro-optical device, electro-optical device, electronic device, semiconductor device, and method for manufacturing electro-optical device. - Google Patents

Abstract

A semiconductor device and a panel mounting position measuring method capable of measuring a displacement of a semiconductor device mounted on a panel with a simple configuration.
A semiconductor device having measurement bumps 32x arranged linearly at equal intervals, and a reference mark 11a at a position where a central axis P1 of a reference bump 32a of the measurement bumps 32x is mounted. And a panel on which the alignment mark 11x is arranged according to a predetermined rule from the mark 11a, and the semiconductor device is mounted on the panel to measure the positional deviation in the mounting surface of the panel of the semiconductor device. This is a panel mounting position measuring method, which is based on the number of alignment marks 11x existing between a mark on a bump whose central axis P2 coincides with the central axis P1 and a mark 11a serving as a reference. The deviation of the bump 32a from the reference mark 11a is calculated.
[Selection] Figure 4-1

Description

  The present invention relates to a mounting position measurement of a semiconductor device and an electro-optical device substrate for measuring the accuracy of the mounting positions of the semiconductor device and the electro-optical device substrate when the semiconductor device having bumps is mounted on the electro-optical device substrate. The present invention relates to a method, a substrate for an electro-optical device, an electro-optical device, an electronic apparatus, a semiconductor device, and a method for manufacturing the electro-optical device.

  In recent years, with the miniaturization of electrical products and the like, the miniaturization of components incorporated in electrical products and the like has progressed. For example, in a liquid crystal display panel, parts other than a liquid crystal display are downsized by mounting components other than liquid crystal such as a liquid crystal driver on the panel on which the liquid crystal is mounted. Therefore, in order to reduce the size of the liquid crystal panel itself, it is necessary to downsize peripheral components such as a liquid crystal driver and mount them on the panel. For this reason, it is necessary to perform alignment accurately when a miniaturized liquid crystal driver or the like is mounted on the panel.

  Conventionally, in COG (Chip On Glass), in order to measure the alignment accuracy of a transparent glass panel on which liquid crystal is mounted and a semiconductor device such as a liquid crystal driver, dots are formed on both the glass panel mounting surface and the liquid crystal driver mounting surface. The alignment mark was formed. After mounting the liquid crystal driver on the glass panel, the distance between the two alignment marks from the back side of the glass panel was measured with a distance measuring device.

  However, in order to measure the alignment accuracy between the glass panel and the liquid crystal driver, measuring the distance between the two alignment marks using a distance measuring device has a problem of requiring labor and time. Further, as a method of mounting an IC (Integrated Circuit) on a non-transparent flexible printed wiring board with high positional accuracy, there is a method of arranging a recognition mark around the IC mounting position on the flexible printed wiring. In this method, the IC mounting position is calculated by measuring the relative distance between the IC mounting position and the recognition mark in advance and detecting the position of the recognition mark by the image recognition apparatus. Therefore, in order to mount the IC on the flexible printed wiring board with high positional accuracy, it is necessary to detect the recognition mark with high accuracy.

  In the flexible printed wiring board described in Patent Document 1, polyimide is formed on a copper foil, and the polyimide on the upper part of the recognition mark formed on the copper foil is deleted in a shape larger than the recognition mark. Then, a flexible printed wiring board is manufactured by forming a recognition mark on the copper foil and applying a necessary coverlay or the like. As a result, the copper foil is exposed from both the front and back surfaces of the flexible printed wiring board, and the recognition marks can be detected from both the front and back surfaces of the flexible printed wiring board.

JP 2002-185102 A

  However, the conventional technique described in Patent Document 1 has a problem that a step of deleting polyimide is required and the position of the recognition mark must be detected by an image recognition device. Further, although the recognition mark when the IC is mounted on the flexible printed wiring board can be detected, there is a problem that the alignment accuracy after the IC is mounted on the flexible printed wiring board cannot be measured.

  The present invention has been made in view of the above, and the position of a semiconductor device mounted on a substrate for an electro-optical device with a simple configuration without using an image recognition device for detecting the position of a recognition mark. It is an object of the present invention to obtain a mounting position measuring method for a semiconductor device and an electro-optical device substrate capable of measuring a deviation, an electro-optical device substrate, an electro-optical device, an electronic device, a semiconductor device, and an electro-optical device manufacturing method.

  In order to solve the above-described problems and achieve the object, the present invention mounts a semiconductor device having bumps arranged in a straight line at equal intervals, and a predetermined portion of the bump as a reference among the bumps. An alignment mark serving as a reference is provided at a position, and the alignment mark is arranged according to a predetermined rule from the alignment mark, and the semiconductor device is mounted on the electro-optic device substrate, A method for measuring a mounting position of a semiconductor device and an electro-optical device substrate in a mounting surface of the electro-optical device substrate in the semiconductor device, wherein the alignment is performed on a bump whose alignment mark coincides with the predetermined portion. Depending on the number of alignment marks existing between the mark and the reference alignment mark, the reference and And calculating a deviation from the alignment mark serving as the reference bump that. Thereby, the alignment marks are arranged according to a predetermined rule, and the bumps are arranged at equal intervals, so that the reference bump and the reference are based on the mounting position where the reference alignment mark and the reference bump match. It is possible to measure the mounting positions of the electro-optical device substrate and the semiconductor device only by detecting the displacement of the alignment mark.

  Also, the mounting position measuring method of the semiconductor device and the electro-optical device substrate according to the present invention is the mounting position measuring method of the semiconductor device and the electro-optical device substrate described above, wherein the alignment mark is the reference. The bumps are arranged in the arrangement direction at an arrangement interval corresponding to the distance from the alignment mark. As a result, the alignment marks are arranged in the bump arrangement direction at an arrangement interval corresponding to the distance from the reference alignment mark, and therefore the mounting positions of the electro-optical device substrate and the semiconductor device in the bump arrangement direction are measured. Is possible.

  Further, the mounting position measuring method for the semiconductor device and the electro-optical device substrate according to the present invention is the mounting position measuring method for the semiconductor device and the electro-optical device substrate described above, wherein the alignment mark is an arrangement of the bumps. It is characterized by being arranged by being shifted by a distance corresponding to the distance from the reference alignment mark in a direction orthogonal to the direction. As a result, the alignment mark is arranged by being shifted by a distance corresponding to the distance from the reference alignment mark in a direction orthogonal to the bump arrangement direction, so that the electro-optical device substrate in the direction orthogonal to the bump arrangement direction The mounting position of the semiconductor device can be measured.

  Also, the mounting position measuring method of the semiconductor device and the electro-optical device substrate according to the present invention is the mounting position measuring method of the semiconductor device and the electro-optical device substrate described above, wherein the alignment mark is at a predetermined position. The rectangular shape of the bumps in the arrangement direction is formed in a length corresponding to the distance from the reference alignment mark, and the alignment marks are arranged at the same arrangement intervals as the bumps. And arranged in the arrangement direction of the bumps. As a result, the rectangular width in the bump arrangement direction is formed to a length corresponding to the distance from the reference alignment mark, so the mounting position of the electro-optical device substrate and the semiconductor device in the bump arrangement direction can be determined. It becomes possible to measure.

  Further, the mounting position measuring method of the semiconductor device and the electro-optical device substrate according to the present invention is the mounting position measuring method of the semiconductor device and the electro-optical device substrate described above, wherein the alignment mark has the rectangular shape. The dimension width of the side in the direction orthogonal to the bump arrangement direction is formed according to the distance from the reference alignment mark, and the alignment mark is the same as the bump in the direction orthogonal to the bump arrangement direction. It arrange | positions at an arrangement | positioning space | interval, It is characterized by the above-mentioned. As a result, the rectangular width in the direction orthogonal to the bump arrangement direction is formed to a length corresponding to the distance from the reference alignment mark, so the electro-optical device in the direction orthogonal to the bump arrangement direction It becomes possible to measure the mounting position of the circuit board and the semiconductor device.

