JP2005065414A - Inverter device - Google Patents

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JP2005065414A
JP2005065414A JP2003292695A JP2003292695A JP2005065414A JP 2005065414 A JP2005065414 A JP 2005065414A JP 2003292695 A JP2003292695 A JP 2003292695A JP 2003292695 A JP2003292695 A JP 2003292695A JP 2005065414 A JP2005065414 A JP 2005065414A
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conductor
anode
cathode
inverter device
barrier
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Toshihiro Yoshida
敏弘 吉田
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Fuji Electric FA Components and Systems Co Ltd
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Fuji Electric FA Components and Systems Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an inverter device which has a conductor device with lower inductance. <P>SOLUTION: This inverter device is of laminate structure where an anode conductor 1, an insulating sheet 3, and a cathode conductor 4 are arranged in this order, and an insulating gap 2, which has a flange part 10 for gaining a creeping distance and barrier parts 11 and 12 for securing spatial distances, is arranged between the anode conductor 1 and the insulating sheet 3. Since only the round holes 9 and 17 of indispensable minimum size to only pass and arrange the barrier part 12 of the insulating gap 2, as for the anode conductor 1, and the barrier part 11, as for the cathode conductor 4, are opened, this inverter can enlarge the reduction effect of the inductance being obtained by approximating counter currents to each other, whereby this can suppress the surge voltage, thus it becomes possible to omit a fuse and a snubber circuit. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明はインバータ装置に関し、特にラミネート構成の低インダクタンス導体装置で平滑コンデンサと半導体スイッチング素子との間を接続して高速スイッチングを可能にしたインバータ装置に関する。   The present invention relates to an inverter device, and more particularly to an inverter device that enables high-speed switching by connecting a smoothing capacitor and a semiconductor switching element with a low-inductance conductor device having a laminated structure.

インバータ装置は、電源となる複数の平滑コンデンサと、複数の半導体スイッチング素子と、各半導体スイッチング素子に接続されたスナバ回路とを備え、平滑コンデンサと半導体スイッチング素子とは導体装置によって接続されている。この導体装置は、陽極電極を構成するプレート状の陽極導体と陰極電極を構成するプレート状の陰極導体とこれらの間に挟持される絶縁シートとからなるラミネート構成のものが知られている(たとえば、特許文献1参照。)。   The inverter device includes a plurality of smoothing capacitors serving as a power source, a plurality of semiconductor switching elements, and a snubber circuit connected to each semiconductor switching element, and the smoothing capacitor and the semiconductor switching element are connected by a conductor device. This conductor device is known to have a laminate structure comprising a plate-like anode conductor constituting an anode electrode, a plate-like cathode conductor constituting a cathode electrode, and an insulating sheet sandwiched therebetween (for example, , See Patent Document 1).

図4は従来の導体装置を示す展開斜視図、図5は従来の導体装置を示す完成斜視図、図6は従来の導体装置を構成する導体を示す平面図であって、(A)は陽極導体、(B)は陰極導体を示している。   4 is a developed perspective view showing a conventional conductor device, FIG. 5 is a completed perspective view showing the conventional conductor device, FIG. 6 is a plan view showing conductors constituting the conventional conductor device, and FIG. A conductor (B) represents a cathode conductor.

従来の導体装置は、プレート状の陽極導体101と、絶縁シート102と、プレート状の陰極導体103とを備えている。陽極導体101は、陽極電源入力端子104と、半導体スイッチング素子に接続される陽極電源出力端子105と、平滑コンデンサの陽極端子に接続される陽極端子接続部106とを有している。この陽極端子接続部106は、その回りに切欠き部107が形成されて導体装置の完成時に陰極導体103と同一レベルになるように段差が付けられているともに、平滑コンデンサの陰極端子の陰極端子との絶縁距離を確保するようにしている。   The conventional conductor device includes a plate-like anode conductor 101, an insulating sheet 102, and a plate-like cathode conductor 103. The anode conductor 101 has an anode power input terminal 104, an anode power output terminal 105 connected to the semiconductor switching element, and an anode terminal connection portion 106 connected to the anode terminal of the smoothing capacitor. The anode terminal connecting portion 106 is formed with a notch 107 around it, and is stepped so as to be at the same level as the cathode conductor 103 when the conductor device is completed, and the cathode terminal of the smoothing capacitor cathode terminal. The insulation distance is secured.

