JP2005074434A - Mold for producing metal-ceramic jointed member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold for producing a metal-ceramic jointed member in which molten metal can easily be poured in a metal circuit plate forming part without arranging a gas venting hole in the mold. <P>SOLUTION: In the mold for joining the metallic member, in which the ceramic member is arranged therein, and the molten metal is poured therein to be made in contact with both surfaces of the ceramic member, then is solidified by cooling, thereby joining the metallic member to the the both surfaces of the ceramic member, when the ceramic member is arranged at a prescribed position in the mold, spaces (100d, 100f) for forming the metallic member and a molten metal flowing passage (100g) communicating the spaces the upper side and the lower side of the ceramic member are formed at the upper side and the lower side of the ceramic memberat, and also a molten metal pouring hole for pouring the molten metal is formed in the space (100f) at the upper side of the ceramic member, and at least the bottom part in the mold portion forming the space at the lower part of the ceramic member is formed of gas-permeable material. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mold for manufacturing a metal / ceramic bonding member, and relates to a mold for manufacturing a metal / ceramic bonding member in which metal members are bonded to both surfaces of a ceramic member.
[0002]
[Prior art]
Conventionally, as a method of manufacturing a metal-ceramic bonding member in which a metal member is bonded to a ceramic member, a method of bonding a metal plate to a ceramic substrate by pouring a molten metal onto the ceramic substrate and then solidifying by cooling is known. (For example, refer to Patent Document 1).
[0003]
[Patent Document 1]
JP 2002-76551 A (paragraph number 0030)
[0004]
[Problems to be solved by the invention]
Further, when a metal plate is bonded to both surfaces of the ceramic substrate by bringing the molten metal into contact with both surfaces of the ceramic substrate and then solidifying by cooling, for example, the metal circuit plate is bonded to one surface of the ceramic substrate and the other When a metal-ceramic bonded circuit board is manufactured by bonding a heat-dissipating metal base plate to the surface, a recess (ceramic substrate holding part) for holding the ceramic substrate is formed on the upper surface of the bottom in the mold, and this ceramic Spaces (metal base plate forming part and metal circuit board forming part) for forming the metal base plate and the metal circuit board are formed on the upper side and the lower side of the substrate holding part, respectively, and these metal base plate forming part and metal circuit It has been proposed to use a mold in which a molten metal flow path for communicating plate forming portions with each other is formed.
[0005]
However, when such an entire mold is formed of a metal material, when the molten metal poured into the mold is filled into the metal circuit board forming part through the molten metal flow path, the gas in the metal circuit board forming part is It is difficult to fill the metal circuit board forming portion with the molten metal. Further, if a gas vent hole for exhausting the gas in the metal circuit board forming portion is provided so that the metal molten metal can be filled into the metal circuit board forming portion, the metal molten metal enters the gas vent hole. As a result, irregularities are formed on the metal circuit board, and a process for ensuring the flatness of the metal circuit board is required, which increases the manufacturing cost. Further, the provision of the vent holes complicates the structure of the mold and increases the manufacturing cost. On the other hand, when no vent hole is provided, the molten metal cannot be filled into the metal circuit board forming portion even when the pouring pressure is increased, and the molten metal leaks from an unexpected part such as a gap in the mold. There is a fear.
[0006]
Therefore, in view of such problems, the present invention provides a mold for producing a metal / ceramic bonding member that can easily fill a metal circuit board forming portion with a molten metal without providing a vent hole in the mold. The purpose is to do.
[0007]
[Means for Solving the Problems]
As a result of diligent research to solve the above problems, the present inventors have formed a gas vent hole in the mold by forming at least the bottom of the metal circuit board forming portion of the mold with a breathable material such as carbon or porous metal. The present inventors have found that the molten metal can be easily filled into the metal circuit board forming portion without providing the metal, and the present invention has been completed.
