JP2005093657A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that can shorten the transmitting time of data from a main controller to each section when the device is actuated and, at the same time, can eliminate the need of transmitting data obtained when adjusting each section to the main controller. <P>SOLUTION: The substrate processing apparatus is composed of a plurality of controlling constituent units (cells) and part of the cells is further provided with a plurality of processing units in its inside. The substrate processing apparatus is provided with the main controller MC which controls the operation of the whole substrate processing apparatus. In addition, the device is also provided with cell controllers CC which control operations in the cells at every cell, and unit controllers UC which control the operations in a plurality of processing units at every processing unit. Each controller CC and UC is provided with a nonvolatile storage means S which can store data required for each control. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus that performs a series of processes on a substrate such as a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, and an optical disk substrate.

  In general, a substrate processing apparatus that performs a series of processing on a substrate includes a plurality of processing units that perform a single processing on the substrate. For example, in order to form a predetermined circuit pattern on a semiconductor substrate, a substrate processing apparatus that performs a resist coating process, a development process, a predetermined heat treatment associated therewith, a chemical process, and the like can be applied to a single substrate A plurality of resist coating processing units that perform resist coating processing, a development processing unit that performs single development processing on a substrate, a thermal processing unit that performs thermal processing on a substrate, and the like are provided.

  Such a substrate processing apparatus includes a main controller that controls the operation of the entire substrate processing apparatus. Conventionally, the main controller is provided with storage means, and all data necessary for controlling the operation of the apparatus is stored in the storage means provided in the main controller.

  The configuration of such a conventional substrate processing apparatus is disclosed in Patent Document 1, for example.

JP-A-11-040473

  However, in the conventional substrate processing apparatus as described above, since all data necessary for controlling each part of the apparatus is stored in the storage means provided in the main controller, a large amount of data is transferred from the main controller to each part of the apparatus at the time of startup. Need to send. Therefore, a considerable time is required for data transmission, which causes a slow start of the apparatus.

  In addition, after each unit such as the processing unit is adjusted, it is necessary to transmit data obtained by the adjustment to the main controller each time.

  The present invention has been made in view of such a problem, and can shorten the time for transmitting data from the main controller to each unit at the time of starting the apparatus, and can also obtain the data obtained at the time of adjusting each unit. It is an object of the present invention to provide a substrate processing apparatus that does not need to be transmitted to.

  In order to solve the above problems, an invention according to claim 1 is a substrate processing apparatus that performs a series of a plurality of processes on a substrate, the plurality of processing units performing a process on the substrate, and the plurality of processes. A plurality of low-order control means for controlling the operation of each unit; and a high-order control means for controlling the operation of the entire apparatus. Each of the plurality of low-order control means controls the operation of the processing unit to be controlled. Non-volatile storage means for storing data necessary for control, and the host control means includes non-volatile storage means for storing data required for controlling the operation of the entire apparatus. To do.

  A second aspect of the present invention is the substrate processing apparatus according to the first aspect, wherein a plurality of structural units correspond to the respective transfer areas of the plurality of substrate transfer means provided in the apparatus. Each of the subordinate control means is defined in a processing apparatus and controls a corresponding processing unit with respect to a local range limited to the respective transfer charge area, and the substrate processing apparatus includes: A plurality of intermediate control means for controlling operations of the plurality of structural units are further provided.

  The invention according to claim 3 is the substrate processing apparatus according to claim 2, wherein the plurality of processing units belong to the plurality of structural units.

  The invention according to claim 4 is the substrate processing apparatus according to claim 2 or claim 3, wherein each of the plurality of intermediate control means controls the operation of the structural unit to be controlled. Non-volatile storage means for storing necessary data is provided.

  The invention according to claim 5 is the substrate processing apparatus according to any one of claims 2 to 4, wherein the upper control means, the middle control means, and the lower control means are hierarchical. It is characterized by being connected.

  According to the first to fifth aspects of the present invention, since data necessary for control in each processing unit can be stored in the lower control means, data necessary for apparatus control when starting the substrate processing apparatus is stored. The transmission / reception time can be shortened, and the amount of data transmitted / received to / from the higher control means can be reduced, so that malfunction of the apparatus due to transmission / reception errors can be reduced. Further, the data obtained by the adjustment for each processing unit can be stored in the lower control means and need not be transmitted to the upper control means, so that the time during which the apparatus is stopped by the adjustment work can be shortened. .