  The present invention also provides a semiconductor device having bumps arranged according to a predetermined rule, and a reference alignment mark provided at a position where a predetermined portion of the reference bump among the bumps is mounted. And an electro-optical device substrate having alignment marks linearly arranged at equal intervals from each other, the semiconductor device being mounted on the electro-optical device substrate, and the electro-optical device substrate of the semiconductor device A mounting position measuring method for a semiconductor device and an electro-optical device substrate for measuring a positional deviation in a mounting surface of the semiconductor device, wherein the bumps coincide with the predetermined portion of any one of the alignment marks, and the reference And the reference bump of the reference alignment mark depending on the number of bumps existing between them. And calculating a deviation from. Thereby, since the bumps are arranged according to a predetermined rule and the alignment marks are arranged at equal intervals, the reference bump and the reference are based on the mounting position where the reference alignment mark and the reference bump match. It is possible to measure the mounting positions of the electro-optical device substrate and the semiconductor device only by detecting the displacement of the alignment mark.

  Further, the mounting position measuring method of the semiconductor device and the electro-optical device substrate of the present invention is the mounting position measuring method of the semiconductor device and the electro-optical device substrate of the present invention described above, wherein the bump is the reference The alignment marks are arranged in the arrangement direction at an arrangement interval corresponding to the distance from the bump. As a result, the bumps are arranged in the alignment mark arrangement direction at an arrangement interval corresponding to the distance from the reference bump, so that the mounting positions of the electro-optical device substrate and the semiconductor device in the alignment mark arrangement direction are measured. Is possible.

  The method for measuring the mounting position of the semiconductor device and the substrate for the electro-optical device according to the present invention is the method for measuring the mounting position of the substrate for the semiconductor device and the substrate for the electro-optical device according to the present invention described above. It is characterized by being arranged by being shifted by a distance corresponding to the distance from the reference bump in a direction orthogonal to the mark arrangement direction. As a result, the bumps are arranged in a direction perpendicular to the alignment mark arrangement direction by a distance corresponding to the distance from the reference bump, so that the electro-optical device substrate and the semiconductor in the direction perpendicular to the alignment mark arrangement direction are arranged. It is possible to measure the mounting position of the apparatus.

  Further, the mounting position measuring method of the semiconductor device and the electro-optical device substrate of the present invention is the mounting position measuring method of the semiconductor device and the electro-optical device substrate of the present invention described above, wherein the bump is a predetermined It has a rectangular shape at a position, and the width in the arrangement direction of the rectangular alignment mark is formed according to the distance from the reference bump, and the bump is the same as the alignment mark. It arrange | positions at the arrangement | positioning space | interval in the arrangement direction of the said alignment mark. As a result, the rectangular width in the alignment mark arrangement direction is formed to a length corresponding to the distance from the reference bump, so the mounting position of the electro-optical device substrate and the semiconductor device in the alignment mark arrangement direction Can be measured.

  Further, the mounting position measuring method for the semiconductor device and the electro-optical device substrate according to the present invention is the mounting position measuring method for the semiconductor device and the electro-optical device substrate described above, wherein the bumps are formed in the rectangular shape. The width in the direction orthogonal to the alignment mark arrangement direction is formed to a length corresponding to the distance from the reference bump, and the bump is the same as the alignment mark in the direction orthogonal to the alignment mark arrangement direction. It arrange | positions at an arrangement | positioning space | interval, It is characterized by the above-mentioned. Thus, the rectangular width in the direction orthogonal to the alignment mark arrangement direction is formed to a length corresponding to the distance from the reference bump, so that the electro-optic in the direction orthogonal to the alignment mark arrangement direction is formed. It is possible to measure the mounting positions of the device substrate and the semiconductor device.

  According to another aspect of the present invention, there is provided a mounting position measuring method for a semiconductor device and an electro-optical device substrate, the mounting position measuring method for the semiconductor device and the electro-optical device substrate described above. The accuracy of the mounting rotation angle within the mounting plane with the semiconductor device is detected by detecting a plurality of distances within the mounting surface. Accordingly, it is possible to measure the accuracy of the mounting rotation angle between the electro-optical device substrate and the semiconductor device in the mounting plane of the bump and the alignment mark.

  Further, the present invention provides a substrate for an electro-optical device on which a semiconductor device having bumps arranged in a straight line at equal intervals is mounted, for measuring a positional deviation of a mounting position of a reference bump among the bumps. It has an alignment mark arranged according to a predetermined rule in the arrangement direction of the bump. As a result, the mounting position of the electro-optical device substrate and the semiconductor device is measured because the alignment mark is arranged in accordance with a predetermined rule in the bump arranging direction for measuring the positional deviation of the reference bump mounting position. It becomes possible to do.

  According to another aspect of the invention, an electro-optical device includes the electro-optical device substrate described above. As a result, an electro-optical device in which the displacement between the mounting positions of the electro-optical device substrate and the semiconductor device is suppressed is provided, and the display quality of the electro-optical device can be improved.

  According to another aspect of the invention, an electronic apparatus includes the electro-optical device described above. As a result, an electronic device in which the displacement between the mounting positions of the electro-optical device substrate and the semiconductor device is suppressed is provided, and the display quality of the electronic device can be improved.

  According to the present invention, in a semiconductor device mounted on an electro-optical device substrate having alignment marks arranged in a straight line at equal intervals, a positional deviation of a reference alignment mark mounting position among the alignment marks is measured. For this purpose, it has a bump arranged in the arrangement direction of the alignment mark according to a predetermined rule. Accordingly, the mounting position of the electro-optical device substrate and the semiconductor device can be determined by having the bumps arranged according to a predetermined rule in the alignment mark arranging direction for measuring the positional deviation of the reference alignment mark mounting position. It becomes possible to measure.

  According to another aspect of the invention, there is provided a method of manufacturing an electro-optical device including a semiconductor device and a substrate for an electro-optical device on which the semiconductor device is mounted. Forming an alignment mark on a substrate for an optical device according to a predetermined rule in a bump arrangement direction for measuring a displacement of a mounting position of a reference bump among the bumps; and the semiconductor device and the electric device Mounting the optical device substrate; and measuring the misalignment between the bumps formed on the semiconductor device and the alignment marks formed on the electro-optical device substrate. Measuring the mounting position. Accordingly, since the alignment mark is arranged in accordance with a predetermined rule in the bump arrangement direction for measuring the positional deviation of the reference bump mounting position, the electro-optical device substrate and The mounting position of the semiconductor device can be measured.

  According to another aspect of the invention, in the method of manufacturing an electro-optical device having a semiconductor device and an electro-optical device substrate on which the semiconductor device is mounted, the alignment marks are linearly arranged on the electro-optical device substrate at equal intervals. A step of arranging bumps on the semiconductor device according to a predetermined rule in the arrangement direction of the alignment mark for measuring a displacement of a mounting position of a reference alignment mark among the alignment marks, and the semiconductor device Measuring a mounting position of the semiconductor device and the electro-optical device substrate by measuring a positional deviation between the bump formed on the electro-optical device and the alignment mark formed on the electro-optical device substrate. And As a result, the electro-optical device substrate is provided in the electro-optical device manufacturing process since the bumps are arranged in accordance with a predetermined rule in the alignment mark arrangement direction for measuring the displacement of the mounting position of the reference alignment mark. It is possible to measure the mounting position of the semiconductor device.

  Embodiments of a mounting panel for a semiconductor device according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this Example.

  FIG. 1 is a cross-sectional view for explaining the configuration of the panel according to the first embodiment. In FIG. 1, a driver IC (Integrated Circuit) 30 is mounted on a liquid crystal display panel (hereinafter referred to as a panel) 10.

  The panel 10 is a substrate for an electro-optical device incorporated in an electro-optical device such as a liquid crystal display device, and the liquid crystal display device or the like is mounted on an electronic device such as a personal computer. The panel 10 includes a first substrate 51, a second substrate 52, a sealing material 53 formed between the first substrate and the second substrate along the outer periphery of the first substrate 51, the first substrate 51, and the second substrate. 52, the liquid crystal 50 which is an electro-optical material surrounded by the sealing material 53. The second substrate 52 is a transparent glass substrate used for COG (Chip On Glass) or the like, and the driver IC 30 is mounted on the overhanging region 54 other than the region where the first substrate or the like is mounted. The liquid crystal 50 is driven by an output signal from the driver IC 30 sent through the metal wiring of the panel 10 and displays an image or the like in a matrix.

