JP2005077189A - Radiation detector and radiation imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily carry out contacting with an electrode formed on a semiconductor element, and to reduce the cost of a maintenance for defective semiconductor devices. <P>SOLUTION: A radiation detector 14 is built up by laminating a semiconductor device 12A of a detector element 12 and a semiconductor device 13A of a detector element 13 so that signal read electrodes 12C, 13C are sandwiched between them. Furthermore, the detector element 12 is made longer than the detector element 13 by a dimension L, thereby partially exposing the signal read electrode 12C which is either of the signal read electrodes 12C, 13C from the signal read electrode 13C being the other electrode. Then, the radiation detector 14 is engaged into a protection connector case 15, thereby bringing the signal read electrode 12C to be in wide plane contact with an electrode contact member 17, formed on the inner wall of the protection connector case 15 and establishing their electrical connection. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductor radiation detector and a radiation imaging apparatus, and more particularly to a radiation detector and a radiation imaging apparatus suitable for use in two-dimensional and three-dimensional imaging apparatuses.

  The radiation detector includes a semiconductor element made of CdTe, CdZnTe, and the like, and electrodes formed on both sides of the semiconductor element. By applying a bias voltage between these electrodes, X-rays, γ-rays, etc. The charge generated when the radiation enters the semiconductor element is taken out as a signal from the electrode.

  By the way, if the energy of the radiation is high, the probability of penetrating through the semiconductor element before interacting with the semiconductor element increases. Therefore, if the thickness of the semiconductor element is increased, the radiation penetrating the semiconductor element can be reduced, and the radiation detection efficiency is increased. However, when the thickness of the semiconductor element is increased, the distance between the electrodes, in other words, the charge collection distance is increased, which causes a decrease in energy resolution with respect to radiation.

  Thus, conventionally, a radiation detector has been proposed in which a plurality of semiconductor elements are stacked with electrodes sandwiched therebetween to increase the volume substantially by the number of stacked layers (see, for example, Patent Document 1). . According to this radiation detector, the incident radiation interacts with one of the stacked semiconductor elements, so that the radiation that is transmitted as it is can be reduced, and the energy associated with the increase in the thickness of the semiconductor element. It is possible to avoid a decrease in resolution.

As another conventional technique, there is a radiation detector configured by stacking a plurality of semiconductor elements with an alumina substrate interposed therebetween (see, for example, Patent Document 2). In this radiation detector, the electrodes formed on both sides of the semiconductor element and the wiring pattern formed on the alumina substrate are brought into surface contact, and the charge generated in the semiconductor element due to radiation is transferred from the electrode to the wiring pattern on the alumina substrate. It is made to take out as a signal via.
JP 2000-241555 A (paragraph number [0019], FIG. 1) Japanese Patent Laid-Open No. 7-50428 (second page, FIG. 3)

  By the way, the radiation detector described in Patent Document 1 must be formed by suppressing the plate thickness of the electrodes sandwiched between the semiconductor elements to about 100 nm, for example, in order to increase the energy resolution with respect to the radiation by the semiconductor elements. There is a problem that it is difficult to stably contact the wiring with such an extremely thin electrode with high accuracy.

  On the other hand, since the radiation detector described in Patent Document 2 has a configuration in which the alumina substrate protrudes from between adjacent semiconductor elements, a wide contact area of the wiring with respect to the alumina substrate can be ensured. Contact can be made relatively easily.

  However, since the radiation detector described in Patent Document 2 has a configuration in which an alumina substrate made of an insulating plate is sandwiched between semiconductor elements, the region of the alumina substrate becomes an insensitive region for radiation, and radiation detection for radiation. There is a problem that the detection efficiency of the detector is lowered.

  Moreover, in the radiation detector described in this patent document 2, since it was set as the structure which fixed and attached a semiconductor element to the board | substrate for a connection, any one of each semiconductor element became a defective element. Even in this case, it is necessary to replace all the semiconductor elements for each connection substrate, and there is a problem that the cost for replacement is high.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a radiation detector, a radiation detection apparatus, and a radiation imaging apparatus that can easily contact a wiring with an electrode and can increase detection efficiency for radiation.

  The radiation detector of the first invention that achieves the above-described object is provided with electrodes in order to increase the effective thickness (effective element thickness) of the semiconductor element and increase the detection efficiency without reducing the energy resolution. A structure is employed in which a plurality of semiconductor elements are arranged side by side. One of the semiconductor elements adjacent to each other is longer than the other, and one end face protrudes from the other end face, and the length of the pair of electrodes disposed between the adjacent semiconductor elements is By making the electrode provided on the long semiconductor element protrude at least partially outside the other semiconductor element, the electrode can be easily contacted with the electrode contact member.