陰極導体103は、陰極電源入力端子108と、半導体スイッチング素子に接続される陰極電源出力端子109と、平滑コンデンサの陰極端子に接続される陰極端子接続部110とを有し、この陰極端子接続部110に隣接して、平滑コンデンサの陽極端子との絶縁距離を確保するために、切欠き部111が形成されている。   The cathode conductor 103 has a cathode power source input terminal 108, a cathode power source output terminal 109 connected to the semiconductor switching element, and a cathode terminal connection portion 110 connected to the cathode terminal of the smoothing capacitor. A notch 111 is formed adjacent to 110 to ensure an insulation distance from the anode terminal of the smoothing capacitor.

絶縁シート102は、陽極導体101と陰極導体103とによって挟持されたときに、陽極導体101の陽極端子接続部106と陰極導体103の陰極端子接続部110とに対応する部分に切欠き部112を有している。   When the insulating sheet 102 is sandwiched between the anode conductor 101 and the cathode conductor 103, a notch 112 is formed at a portion corresponding to the anode terminal connection portion 106 of the anode conductor 101 and the cathode terminal connection portion 110 of the cathode conductor 103. Have.

このように、平滑コンデンサと半導体スイッチング素子との間を電気的に接続する導体装置をラミネート構成にしたことにより、陽極導体101と陰極導体103とを流れる対向電流が近接化し、これにより配線の相互インダクタンスが相殺されて配線インダクタンスを低減することができる。この導体装置の低インダクタンス化により、スイッチング時に半導体スイッチング素子に印加されるサージ電圧が低減され、スナバコンデンサの容量を小さく、または省略することができる。
特開平9−117126号公報(段落番号〔0007〕〜〔0008〕、〔0012〕,図2)
As described above, the conductor device that electrically connects the smoothing capacitor and the semiconductor switching element has a laminated configuration, so that the opposing currents flowing through the anode conductor 101 and the cathode conductor 103 become close to each other. The inductance is offset and the wiring inductance can be reduced. By reducing the inductance of the conductor device, the surge voltage applied to the semiconductor switching element during switching is reduced, and the capacity of the snubber capacitor can be reduced or omitted.
JP-A-9-117126 (paragraph numbers [0007] to [0008], [0012], FIG. 2)

しかしながら、従来のインバータ装置に用いられている導体装置は、半導体スイッチング素子から平滑コンデンサまでの陽極導体および陰極導体を平面で重ね、各導体相間に絶縁シートのみを介挿したラミネート構成であるが、各平滑コンデンサの端子への接続部の絶縁距離を確保するため、陽極導体および陰極導体は、各端子接続部の周辺を大きく切り欠くことが必要で、ラミネート構成になっていない範囲があり、配線インダクタンス低減のネックとなっているという問題点があった。特に、大容量インバータ装置の半導体スイッチング素子としてIGBT(絶縁ゲート型バイポーラトランジスタ)素子を使用する場合に、サージ電圧を素子耐圧以下に抑えるためには、さらなる配線インダクタンスの低減が必要になる。   However, the conductor device used in the conventional inverter device is a laminate configuration in which the anode conductor and the cathode conductor from the semiconductor switching element to the smoothing capacitor are stacked in a plane, and only the insulating sheet is interposed between the conductor phases. In order to secure the insulation distance of the connection part to the terminal of each smoothing capacitor, the anode conductor and the cathode conductor need to be largely cut out around each terminal connection part, and there is a range that is not laminated, There was a problem that it became a bottleneck for inductance reduction. In particular, when an IGBT (insulated gate bipolar transistor) element is used as the semiconductor switching element of the large-capacity inverter device, it is necessary to further reduce the wiring inductance in order to suppress the surge voltage below the element breakdown voltage.

本発明はこのような点に鑑みてなされたものであり、低インダクタンス化した導体装置を有するインバータ装置を提供することを目的とする。   This invention is made | formed in view of such a point, and it aims at providing the inverter apparatus which has a conductor apparatus made into low inductance.