  The driver IC 30 is a semiconductor device for driving the liquid crystal 50 by controlling the panel 10, and a plurality of output side bumps 31 and a plurality of inputs are provided on the surface of the driver IC 30 that is mounted on the panel 10. Side bumps 35 are formed. FIG. 1 shows only one output side bump 31 and one input side bump 35.

  The output-side bump 31 is a terminal that outputs an output signal from the driver IC 30 and is formed on the driver IC 30 by a vapor deposition method or a plating method using a material such as gold. Note that the output-side bump 31 is positioned so as to be closer to the liquid crystal 50 than the input-side bump 35 when the driver IC 30 is mounted on the panel 10 in order to facilitate wiring for electrical connection with the liquid crystal 50. Is formed.

  The input-side bump 35 is a terminal for inputting an input signal to the driver IC 30 and is formed by a vapor deposition method or a plating method using a material such as gold. Metal wiring (not shown) and the like are formed on the surface of the panel 10 and in the vicinity of the surface on the side where the liquid crystal 50 and the driver IC 30 are mounted. The liquid crystal 50 and the driver IC 30 are electrically connected via the metal wiring. An alignment mark 11x for measuring the mounting alignment accuracy between the driver IC 30 and the panel 10 is provided on the surface of the panel 10 where the metal wiring is formed and the output-side bump 31 of the driver IC 30 is mounted. Is formed.

  The alignment mark 11x is formed using a lithography technique or the like, and is created simultaneously with the metal forming step, the contact hole forming step, and the via hole forming step when forming the metal wiring of the panel 10. You may make it do, and you may make it produce by a separate independent process.

  The driver IC 30 is mounted on the panel 10 so that the output-side bump 31 overlaps the alignment mark 11x, and the position where the output-side bump 31 and the alignment mark 11x overlap is opposite to the side of the panel 10 where the driver IC 30 is mounted. By detecting from the back side of the panel 10 which is the surface, the mounting accuracy of the driver IC 30 and the driver IC 30 in the mounting direction in the mounting plane of the panel 10 is measured.

  FIG. 2 is a diagram for explaining the positional relationship when the driver IC is mounted on the panel. A plurality of input-side bumps 35 and a plurality of output-side bumps 31 are arranged on the driver IC 30 according to a predetermined rule. The output side bumps 31 have a rectangular shape. For example, the output side bumps 31 are arranged in a straight line in the lateral direction of the driver IC 30. The output-side bump 31 may include a dummy arranged in addition to the one for driving the liquid crystal 50.

  There is a driver IC mounting position 40 in the overhang region 54 of the panel 10 in which the liquid crystal 50 is sealed as a display element. Further, when the driver IC 30 is mounted on the panel 10, an alignment mark 11 x for measuring the mounting position alignment accuracy between the driver IC 30 and the panel 10 is formed on the panel 10.

  In the driver IC mounting position 40, an input side bump mounting position 41 is shown at a position where it is connected to the input side bump 35 of the driver IC 30 when the driver IC 30 is mounted on the panel 10. Further, in the driver IC mounting position 40, when the driver IC 30 is mounted on the panel 10, the output side bump mounting position 42 is shown in a portion connected to the output side bump 31 of the driver IC 30.

  The driver IC 30 is mounted on the panel 10 such that the output-side bump 31 of the driver IC 30 overlaps the output-side bump mounting position 42 of the panel 10. Then, the horizontal mounting position alignment accuracy between the driver IC 30 and the panel 10 is measured from the position where the alignment mark 11x of the panel 10 and the output-side bump 31 overlap. At this time, since the panel 10 is made of a transparent material such as a glass substrate, the position where the alignment mark 11x and the output-side bump 31 overlap can be seen from the surface of the panel 10 opposite to the side where the driver IC 30 is mounted.

  FIG. 3 is a diagram for explaining the configuration of alignment marks and output-side bumps. FIG. 3 shows the alignment mark 11x and the measurement bump 32x when viewed from the back side of the panel 10. The measurement bump 32x is for detecting the positional deviation of the driver IC 30 and the panel 10 in the lateral direction by detecting the position of the output bump 31 that overlaps the alignment mark 11x, and measuring the mounting alignment accuracy. is there. The measurement bumps 32x have, for example, a rectangular shape having a horizontal side of 5 μm and a vertical side of 10 μm, and the measurement bumps 32x are arranged in a straight line at equal intervals in the horizontal direction of the driver IC 30. Place it.

  The measurement bump 32x is composed of, for example, seven bumps, and the bump 32a is located at the center of the measurement bumps 32x. With the bump 32a located at the center as a reference, the next right one is the bump 32b1, the right one next is the bump 32c1, and the one right next is the bump 32d1. The one adjacent to the left of the bump 32a is the bump 32b2, the one adjacent to the left is the bump 32c2, and the one adjacent to the left is the bump 32d2. The measurement bumps 32x are arranged at regular intervals such that the arrangement interval between the measurement bumps 32x is 20 μm, for example.

  The alignment mark 11x is used for measuring the mounting accuracy in the horizontal direction between the driver IC 30 and the panel 10 by detecting the position overlapping the measurement bump 32x. The alignment mark 11x has, for example, a rectangular shape with a side of 1 μm in the horizontal direction and a side of 20 μm in the vertical direction, and each alignment mark 11x is a straight line in the horizontal direction of the driver IC 30 that is the arrangement direction of the measurement bumps 32x. Are arranged in a line.

  The alignment mark 11x is composed of the same number of seven marks as the measurement bumps 32x, and the mark 11a located at the center of the alignment marks 11x. Using 11a located at the center as a reference, the next right one is the mark 11b1, the right one next is the mark 11c1, and the one right next is the mark 11d1. A mark 11b2 is one mark next to the mark 11a, a mark one next to the left is a mark 11c2, and a mark one next to the left is a mark 11d2.

  Using the mark 11a located at the center as a reference, the other marks 11b1, 11b2, 11c1, 11c2, 11d1, and 11d2 are arranged so that the arrangement interval between adjacent marks increases as the distance from the reference mark 11a increases. For example, the marks 11b1 and 11b2 adjacent to the left and right one from the center mark 11a are arranged at a distance of 21 μm from the mark 11a. Next, two marks 11c1 and 11c2 adjacent to the left and right of the mark 11a are arranged at a distance of 22 μm from the marks 11b1 and 11b2. Further, three marks 11d1 and 11d2 adjacent to the left and right of the mark 11a are arranged at a distance of 23 μm from the marks 11c1 and 11c2. In this way, as the distance from the mark 11a located at the center increases, the arrangement interval between the marks is increased by a predetermined distance.

  Here, the mark 11a used as the reference for the arrangement of the alignment mark 11x is used as the reference for the mounting position, and the bump 32a used as the reference for the arrangement of the measurement bump 32x is used as the reference for the mounting position. Then, the measurement bump 32x of the driver IC 30 and the alignment mark 11x of the panel 10 are measured with the center of the side in the horizontal direction of the mark 11a as a reference of the mounting position of the alignment mark 11x when the driver IC 30 is mounted on the panel 10. It is designed such that the centers of the lateral sides of the bumps 32a used as the reference for the mounting position of the bumps 32x are mounted so as to coincide with each other.

  It is not necessary to use the same mark or bump as the placement reference for the mounting position reference mark or bump, which is different from the placement position reference mark or bump reference mark or bump. Marks and bumps may be used. Furthermore, although the reference of the mounting position is the center of the horizontal side of the mark or bump, the vertical side of the mark or bump may be used as the reference of the mounting position.

  Then, by confirming the overlapping position of the measurement bump 32x and the alignment mark 11x from the back surface of the panel 10 with an optical microscope or the like, it is possible to measure the lateral mounting alignment accuracy of the driver IC 30 and the panel 10 as will be described later. It becomes possible. The output-side bump 31 includes a bump used for driving the liquid crystal 50 and a bump disposed as a dummy. However, the measurement bump 32x may be used for driving the liquid crystal 50. However, the one arranged as a dummy may be used. When the measurement bump 32x used for driving the liquid crystal 50 is used, the alignment mark 11x may be configured so as not to affect the metal wiring of the panel 10.