  Moreover, the radiation detection apparatus of 2nd invention exists in attaching the above-mentioned radiation detector to the detector holding member so that attachment or detachment was possible. Such a radiation detection apparatus can easily replace an abnormal radiation detector.

  According to the present invention, the radiation detection efficiency of the radiation detector can be improved, and the electrode contact member can be easily brought into contact with the electrode provided in the radiation detector.

(First embodiment)
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a first embodiment of the invention will be described with reference to the accompanying drawings of FIGS.

  As shown in FIG. 1, a gamma camera device 1 that is a radiation imaging device includes a bed 2 movable in the longitudinal direction, a pair of gamma camera holding units 3 placed at a predetermined interval across the bed 2, and radiation. The collimator 4 located in the information of the bed 2 below the detection device 30 and the radiation detection device 30, the data collection analysis device 23, the input device 24, and the display device 25 are provided. The radiation detection device 30 includes a metal plate 5 made of a thin aluminum plate that is positioned above the collimator 4 and attached to each gamma camera holding unit 3, and a plurality of radiation detection units disposed above the metal plate 5. Unit 11 is provided. Furthermore, the radiation detection apparatus 30 includes a socket board (detector holding member) 6 and a measurement circuit unit (signal processing apparatus unit) 8 attached to the socket board 6 and including a measurement circuit (signal processing apparatus) 8A. Prepare. The socket board 6 and the measurement circuit unit 8 are disposed between the gamma camera holding unit (radiation detection device support member) 3 and are detachably attached to the gamma camera holding unit 3 using a fixing tool (not shown) such as a bolt. It is done. The radiation detection unit 11 is detachably attached to the socket board 6. The socket board 6 also functions as a holding member for the radiation detector 14 described later. A light shielding / electromagnetic shield 7 surrounds and is attached to the metal plate 5 and the socket board 6. All the radiation detection units 11 attached to the socket board 6 are located in a space surrounded by the light shielding / electromagnetic shield 7. The radiation detection device 30 is detachably attached to the gamma camera holding unit 3.

  The light shielding / electromagnetic shield 7 surrounds the entire assembly of all the radiation detection units 11 and prevents the radiation other than the gamma rays 10 from entering the radiation detection unit 11. An operation panel 26 is installed in the gamma camera holding unit 3. The operation panel 26 is for performing operations in the vicinity of the gamma camera device 1 and has the same functions as the data collection analysis device 23, the input device 24, and the display device 25.

  Next, the configuration of the radiation detection unit 11 will be described. As shown in FIGS. 2 to 4, the radiation detection unit 11 includes a plurality of radiation detectors 14 each having detector elements 12 and 13, and a plurality of protective connector cases for individually accommodating these radiation detectors 14. 15, each radiation detector 14 functions as a pixel at the time of imaging of the gamma camera device 1 to be described later.

  The detector element 12 constituting the radiation detector 14 includes a semiconductor element 12A made of a rectangular plate that generates charges when gamma rays 10 are incident, and a voltage applying electrode (mounted on one surface of the semiconductor element 12A). Cathode) 12B and a signal readout electrode (anode) 12C attached to the other surface opposite to that of semiconductor element 12A. Also for the detector element 13, a semiconductor element 13A, a voltage applying electrode 13B attached to one surface of the semiconductor element 13A, and a signal readout electrode 13C attached to the other surface opposite to that of the semiconductor element 13A are provided. Have. The voltage application electrode 12B and the signal readout electrode 12C are attached to the entire corresponding surface of the semiconductor element 12A, and the voltage application electrode 13B and the signal readout electrode 13C are attached to the entire corresponding surface of the semiconductor element 13A by vapor deposition. Is called. For this reason, the thickness of each voltage application electrode and each signal readout electrode can be very thin, about 20 microns. The semiconductor elements 12A and 13A are configured using, for example, CdTe. The semiconductor elements 12A and 13A may be made of any of CdZnTe, GaAs, HgI2, Si, and Ge other than CdTe.

