JP2005038949A - Auxiliary apparatus and method of analyzing luminescence of plasma processing apparatus - Google Patents

Auxiliary apparatus and method of analyzing luminescence of plasma processing apparatus Download PDF

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Publication number
JP2005038949A
JP2005038949A JP2003198155A JP2003198155A JP2005038949A JP 2005038949 A JP2005038949 A JP 2005038949A JP 2003198155 A JP2003198155 A JP 2003198155A JP 2003198155 A JP2003198155 A JP 2003198155A JP 2005038949 A JP2005038949 A JP 2005038949A
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Prior art keywords
plasma processing
light
emission
data
processing apparatus
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JP2003198155A
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Japanese (ja)
Inventor
Shizuaki Kimura
静秋 木村
Yoshiro Suemitsu
芳郎 末光
Katsuyoshi Kudo
勝義 工藤
Masaomi Hamada
雅臣 浜田
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Hitachi Kasado Engineering Co Ltd
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Hitachi Kasado Engineering Co Ltd
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  • Spectrometry And Color Measurement (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for collecting luminescence data of multiple wavelengths by a CCD without communicating (without changing software of a high order apparatus) with the high order apparatus (a specific plasma processing apparatus etc.), performing processing for a designated signal fluctuation ratio with respect to waveform data of a specific wavelength lighted after automatic light quantity adjustment, outputting the processed wavelength data to the high order apparatus (the specific plasma processing apparatus etc.), storing the waveform data after the automatic light quantity adjustment to enable displaying and analyzing the waveform by a simulation operation, and stopping the processing of the high order apparatus (the specific plasma processing apparatus etc.) side if an abnormality occurs. <P>SOLUTION: Automatic light quantity adjustment can be performed by using a CCD for a detecting section and controlling a CCD storing time to enable recognizing start of luminescence. Luminescence data can be automatically collected and stored, waveform processing is performed, and the waveform data after waveform processing can be outputted by taking any hardware signal. If an abnormality occurs, an abnormal signal is added to a hardware interlock of luminescence start, thereby enabling stopping the processing of the high order apparatus (the specific plasma processing apparatus etc.) side. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、プラズマ等からの発光を分光解析する発光解析装置を用いたシステムで、多波長あるいは、特定波長の発光強度レベル及び信号変化率のデータ解析を利用した(例えば、特定のプラズマ処理装置他の終点検出等)制御に関する。
【0002】
【従来の技術】
単波長の発光解析装置では、採光部の感度を変えながら特定波長の信号変化率の解析を行なっていたが、感度調整を行なってもプラズマの周囲環境等により発光の強度が低下し、特定波長の信号変化率が認識しづらくなった場合、解析が不可能になりプラズマの周囲環境(例えば、特定のプラズマ処理装置のチャンバ内全掃等)を頻繁に清掃しなければならない。使用条件によっては、その頻度が高くなり、発光強度の低下に対する解析及びプラズマの周囲環境の清掃頻度を改善する事が困難である。
【0003】
【発明の解決しようとする課題】
上位装置(例えば、特定のプラズマ処理装置等)との通信を行っていない為、試料(例えば、ウェハエッチング)処理中のプラズマ発光を検出後に解析対象となる特定波長の光量自動調整及び波形データ加工処理を正常に実施できないという課題があった。
また、本装置が異常(CCDがオーバーフローまたは、CCDデータの採取時に何らかの異常)の場合、その試料(例えば、ウェハエッチング)の処理を停止させることができないという課題があった。
【0004】
本発明の目的は、発光解析装置に対して必要とする特定波長の変化を認識できる波形データとして上位装置(例えば、特定のプラズマ処理装置等)へ提供すると共に、プラズマの周囲環境の清掃頻度を減少させることである。
【0005】
【課題を解決するための手段】
上記目的を達成する為には、外部から試料(例えば、ウェハエッチング)処理開始に相当するハード信号を本発光解析補助装置へ取り入れ、異常時の信号を外部出力し、上位装置(例えば、特定のプラズマ処理装置等)の試料(例えば、ウェハエッチング)処理ハードインターロックへ取り入れる事で上位装置(例えば、特定のプラズマ処理装置等)側でソフト変更を行なわずに加工波形データの解析を行なう事が可能。
【0006】
【作用】
上記のように発光解析装置を用いたシステムにおいて特定波長の解析結果を用いた試料(例えば、ウェハエッチング)処理制御及びプラズマの周囲環境を清掃する頻度の低減を改善するのに必要な機能とされる。
【0007】
【発明の実施の形態】
図1に本発明である本発光分析補助装置の1実施例を示す。
発光源1(例えば、半導体製造装置のウエハ処理工程等のプラズマ発光)の発光は、採光部で集光レンズ2により光量を大きくし、光伝送経路である光ファイバー3を経由し、発光データが光信号として検出器4のCCD(Charge Coupled Device)5へ入射される。
CCD5内では、その光信号を波長毎に異なる角度に分光する。分光された光は、複数個(通常数百個から数千個。以下の説明では、簡単化のため2048個を仮定する。)の光の検知器を内蔵するCCD5に入力され、このCCD5中の特定位置の検知器により入射光中の特定波長成分の強さが検知される。
検出器4内では、CCD5のアナログデータをディジタルデータ6に変換して発光分析補助装置7へ送信する。発光分析補助装置7(ここでは、例としてパソコンを仮定する。)内では、このデータによりCCD5へ入射された特定波長の光量レベルの確認を行う。この結果によりCCD蓄積時間指令信号8を検出器4へ送信して光量自動調整を行なう。
発光分析補助装置7内では、発光がONした信号9を外部入力として検出器4から多波長の発光データを採取し、特定波長、多波長の発光データを保存及び特定波長の加工処理を行ない、加工後の波形データをD/A変換器10からアナログ信号11にて上位装置12(例えば、特定のプラズマ処理装置等)へ出力する。また、発光源1の発光強度レベル差が大きく、光量自動調整では対応できない場合、発光分析補助装置7から上位装置12(例えば、特定のプラズマ処理装置等)へ異常信号13を出力し、発光をOFF14させて発光分析補助装置7の異常表示灯15を点滅させる。
【008】
図2に本発明である特定波長波形データの加工方法の1実施例を示す。