  Further, the seven measurement bumps 32x may be arranged anywhere on the left end, near the center, right end, etc. of the driver IC 30. When the seven measurement bumps 32x are arranged near the left end or the right end of the driver IC 30, the bumps 32d1, 32c1, 32b1, 32a are arranged near the right end, and the bumps 32d2, 32c2, 32b2, 32a are arranged near the left end. You may divide and arrange so that. Further, a plurality of sets of seven measurement bumps 32x may be arranged on the driver IC 30. Next, a method for measuring the mounting alignment accuracy between the driver IC 30 and the panel 10 will be described.

  FIG. 4A is a diagram illustrating a state in which the measurement bump and the alignment mark overlap without being displaced in the horizontal direction. 4A illustrates the alignment mark 11x and the measurement bump 32x when the driver IC 30 is mounted on the panel 10 when viewed from the back side of the panel 10. FIG. In FIG. 4A, the vertical center axis P1 passing through the center of the side in the horizontal direction of the mark 11a overlaps with the vertical center axis P2 of the bump 32a. Further, the vertical central axes (not shown) of the marks 11b1 and 11b2 overlap with each other by 1 μm from the vertical central axes (not shown) of the bumps 32b1 and 32b2. Further, the vertical central axes (not shown) of the marks 11c1 and 11c2 overlap with a vertical central axis (not shown) of the bumps 32c1 and 32c2 so as to be shifted by 2 μm, and the vertical central axes of the marks 11d1 and 11d2 (not shown). ) Are overlapped by 3 μm from the vertical center axis (not shown) of the bumps 32d1 and 32d2.

  When the positions of the vertical central axis of each bump and the vertical central axis of the mark are compared in the seven overlapping bump and mark pairs, the pair of the bump 32a and the mark 11a is in the state where the central axes are closest to each other. They are overlapping. When the alignment mark 11x and the measurement bump 32x overlap in such a state, the central axis of the mark 11a as the reference for the mounting position overlaps the central axis of the bump 32a, and the driver is viewed from the back side of the panel 10. It is determined that the IC 30 and the panel 10 are mounted without shifting in the horizontal direction.

  FIG. 4B is a diagram illustrating a state in which the measurement bump is shifted to the right by 1 μm from the alignment mark. 4B illustrates the alignment mark 11x and the measurement bump 32x when the driver IC 30 is mounted on the panel 10 when viewed from the back side of the panel 10. FIG. In FIG. 4B, the vertical center axis Q1 of the mark 11b1 overlaps with the vertical center axis Q2 of the bump 32b1. The vertical center axis of the mark 11a overlaps with a deviation of 1 μm from the vertical center axis of the bump 32a, and the vertical center axis of the mark 11c1 also overlaps with a deviation of 1 μm from the vertical center axis of the bump 32c1. Further, the vertical center axis of the mark 11b2 overlaps with a deviation of 2 μm from the vertical center axis of the bump 32b2, and the vertical center axis of the mark 11d1 also overlaps with a deviation of 2 μm from the vertical center axis of the bump 32d1. Yes. Further, the vertical center axis of the mark 11c2 overlaps with a deviation of 3 μm from the vertical center axis of the bump 32c2, and the vertical center axis of the mark 11d2 overlaps with a deviation of 4 μm from the vertical center axis of the bump 32d2.

  When the positions of the vertical central axis of each bump and the vertical central axis of the mark are compared in the seven overlapping bump and mark pairs, the pair of the bump 32b1 and the mark 11b1 is in the state where the central axes are closest to each other. They are overlapping. In this state, when the alignment mark 11x and the measurement bump 32x are overlapped, the mark 32b1 and the mark 11b1 in the state in which the center axes are closest to each other are marked between the bump 32a as the reference of the mounting position. And the bump 32a is mounted with a displacement of 1 μm in the right direction from the mark 11a, and the driver IC 30 is mounted on the panel 10 with a displacement of 1 μm in the right direction when viewed from the back side of the panel 10. Will be judged.

  FIG. 4C is a diagram illustrating a state in which the measurement bump is shifted to the left by 3 μm from the alignment mark. 4C illustrates the alignment mark 11x and the measurement bump 32x when the driver IC 30 is mounted on the panel 10 as viewed from the back side of the panel 10. FIG. In FIG. 4C, the vertical center axis R1 of the mark 11d2 overlaps with the vertical center axis R2 of the bump 32d2. Further, the vertical center axis of the mark 11c2 overlaps with a deviation of 1 μm from the vertical center axis of the bump 32c2, and the vertical center axis of the mark 11b2 overlaps with a deviation of 2 μm from the vertical center axis of the bump 32b2. Further, the vertical center axis of the mark 11a overlaps with a deviation of 3 μm from the vertical center axis of the bump 32a, and the vertical center axis of the mark 11d1 overlaps with a deviation of 4 μm from the vertical center axis of the bump 32b1. Further, the vertical center axis of the mark 11c1 overlaps with a deviation of 5 μm from the vertical center axis of the bump 32c1, and the vertical center axis of the mark 11d1 overlaps with a deviation of 6 μm from the vertical center axis of the bump 32d1.

  When the positions of the vertical central axis of each bump and the vertical central axis of the mark are compared in the seven overlapping bump and mark pairs, the pair of the bump 32d2 and the mark 11d2 is in the state where the central axes are closest to each other. They are overlapping. When the alignment mark 11x and the measurement bump 32x overlap with each other in such a state, 2 between the set of the bump 32d2 and the mark 11d2 whose center axes are closest to each other and the bump 32a as the reference of the mounting position. Since there are two marks and two bumps, the bump 32a is mounted 3 μm off the mark 11a in the left direction, and the driver IC 30 is mounted on the panel 10 3μm left when viewed from the back side of the panel 10. It will be judged that it was done.

  As described with reference to FIGS. 4A to 4C, when the vertical center axis of the mark 11a overlaps with the vertical center axis of the bump 32a, the driver IC 30 is seen from the back side of the panel 10. It is determined that the panel 10 is mounted without shifting in the lateral direction.

  When the vertical center axis of the mark 11b1 is overlapped so as to pass through the vertical center axis of the bump 32b1, the driver IC 30 is mounted on the panel 10 with a deviation of 1 μm in the right direction when viewed from the back side of the panel 10. Judge. When the vertical center axis of the mark 11c1 is overlapped so as to pass through the vertical center axis of the bump 32c1, the driver IC 30 is mounted on the panel 10 while being shifted by 2 μm in the right direction when viewed from the back side of the panel 10. Judge. When the vertical center axis of the mark 11d1 is overlapped so as to pass through the vertical center axis of the bump 32d1, the driver IC 30 is mounted on the panel 10 in a state shifted by 3 μm in the right direction when viewed from the back side of the panel 10. Judge.

  When the vertical center axis of the mark 11b2 overlaps with the vertical center axis of the bump 32b2, the driver IC 30 is mounted on the panel 10 with a shift of 1 μm to the left when viewed from the back side of the panel 10. Judge. When the vertical center axis of the mark 11c2 is overlapped so as to pass through the vertical center axis of the bump 32c2, the driver IC 30 is mounted on the panel 10 in a state shifted by 2 μm leftward when viewed from the back side of the panel 10. Judge. When the vertical center axis of the mark 11d2 is overlapped so as to pass through the vertical center axis of the bump 32d2, the driver IC 30 is mounted on the panel 10 with a deviation of 3 μm in the left direction when viewed from the back side of the panel 10. Judge.

  FIG. 5 is a flowchart showing a procedure for measuring the mounting alignment accuracy in the horizontal direction between the driver IC and the panel. Metal wiring or the like is formed on the surface of the second substrate 52 on the side where the driver IC 30 is mounted, and the alignment mark 11x is formed in the overhang region 54 (step S10). Further, the sealing material 53, the liquid crystal 50, and the first substrate 51 are mounted on the surface of the second substrate 52 on which metal wiring or the like has been applied to form the panel 10 (step S20). The output side bumps 31 including the measurement bumps 32x and the input side bumps 35 are formed on the back surface of the driver IC 30 that is the surface to be mounted on the panel 10 (step S30). The driver IC 30 on which the output-side bump 31 and the input-side bump 35 are formed, and the panel 10 on which the liquid crystal 50 and the like are mounted are mounted so that the measurement bump 32x and the alignment mark 11x overlap with each other as much as possible (step S40).