  The signal readout electrode 12C of the detector element 12 and the signal readout electrode 13C of the detector element 13 are adjacent to each other, and are integrally fixed by a conductive paste, a conductive adhesive or the like. Therefore, the detector element 12 and the detector element 13 are integrated, and the radiation detector 14 has a structure in which the semiconductor element 12A and the semiconductor element 13A are arranged side by side with the signal readout electrodes 12C and 13C interposed therebetween. Yes. As shown in FIG. 2, the detector element 12 is formed to be longer than the detector element 13 by a dimension L. Specifically, one end face of the semiconductor element 12A protrudes from one end face of the semiconductor element 13A in the longitudinal direction of the semiconductor element 12A. For this reason, in the radiation detector 14, of the signal readout electrodes 12C and 13C arranged between the adjacent semiconductor elements 12A and 13A, the signal readout electrode 12C provided in the semiconductor element 12A having a long length is partially Therefore, the semiconductor element 13 having a short length protrudes outward from one end. That is, the signal readout electrode 12C is partially exposed.

As shown in FIG. 2, the protective connector case 15 (connector casing) is formed into a box-like body having a space 35 connected to an opening 36 formed at one end using a resin material or the like that is an electrical insulating material. The The upper end of the space 35 is sealed. The protective connector case 15 is formed by fixing two case elements 15B and 15C having a substantially concave dividing surface 15A to each other. Here, the density of the resin material used for the protective connector case 15 is preferably set to 4 g / cm ³ or less, and the atomic number of the constituent elements of the protective connector case 15 is preferably set to about 10 or less. This is to suppress the reaction probability due to the photoelectric effect between the gamma ray 10 and the protective connector case 15 and prevent the protective connector case 15 from becoming an obstacle and reducing the energy resolution by the radiation detector 14. Incidentally, the reaction probability due to the photoelectric effect is proportional to the first power of the density of the protective connector case 15, and is proportional to the fourth to fifth power of the atomic number.

  A space 35 in the protective connector case 15 is surrounded by four inner side surfaces of the protective connector case 15. The detector elements 12 and 13 are inserted into the space 35 through the opening 36. A surface 37 facing the upper end surface 12D of the detector element 12 and a surface 38 facing the upper end surface 13D of the detector element 13 are formed at the upper end of the space 35. The level at which the surface 37 is located is higher than the level with respect to the surface 38, and the surface 37 and the surface 38 are connected by a vertical surface. An electrode contact member 17 in contact with the signal readout electrode 12C is provided on the vertical surface. A surface 39 is formed at a position higher than the surface 37 at the upper end of the space 35. The surface 39 extends from the surface 37 toward the surface 38 in parallel with the surfaces 37, 38, and extends from one inner surface of the space 35 to another inner surface facing the inner surface. An electrode contact member 16 having contact portions 16A, 16B, and 16C is provided in the space 35. The contact portion 16C is provided on the surface 39, the contact portion 16A is provided on the one inner surface, and the contact portion 16B is provided on the other inner surface. The contact portions 16A, 16B, and 16C are electrically connected to each other. The contact portions 16A, 16B, 16C and the electrode contact member 17 constituting the electrode contact member 16 are made of a conductive material. The contact portions 16A, 16B, and 16C and the electrode contact member 17 are metal plated on a resin called a three-dimensional injection molded circuit component manufacturing method (reference: Hitachi Cable No. 20 p.69-74 (2001-1)). It is formed at a corresponding position using a technique for producing a circuit by three-dimensional patterning. In addition, an insulation maintaining step 15D having a dimension d is formed in the protective connector case 15 as shown in FIG. That is, the insulation maintaining step 15D is formed between the surface 37 and the surface 39. For this reason, the electrode contact members 16 and 17 are spaced apart from each other via the insulation maintaining step portion 15D, and the electrode contact members 16 and 17 are prevented from being short-circuited.

  Further, a voltage applying plug 18 and a signal readout plug 19 are attached to the protective connector case 15 by integral molding with the protective connector case 15. The voltage applying plug 18 is electrically connected to the electrode contact member 16 at one end side and protrudes from the protective connector case 15 at the other end side. Further, one end of the signal read plug 19 is electrically connected to the electrode contact member 17, and the other end protrudes from the protective connector case 15. Further, the voltage applying plug 18 is formed in a crank shape, and the signal reading plug 19 is formed in an L shape, thereby preventing the plugs 18 and 19 from falling off the protective connector case 15.