[0008]
That is, the mold for producing a metal / ceramic bonding member according to the present invention includes a ceramic member disposed therein, a molten metal poured into the interior, brought into contact with both surfaces of the ceramic member, and then cooled and solidified. In a mold for joining metal members to both surfaces of a member, when the ceramic member is placed at a predetermined position in the mold, spaces for forming the metal member are formed on the upper and lower sides of the ceramic member and the ceramic A mold that forms a molten metal flow path that connects the upper and lower spaces of the member, forms a pouring port for pouring the molten metal into the upper space of the ceramic member, and forms a lower space of the ceramic member At least the bottom of this part is formed of a breathable material.
[0009]
In this metal / ceramic bonding member manufacturing mold, the entire mold is preferably formed of a breathable material. Alternatively, the mold is made of a metal material, and an opening is provided at the bottom of the mold part that forms the space below the ceramic member, and a ventilation member made of a breathable material is fitted in the opening in a liquid-tight manner. May be. Alternatively, the first and second mold members made of a gas-permeable material and the third mold member made of a metal material disposed between these members, and the molten metal flow path is formed in the third mold member. May be. The breathable material is preferably carbon or porous metal.
[0010]
In the present specification, the “breathable material” refers to a material having a large number of pores having a size through which a gas passes and a molten metal does not enter. When carbon is used as the breathable material, it is preferable to use an extruded or CIP-molded graphite material because of its high density and high strength, and since the pores are anisotropic, the three-dimensional It is preferred to use a CIP molding that is compressed in a compressed manner. Moreover, when using a porous metal as a breathable material, a sintered metal obtained by sintering metal powder can be used, and the size of the pores is controlled by the particle size and molding density of the raw metal powder. be able to. In particular, as a material having low wettability to molten aluminum among molten metals, refractory metals such as molybdenum and tungsten and alloys thereof such as TZM (0.5 wt% titanium and 0.08 wt% zirconium in molybdenum) It is preferable to use a porous metal based on SKD or SUS as the Fe-based material.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of a metal-ceramic bonding member manufacturing mold according to the present invention will be described with reference to the accompanying drawings.
[0012]
[First Embodiment]
With reference to FIG. 1 and FIG. 2, a first embodiment of a mold for producing a metal / ceramic bonding member according to the present invention will be described.
[0013]
The mold according to this embodiment is made of a breathable material such as carbon or porous metal, and includes a lower mold member 100 and an upper mold member 102 as shown in FIG.
[0014]
As shown in FIGS. 1A and 1B, the lower mold member 100 has a bottom surface portion 100a having a substantially rectangular planar shape, and side walls extending upward in the vertical direction from the peripheral edge portion of the bottom surface portion 100a. Part 100b. Two concave portions 100 c having stepped side walls are formed on the upper surface of the bottom surface portion 100 a of the lower mold member 100. Each of these recesses 100c is formed adjacent to an upper portion of the metal circuit board forming portion 100d having a shape and size substantially equal to a metal circuit board described later, and a ceramic substrate described later. The ceramic substrate holding part 100e has substantially the same shape and size. Further, as shown in FIG. 2A, the concave portion of the lower mold member 100 in the space defined by covering the upper mold member 102 having a substantially rectangular planar shape on the upper part of the lower mold member 100. The portion excluding 100c becomes a metal base plate forming portion 100f having a shape and size substantially equal to a metal base plate described later. The upper mold member 102 has a pouring port (not shown) for pouring a molten metal into the mold. Further, the lower mold member 100 is formed with a molten metal flow path 100g extending between the metal base plate forming portion 100f and the metal circuit plate forming portion 100d, and when the ceramic substrate is accommodated in the ceramic substrate holding portion 100e. Also, the metal base plate forming portion 100f and the metal circuit plate forming portion 100d communicate with each other.