  From the back surface of the panel 10, the measurement bumps 32x and the alignment marks 11x are observed. At this time, a set of marks and bumps that overlap each other so that their vertical central axes are closest to each other is searched for from the alignment mark 11x and the measurement bump 32x. As a result, how much the alignment mark 11x and the measurement bump 32x are displaced is measured (step S50). Depending on how much the alignment mark 11x and the measurement bump 32x are misaligned, the driver IC 30 can detect how misaligned it is with the panel 10 (step S60). In this embodiment, the driver IC 30 attached to the panel 10 is attached after the liquid crystal 50. However, the driver IC 30 may be attached to the panel 10 before the liquid crystal 50. Further, the alignment mark 11x may be formed on the surface of the second substrate 52 opposite to the side on which the driver IC 30 is mounted.

  In the present embodiment, the alignment marks 11x are arranged so that the arrangement interval between the marks increases by a predetermined distance as they move away from the mark 11a. You may arrange | position so that it may become far in the ratio. Further, in the present embodiment, the alignment marks 11x are arranged so that the arrangement interval between the marks is increased by a predetermined distance as the distance from the mark 11a is increased. May be arranged so as to be closer to each other or at a predetermined rate.

  Further, in the present embodiment, the measurement bumps 32x are arranged in a straight line so that the arrangement intervals of the measurement bumps 32x are constant, and the arrangement intervals between the marks are increased by a predetermined distance as the alignment marks 11x are separated from the marks 11a. However, the alignment marks 11x are arranged in a straight line so that the arrangement intervals of the alignment marks 11x are constant, and the predetermined intervals are set such that the arrangement intervals between the marks are increased by a predetermined distance as the measurement bumps 32x are separated from the bumps 32a. May be arranged so as to be closer to each other, at a predetermined rate, or closer at a predetermined rate.

  In this embodiment, the measurement bump 32x and the alignment mark 11x are each composed of seven bumps and seven marks, but the bumps and marks may be composed of other than seven. In the present embodiment, the alignment mark 11x has a plurality of rectangular shapes. However, a part or all of the alignment marks 11x may have a comb shape.

  If a plurality of sets of seven measurement bumps 32x are arranged in the vertical direction of the driver IC 30, the accuracy of the mounting rotation angle within the mounting plane of the panel 10 and the driver IC 30 can be measured. In this case, the measurement results of the positions of the plurality of measurement bumps 32x on the driver IC 30 and the respective mounting positions of the measurement bumps 32x arranged at a plurality of locations are within the mounting plane of the panel 10 and the driver IC 30. Measure the accuracy of the mounting rotation angle.

  As described above, according to the first embodiment, the measurement bumps 32x are linearly arranged in the lateral direction of the driver IC 30 so that the horizontal arrangement intervals between the measurement bumps 32x are constant, and the alignment is performed. As the mark 11x moves away from the mark 11a, the arrangement distance between the marks is increased by a predetermined distance in the horizontal direction. For this reason, the lateral displacement between the measurement bump 32x and the alignment mark 11x is measured simply by searching for a pair of bumps and marks that overlap so that the vertical central axes of the measurement bump 32x and the alignment mark 11x are closest to each other. be able to. Therefore, it is possible to measure the mounting accuracy of the driver IC 30 and the panel 10 in the horizontal direction. Furthermore, it is possible to measure the mounting alignment accuracy of the driver IC 30 and the panel 10 in the lateral direction even in the manufacturing process of the electro-optical device having the IC driver 30 and the panel 10.

  A second embodiment of the present invention will be described with reference to FIGS. In the first embodiment, the mounting accuracy in the horizontal direction between the panel 10 and the driver IC 30 is measured, whereas in the second embodiment, the mounting alignment accuracy in the vertical direction between the panel 10 and the driver IC 30 is measured. The configuration of the second embodiment is the same as that of the first embodiment except for the above differences. 6 and 7, the same reference numerals are given to the components that achieve the same functions as the components shown in FIGS. 1 to 4 of the first embodiment, and duplicate descriptions are omitted. .

  FIG. 6 is a diagram for explaining a configuration of an alignment mark for measuring the vertical mounting position alignment accuracy. FIG. 6 shows the alignment mark 12 x when viewed from the back side of the panel 10. The alignment mark 12x is used to measure the vertical mounting accuracy of the driver IC 30 and the panel 10, and the alignment mark 12x is composed of seven marks.

  Each mark has a rectangular shape, for example, one side in the horizontal direction is 15 μm and one side in the vertical direction is 6 μm. Each of the horizontal sides of 15 μm in the horizontal direction is, for example, 1 μm at a predetermined distance. The driver IC 30 is arranged so as to be shifted in the vertical direction, which is a direction perpendicular to the arrangement direction of the driver IC 30. Further, the marks are arranged in the lateral direction of the driver IC 30 at the same arrangement interval as the measurement bumps 32x. Of the alignment marks 12x, the mark 12a is located at the center. With reference to 12a located at the center, the one on the right is mark 12b1, the one on the right is mark 12c1, and the one on the right is mark 12d1. The mark on the left side of the mark 12a is the mark 12b2, the mark on the left of the mark 12a is the mark 12c2, and the mark on the left of the mark 12a is the mark 12d2. When the driver IC 30 is mounted on the panel 10, the center line passing through the center of the vertical side of the mark 12a used as the reference of the alignment mark 11x is the reference of the measurement bump 32x shown in FIG. The bumps 32a are designed to overlap with the center line passing through the center of the vertical side.

  FIG. 7 is a diagram illustrating a state in which the measurement bump and the alignment mark overlap without being displaced in the vertical direction. FIG. 7 shows the alignment mark 12x and the measurement bump 32x when the driver IC 30 is mounted on the panel 10 when viewed from the back side of the panel 10. The measurement bumps 32x are the same as those shown in FIG. In FIG. 7, the horizontal central axis S1 of the mark 12a overlaps the horizontal central axis of the bump 32a. Further, the horizontal central axis S2 (not shown) of the marks 12b1 and 12b2 overlaps with a deviation of 1 μm from the horizontal central axis (not shown) of the bumps 32b1 and 32b2. Further, the horizontal central axes (not shown) of the marks 12c1 and 12c2 are overlapped with a deviation of 2 μm from the horizontal central axes (not shown) of the bumps 32c1 and 32c2, and the horizontal central axes (not shown) of the marks 12d1 and 12d2 are overlapped. ) Are overlapped with a deviation of 3 μm from the horizontal central axis (not shown) of the bumps 32d1 and 32d2. When the alignment mark 11x and the measurement bump 32x overlap in this state, it is determined that the driver IC 30 and the panel 10 are mounted without being displaced in the vertical direction.

  If a plurality of sets of seven measurement bumps 32x are arranged in the lateral direction of the driver IC 30, the accuracy of the mounting rotation angle in the mounting plane of the panel 10 and the driver IC 30 can be measured. In this case, the mounting rotation angle in the mounting plane of the panel 10 and the driver IC 30 is determined from the measurement results of the positions of the plurality of measurement bumps 32x on the driver IC 30 and the mounting positions of the plurality of measurement bumps 32x. Measure accuracy.

  As described above, according to the second embodiment, the measurement bumps 32x are arranged so as to be linearly arranged in the lateral direction of the driver IC 30, and each alignment mark 12x has a predetermined distance between the lateral sides of the alignment mark 12x. It arrange | positions so that it may shift | deviate to the vertical direction of IC30. Therefore, the vertical deviation between the measurement bump 32x and the alignment mark 12x is measured simply by searching for a pair of the bump and mark that overlaps so that the horizontal central axes of the measurement bump 32x and the alignment mark 12x are closest to each other. be able to. Therefore, it is possible to measure the mounting accuracy of the driver IC 30 and the panel 10 in the vertical direction. Furthermore, it is possible to measure the mounting alignment accuracy of the driver IC 30 and the panel 10 in the lateral direction even in the manufacturing process of the electro-optical device having the IC driver 30 and the panel 10.