本発明では上記問題を解決するために、第1の電極を構成する第1の導体と第2の電極を構成する第2の導体との間に絶縁シートを挟持したラミネート構成の導体装置で平滑コンデンサと半導体スイッチング素子との間を接続するインバータ装置において、前記第1の導体と前記第2の導体との間に配置されて前記第2の導体を前記平滑コンデンサの端子接続部の一方に接続するねじを囲うように前記第1の導体を貫通して伸びる筒状の第1のバリア部と周縁部が前記第1のバリア部の周囲から所定距離だけ隔てられた第1のフランジ部とを有する第1の絶縁キャップと、前記第1の導体と前記第2の導体との間に配置されて前記第1の導体を前記平滑コンデンサの端子接続部の他方に接続するねじを着座させるべく前記第1の導体に前記第2の導体の方向へ略板厚分の段差を設けた丸い段差部を囲うように前記第2の導体を貫通して伸びる筒状の第2のバリア部と周縁部が前記第2のバリア部の周囲から所定距離だけ隔てられた第2のフランジ部とを有する第2の絶縁キャップとを備え、前記第1の導体は、前記第1の絶縁キャップの前記第1のバリア部を貫通配置させるだけの第1の丸穴と、前記段差部の中央に設けられた第2の丸穴とを有し、前記第2の導体は、前記第2の絶縁キャップの前記第2のバリア部を貫通配置させるだけの第3の丸穴と、前記ねじを通す第4の丸穴とを有する、ことを特徴とするインバータ装置が提供される。   In the present invention, in order to solve the above-described problem, a smoothed conductor device in which an insulating sheet is sandwiched between a first conductor constituting the first electrode and a second conductor constituting the second electrode is used. In the inverter device for connecting a capacitor and a semiconductor switching element, the second conductor is arranged between the first conductor and the second conductor and connected to one of the terminal connection portions of the smoothing capacitor. A cylindrical first barrier portion extending through the first conductor so as to surround a screw to be engaged with a first flange portion having a peripheral edge portion separated from the periphery of the first barrier portion by a predetermined distance. A first insulating cap having the first conductor, and a screw disposed between the first conductor and the second conductor to connect the first conductor to the other of the terminal connection portions of the smoothing capacitor. Said first conductor A cylindrical second barrier portion extending through the second conductor and a peripheral portion of the second barrier portion so as to surround a round step portion provided with a step having a substantially plate thickness in the direction of the conductor of the second barrier portion. And a second insulating cap having a second flange portion separated by a predetermined distance from the surroundings, and the first conductor is simply disposed through the first barrier portion of the first insulating cap. A first round hole and a second round hole provided in the center of the stepped portion, and the second conductor is disposed through the second barrier portion of the second insulating cap. There is provided an inverter device characterized by having a third round hole to be allowed to pass and a fourth round hole through which the screw is passed.

このようなインバータ装置によれば、ラミネート構成の導体装置を構成する第1および第2の導体は、第1および第2の絶縁キャップの第1および第2のバリア部を貫通配置させるだけの第1および第3の丸穴だけしか開いていないので、平面で重ね合わせられる面積を最大に取ることができ、これによって、第1および第2の導体を流れる対向電流を近接させることで得られるインダクタンスの低減効果を大きくすることができ、インダクタンスが低減されることで、スイッチング時に半導体スイッチング素子に印加されるサージ電圧を抑制することができて、ヒューズおよびスナバ回路の省略が可能になる。   According to such an inverter device, the first and second conductors constituting the laminate-structured conductor device are provided only by the first and second barrier portions of the first and second insulating caps. Since only the first and third round holes are opened, the area overlapped in the plane can be maximized, and thereby the inductance obtained by bringing the opposing currents flowing through the first and second conductors close to each other. As a result, the surge voltage applied to the semiconductor switching element during switching can be suppressed, and the fuse and the snubber circuit can be omitted.

本発明のインバータ装置は、平滑コンデンサと半導体スイッチング素子とを接続する導体装置を低インダクタンス化したことにより、スイッチング時に半導体スイッチング素子に印加されるサージ電圧を素子耐圧以下に抑えることが可能になるので、その場合には、スナバ回路を省略できるだけでなく、通常設けられているヒューズを省略することもできるため、インバータ装置のコストを低減することができるという利点がある。   In the inverter device of the present invention, since the inductance of the conductor device connecting the smoothing capacitor and the semiconductor switching element is reduced, the surge voltage applied to the semiconductor switching element at the time of switching can be suppressed below the element breakdown voltage. In this case, not only the snubber circuit can be omitted, but also a normally provided fuse can be omitted, so that there is an advantage that the cost of the inverter device can be reduced.