  The radiation detector 14 is inserted into the protective connector case 15 and fixed to the protective connector case 15 by using a conductive paste, a conductive adhesive or the like (see FIG. 3). In this state, the upper end surface 12D of the detector element 12 faces the surface 37, and the upper end surface 13D of the detector element 13 faces the surface 38. The voltage applying electrodes 12B and 13B are electrically connected to the electrode contact member 16 and the signal readout electrodes 12C and 13C are electrically connected to the electrode contact member 17 in a surface contact state. Specifically, the voltage application electrode 12B contacts the surface 16A of the electrode contact member 16, and the voltage application electrode 13B contacts the surface 16B of the electrode contact member 16.

  As shown in FIG. 4, the socket board 6 is provided with a plurality of sockets 6A for voltage application and a plurality of sockets 6B for signal readout (only two are shown) as holes. Each socket 6 </ b> A is connected to a high voltage power source 21 through a common wiring 20. Further, each socket 6B is connected to a measurement circuit 8A in the measurement circuit unit 8 via a signal readout wiring 22. The voltage application plug 18 and the signal readout plug 19 of the radiation detection unit 11 are detachably inserted and attached to the socket 6A and the socket 6B, respectively.

  Next, the operation of the gamma camera device 1 configured as described above will be described. A high voltage from the high voltage power supply 21 is applied to the voltage application electrodes 12B and 13B of each radiation detector 14 via the wiring 20, the voltage application plug 18, and the electrode contact member 16. The subject P to which the radiopharmaceutical (radioisotope) is administered lies on the bed 2 as shown in FIG. 1, and in this state, the radiation detector 14 (see FIG. 4) and the subject P The distance in the vertical direction is adjusted by the gamma camera holding unit 3 and the position of the subject P in the body axis direction is adjusted by the bed 2. Then, the gamma camera device 1 detects the gamma rays 10 emitted from the radiopharmaceutical accumulation part (for example, an affected part such as cancer) C in the body of the subject P, as described later, and thereby the body of the subject P. Take a photo of

  That is, among the gamma rays 10 isotropically emitted from the specific accumulation unit C, the incident direction of the gamma rays 10 directed to the radiation detector 14 is regulated by the collimator 4. The gamma rays 10 that have passed through a plurality of γ-ray passages (not shown) that are openings formed in the collimator 4 enter the semiconductor elements 12A and 13A of the radiation detector 14. When the gamma ray 10 is incident on the semiconductor element, charge is induced between the voltage application electrode and the signal readout electrode provided on the semiconductor element, and a voltage signal (γ-ray detection signal) corresponding to the amount of induced charge is signal readout electrode. Is output. The γ-ray detection signal output from the signal readout electrode 12C is transmitted to the measurement circuit 8A via the electrode contact member 17, the signal readout plug 19, and the signal readout wiring 22. The measurement circuit 8a processes each γ-ray detection signal output from each radiation detector 14, and the incident energy obtained for each γ-ray detection signal, information on the count value of the gamma rays and the corresponding radiation detector. 14 position information is transmitted to the data collection and analysis device 23 via the signal cable 9. The data collection and analysis device (image generation device) 23 generates an image including the accumulation part C of the subject P by a known method using information such as the gamma ray count value output from the measurement circuit 8A and its position information. To do. When the operator operates the input device (for example, keyboard) 24, the image table and detailed data of the subject P can be displayed on the screen of the display device 25.

Here, the radiation detector 14 according to the present embodiment has a configuration in which two semiconductor elements 12A and a semiconductor 13A are arranged side by side via the signal readout electrodes 12C and 13C. , And the detection efficiency of gamma rays by the radiation detector 14 can be increased. In addition, since the semiconductor elements 12A and 13A are thin and electrons and holes generated by γ-ray incidence reach the corresponding electrodes quickly, the radiation detector 14 has high energy resolution, high time resolution, and high count rate characteristics. It functions as a radiation detector. In the radiation detector 14, the voltage application electrode and the signal readout electrode are very thin, and the area occupied by the semiconductor element in the incident direction of the gamma rays is large, so that more gamma rays can be incident on the semiconductor element. This also contributes to improvement of gamma ray detection efficiency.
Since the signal readout electrode 12C of the detector element 12 and the signal readout electrode 13C of the detector element 13 are in contact with each other, the γ-ray detection signal of the detector element 13 is easily transmitted from the signal readout electrode 13C to the signal readout electrode 12C.