  A third embodiment of the present invention will be described with reference to FIG. In the first or second embodiment, the horizontal mounting position alignment accuracy or the vertical mounting position alignment accuracy of the panel 10 and the driver IC 30 is measured, whereas in the third embodiment, the panel 10 and the driver IC 30 are aligned. The horizontal mounting alignment accuracy and the vertical mounting alignment accuracy are measured simultaneously. The configuration of the third embodiment is the same as that of the first or second embodiment except for the above differences. In addition, among the constituent elements in FIG. 8, constituent elements that achieve the same functions as the constituent elements shown in FIGS. 1 to 4, 6, and 7 in Embodiment 1 or Embodiment 2 are assigned the same numbers. A duplicate description is omitted.

  FIG. 8 is a diagram for explaining a configuration of an alignment mark for simultaneously measuring mounting position alignment accuracy in the vertical direction and the horizontal direction. FIG. 8 shows alignment marks 13x and measurement bumps 32x when the driver IC 30 is mounted on the panel 10 when viewed from the back side of the panel 10. The alignment mark 13x is used for measuring the vertical mounting position alignment accuracy and the horizontal mounting position alignment accuracy of the driver IC 30 and the panel 10, and the alignment mark 13x includes seven marks.

  Of the alignment marks 13x, the mark 13a is located at the center. With reference to 13a located at the center, the next right one is the mark 13b1, the right one next is the mark 13c1, and the one right next is the mark 13d1. One mark to the left of the mark 13a is the mark 13b2, one mark to the left is the mark 13c2, and one mark to the left is the mark 13d2.

  Each mark has, for example, a rectangular shape in which one side in the horizontal direction is 9 μm and one side in the vertical direction is 6 μm, and the horizontal side of one side of 9 μm is arranged to be shifted by 1 μm in the vertical direction of the driver IC 30. ing. Further, the marks 13b1 and 13b2 adjacent to the left and right from the mark 13a located at the center are arranged at a distance of 21 μm from the mark 13a. Next, two marks 13c1 and 13c2 adjacent to the left and right of the mark 13a are arranged at a distance of 22 μm from the marks 13b1 and 13b2. Further, three marks 13d1 and 13d2 adjacent to the left and right of the mark 13a are arranged at a distance of 23 μm from the marks 13c1 and 13c2. In this way, the distance between the marks is increased by a predetermined distance as the distance from the mark 13a located at the center increases. It should be noted that when the driver IC 30 is mounted on the panel 10, it is designed so that the center of the mark 13a passes through the center of the bump 32a and overlaps.

  FIG. 8 shows a state in which the alignment mark 13x and the measurement bump 32x overlap with each other in the vertical direction and the horizontal direction when viewed from the back side of the panel 10. Here, in the alignment mark 13x and the measurement bump 32x, the vertical central axis T1 of the mark 13a overlaps the vertical central axis T2 of the bump 32a, and the horizontal central axis U1 of the mark 13a is lateral to the bump 32a. It overlaps with the central axis U2.

Further, the vertical central axis and the horizontal central axis of the marks 13b1 and 13b2 overlap each other by 1 μm from the vertical central axis and the horizontal central axis of the bumps 32b1 and 32b2, respectively.
Further, the vertical center axis and the horizontal center axis of the marks 13c1 and 13c2 are overlapped with each other by 2 μm from the vertical center axis and the horizontal center axis of the bumps 32c1 and 32c2, respectively. Further, the vertical center axis and the horizontal center axis of the marks 13d1 and 13d2 overlap each other by 3 μm from the vertical center axis and the horizontal center axis of the bumps 32d1 and 32d2, respectively.

  As described above, according to the third embodiment, the measurement bumps 32x are linearly arranged in the lateral direction of the driver IC 30 so that the horizontal arrangement interval between the measurement bumps 32x is constant, and the alignment is performed. As the mark 13x moves away from the mark 11a, the distance between the marks is increased by a predetermined distance in the lateral direction of the driver IC 30, and the lateral sides of the alignment mark 13x are shifted by a predetermined distance in the vertical direction of the driver IC 30. It is arranged. For this reason, the vertical direction of the measurement bump 32x and the alignment mark 13x can be determined only by searching for a pair of bumps and marks that overlap so that the vertical central axis and the horizontal central axis of the measurement bump 32x and the alignment mark 13x are closest to each other. Directional and lateral displacement can be measured simultaneously. Therefore, it is possible to measure the mounting alignment accuracy of the driver IC 30 and the panel 10 in the vertical and horizontal directions.

  Embodiment 4 of the present invention will be described with reference to FIG. In the first to third embodiments, the alignment mark 11x, the alignment mark 12x, and the alignment mark 13x of the panel 10 have a rectangular shape, whereas in the fourth embodiment, the alignment mark has four L-shaped shapes. A mark having a shape (hereinafter, referred to as an L-shaped mark) is configured as seven sets of L-shaped marks as one set of L-shaped marks. The configuration of the fourth embodiment is the same as that of the first to third embodiments except for the above differences. In addition, among the constituent elements in FIG. 9, constituent elements that achieve the same functions as the constituent elements shown in FIGS. A duplicate description is omitted.

  FIG. 9 is a diagram for explaining an example of an alignment mark having a shape other than a rectangle. FIG. 9 shows the alignment mark 14x and the measurement bump 32x when the driver IC 30 is mounted on the panel 10 when viewed from the back side of the panel 10. The alignment mark 14x is composed of seven sets of L-shaped marks, with four L-shaped marks as a set of L-shaped marks. In a set of L-shaped marks, the outer corners of each of the four L-shaped shapes are arranged to form four corners of a rectangle.

  Of the alignment marks 14x, the mark 14a is located at the center. Using the mark 14a located at the center as a reference, the one right next to it is the mark 14b1, the one right next is the mark 14c1, and the one right next is the mark 14d1. The mark one left adjacent to the mark 14a is the mark 14b2, the mark one next to the left is the mark 14c2, and the mark one next to the left is the mark 14d2. The apex portions outside the L-shaped mark located at the lower left of each alignment mark 14x are arranged at regular intervals, for example, such that the arrangement interval between the apexes is 20 μm in the horizontal direction.

  A set of four L-shaped marks is formed such that all four L-shaped marks become narrower than the mark positioned on the left as the mark is positioned on the right. For example, four L-shaped marks constituting the leftmost mark 14d2 are formed with a width of 7 μm, and four L-shaped marks configuring the right adjacent mark 14c2 are formed with a width of 6 μm. Further, four L-shaped marks constituting the mark 14b2 on the right side of the mark 14c2 are formed with a width of 5 μm. Similarly, the alignment mark 14x located on the right side is similarly wider than the alignment mark 14x located on the left side. The four L-shaped marks constituting the rightmost mark 14d1 are formed with a width of 1 μm. Note that, in one mark that forms a rectangle with four L-shaped marks, the horizontal length of the rectangle formed by the inner corner of the L-shaped mark is the same as the horizontal length of the measurement bump 32x. Keep it. When the driver IC 30 is mounted on the panel 10 without being laterally displaced, the alignment mark 14x is arranged so that the mark 14a is in contact with one part of the four sides of the bump 32a so as to surround the four vertices. Is formed.

  FIG. 9 shows a state in which the alignment mark 14x and the measurement bump 32x overlap with each other in the lateral direction of the driver IC 30 when viewed from the back side of the panel 10, and the mark 14a is located inside the rectangle. The vertical side is in contact with the vertical side of the bump 32a. Further, the vertical sides inside the rectangle formed by the marks 14b and 14b2 are overlapped with a deviation of 1 μm from the vertical sides of the bumps 32b. Further, the vertical sides inside the rectangle formed by the marks 14c1 and 14c2 are shifted by 2 μm from the vertical sides of the bump 32c, and the vertical sides inside the rectangle formed by the marks 14d1 and 14d2 are overlapped by the bump 32d. It overlaps with a deviation of 3 μm from the vertical side.