  In particular, according to the fourth aspect of the present invention, since data necessary for control in each structural unit can be stored in the intermediate control means, data necessary for apparatus control is transmitted and received when the substrate processing apparatus is activated. The time can be further shortened, and malfunction of the apparatus due to transmission / reception errors can be further reduced. In addition, the data obtained by adjustment for each structural unit can be stored in the intermediate control means, and it is not necessary to transmit to the upper control means, so that the time during which the apparatus is stopped by the adjustment work is further reduced. Can do.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

<1. Configuration on Mechanism of Substrate Processing Apparatus 100>
FIG. 1 is a plan view of a substrate processing apparatus 100 according to an embodiment of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a front view of a heat treatment section. 1 to 3 are attached with an XYZ orthogonal coordinate system in order to clarify the directional relationship between the drawings. An arrangement direction of a plurality of blocks to be described later is an X direction, a direction orthogonal to the X direction in a horizontal plane is a Y direction, and a vertical direction is a Z direction.

  The substrate processing apparatus 100 is an apparatus that performs a resist coating process, a developing process, a predetermined heat treatment associated therewith, a chemical liquid process, and the like related to a photolithography process for forming a predetermined circuit pattern on a semiconductor substrate. However, the present invention is not limited to a semiconductor substrate, and can be applied to a substrate processing apparatus that handles various substrates such as a glass substrate for a liquid crystal display device.

  As shown in FIG. 1, the substrate processing apparatus 100 according to this embodiment is roughly divided into an indexer block 1, an antireflection film processing block 2, a resist film processing block 3, a development processing block 4, and an interface block 5. It is configured by arranging structural units (blocks) on five mechanisms. These five blocks are individually assembled into a frame (frame body) and can be physically divided, and the substrate processing apparatus 100 can be configured by connecting in the above order. Therefore, it is possible to add a new block or delete some blocks depending on the usage status of the substrate processing apparatus 100. Each block accommodates a plurality of processing units for performing a target process. Further, adjacent to the interface block 5 is an exposure apparatus STP that performs a process of exposing a predetermined circuit pattern to the resist film. The exposure apparatus STP is a separate apparatus from the substrate processing apparatus 100. Below, the structure of the substrate processing apparatus 100 is demonstrated for every block which is a structural unit on a mechanism first.

  The indexer block 1 is a block that receives an unprocessed substrate W from the outside of the substrate processing apparatus 100 and conversely pays out a processed substrate W to the outside. The indexer block 1 sequentially takes out a cassette mounting table 6 on which a plurality of cassettes C (four in FIG. 1) that can store a predetermined number of substrates W in multiple stages are placed side by side, and unprocessed substrates W from the cassette C. And an indexer transport mechanism 7 which is a transport means that can be used for subsequent processing and can receive processed substrates W and sequentially store them in the cassette C again.

  The indexer transport mechanism 7 includes a movable table 7a that can move horizontally in the Y-axis direction on the cassette mounting table 6, a holding arm 7b provided on the movable table 7a, and a plurality of protrusions that protrude inward of the tip of the holding arm 7b. And a book pin 7c. The substrate W is held on the holding arm 7b in a horizontal posture by being placed on the pins 7c. The holding arm 7b can perform vertical movement in the Z-axis direction, turning movement in the horizontal plane, and advance / retreat movement in the turning radius direction while holding the substrate W.

  The anti-reflection film processing block 2 applies and forms an anti-reflection film on the surface of the substrate W (below the photoresist film to be applied later) in order to reduce standing waves and halation generated during exposure in the exposure apparatus STP. It is a block. The anti-reflection film processing block 2 includes an anti-reflection film coating processing unit 8 that performs a process of applying an anti-reflection film on the surface of the substrate W, an anti-reflection film heat processing unit 9 that performs a heat treatment necessary for coating, and a reflection A first main transport mechanism 10A, which is a transport unit that delivers the substrate W to the coating treatment unit 8 for the anti-reflection film and the heat treatment unit for the anti-reflection film, is provided. In order to suppress the thermal influence from the heat treatment section 9 for the antireflection film to the coating processing section 8 for the antireflection film, the coating processing section 8 for the antireflection film is placed on the front side of the apparatus with the first main transport mechanism 10A interposed therebetween ( On the -Y side), the heat treatment portion 9 for antireflection film is disposed so as to be located on the back side (+ Y side) of the apparatus. Further, a heat partition (not shown) is provided on the front side of the heat treatment portion 9 for antireflection film.