以下、本発明の実施の形態を三相交流出力のインバータ装置に適用した場合を例に図面を参照して詳細に説明する。
図1は本発明によるインバータ装置の導体装置を示す展開斜視図、図2は本発明によるインバータ装置の導体装置を示す完成斜視図、図3は本発明によるインバータ装置の導体装置を構成する導体を示す平面図であって、(A)は陽極導体、(B)は陰極導体を示している。
Hereinafter, a case where the embodiment of the present invention is applied to a three-phase AC output inverter device will be described in detail with reference to the drawings.
1 is a developed perspective view showing a conductor device of an inverter device according to the present invention, FIG. 2 is a completed perspective view showing a conductor device of the inverter device according to the present invention, and FIG. 3 shows conductors constituting the conductor device of the inverter device according to the present invention. It is the top view shown, Comprising: (A) has shown the anode conductor, (B) has shown the cathode conductor.

本発明によるインバータ装置の導体装置は、プレート状の陽極導体1と、第1および第2の絶縁キャップを樹脂成型により一体に形成した絶縁キャップ2と、絶縁シート3と、プレート状の陰極導体4とを備えている。陽極導体1は、略四角形の導体板の対向する2辺を反対方向に折り曲げた形状を有し、その折り曲げ片の一方には陽極電源入力端子5が一体に形成され、他方の折り曲げ片には、半導体スイッチング素子に接続される陽極電源出力端子6が一体に形成されている。この例のインバータ装置では、三相交流出力を得るために3組の半導体スイッチング素子を備えているので、この陽極電源出力端子6は、3つ備えている。陽極導体1は、また、平滑コンデンサの陽極端子に接続される陽極端子接続部7を有している。この陽極端子接続部7は、陽極導体1に板厚分の段差を有する凹部が設けられていて、その中心に平滑コンデンサの陽極端子に螺着されるねじ8を挿通させるための丸穴が穿設されることにより形成されている。この陽極端子接続部7は、この例では4つの平滑コンデンサを陽極導体1に並列に接続するため、それらの陽極端子に対応する位置に4つ設けられている。これら陽極端子接続部7に隣接して平滑コンデンサの陰極端子に螺着されるねじ8を挿通させるための丸穴9もそれぞれ陽極導体1に穿設されている。   The conductor device of the inverter device according to the present invention includes a plate-like anode conductor 1, an insulation cap 2 in which first and second insulation caps are integrally formed by resin molding, an insulation sheet 3, and a plate-like cathode conductor 4. And. The anode conductor 1 has a shape in which two opposite sides of a substantially rectangular conductor plate are bent in opposite directions, and an anode power input terminal 5 is integrally formed on one of the bent pieces, and the other bent piece has The anode power supply output terminal 6 connected to the semiconductor switching element is integrally formed. In the inverter device of this example, three sets of semiconductor switching elements are provided in order to obtain a three-phase alternating current output, so three anode power supply output terminals 6 are provided. The anode conductor 1 also has an anode terminal connection portion 7 connected to the anode terminal of the smoothing capacitor. The anode terminal connecting portion 7 is provided with a concave portion having a step corresponding to the plate thickness in the anode conductor 1, and a round hole for inserting a screw 8 screwed to the anode terminal of the smoothing capacitor is formed in the center thereof. It is formed by being installed. In this example, four anode terminal connection portions 7 are provided at positions corresponding to the anode terminals in order to connect four smoothing capacitors to the anode conductor 1 in parallel. A round hole 9 for inserting a screw 8 screwed to the cathode terminal of the smoothing capacitor adjacent to the anode terminal connecting portion 7 is also formed in the anode conductor 1.