  Here, the mark arranged on the right is formed so as to be thinner than the mark arranged on the left, but the mark arranged on the right may be formed thicker than the mark arranged on the left. Here, the alignment mark 14x is configured to detect the horizontal position of the alignment mark 14x and the measurement bump 32x. However, the alignment mark 14x may be configured to detect the vertical position, or the vertical and horizontal positions may be detected simultaneously. You may comprise so that it may detect. When the driver IC 30 is arranged in the vertical direction, the mark arranged above is arranged so as to be thinner or thicker than the mark arranged below.

  As described above, according to the fourth embodiment, the alignment mark 14x is composed of seven L-shaped marks, with four L-shaped marks as one set of L-shaped marks, and one set of L-shaped marks. The four L-shaped corners are arranged to form four rectangular corners. For this reason, it becomes easy to confirm the overlap of the vertical central axes of the measurement bump 32x and the alignment mark 13x. Therefore, it becomes easy to measure the mounting alignment accuracy of the driver IC 30 and the panel 10 in the vertical and horizontal directions.

  A fifth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, the alignment mark is arranged with a certain distance width and the dimension width of the alignment mark is formed so as to become narrower than the alignment mark positioned on the left side as the alignment mark is positioned on the right side. In FIG. 5, the bumps are arranged with a certain distance width, and the dimension width of the bumps is formed so as to become narrower than the bumps located on the left side as the bumps are located on the right side. The configuration of the fifth embodiment is the same as that of the fourth embodiment except for the above differences. Moreover, the same number is attached | subjected to the component which achieves the function same as each component shown in FIGS. 1-4, 6-9 of Example 1-4 of Example among each component of FIG. A duplicate description is omitted.

  FIG. 10 is a diagram for explaining a configuration of a measurement bump for measuring the mounting alignment accuracy in the horizontal direction. FIG. 10 shows alignment marks 15x and measurement bumps 33x when the driver IC 30 is mounted on the panel 10 when viewed from the back side of the panel 10. The alignment mark 15x is composed of seven sets of L-shaped marks, with four L-shaped marks as a set of L-shaped marks. In a set of L-shaped marks, the outer corners of each of the four L-shaped shapes are arranged to form four corners of a rectangle.

  Of the alignment marks 15x, the mark 15a is located at the center. Using the mark 15a located at the center as a reference, the one right next to it is the mark 15b1, the one right next is the mark 15c1, and the one right next is the mark 15d1. The mark on the left of the mark 15a is the mark 15b2, the mark on the left of the mark 15a is the mark 15c2, and the mark on the left of the mark 15a is the mark 15d2. The alignment marks 15x are arranged at regular intervals so that the arrangement interval is, for example, 20 μm in the horizontal direction. The four L-shaped marks are all formed with the same dimensional width.

  Further, in one mark that forms a rectangle with four L-shaped marks, the lateral length of the rectangle formed by the inner corner of the L-shaped mark is the width of the bump 33a located at the center of the measurement bump 32x. The lateral length is set to 10 μm. When the driver IC 30 is mounted on the panel 10 without being laterally displaced, the alignment mark 15x is arranged so that the mark 15a is in contact with a part of the four sides of the bump 32a so as to surround the four apexes. Form.

  Among the measurement bumps 33x, the bump 33a is located at the center. With the bump 33a located at the center as a reference, the one right next is the bump 33b1, the one right next is the bump 33c1, and the one right next is the bump 33d1. The bump 33b2 is one bump left next to the bump 33a, the bump 33c2 is one next left, and the bump 33d2 is one next left. The arrangement is such that the arrangement interval of the vertical sides located on the left side of each measurement bump 33x is 20 μm, which is the same as that of the alignment mark 15x.

  Further, the measurement bump 33x is formed so that the width of the side has a length corresponding to the distance from the reference bump. Here, the bump is formed so as to become shorter than the length of the lateral side of the bump located on the left as the bump is located on the right. For example, the length of the lateral side of the leftmost bump 33d2 is formed at 13 μm, and the length of the lateral side of the bump 33c2 adjacent to the right is formed at 12 μm. Further, the length of the lateral side of the bump 33b2 on the right side of the bump 33c2 is formed to be 11 μm. Similarly, the alignment mark 15x located on the right side is the length of the side in the lateral direction of the bump located on the left side. The length of the lateral side of the rightmost bump 33d1 is formed with a width of 7 μm.

  FIG. 10 shows a state in which the alignment mark 15x and the measurement bump 33x overlap with each other in the lateral direction of the driver IC 30 when viewed from the back side of the panel 10, and the vertical side of the bump 33a has the mark 15a. It is in contact with the vertical side that is inside the rectangle. Further, the vertical sides of the bumps 33b1 and 33b2 are shifted by 1 μm in the horizontal direction from the vertical sides inside the rectangle formed by the marks 15b1 and 15b2. Further, the vertical sides of the bumps 33c1 and 33c2 are respectively shifted by 2 μm in the horizontal direction from the vertical sides inside the rectangle formed by the marks 15c1 and 15c2, and the vertical sides of the bumps 33d1 and 33d2 are formed by the marks 15d1 and 15d2. Each of the horizontal sides is displaced by 3 μm from the vertical side inside the rectangular shape.

  Here, the bump arranged on the right is formed so as to be thinner than the bump arranged on the left, but the bump arranged on the right may be formed thicker than the bump arranged on the left. Further, here, the bump 33x is configured to detect the horizontal position of the alignment mark 15x and the measurement bump 33x. However, the bump 33x is configured to detect the vertical position, or the vertical and horizontal positions are detected simultaneously. You may comprise. When the driver IC 30 is arranged in the vertical direction, the bumps arranged on the upper side are arranged such that the vertical sides of the bumps are shorter or longer than the vertical sides of the bumps arranged below.

  As described above, according to the fifth embodiment, the measurement bump 33x is configured to be shorter than the length of the lateral side of the bump located on the left as the bump is located on the right. For this reason, various dimensions of the lateral sides of the measurement bump 33x can be formed in the process of forming the driver IC 30, and it is easy to confirm the overlap between the vertical central axes of the measurement bump 33x and the alignment mark 15x. Accordingly, it becomes easy to measure the mounting accuracy of the driver IC 30 and the panel 10 in the horizontal direction.

  It should be noted that the electro-optical device and the electronic apparatus of the present invention are not limited to the illustrated examples described above, and various changes can be made without departing from the scope of the present invention. For example, each of the electro-optical devices shown in the above embodiments is a liquid crystal display device having a liquid crystal panel, but instead of the liquid crystal panel, an inorganic electroluminescence device, an organic electroluminescence device, a plasma display device, an FED (Field Emission). It is also possible to use one having a substrate for various electro-optical devices such as a display device.

  In Example 6, a specific example of an electronic apparatus including the electro-optical device having the panel described in Examples 1 to 5 will be described. FIGS. 11 to 13 are examples of electronic apparatuses each including an electro-optical device using the panel according to the present invention. FIG. 11 is a perspective view illustrating an example of a mobile phone. Reference numeral 100 denotes a mobile phone main body, and 101 is a display unit comprising an electro-optical device using the panel of the present invention. FIG. 12 is a perspective view illustrating an example of a wristwatch-type electronic device. Reference numeral 110 denotes a watch main body with a built-in watch function, and 111 denotes a display unit comprising an electro-optical device using the panel of the present invention. FIG. 13 is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. In FIG. 13, reference numeral 120 denotes a portable information processing apparatus, 122 denotes an input unit such as a keyboard, 124 denotes an information processing apparatus main unit storing arithmetic means, storage means, and the like, and 126 denotes the present invention. It is the display part which consists of an electro-optical apparatus using the panel of this.

  In addition to the mobile phone shown in FIG. 11, the wristwatch-type electronic device shown in FIG. 12, the portable information processing device shown in FIG. For example, digital still cameras, in-vehicle monitors, digital video cameras, liquid crystal televisions, viewfinder types, monitor direct-view video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, video phones, Examples thereof include an electronic device including an electro-optical device such as a POS terminal.

  As described above, the substrate for an electro-optical device according to the present invention is for a semiconductor device and an electro-optical device that can accurately measure the mounting alignment accuracy in the mounting plane of the substrate for the electro-optical device and the semiconductor device with a simple configuration. It is suitable for a method for measuring the mounting position of a substrate.