  As shown in FIG. 2, the antireflection film application processing unit 8 includes three antireflection film application processing units 8 a to 8 c that are stacked. The antireflection film coating processing units 8a to 8c are processing units for performing a single coating process, respectively. The spin chuck 11 that rotates by sucking and holding the substrate W in a horizontal posture, and the substrate W held on the spin chuck 11 A nozzle 12 for supplying a coating solution for an antireflection film is provided on the top.

  As shown in FIG. 3, the antireflection film heat treatment section 9 includes a plurality of heating plates HP for heating the substrate W to a predetermined temperature, and a plurality for cooling the heated substrate W to room temperature. In order to improve the adhesion between the resist plate and the substrate W, a plurality of adhesion processing units AHL that heat-treat the substrate W in a vapor atmosphere of HMDS (hexamethyldisilazane) are arranged in two rows. Has been. The heating plate HP, the cooling plate CP, and the adhesion processing unit AHL are all processing units that perform a single heat treatment. In FIG. 3, the locations indicated by “x” marks are locations where a pipe wiring portion is provided or an empty space for adding a processing unit is secured.

  The resist film processing block 3 is a block in which a photoresist film such as a chemically amplified resist is applied and formed on the surface of the substrate W on which an antireflection film is applied. The resist film processing block 3 includes a resist film application processing unit 15 that performs a process of applying a photoresist film on the surface of the substrate W, a resist film heat processing unit 16 that performs a heat treatment necessary for application, and a resist film application. A second main transport mechanism 10B, which is transport means for delivering the substrate W to the processing unit 15 and the resist film heat treatment unit 16, is provided. In order to suppress the thermal influence from the resist film heat treatment section 16 to the resist film coating processing section 15, the resist film coating processing section 15 is located on the front side of the apparatus (the −Y side) with the second main transport mechanism 10B interposed therebetween. ), The resist film heat treatment portion 16 is disposed so as to be located on the back side (+ Y side) of the apparatus. Further, a heat partition (not shown) is provided on the front side of the heat treatment section 16 for resist film.

  As shown in FIG. 2, the resist film coating processing unit 15 includes three resist film coating processing units 15 a to 15 c that are stacked. Each of the resist film coating units 15a to 15c is a processing unit for performing a single coating process. The spin chuck 17 rotates by sucking and holding the substrate W in a horizontal posture, and the substrate W held on the spin chuck 17 And a nozzle 18 for supplying a coating solution for the resist film.

  As shown in FIG. 3, the resist film heat treatment section 16 includes a plurality of heating plates HP for heating the substrate W to a predetermined temperature and a plurality of plates for cooling the heated substrate W to room temperature. The cooling plates CP are stacked in two rows. The heating plate HP and the cooling plate CP are both processing units that perform a single heat treatment. In FIG. 3, the locations indicated by “x” marks are locations where a pipe wiring portion is provided or an empty space for adding a processing unit is secured.

  The development processing block 4 is a block for performing development processing on the substrate W on which a predetermined circuit pattern is exposed in the exposure apparatus STP. The development processing block 4 includes a development processing unit 30 that performs development processing with a developing solution, a development heat treatment unit 31 that performs heat treatment necessary for the development processing, and the development processing unit 30 and the development heat treatment unit 31. And a third main transport mechanism 10C, which is a transport means for delivering. In order to suppress the thermal influence from the development heat treatment section 31 to the development processing section 30, the development processing section 30 is placed on the front side of the apparatus (−Y side) with the third main transport mechanism 10C interposed therebetween. 31 is arranged so as to be located on the back side (+ Y side) of the apparatus. Further, a thermal partition (not shown) is provided on the front side of the heat treatment section 31 for development.

  As shown in FIG. 2, the development processing unit 30 includes five development processing units 30 a to 30 e that are stacked. Each of the development processing units 30a to 30e is a processing unit that performs a single development processing. The spin chuck 32 rotates by sucking and holding the substrate W in a horizontal posture, and the developer is applied on the substrate W held on the spin chuck 32. The nozzle 33 etc. which supply are provided.

  As shown in FIG. 3, the development heat treatment section 31 includes a plurality of heating plates HP for heating the substrate W to a predetermined temperature and a plurality of coolings for cooling the heated substrate W to room temperature. The plates CP are stacked in two rows. The heating plate HP and the cooling plate CP are both processing units that perform a single heat treatment. The development heat treatment section 31 also includes substrate platforms PASS7 and PASS8 described later. In FIG. 3, the locations indicated by “x” marks are locations where a pipe wiring portion is provided or an empty space for adding a processing unit is secured.