  Moreover, in the present embodiment, the detector element 12 constituting the radiation detector 14 is formed to be longer than the detector element 13 by the dimension L. For this reason, one end of the detector element 12 protrudes from one end of the detector element 13. Specifically, one end of the semiconductor element 12A protrudes from one end of the semiconductor element 13A. Among the signal readout electrodes 12 </ b> C and 13 </ b> C, a part of the signal readout electrode 12 </ b> C protrudes from the end face of the detector element 13 and is located outside the detector element 13. Accordingly, the signal readout electrode 12C can be brought into wide and stable surface contact with the electrode contact member 17, and the signal readout electrode 12C with respect to the electrode contact member 17 can be simply fitted into the protective connector case 15. Contact can be made easily. Further, since the signal readout electrode 12C is disposed by vapor deposition on the surface of the semiconductor element 12A even on the outer side of the end face of the detector element 13, the thin portion of the signal readout electrode 12C holding the portion protruding from the detector element 13 is retained. Can be easily performed, and the protruding portion is prevented from being broken. In other words, the portion of the semiconductor element 12A that protrudes more than the semiconductor element 13A functions as a reinforcing material for the signal readout electrode 12C. Since the signal readout electrode 13C is electrically connected to the electrode contact member 17 via the signal readout electrode 12C, the signal readout electrode 13C does not need to be in direct contact with the electrode contact member 17.

  Further, since the plurality of radiation detection units 11 having the radiation detector 14 and the protective connector case 15 are individually detachably attached to the socket boat 6, the radiation detection unit 11 in which an abnormality has occurred can be easily and in a short time. Can be exchanged. Specifically, the radiation detection device 30 is first removed from the gamma camera holding member 3, and then the metal plate 5 and the light shielding / electromagnetic shield 7 are removed, so that only the failed (or abnormal) radiation detection unit 11 is removed. The socket board 6 can be easily removed and replaced in a short time. Therefore, the other normal radiation detection unit 11 attached to the socket board 6 can be used as it is, and the replacement of the normal radiation detection unit 11 can be avoided.

  In the radiation detector 14, the signal readout electrodes 12C and 13C are arranged between the semiconductor elements 12A and 13A, and the voltage applying electrodes 12B and 13B are arranged outside the signal readout electrodes 12C and 13C with the semiconductor elements 12A and 13A interposed therebetween. Thus, the voltage application electrodes 12B and 13B are shielded from the other radiation detectors 14, and the signal application electrodes 12B and 13B can prevent crosstalk of signals from the signal readout electrodes 12C and 13C.

Further, since the protective connector case 15 is constituted by the two case elements 15B and 15C, when the radiation detection unit 11 is assembled, the case elements 15B and 15C are brought close to the radiation detector 14 from various directions, so that the dividing surface 15A. You can collide with each other. For this reason, the assembly operation of the radiation detection unit 11 can be easily performed.
In the present embodiment, the radiation detector in which two semiconductor elements are arranged side by side has been described. However, the radiation detector may be configured by arranging three or more semiconductor elements in parallel. In this case, the lengths of the three semiconductor elements are all different, and the semiconductor elements are arranged adjacent to each other in the order of the shortest length, and electrodes are provided on both surfaces of each semiconductor element. Looking at adjacent semiconductor elements, the end face of one semiconductor element protrudes from the end face of the other semiconductor element, and the electrode provided on the side facing the other semiconductor element of the one semiconductor element also has the other end. It protrudes from the end face of the semiconductor substrate. The gamma camera device provided with the semiconductor detection device having such a radiation detector can also obtain the same effect as the gamma camera device 1 described above.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 5, the radiation detection unit 31 includes a radiation detector 14 having a detector element 12 and a detector element 13, as in the radiation detection unit 11 described in the first embodiment, and this radiation detection. And a protective connector case 32 that accommodates the container 14 therein.

  The protective connector case 32 includes an electrode contact member 16 on the voltage application side, an electrode contact member (not shown) on the signal readout side, and an insulation maintaining step 15D. Further, the voltage applying plug 18 and the signal reading plug 19 are attached to the protective connector case 32. The radiation detection unit 31 is detachably attached to the sockets 6A and 6B of the socket board 6 shown in FIG. 4 by the voltage application plug 18 and the signal readout plug 19. The length A of the protective connector case 32 is longer than that of the protective connector case 15 described in the first embodiment. Then, in the side wall of the opening side end portion of the protective connector case 32, extraction holes 32A and 32A which are extraction portions are formed.