[0015]
After the ceramic substrate is accommodated in the ceramic substrate holding part 100e of the lower mold member 100 of this mold, a molten metal such as a molten aluminum is poured into the metal base plate forming part 100f, and the metal is introduced via the molten metal channel 100g. The metal base plate 14 is directly bonded to one surface of the ceramic substrate 10 as shown in FIG. 2B by filling the molten metal up to the circuit board forming portion 100d and then cooling to solidify the molten metal. In addition, an integrated metal-ceramic bonding member in which the metal circuit board 12 is directly bonded to the other surface is obtained.
[0016]
In this embodiment, since the entire mold is formed of a breathable material such as carbon or porous metal, the gas present in the metal circuit board holding portion before filling with the molten metal is mainly from the bottom surface of the mold. The metal circuit board forming portion 100d can be easily filled with the molten metal without being vented and provided with a vent hole in the mold on the metal circuit board side.
[0017]
[Second Embodiment]
Next, with reference to FIG. 3, a second embodiment of a metal / ceramic bonding member manufacturing mold according to the present invention will be described.
[0018]
In this embodiment, the mold is formed of a metal material, and only the portion of the bottom surface portion 100a of the lower mold member 100 that forms the bottom surface of the metal circuit board forming portion 100d is formed of a breathable material such as carbon or porous metal. Since it is the same as that of 1st Embodiment except being formed, only a different part is demonstrated, the same code | symbol is attached | subjected about the same part, and the description is abbreviate | omitted.
[0019]
In this embodiment, the mold is formed by using a ceramic material, a metal material having a thermal expansion coefficient close to that of a breathable material such as carbon or porous metal, for example, a metal material such as molybdenum, tungsten, or an alloy thereof. In one embodiment, chipping and cracking of the mold that are likely to occur when the mold is made of carbon are prevented, and the strength and life of the mold are improved.
[0020]
Further, an opening is formed in a portion of the bottom surface portion 100a of the lower mold member 100 where the bottom surface of the metal circuit board forming portion 100d is formed, and a ventilation member made of a breathable material such as carbon or porous metal is formed in the opening. By fitting 100h in a liquid-tight manner, the gas in the metal circuit board forming portion 100d can be permeated and the molten metal can be filled into the metal circuit board forming portion 100d without leaking from the gap.
[0021]
[Third Embodiment]
Next, a third embodiment of the metal-ceramic bonding member manufacturing mold according to the present invention will be described with reference to FIG.
[0022]
Since this embodiment is the same as the first embodiment except that a part of the mold is made of a metal material, only different parts will be described, and the same parts will be denoted by the same reference numerals. The description is omitted.
[0023]
That is, in the mold of this embodiment, a metal mold member 204 made of a metal material is disposed between an upper mold member 202 made of a gas-permeable material such as carbon or a porous metal and a lower mold member 200 to hold the ceramic substrate. Side surfaces of the portion 100e and the metal circuit board forming portion 100d are defined by the metal mold member 204. The metal mold member 204 can be formed of a metal material having a thermal expansion coefficient close to that of a breathable material such as a ceramic substrate or carbon or porous metal, for example, a metal material such as molybdenum, tungsten, or an alloy thereof. The metal mold member 204 is formed with a molten metal passage (not shown) extending between the metal base plate forming portion 100f and the metal circuit plate forming portion 100d, and the ceramic substrate is accommodated in the ceramic substrate holding portion 100e. Sometimes, the metal base plate forming portion 100f and the metal circuit plate forming portion 100d communicate with each other.
[0024]
As described above, the portion of the mold that is easily broken, that is, the portion that defines the side surfaces of the ceramic substrate holding portion 100e and the metal circuit board forming portion 100d is formed of a metal material, and the other portion is a breathable material such as carbon or porous metal Therefore, before filling the molten metal, the gas existing in the metal circuit board forming portion 100d is mainly exhausted from the bottom surface of the mold, and the mold on the metal circuit board side is not provided with a vent hole. Not only can the molten metal be easily filled into the metal circuit board forming portion 100d, but also the mold can be prevented from being chipped or cracked and the strength and life of the mold can be improved. Furthermore, by exchanging the metal mold member 204, various types of metal-ceramic bonding members having different shapes and sizes of metal circuit boards and ceramic substrates can be manufactured. Very advantageous.