  The interface block 5 is a block for transferring the substrate W between the substrate processing apparatus 100 and the exposure apparatus STP provided adjacent thereto. The interface block 5 transfers the substrate W between the two edge exposure units EEW that pre-expose the peripheral portion of the substrate W coated with the photoresist, the substrate platforms PASS7 and PASS8, and the edge exposure unit EEW. For the fourth main transport mechanism 10D, which is a transport means for transporting, the substrate platform PASS9, PASS10, and the interface, which is a transport means for delivering the substrate W between the substrate platform PASS9, PASS10 and the exposure apparatus STP It mainly includes a transport mechanism 35, a sending buffer SBF for temporarily storing the substrate W before sending the substrate W to the exposure apparatus STP, and a return buffer RBF for temporarily storing the substrate W after exposure. Yes. Of these, the two EEWs, the return buffer RBF, and the substrate platforms PASS9 and PASS10 are stacked in this order from the top in the center of the interface block 5. Each of the sending buffer SBF and the returning buffer RBF includes a storage shelf that can store a plurality of substrates W in multiple stages.

  Each of the two edge exposure units EEW is a processing unit that performs a single edge exposure process. As shown in FIG. 2, the spin chuck 36 that rotates while holding the substrate W in a horizontal position by suction, or on the spin chuck 36 A light irradiator 37 for exposing the periphery of the substrate W held on the substrate is provided.

  As shown in FIGS. 1 and 2, the interface transport mechanism 35 includes a movable table 35 a that can move in the horizontal direction (Y-axis direction), and a holding arm 35 b that holds the substrate W on the movable table 35 a. It has. The holding arm 35b can be moved up and down, turned, and moved back and forth in the turning radius direction by a driving means (not shown). Accordingly, the interface transport mechanism 35 has a certain movable range in the horizontal direction, and the substrate W with respect to the exposure apparatus STP, the substrate platform PASS9, PASS10, and the sending buffer SBF is in a predetermined position. Delivery is now possible.

  The first main transport mechanism 10A, the second main transport mechanism 10B, the third main transport mechanism 10C, and the fourth main transport mechanism 10D each have a structure in which two holding arms 10a and 10b are provided on the base 10d. It has become. The holding arms 10a and 10b have a substantially C-shaped tip portion, and the substrate W is horizontally leveled by a plurality of pins 10c (three cases are shown in FIG. 1) protruding inside the tip portion. Can be held in a posture. The holding arms 10 a and 10 b can hold the substrate W and perform a turning movement in the horizontal plane, a vertical movement in the Z-axis direction, and a forward and backward movement in the turning radius direction by a driving mechanism (not shown).

  As shown in FIG. 1, in the substrate processing apparatus 100, the partition wall 13 aiming at interrupting | blocking each other's atmosphere is provided in the boundary part of adjacent blocks, respectively. Among them, between the indexer block 1 and the antireflection film processing block 2, between the antireflection film processing block 2 and the resist film processing block 3, and between the resist film processing block 3 and the development processing block 4. In order to transfer the substrate W, six substrate platforms PASS1 to PASS6 are provided that partially pass through each partition wall 13 in FIG. The six substrate platforms PASS <b> 1 to PASS <b> 6 are provided close to the top and bottom, two on each of three partition walls. In addition, two substrate platforms PASS7 and PASS8 are provided close to each other in the development heat treatment section 31 in order to transfer the substrate between the development processing block 4 and the interface block 5. . Further, as described above, in the interface block 5, the two substrate platforms PASS9 and PASS10 are vertically moved in order to transfer the substrate between the fourth main transport mechanism 10D and the interface transport mechanism 35. Proximity is provided. Among the above ten substrate platforms PASS1 to PASS10, the upper substrate platforms PASS1, PASS3, PASS5, PASS7, and PASS9 are used when the substrate W on the lower side is transported in the forward direction (+ X direction). The placement units PASS2, PASS4, PASS6, PASS8, and PASS10 are respectively used when the substrate W is transported in the return direction (−X direction). The substrate platforms PASS <b> 1 to PASS <b> 10 include a plurality of fixed support pins that are fixedly installed, and the substrate W can be placed on the support pins. The substrate platforms PASS1 to PASS10 are provided with optical sensors (not shown) that detect the presence / absence of the substrate W. Based on the detection signals of the sensors, the indexer transport mechanism 7 and the main transport mechanism 10A are provided. 10D and the interface transport mechanism 35 can determine whether or not the substrate W can be delivered to the substrate platforms PASS1 to PASS10.