絶縁キャップ2は、沿面距離を稼ぐための薄いフランジ部10と、空間距離を確保するためにこのフランジ部10の面から互いに反対方向に伸びる筒状のバリア部11,12とを有しており、これらフランジ部10およびバリア部11,12は、絶縁性の樹脂によって一体に成型されている。フランジ部10は、バリア部11,12の周囲からある一定の距離だけ隔てられた周縁部を有している。絶縁キャップ2の大径のバリア部11は、陽極端子接続部7の段差部が干渉しないだけの貫通穴を有し、小径のバリア部12は、ねじ8が通るだけの貫通穴を有していて、このバリア部12は、導体装置を組み立てたときに陽極導体1の丸穴9に挿通される。   The insulating cap 2 has a thin flange portion 10 for increasing a creepage distance, and cylindrical barrier portions 11 and 12 extending in opposite directions from the surface of the flange portion 10 to ensure a spatial distance. The flange portion 10 and the barrier portions 11 and 12 are integrally molded with an insulating resin. The flange portion 10 has a peripheral edge portion that is separated from the periphery of the barrier portions 11 and 12 by a certain distance. The large-diameter barrier portion 11 of the insulating cap 2 has a through hole that does not interfere with the stepped portion of the anode terminal connecting portion 7, and the small-diameter barrier portion 12 has a through hole through which the screw 8 can pass. The barrier portion 12 is inserted into the round hole 9 of the anode conductor 1 when the conductor device is assembled.

絶縁シート3は、略四角形のシートの対向する2辺を反対方向に折り曲げた形状を有し、導体装置を組み立てたときに絶縁キャップ2の大径のバリア部11が挿通される大径の丸穴13と、陽極導体1の丸穴9と同じ径を有する丸穴14とがそれぞれ4組設けられている。   The insulating sheet 3 has a shape in which two opposing sides of a substantially rectangular sheet are bent in opposite directions, and a large-diameter circle into which the large-diameter barrier portion 11 of the insulating cap 2 is inserted when the conductor device is assembled. Four sets of holes 13 and round holes 14 having the same diameter as the round holes 9 of the anode conductor 1 are provided.

陰極導体4は、略四角形の導体板の対向する2辺を反対方向に折り曲げた形状を有し、その折り曲げ片の一方には陰極電源入力端子15が一体に形成され、他方の折り曲げ片には、半導体スイッチング素子に接続される4つの陰極電源出力端子16が一体に形成されている。陰極導体4は、また、絶縁キャップ2の大径のバリア部11が挿通される絶縁シート3の丸穴13と同じ径を有する大径の丸穴17と、平滑コンデンサの陰極端子に螺着されるねじ8を挿通させるための丸穴18とが穿設されている。   The cathode conductor 4 has a shape in which two opposite sides of a substantially rectangular conductor plate are bent in opposite directions, and a cathode power input terminal 15 is integrally formed on one of the bent pieces, and the other bent piece has The four cathode power output terminals 16 connected to the semiconductor switching element are integrally formed. The cathode conductor 4 is also screwed into the large-diameter round hole 17 having the same diameter as the round hole 13 of the insulating sheet 3 through which the large-diameter barrier portion 11 of the insulating cap 2 is inserted, and the cathode terminal of the smoothing capacitor. And a round hole 18 through which the screw 8 is inserted.

導体装置は、陽極導体1、絶縁シート3および陰極導体4をこの順序で配置したラミネート構成とし、絶縁キャップ2を陽極導体1と絶縁シート3との間で、バリア部11が絶縁シート3の丸穴13および陰極導体4の丸穴17を貫通し、バリア部12が陽極導体1の丸穴9を貫通するように配置することにより、図2に示されるように構成される。ねじ8による各接続部周辺の陽極導体1および陰極導体4には、絶縁キャップ2の形状を逃げるためだけの必要最小限の丸穴9,17しか開けられていない。   The conductor device has a laminated structure in which the anode conductor 1, the insulating sheet 3, and the cathode conductor 4 are arranged in this order, the insulating cap 2 is between the anode conductor 1 and the insulating sheet 3, and the barrier portion 11 is a round of the insulating sheet 3. By arranging the hole 13 and the round hole 17 of the cathode conductor 4 so that the barrier portion 12 penetrates the round hole 9 of the anode conductor 1, it is configured as shown in FIG. 2. In the anode conductor 1 and the cathode conductor 4 around each connection portion by the screw 8, only the necessary minimum round holes 9 and 17 for escaping the shape of the insulating cap 2 are formed.