[0025]
In the first to third embodiments described above, the case where a plate-shaped metal base plate larger than the ceramic substrate is bonded to the ceramic substrate has been described. However, the shape of the metal-ceramic bonding member manufacturing mold according to the present invention is described. By changing the above, metal base plates of various shapes and sizes, such as a metal base plate smaller than the ceramic substrate and a metal base plate integrally formed with heat radiation fins on the back surface can be joined to the ceramic substrate.
[0026]
【The invention's effect】
As described above, according to the present invention, at least the bottom part of the metal circuit board forming part of the mold is formed of a gas-permeable material such as carbon or porous metal, so that the mold is relatively free from a vent hole. Even with a low pouring pressure, the molten metal can be easily filled into the metal circuit board forming portion.
[Brief description of the drawings]
FIG. 1 is a view showing a lower mold member of a first embodiment of a metal / ceramic bonding member manufacturing mold according to the present invention, FIG. 1 (a) is a plan view of the lower mold member, and FIG. FIG. 1B is a cross-sectional view of the lower mold member taken along line B-B in FIG.
2A and 2B are views showing a first embodiment of a mold for producing a metal / ceramic bonding member according to the present invention. FIG. 2A is a cross-sectional view of the mold, and FIG. Sectional drawing of the metal-ceramics joining member manufactured by the casting_mold | template of this.
FIG. 3 is a sectional view of a second embodiment of a mold for producing a metal / ceramic bonding member according to the present invention.
FIGS. 4A and 4B are diagrams showing a third embodiment of a mold for producing a metal / ceramic bonding member according to the present invention, FIG. 4A is a sectional view of the mold, and FIG. 4B is FIG. The perspective view of the metal casting_mold | template member arrange | positioned between the upper mold | type and lower mold | type of a casting_mold | template.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Ceramic substrate 12 Metal circuit board 14 Metal base board 100, 200 Lower side mold member 100a Bottom surface part 100b Side wall part 100c Recessed part 100d Metal circuit board formation part 100e Ceramic substrate holding part 100f Metal base plate formation part 100g Molten flow path 100h Ventilation member 102, 202 Upper mold member 204 Metal mold member

Claims (6)

A ceramic member is disposed inside, and after pouring a molten metal into the inside and bringing it into contact with both surfaces of the ceramic member, cooling and solidifying the ceramic member in a mold for joining the metal member to both surfaces of the ceramic member When the metal member is disposed at a predetermined position in the mold, a space for forming the metal member is formed on the upper side and the lower side of the ceramic member, and a molten metal flow path for communicating the upper and lower spaces of the ceramic member is provided. A pouring port for pouring a molten metal into the upper space of the ceramic member is formed, and at least the bottom of the mold part forming the lower space of the ceramic member is formed of a breathable material. A mold for producing a metal / ceramic bonding member. 2. The mold for producing a metal / ceramic bonding member according to claim 1, wherein the entire mold is made of a gas-permeable material. The mold is formed of a metal material, and an opening is provided at the bottom of the mold portion that forms the space below the ceramic member, and a ventilation member made of a breathable material is fitted in the opening in a liquid-tight manner. The mold for producing a metal / ceramic bonding member according to claim 1, wherein 2. The metal-ceramic according to claim 1, comprising first and second mold members made of a gas-permeable material and a third mold member made of a metal material disposed between these members. Mold for manufacturing joining members. The mold for producing a metal / ceramic bonding member according to claim 4, wherein the molten metal flow path is formed in a third mold member. The mold for producing a metal / ceramic bonding member according to any one of claims 1 to 5, wherein the breathable material is carbon or a porous metal.

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