<2. Process Flow in Substrate Processing Apparatus 100>
An example of the flow of a series of processes in the substrate processing apparatus 100 having the above-described mechanical configuration will be outlined below. Here, a single substrate W will be described while following the flow of processing.

  First, in the indexer block 1, the indexer transport mechanism 7 moves to a position facing a predetermined cassette C, and an unprocessed substrate W stored in the cassette C is taken out. The indexer transport mechanism 7 transports the taken-out substrate W to the substrate platform PASS1 and places it on the substrate platform PASS1.

  In the antireflection film processing block 2, the first main transport mechanism 10 </ b> A converts the substrate W placed on the substrate platform PASS <b> 1 into a predetermined cooling plate CP, antireflection film coating processing unit 8 a (or 8 b, 8 c), It conveys in order of predetermined heating plate HP. In each processing unit, the substrate W is subjected to a predetermined process, and an antireflection film is formed on the surface of the substrate W. Thereafter, the first main transport mechanism 10A transports the substrate W to the substrate platform PASS3 and places it on the substrate platform PASS3.

  In the resist film processing block 3, the second main transport mechanism 10B moves the substrate W placed on the substrate platform PASS3 to a predetermined cooling plate CP, a resist film coating processing unit 15a (or 15b, 15c), a predetermined It conveys in order of the heating plate HP. In each processing unit, the substrate W is subjected to predetermined processing, and a resist film is formed on the surface of the substrate W. Thereafter, the second main transport mechanism 10B transports the substrate W to the substrate platform PASS5 and places it on the substrate platform PASS5.

  In the development processing block 4, the third main transport mechanism 10C transports the substrate W placed on the substrate platform PASS5 to the substrate platform PASS7 and places it on the substrate platform PASS7.

  In the interface block 5, the fourth main transport mechanism 10 </ b> D transports the substrate W placed on the substrate platform PASS <b> 7 in order of the edge exposure unit EEW and the cooling plate CP of the development heat treatment unit 31. In each processing unit, the substrate W is subjected to a predetermined process, and the peripheral portion of the substrate W is exposed. Thereafter, the fourth main transport mechanism 10D transports the substrate W to the substrate platform PASS9 and places it on the substrate platform PASS9. Subsequently, the interface transport mechanism 35 transports the substrate W placed on the substrate platform PASS9 to the adjacent exposure apparatus STP. After the exposure processing in the exposure apparatus STP is completed, the interface transport mechanism 35 receives the substrate W after the exposure processing, transports it to the substrate platform PASS10, and places it on the substrate platform PASS10. Then, the fourth main transport mechanism 10 </ b> D transports the substrate W placed on the substrate platform PASS <b> 10 to the heating plate HP of the development heat treatment unit 31. In the heating plate HP, the substrate W is subjected to a predetermined heat treatment. Thereafter, the fourth main transport mechanism 10D transports the substrate W to the substrate platform PASS8 and places it on the substrate platform PASS8.

  In the development processing block 4, the third main transport mechanism 10C moves the substrate W placed on the substrate platform PASS8 in the order of a predetermined cooling plate CP, a development processing unit 30a (or 30b to 30e), and a predetermined heating plate HP. Transport. In each processing unit, the substrate W is subjected to a predetermined process, and the surface of the substrate W is developed. Thereafter, the third main transport mechanism 10C transports the substrate W to the substrate platform PASS6 and places it on the substrate platform PASS6.

  In the resist film processing block 3, the second main transport mechanism 10B transports the substrate W placed on the substrate platform PASS6 to the substrate platform PASS4 and places it on the substrate platform PASS4.

  In the antireflection film processing block 2, the first main transport mechanism 10 </ b> A transports the substrate W placed on the substrate platform PASS <b> 4 to the substrate platform PASS <b> 2 and places it on the substrate platform PASS <b> 2.

  In the indexer block 1, the indexer transport mechanism 7 transports the substrate W placed on the substrate platform PASS <b> 2 to a predetermined cassette C and stores it in the cassette C.