したがって、陽極導体1および陰極導体4を絶縁シート3および絶縁キャップ2を用いて、平面で重ね合わせられる面積を最大に取ることで、従来ラミネート化できなかった部分をもラミネート化することができようになり、陽極導体1および陰極導体4を流れる対向電流を近接させることで得られるインダクタンスの低減効果をさらに大きくすることができる。配線インダクタンスが低減されることにより、スイッチング時に半導体スイッチング素子に印加されるサージ電圧をさらに抑制することができる。したがって、サージ電圧が素子耐圧以下に抑えられる動作条件のもとでは、従来必要であったヒューズおよびスナバ回路を省略、もしくはスナバ回路のコンデンサの容量を大幅に低減させることが可能になるだけでなく、素子の耐電圧がシビアであったIGBTを半導体スイッチング素子として採用することが可能になる。   Therefore, by using the insulating sheet 3 and the insulating cap 2 to maximize the area where the anode conductor 1 and the cathode conductor 4 can be overlapped on a plane, it is possible to laminate portions that could not be laminated conventionally. Thus, the effect of reducing the inductance obtained by bringing the opposing currents flowing through the anode conductor 1 and the cathode conductor 4 close to each other can be further increased. By reducing the wiring inductance, the surge voltage applied to the semiconductor switching element during switching can be further suppressed. Therefore, under the operating conditions where the surge voltage is kept below the element breakdown voltage, it is possible not only to omit the fuse and snubber circuit, which have been necessary in the past, but also to greatly reduce the capacity of the snubber circuit capacitor. It is possible to employ an IGBT whose withstand voltage of the element is severe as a semiconductor switching element.

なお、上記に実施の形態では、絶縁キャップ2を1つの平滑コンデンサに対して1つ用いるように構成したが、平滑コンデンサに端子間距離が広かったり、長い沿面距離が必要でない場合には、平滑コンデンサの端子ごとに1つずつ用いるようにしてもよい。   In the above embodiment, one insulating cap 2 is used for one smoothing capacitor. However, if the smoothing capacitor has a large inter-terminal distance or does not require a long creepage distance, a smoothing capacitor is used. One may be used for each capacitor terminal.

本発明によるインバータ装置の導体装置を示す展開斜視図である。It is an expansion | deployment perspective view which shows the conductor apparatus of the inverter apparatus by this invention. 本発明によるインバータ装置の導体装置を示す完成斜視図である。It is a completion perspective view which shows the conductor apparatus of the inverter apparatus by this invention. 本発明によるインバータ装置の導体装置を構成する導体を示す平面図であって、(A)は陽極導体、(B)は陰極導体を示している。It is a top view which shows the conductor which comprises the conductor apparatus of the inverter apparatus by this invention, Comprising: (A) has shown the anode conductor, (B) has shown the cathode conductor. 従来の導体装置を示す展開斜視図である。It is an expansion | deployment perspective view which shows the conventional conductor apparatus. 従来の導体装置を示す完成斜視図である。It is a completion perspective view which shows the conventional conductor apparatus. 従来の導体装置を構成する導体を示す平面図であって、(A)は陽極導体、(B)は陰極導体を示している。It is a top view which shows the conductor which comprises the conventional conductor apparatus, Comprising: (A) has shown the anode conductor, (B) has shown the cathode conductor.

符号の説明Explanation of symbols

1 陽極導体
2 絶縁キャップ
3 絶縁シート
4 陰極導体
5 陽極電源入力端子
6 陽極電源出力端子
7 陽極端子接続部
8 ねじ
9 丸穴
10 フランジ部
11,12 バリア部
13,14 丸穴
15 陰極電源入力端子
16 陰極電源出力端子
17,18 丸穴
DESCRIPTION OF SYMBOLS 1 Anode conductor 2 Insulation cap 3 Insulation sheet 4 Cathode conductor 5 Anode power supply input terminal 6 Anode power output terminal 7 Anode terminal connection part 8 Screw 9 Round hole 10 Flange part 11,12 Barrier part 13,14 Round hole 15 Cathode power supply input terminal 16 Cathode power output terminal 17, 18 Round hole

Claims (2)