  In the present embodiment configured as described above, when the radiation detection unit 31 is replaced, as shown in FIG. 5, for example, hooks such as hooks 33, 33 are hooked on the respective extraction holes 32 </ b> A of the protective connector case 32. The radiation detection unit 31 can be easily pulled out and removed from the socket board 6, and the work efficiency when replacing the radiation detection unit 31 can be increased. Moreover, this embodiment can acquire the effect which arises in 1st Embodiment.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The gamma camera device of this embodiment is different from the gamma camera device 1 of FIG. 1 only in that a protective connector case is not provided and a socket board having a different configuration is provided. As shown in FIGS. 6 and 7, the radiation detection device 30 </ b> A used in the gamma camera device of the present embodiment has a fitting groove 47 into which the radiation detector 14 is inserted into a socket board (detector holding member) 41. . The fitting groove 47 is a stepped groove, and has a surface 42 that faces the upper end surface 12D of the detector element 12 and a surface 43 that has a step difference from the surface 42 and faces the upper end surface 13D of the detector element 13. The surface 42 is deeper than the surface 43. The fitting groove 47 constitutes a detector mounting portion to which the radiation detector 14 is detachably mounted.

  As shown in FIG. 7, the electrode contact member 45 is disposed on the side surface 48 extending from the surface 42 to the surface 43, and the electrode contact member 44 is disposed on the side surface 49 facing the side surface 48. The members 46 are respectively installed on the side surfaces 50 extending from the surface 43 to the surface of the socket board 41. In a state where the radiation detector 14 is inserted into the fitting groove 47, the voltage application electrode 12B of the radiation detector 14 is brought into contact with the electrode contact member 44, the signal readout electrode 12C is brought into contact with the electrode contact member 45, and voltage application is performed. The electrode 13B is brought into contact with the electrode contact member 46. The signal readout wiring 22 is connected to the electrode contact member 45. The wiring 20 connected to the high voltage power source 21 is connected to the electrode contact members 44 and 46.

  The electrode contact members 44, 45, 46 are configured using conductive rubber. The electrode contact members 44 and 45 gradually increase in thickness toward the surface 42, and the fitting groove 47 side is an inclined surface. The electrode contact member 46 gradually increases in thickness toward the surface 43, and the fitting groove 47 side is an inclined surface. Therefore, when the radiation detector 14 is inserted into the fitting groove 47, the electrode contact members 44, 45, 46 are elastically deformed, so that the radiation detector 14 is sandwiched by the electrode contact members 44, 45, 46 from both sides. It can be fixed in the state.

  Also in this embodiment configured as described above, the radiation detector 14 can be stably and widely brought into surface contact with the electrode contact members 44, 45, 46, and the radiation detector 14 is individually provided with respect to the socket board 41. Can be detachably attached, and the same effect as the first embodiment can be obtained.

(Fourth embodiment)
Next, a single photon emission CT apparatus (hereinafter referred to as SPECT) according to a fourth embodiment of the present invention will be described with reference to FIG. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  In FIG. 8, a SPECT 51 that is a radiation imaging apparatus includes a pair of radiation detection devices 30, a rotation support base 56, a data collection analysis device 23, an input device 24, and a display device 25. Those radiation detection devices 30 are arranged on the rotation support base 56 at positions shifted by 180 ° in the circumferential direction. Specifically, each socket board 6 of each radiation detection device 30 is attached to the rotation support base 56 at a position 180 degrees apart in the circumferential direction. Each radiation detection unit 11 faces the bed 2 side. A collimator 52 is installed between the radiation detection unit 11 and the subject P to limit the viewing angle from the radiation detection unit 11. A measurement circuit unit 8 is also installed in each socket board 6. The radiation detection unit 11, the collimator 4, and the measurement circuit unit 8 are housed in the light shielding / electromagnetic shield 7 to block the influence of electromagnetic waves other than gamma rays.

  The bed 2 on which the subject P to which the radiopharmaceutical is administered is moved, and the subject P is moved between the pair of socket boards 6. The gamma rays 10 emitted from the accumulation part C in the subject P where the radiopharmaceutical is accumulated pass through the through-hole part in the collimator 4 and enter each radiation detector 14 of the radiation detection unit 11. The γ-ray detection signal output from the radiation detector 14 is processed by the measurement circuit unit 53. The data collection / analysis device 54 creates image information for the subject P using the information output from the measurement circuit unit 53, and displays this image information on the display device 25. By rotating the rotation support base 56, each socket board 6 and the radiation detection unit 11 turn around the subject P. The radiation detection unit 11 outputs a γ-ray detection signal while turning. The rotation control of the rotation support base 56, the control of the distance between the radiation detection unit 11 and the subject P, and the position control of the subject P by the bed 2 can be performed in the vicinity of the SPECT 51 by the operation panel 58 and input. It is also possible to carry out from a long distance by means of the device 24.