<3. Configuration on Control of Substrate Processing Apparatus 100>
Next, the control configuration of the substrate processing apparatus 100 will be described below. FIG. 4 is a diagram illustrating an arrangement of structural units in the control of the substrate processing apparatus 100. FIG. 5 is a block diagram showing connection of a control system of the substrate processing apparatus 100.

  As shown in FIG. 4, the substrate processing apparatus 100 includes an indexer cell C1, an antireflection film processing cell C2, a resist film processing cell C3, a development processing cell C4, a post-exposure heating processing cell C5, and an interface cell C6. It consists of two control units (cells). The cell is a structural unit defined by a concept different from the block which is the structural unit of the substrate processing apparatus 100 described above. However, the cells C1 to C3 have the same structural unit as the blocks 1 to 3 as a result. It has become. Since cells that are the same structural unit as the block can be physically divided as described above, new cells may be added or some cells may be deleted depending on the usage status of the substrate processing apparatus 100. It becomes possible to do.

  Each cell is defined in the substrate processing apparatus 100 in correspondence with each transfer area of the plurality of substrate transfer mechanisms provided in the substrate processing apparatus 100. That is, each cell has one transport mechanism. In addition, a plurality of processing units that are in a limited local range than the transfer charge area of each cell belong to the cells C2 to C5.

  The indexer cell C1 is a cell including the indexer transport mechanism 7, and includes a cassette mounting table 6 and the like. The antireflection film processing cell C2 is a cell including the first main transport mechanism 10A, and includes a plurality of processing units (for the antireflection film) included in the antireflection film application processing unit 8 and the antireflection film heat treatment unit 9. Coating processing units 8a to 8c, a heating plate HP, a cooling plate CP, and an adhesion processing unit AHL). The resist film processing cell C3 includes the second main transport mechanism 10B, and includes a plurality of processing units (resist film coating processing unit 15a) included in the resist film coating processing unit 15 and the resist film heat processing unit 16. To 15c, heating plate HP, cooling plate CP). The development processing cell C4 is a cell including the third main transport mechanism 10C, and includes a plurality of processing units (development processing) included in the development heat treatment section 31 and the development processing section 30 excluding the heat treatment section used for post-exposure heating. Units 30a to 30e, heating plate HP, cooling plate CP). The post-exposure heating processing cell C5 is a cell including the fourth main transport mechanism 10D, and includes a plurality of thermal processing units (in this embodiment, the development thermal processing section 31) that performs thermal processing on the post-exposure substrate W before development. A part of a plurality of heating plates HP provided) and two edge exposure units EEW. The interface cell C6 is a cell including an interface transport mechanism 35 that delivers the substrate W to the exposure apparatus STP.

  The substrate processing apparatus 100 includes, for each cell, a cell controller CC, which is a middle-level control means for controlling the operation in each cell, in addition to the main controller MC that is a higher-level control means for controlling the operation of the entire apparatus. Prepare. Further, the substrate processing apparatus 100 includes a unit controller UC, which is a low-order control means for controlling operations inside a plurality of processing units provided in the cells C2 to C5, for each processing unit. That is, the substrate processing apparatus 100 includes a main controller MC, a plurality of cell controllers CC, and a plurality of unit controllers UC, and each controller divides and controls the control range of the substrate processing apparatus 100.

  In this way, by dividing the control range by using a plurality of controllers, the control burden on each controller can be reduced as compared with the conventional case where each part of the apparatus is collectively controlled by the main controller. Therefore, it is possible to reduce malfunctions in control in each controller, and it is possible to more easily identify a defective part with respect to a defective control system than in the past. Further, even when a new processing unit or cell is added or a part of the processing unit or cell is deleted depending on the usage status of the substrate processing apparatus 100, the adjacent cell or processing unit is not affected. The control system can be easily reconfigured without significantly modifying the control system configuration.

  As shown in FIG. 5, the main controller MC, the cell controller CC, and the unit controller are connected in a hierarchy. The main controller MC is connected to the cell controllers CC1 to CC6 via a network N such as an intranet, and can control the cell controllers CC1 to CC6 in an integrated manner. Similarly, the cell controllers CC2 to CC5 are connected to the unit controllers UC2a to UC2c, UC3a to UC3c, UC4a to UC4e, UC5a to UC5b, and UCt which control processing units in each cell via the network N, respectively. The previous unit controller UC can be centrally controlled. Each unit controller UC is connected to a separate controller (not shown) for adjusting the temperature and humidity in each processing unit, the handling of the substrate W, and the like via a network such as serial communication. There are also things.