Sectional drawing for demonstrating the structure of the panel which concerns on a present Example. The figure for demonstrating the positional relationship when driver IC is mounted in a panel. The figure for demonstrating the structure of an alignment mark and an output side bump. The figure which shows the state which a bump and a mark overlap, without shifting | deviating to a horizontal direction. The figure which shows the state which bump has shifted | deviated 1 micrometer right from the mark. The figure which shows the state which bump has shifted | deviated 3 micrometers left from the mark. The flowchart which shows the measurement procedure of the mounting position of driver IC and a panel. The figure which shows the structure of the alignment mark which measures the mounting position of a vertical direction. The figure which shows the state which the bump and the mark have overlapped without shifting | deviating to the vertical direction. The figure which shows the structure of the alignment mark which measures the mounting position of the vertical and horizontal direction. The figure for demonstrating an example of the alignment mark of another shape. The block diagram of the measurement bump for measuring the mounting | wearing position alignment precision of a horizontal direction. The perspective view which shows an example of a mobile telephone. The perspective view which shows an example of a wristwatch-type electronic device. The perspective view which shows an example of a portable information processing apparatus.

Explanation of symbols

10 panels, 11x-14x alignment marks, 11a-14a, 11b1-14b1, 11b2-14b2, 11c1-14c1, 11c2-14c2, 11d1-14d1, 11d2-11d2 marks, 30 driver ICs, 31 output bumps, 32a, 32b1 32c1, 32d1, 32b2, 32c2, 32d2 bump, 32x measurement bump, 35 input side bump, 40 driver IC mounting position, 41 input side bump mounting position, 42 output side bump mounting position, 50 liquid crystal, 51 first substrate, 52 Second substrate, 53 Sealing material, 54 Overhang area, 100 Mobile phone main body, 101, 111, 126 Display unit, 110 Clock main body, 120 Portable information processing device, 122 Input unit, 124 Information processing device main body, P1 ~ U1, P2-U2 Medium Core axis

Claims (17)

A semiconductor device having bumps arranged in a straight line at equal intervals;
An electro-optical device substrate in which a reference alignment mark is provided at a position where a predetermined part of the reference bump is mounted among the bumps, and the alignment mark is arranged according to a predetermined rule from the alignment mark;
A mounting position of the semiconductor device and the electro-optical device substrate, wherein the semiconductor device is mounted on the electro-optical device substrate and a positional deviation of the semiconductor device in the mounting surface of the electro-optical device substrate is measured. A measuring method,
The deviation of the reference bump from the reference alignment mark depends on the number of alignment marks between the alignment mark on the bump whose alignment mark matches the predetermined portion and the reference alignment mark. A mounting position measuring method for a semiconductor device and an electro-optical device substrate, characterized by:   2. The mounting of the semiconductor device and the electro-optical device substrate according to claim 1, wherein the alignment marks are arranged in an arrangement direction of the bumps at an arrangement interval corresponding to a distance from the reference alignment mark. Position measurement method.   3. The semiconductor device according to claim 1, wherein the alignment mark is arranged by being shifted by a distance corresponding to a distance from the reference alignment mark in a direction orthogonal to the arrangement direction of the bumps. A mounting position measurement method for a substrate for an electro-optical device.   The alignment mark has a rectangular shape at a predetermined position, and the width in the arrangement direction of the rectangular bump is formed in a length corresponding to the distance from the reference alignment mark. 2. The mounting position measuring method for a semiconductor device and an electro-optical device substrate according to claim 1, wherein the alignment marks are arranged in the arrangement direction of the bumps at the same arrangement interval as the bumps.   The alignment mark is formed to have a width in a direction perpendicular to the arrangement direction of the rectangular bumps according to the distance from the reference alignment mark, and the alignment mark is arranged in the bump arrangement direction. 5. The mounting position measuring method for a semiconductor device and an electro-optical device substrate according to claim 4, wherein the mounting positions are arranged in the direction perpendicular to the bumps at the same spacing as the bumps. A semiconductor device having bumps arranged according to a predetermined rule;
A substrate for an electro-optical device having an alignment mark arranged linearly at equal intervals from the alignment mark, provided with a reference alignment mark at a position where a predetermined portion of the bump serving as a reference is mounted among the bumps;
A mounting position of the semiconductor device and the electro-optical device substrate, wherein the semiconductor device is mounted on the electro-optical device substrate and a positional deviation of the semiconductor device in the mounting surface of the electro-optical device substrate is measured. A measuring method,
The reference bump of the reference alignment mark, depending on the number of bumps existing between the bump that matches the predetermined portion of the alignment mark and the reference bump. A method of measuring a mounting position of a semiconductor device and a substrate for an electro-optical device, characterized by calculating a deviation from   7. The mounting position of the semiconductor device and the electro-optical device substrate according to claim 6, wherein the bumps are arranged in an arrangement direction of the alignment mark at an arrangement interval corresponding to a distance from the reference bump. Measuring method.   8. The semiconductor device according to claim 6, wherein the bumps are arranged so as to be shifted by a distance corresponding to a distance from the reference bump in a direction perpendicular to the arrangement direction of the alignment marks. A mounting position measuring method for a substrate for an optical device.   The bump has a rectangular shape at a predetermined position, and the width in the arrangement direction of the rectangular alignment mark is formed according to the distance from the reference bump, and the bump 7. The method for measuring a mounting position of a semiconductor device and a substrate for an electro-optical device according to claim 6, wherein the semiconductor device and the electro-optical device substrate are arranged in the arrangement direction of the alignment mark at the same arrangement interval as the alignment mark.   The bumps are formed such that the width in the direction orthogonal to the arrangement direction of the rectangular alignment marks is a length corresponding to the distance from the reference bump, and the bumps are arranged in the arrangement direction of the alignment marks. 10. The method for measuring a mounting position of a semiconductor device and an electro-optical device substrate according to claim 9, wherein the mounting positions are arranged in the perpendicular direction at the same arrangement interval as the alignment mark.   11. The accuracy of the mounting rotation angle in the mounting plane with the semiconductor device is detected by detecting a plurality of distances in the mounting plane of the bump and the alignment mark. The mounting position measuring method of the semiconductor device and electro-optical device board | substrate as described in one. In a substrate for an electro-optical device on which a semiconductor device having bumps arranged linearly at equal intervals is mounted,
An electro-optical device substrate comprising an alignment mark arranged in accordance with a predetermined rule in the bump arrangement direction for measuring a displacement of a mounting position of a reference bump among the bumps.   An electro-optical device comprising the electro-optical device substrate according to claim 12.   An electronic apparatus comprising the electro-optical device according to claim 13. In a semiconductor device mounted on an electro-optical device substrate having alignment marks arranged linearly at equal intervals,
A semiconductor device comprising: a bump arranged in accordance with a predetermined rule in the arrangement direction of the alignment mark for measuring a displacement of a mounting position of a reference alignment mark among the alignment marks. In a manufacturing method of an electro-optical device having a semiconductor device and an electro-optical device substrate on which the semiconductor device is mounted
Forming bumps in a straight line at equal intervals on the semiconductor device;
Forming an alignment mark on the electro-optic device substrate in accordance with a predetermined rule in the arrangement direction of the bumps for measuring a displacement of a mounting position of a reference bump among the bumps;
Attaching the semiconductor device and the electro-optical device substrate;
Measuring a mounting position of the semiconductor device and the electro-optical device substrate by measuring a displacement between a bump formed on the semiconductor device and an alignment mark formed on the electro-optical device substrate;
A method for manufacturing an electro-optical device. In a manufacturing method of an electro-optical device having a semiconductor device and an electro-optical device substrate on which the semiconductor device is mounted,
Arranging alignment marks linearly at equal intervals on the electro-optical device substrate;
In the semiconductor device, a step of arranging bumps according to a predetermined rule in the arrangement direction of the alignment mark for measuring a positional deviation of a mounting position of a reference alignment mark among the alignment marks;
Measuring a mounting position of the semiconductor device and the electro-optical device substrate by measuring a displacement between a bump formed on the semiconductor device and an alignment mark formed on the electro-optical device substrate;
A method for manufacturing an electro-optical device.

Images