  Also in this embodiment configured as described above, since the radiation detector 14 arranged in parallel is detachably attached to the socket board 6, the SPECT 51 having high energy resolution, high time resolution, and high count rate characteristics is provided. In addition to being provided, the radiation detector 14 that has become abnormal can be replaced in a minimum unit. In addition, it is possible to easily replace the abnormal radiation detector 14 in a short time. The effect which arises in 1st Embodiment can also be acquired.

(Fifth embodiment)
Next, a positron emission tomography apparatus 61 (hereinafter referred to as PET), which is a fifth embodiment of the present invention, will be described with reference to FIGS. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  In FIG. 9, a PET 61 that is a radiation imaging apparatus has a plurality of radiation detection apparatuses 30 (see FIG. 10) arranged so as to surround the bed 2. In each radiation detection device 30, a plurality of radiation detection units 11 detachably attached to the socket board 6 face the bed 2. For this reason, a large number of radiation detectors 11 are arranged surrounding the bed 2. The radiation detection unit 11, the measurement circuit unit 62, and the measurement circuit control system 63 are housed in the light shielding / electromagnetic shield 7 to block the influence of electromagnetic waves other than gamma rays. In the present embodiment, no collimator is installed between the radiation detection unit 11 and the subject P.

  The bed 2 on which the subject P to which the radiopharmaceutical is administered is moved, and the subject P is inserted into a space surrounded by the radiation detection units 11 arranged in a ring shape. The position control of the bed 2 can be performed in the vicinity of the PET 61 by the operation panel 67 and can be performed from a long distance by the input device 24. A pair of gamma rays 10 caused by the radiopharmaceutical is emitted from the accumulation portion C in the subject P where the radiopharmaceutical is accumulated. Since these gamma rays 10 are emitted 180 degrees opposite to each other, these gamma rays 10 are detected by separate radiation detectors 14 to determine the radiation direction of these gamma rays. These radiation directions are specified by performing coincidence counting processing by the data collection and analysis device 64. The γ-ray detection signals output from the radiation detector 14 are collected as data in the data collection / analysis device 64 via the measurement circuit 62A and the measurement circuit control system 63 of the measurement circuit unit 62. The data collection and analysis device 64 creates tomographic image information of the accumulation unit C using the gamma ray count value information obtained by the coincidence counting process and displays it on the display device 25.

  Also in this embodiment configured as described above, since the radiation detectors 14 arranged in parallel are detachably attached to the socket board 6, the PET 61 having high energy resolution, high time resolution, and high count rate characteristics is provided. Can be provided. In particular, it is most suitable for 3D-PET requiring high count rate characteristics. Further, the radiation detector 14 that has become abnormal can be replaced in a minimum unit. In addition, it is possible to easily replace the abnormal radiation detector 14 in a short time. The effect which arises in 1st Embodiment can also be acquired.

  In each embodiment, the case where the radiation detector is configured by arranging two semiconductor elements in parallel has been described as an example. However, the present invention is not limited to this, and for example, three or more semiconductor elements are arranged in parallel. It may be arranged to constitute a radiation detector.

  Further, in the second embodiment, the case where the protective connector case is configured to have a pull-out hole as a pull-out portion has been described as an example. For this purpose, the lead-out portion may be formed by projecting an L-shaped projection for projecting at the opening end of the protective connector case.

1 is an overall perspective view showing a gamma camera device according to a first embodiment of the present invention. It is a disassembled perspective view which expands and shows the radiation detection unit in FIG. It is a perspective view which shows the radiation detection unit in FIG. It is a perspective view which expands and shows the radiation detection unit, socket board, and measurement circuit unit in FIG. It is a perspective view which shows the radiation detection unit of the gamma camera apparatus which concerns on the 2nd Embodiment of this invention alone. It is a perspective view which shows the radiation detector of the gamma camera apparatus which concerns on the 3rd Embodiment of this invention, a socket board, and a measurement circuit unit. It is a side view shown in the state which decomposed | disassembled the radiation detector and socket board in FIG. It is a whole perspective view which shows the single photon emission CT apparatus which concerns on the 4th Embodiment of this invention. It is a whole perspective view which shows the positron emission tomography apparatus based on the 5th Embodiment of this invention. It is a perspective view which expands and shows the radiation detection unit and measurement circuit unit in FIG.