  Among the plurality of cell controllers CC, the controller that controls the operation of the indexer cell C1 controls the operation of the cell controller CC1, and the operation of the antireflection film processing cell C2 controls the operation of the cell controller CC2 and the resist film processing cell C3. The controller that controls the operation of the cell controller CC3, the controller that controls the operation of the development processing cell C4, the controller that controls the operation of the post-exposure heating processing cell C5, the controller that controls the operation of the cell controller CC5 and the interface cell C6 Is the cell controller CC6.

  In addition, among the plurality of unit controllers UC, a controller that controls the operations of the three antireflection film coating units 8a to 8c controls the operations of the unit controllers UC2a to UC2c and the three resist film coating units 15a to 15c. The controller that controls the operations of the unit controllers UC3a to UC3c, the five development processing units 30a to 30e is the controller that controls the operations of the unit controllers UC4a to UC4e, and the two edge exposure units EEW are unit controllers UC5a and UC5b, A controller for controlling the operation of the heat treatment unit is a unit controller UCt. There are a plurality of types of heat treatment units, such as a cooling plate CP, a heating plate HP, and an adhesion processing unit AHL, and there are a plurality of types of controllers for each heat treatment unit. In FIG. Each type of controller is indicated by a unit controller UCt.

  All the above-mentioned controllers are equipped with the memory | storage means S which can memorize | store the data required for each control. As the storage means S, a storage device (such as a hard disk or a compact flash (R)) that does not erase the recording even when the power supply is stopped is used.

  The storage means S in the main controller MC includes a series of cell configuration data (data on the number of cells, cell category, process flow direction, etc.) provided in the substrate processing apparatus 100 and a series of data using the substrate processing apparatus 100. Data necessary for controlling the overall operation of the substrate processing apparatus 100 such as data relating to processing conditions when performing processing (library data) and data for generating various alarms for a series of processing may be stored. it can.

  In the storage means S in the cell controller CC, the configuration data of the processing units and the like provided in each cell (data relating to the number of processing units, the category of the processing units, the presence or absence of a buffer, etc.) Control targets such as data related to transfer control (data related to transfer control method, recovery method, transfer operation time, etc.) and data for controlling maintenance operation in each cell (data related to setting of coupling, dispensing, etc.) Data necessary for controlling the operation in the cell can be stored.

  In the storage means S in the unit controller UC, data relating to the control of the starting operation of each processing unit, data relating to the transport position of the substrate W in each processing unit, data relating to the control of each motor in each processing unit, Identify the data related to the control of each sensor in each processing unit, the data related to temperature control in each processing unit, the data related to the setting of the stage in each processing unit, and the type of chemical used in each processing unit For controlling the operation in the processing unit to be controlled, such as data for specifying the type of exposure apparatus arranged in parallel with the substrate processing apparatus 100, communication setting with the above-mentioned separate controller, etc. It is possible to store necessary data.

  That is, in the conventional substrate processing apparatus, all data necessary for controlling each part of the apparatus is stored in the storage means S provided in the main controller MC. However, in the substrate processing apparatus 100, each cell and each process Data necessary for control within the unit is configured to be shared and stored by each cell controller CC and each unit controller UC.

  By adopting such a configuration, the substrate processing apparatus 100 can shorten the time for transmitting (loading) data necessary for apparatus control at the time of activation. That is, in the conventional substrate processing apparatus, since all data necessary for controlling each part of the apparatus is stored in the storage means provided in the main controller, a large amount of data is provided in each part of the apparatus at startup. In the substrate processing apparatus 100, the data necessary for controlling each cell and each processing unit is stored in the nonvolatile memory provided in each cell controller CC and each unit controller UC. Since the data can be divided and stored in the storage means S, the amount of data to be transmitted at the time of activation can be reduced.

  In addition, since a large amount of data is not transmitted / received between the main controller and each unit at the same time, malfunction of the apparatus due to transmission / reception errors can be reduced, and the reliability of the apparatus can be improved.

  Further, by adopting such a configuration, in the substrate processing apparatus 100, data obtained by adjustment for each processing unit (for example, data relating to the transport position of the substrate W in each processing unit obtained by teaching work) is obtained. Data stored in the storage means S in the unit controller UC and adjusted by each cell (for example, data related to transfer control of each transfer mechanism obtained by teaching work) is stored in the cell controller CC. It can be stored in the means S. Therefore, it is not necessary to transmit the obtained data to the main controller each time after adjusting each processing unit or each cell. Therefore, the time during which the apparatus is stopped due to the adjustment work can be shortened.