第1の電極を構成する第1の導体と第2の電極を構成する第2の導体との間に絶縁シートを挟持したラミネート構成の導体装置で平滑コンデンサと半導体スイッチング素子との間を接続するインバータ装置において、
前記第1の導体と前記第2の導体との間に配置されて前記第2の導体を前記平滑コンデンサの端子接続部の一方に接続するねじを囲うように前記第1の導体を貫通して伸びる筒状の第1のバリア部と周縁部が前記第1のバリア部の周囲から所定距離だけ隔てられた第1のフランジ部とを有する第1の絶縁キャップと、前記第1の導体と前記第2の導体との間に配置されて前記第1の導体を前記平滑コンデンサの端子接続部の他方に接続するねじを着座させるべく前記第1の導体に前記第2の導体の方向へ略板厚分の段差を設けた丸い段差部を囲うように前記第2の導体を貫通して伸びる筒状の第2のバリア部と周縁部が前記第2のバリア部の周囲から所定距離だけ隔てられた第2のフランジ部とを有する第2の絶縁キャップとを備え、
前記第1の導体は、前記第1の絶縁キャップの前記第1のバリア部を貫通配置させるだけの第1の丸穴と、前記段差部の中央に設けられた第2の丸穴とを有し、
前記第2の導体は、前記第2の絶縁キャップの前記第2のバリア部を貫通配置させるだけの第3の丸穴と、前記ねじを通す第4の丸穴とを有する、
ことを特徴とするインバータ装置。
A smoothing capacitor and a semiconductor switching element are connected by a laminated conductor device in which an insulating sheet is sandwiched between a first conductor constituting the first electrode and a second conductor constituting the second electrode. In the inverter device,
The first conductor is inserted between the first conductor and the second conductor so as to surround a screw that connects the second conductor to one of the terminal connection portions of the smoothing capacitor. A first insulating cap having an extending cylindrical first barrier portion and a first flange portion whose peripheral edge portion is separated from the periphery of the first barrier portion by a predetermined distance; the first conductor; A plate approximately in the direction of the second conductor to the first conductor to seat a screw disposed between the second conductor and connecting the first conductor to the other terminal connection of the smoothing capacitor. A cylindrical second barrier portion extending through the second conductor and a peripheral portion are separated from the periphery of the second barrier portion by a predetermined distance so as to surround a round step portion provided with a thickness step. And a second insulating cap having a second flange portion,
The first conductor has a first round hole that only allows the first barrier portion of the first insulating cap to pass through, and a second round hole provided in the center of the stepped portion. And
The second conductor has a third round hole that only allows the second barrier portion of the second insulating cap to pass therethrough, and a fourth round hole that passes the screw.
An inverter device characterized by that.
前記第1および第2の絶縁キャップは、樹脂成型により一体に形成されていることを特徴とする請求項1記載のインバータ装置。   2. The inverter device according to claim 1, wherein the first and second insulating caps are integrally formed by resin molding.
JP2003292695A 2003-08-13 2003-08-13 Inverter device Pending JP2005065414A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012152052A (en) * 2011-01-20 2012-08-09 Meidensha Corp Conductor and inverter device
WO2013140963A1 (en) 2012-03-22 2013-09-26 アイシン精機株式会社 Hollow cylindrical capacitor and inverter device
CN104170085A (en) * 2012-03-28 2014-11-26 富士电机株式会社 Semiconductor device
US9379083B2 (en) 2012-03-28 2016-06-28 Fuji Electric Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9385061B2 (en) 2012-03-28 2016-07-05 Fuji Electric Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9504154B2 (en) 2013-06-04 2016-11-22 Fuji Electric Co., Ltd. Semiconductor device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012152052A (en) * 2011-01-20 2012-08-09 Meidensha Corp Conductor and inverter device
WO2013140963A1 (en) 2012-03-22 2013-09-26 アイシン精機株式会社 Hollow cylindrical capacitor and inverter device
US9412522B2 (en) 2012-03-22 2016-08-09 Aisin Seiki Kabushiki Kaisha Hollow cylindrical capacitor and inverter device
CN104170085A (en) * 2012-03-28 2014-11-26 富士电机株式会社 Semiconductor device
EP2804212A4 (en) * 2012-03-28 2015-12-09 Fuji Electric Co Ltd Semiconductor device
US9312192B2 (en) 2012-03-28 2016-04-12 Fuji Electric Co., Ltd. Semiconductor device
US9379083B2 (en) 2012-03-28 2016-06-28 Fuji Electric Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9385061B2 (en) 2012-03-28 2016-07-05 Fuji Electric Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
CN104170085B (en) * 2012-03-28 2017-05-10 富士电机株式会社 Semiconductor device
US9504154B2 (en) 2013-06-04 2016-11-22 Fuji Electric Co., Ltd. Semiconductor device

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