Explanation of symbols

1 Gamma camera device (radiation imaging device)
4 Collimator 6, 41 Socket board 6A, 6B Socket (detector holding member)
11, 31 Radiation detection unit 12 Detector element 12A, 13A Semiconductor element 12B, 13B Voltage application electrode (electrode)
12C, 13C Signal readout electrode (electrode)
13 Detector element 14 Radiation detector 15, 32 Protective connector case 15D, 34 Insulation maintenance step (step)
16, 17, 33, 44, 45, 46 Electrode contact member 30, 30A Radiation detection device 32A Extraction hole (extraction part)
47 Fitting groove (detector holding part)
51 Single photon emission CT system (radiation imaging device)
61 Positron emission tomography equipment (radiation imaging equipment)

Claims (16)

A plurality of semiconductor elements that are arranged side by side and generate electric charges when irradiated with radiation, a first electrode provided on one surface of each of the semiconductor elements, and each of the semiconductor elements on the opposite side of the one surface A radiation detector comprising a second electrode provided on each of the other surfaces,
One length of the adjacent semiconductor elements is longer than the other length, and the one end face protrudes from the other end face, and among the pair of electrodes arranged between the adjacent semiconductor elements, The radiation detector according to claim 1, wherein the electrode provided on the semiconductor element having the long length protrudes at least partially outward from the other semiconductor element.   The radiation detector according to claim 1, wherein the pair of first electrodes are in contact with each other. A plurality of semiconductor elements that are arranged side by side and generate electric charges upon incidence of radiation, a first electrode provided on one surface of each of the semiconductor elements, and each of the semiconductor elements on the opposite side of the one surface A plurality of radiation detectors each including a second electrode provided on each of the other surfaces, wherein one of the adjacent semiconductor elements is longer than the other, and the one end surface is longer than the other end surface. Of the pair of the first electrodes disposed between the adjacent semiconductor elements, the first electrode provided on the semiconductor element having the long length is at least partly the other semiconductor element. A plurality of said radiation detectors projecting outward than,
A radiation detection apparatus comprising a detector holding member that detachably holds these radiation detectors. The radiation detector is housed in a connector casing in which a first electrode contact member electrically connected to the first electrode and a second electrode contact member electrically connected to the second electrode are installed. And
The radiation detection apparatus according to claim 3, wherein the configuration in which the radiation detector is detachably held on the detector holding member is a configuration in which the connector casing is detachably held on the detector holding member.   The detachable attachment structure of the connector casing to the detector holding member includes first and second plug portions that are provided in the connector casing and are inserted into the detector holding member, and are attached to the first electrode contact member. The radiation detection apparatus according to claim 4, wherein the second plug portion is electrically connected to the first plug portion and the second electrode contact member that are electrically connected.   The radiation detection apparatus according to claim 3, wherein the connector casing is formed with an extraction portion for extracting the connector casing from the detector holding member.   The radiation detection apparatus according to claim 4, wherein the electrode contact member is formed using a three-dimensional injection molding circuit component manufacturing method.   8. The device according to claim 4, wherein the first electrode contact member and the second electrode contact member are provided inside the connector casing in a stepped manner in order to keep an electrically insulated state therebetween. A radiation detection apparatus according to claim 1. The radiation detection apparatus according to claim 4, wherein a density of a material constituting the connector casing is 4 g / cm ³ or less.   The radiation detection apparatus according to claim 4, wherein an atomic number of an element constituting a material used for the protective connector casing is 10 or less.   The detector holding member has a hole for inserting the radiation detector and has a first electrode contact member electrically connected to the first electrode and a first electrode electrically connected to the second electrode. The radiation detection apparatus according to claim 2, wherein a two-electrode contact member is provided in the hole.   The radiation detection apparatus according to claim 11, wherein the first and second electrode contact members are made of an elastic conductive material. A radiation detection device according to any one of claims 3, 4, and 11, a bed that supports a subject and is movable in a longitudinal direction, and the charge from each radiation detector of the radiation detection device. A radiation imaging apparatus comprising: an image information creation device that creates image information using information obtained based on a radiation detection signal output correspondingly.
  14. The radiation imaging apparatus according to claim 13, wherein the radiation imaging apparatus is a gamma camera apparatus, and includes a radiation detection apparatus holding member that holds the radiation detection apparatus.   The single-photon emission CT apparatus according to claim 13, which is a single-photon emission CT apparatus, wherein the radiation detection apparatus is held by a rotatable support member.   14. The radiation imaging apparatus according to claim 13, wherein the radiation imaging apparatus is a positron emission tomography apparatus, wherein a plurality of the radiation detection apparatuses are arranged around the bed.

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