  In particular, in the manufacturing process of a substrate processing apparatus, conventionally, after the entire apparatus is assembled and connected to the main controller, a process of transmitting data obtained by adjusting each part to the main controller is indispensable. However, since the substrate processing apparatus 100 can perform detailed adjustment work sequentially from the completed processing units and cells and store the obtained data in the storage means S in each processing unit or cell, such a process is possible. Becomes unnecessary, and the manufacturing process can be shortened.

<4. Modification>
In the above-described embodiment, the substrate processing apparatus 100 has been described with respect to the mode in which the cell controller CC is provided for each cell, and the unit controller UC is provided for each processing unit. It may be a form provided with a controller for each.

  For example, an antireflection film coating processing unit 8, a resist film coating processing unit 15, a development processing unit 30, an antireflection film heat treatment unit 9, a resist, which can be regarded as a control structural unit between the cell and the processing unit. For the heat treatment section 16 for film, the heat treatment section 31 for development, and the like, it is possible to provide a controller having a storage means S that can store data necessary for each processing section for each processing section. .

  Further, the antireflection film coating processing section 8, the resist film coating processing section 15, and the development processing section 30 are collectively regarded as one control structural unit, or the antireflection film heat processing section 9 and the resist film processing section. A configuration in which the heat treatment unit 16 and the development heat treatment unit 31 are collectively regarded as one control structural unit, and a controller including a storage unit S capable of storing necessary data for each structural unit is provided for each structural unit. You can also

1 is a plan view of a substrate processing apparatus 100 according to an embodiment of the present invention. 1 is a front view of a substrate processing apparatus 100. FIG. 3 is a front view of a heat treatment part of the substrate processing apparatus 100. FIG. FIG. 3 is a diagram showing an arrangement of structural units for control of the substrate processing apparatus 100. 3 is a block diagram showing connection of a control system of the substrate processing apparatus 100. FIG.

Explanation of symbols

7 Indexer transport mechanism 8a to 8c Antireflection film coating processing units 10A to 10D Main transport mechanism 15a to 15c Resist film coating processing units 30a to 30e Development processing unit 35 Interface transport mechanism 100 Substrate processing apparatus C1 Indexer cell C2 Antireflection film processing cell C3 Resist film processing cell C4 Development processing cell C5 Post-exposure heating processing cell C6 Interface cell HP Heating plate CP Cooling plate AHL Adhesion processing unit EEW Edge exposure unit MC Main controller CC1 to CC6 Cell controller UC2a UC2c, UC3a to UC3c, UC4a to UC4e, UC5a to UC5b, UCt Unit controller S Storage means W substrate

Claims (5)

A substrate processing apparatus for performing a series of processes on a substrate,
A plurality of processing units for processing a substrate;
A plurality of subordinate control means for controlling the operation of each of the plurality of processing units;
Upper control means for controlling the operation of the entire apparatus;
With
Each of the plurality of subordinate control means is
Comprising non-volatile storage means for storing data necessary for controlling the operation of the processing unit to be controlled;
The upper control means includes
A substrate processing apparatus comprising a non-volatile storage means for storing data necessary for controlling the operation of the entire apparatus. The substrate processing apparatus according to claim 1,
A plurality of structural units are defined in the substrate processing apparatus in correspondence with respective transfer areas of the plurality of substrate transfer means provided in the apparatus,
Each of the subordinate control means controls a corresponding processing unit with respect to a local range that is more limited than the respective transportation charge area,
The substrate processing apparatus is
A plurality of intermediate control means for controlling operations of the plurality of structural units;
A substrate processing apparatus further comprising: The substrate processing apparatus according to claim 2,
The substrate processing apparatus, wherein the plurality of processing units belong to the plurality of structural units. A substrate processing apparatus according to claim 2 or claim 3, wherein
Each of the plurality of intermediate control means is
A substrate processing apparatus comprising: a non-volatile storage unit that stores data necessary for controlling the operation of the structural unit to be controlled. A substrate processing apparatus according to any one of claims 2 to 4, wherein
The substrate processing apparatus, wherein the upper control means, the middle control means, and the lower control means are connected in a hierarchical manner.

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