採取した解析の対象となる特定波長である発光の生波形データ16は、光量調整デッドタイム17後に所定のレベル18に自動調整された波形データ19となり、その後でゲイン/オフセット20により加工処理された波形データ21として外部へ出力される。
【009】
【発明の効果】
本発明は、以上で説明したように構成されているので、以下に記載するような効果を奏する。
【0010】
本発明の特定波長の加工波形データ出力においては、対象となる上位装置(例えば、特定のプラズマ処理装置等)のソフト変更を行なわずにCCDの蓄積時間の制御により、特定波長の光量を安定させるような自動光量調整を行なった後、その特定波長の波形データの保存、加工処理、加工後のデータを上位装置(例えば、特定のプラズマ処理装置等)へ出力及びシミュレーションでの波形加工データの解析ができるという効果を奏する。
【0011】
また、プラズマ発光自体の経時変化等に影響されること無く、多波長発光データ収集及び特定波長の波形データの加工ができるという効果を奏する。
【0012】
発光データの採取のみを行なう場合、持運び移動が容易なノートタイプのパソコンを使用し、採光部の部品を取外す事により、対象となる他のプラズマ処理装置等に仮設置を行ない、簡単にデータ収集ができるという効果を奏する。
【0013】
【図面の簡単な説明】
【図1】本発明であるプラズマ処理装置の発光解析補助方法及び装置の説明図
【図2】本発明である発光解析補助装置内での特定波長波形データの加工例の説明図
【符号の説明】
1. 発光源
2. 集光レンズ
3. 光ファイバー
4. 検出器
5. CCD
6. ディジタルデータ
7. 発光分析補助装置
8. CCD蓄積時間指令信号
9. 発光がONした信号
10. D/A変換器
11. アナログ信号(加工波形データ)
12. 上位装置
13. 異常信号
14. 発光をOFF
15. 異常表示灯
16. 生波形データ
17. 光量調整デッドタイム
18. 所定のレベル
19. 自動調整された波形データ
20. ゲイン/オフセット
21. 加工処理された波形データ
[0001]
BACKGROUND OF THE INVENTION
The present invention is a system using a light emission analysis device that spectrally analyzes light emission from plasma or the like, and uses data analysis of light emission intensity levels and signal change rates of multiple wavelengths or specific wavelengths (for example, a specific plasma processing device). Other end point detection etc.) related to control.
[0002]
[Prior art]
In the single wavelength emission analyzer, the signal change rate of a specific wavelength was analyzed while changing the sensitivity of the daylighting section. However, even if the sensitivity was adjusted, the intensity of emitted light decreased due to the ambient environment of the plasma, and so on. If the signal change rate becomes difficult to recognize, the analysis becomes impossible, and the ambient environment of the plasma (for example, a full sweep in the chamber of a specific plasma processing apparatus) must be frequently cleaned. Depending on the use conditions, the frequency is high, and it is difficult to analyze the decrease in emission intensity and improve the frequency of cleaning the surrounding environment of the plasma.
[0003]
[Problem to be Solved by the Invention]
Since communication with a host device (for example, a specific plasma processing apparatus) is not performed, automatic adjustment of light amount and waveform data processing of a specific wavelength to be analyzed after detection of plasma emission during sample (for example, wafer etching) processing There was a problem that processing could not be carried out normally.
Further, when the apparatus is abnormal (CCD overflow or some abnormality when collecting CCD data), there is a problem that processing of the sample (for example, wafer etching) cannot be stopped.
[0004]
An object of the present invention is to provide waveform data capable of recognizing a change in a specific wavelength required for an emission analysis apparatus to a higher-level apparatus (for example, a specific plasma processing apparatus) and to clean the frequency of the surrounding environment of the plasma. It is to reduce.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, a hardware signal corresponding to the start of sample (for example, wafer etching) processing is taken into the emission analysis auxiliary device from the outside, an abnormal signal is output to the outside, and a host device (for example, a specific device) Processing waveform data can be analyzed without changing software on the host device (for example, a specific plasma processing device) by incorporating the sample (for example, wafer etching) processing hard interlock of the plasma processing device, etc. Possible.
[0006]
[Action]
As described above, in the system using the light emission analysis device, it is a function necessary to improve the sample (for example, wafer etching) processing control using the analysis result of the specific wavelength and the reduction of the frequency of cleaning the plasma surrounding environment. The
[0007]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows one embodiment of the present emission analysis auxiliary apparatus according to the present invention.
Light emission from the light source 1 (for example, plasma light emission in a wafer processing process of a semiconductor manufacturing apparatus) is increased by the condenser lens 2 in the daylighting unit, and the light emission data is transmitted through the optical fiber 3 as an optical transmission path. The signal is incident on a CCD (Charge Coupled Device) 5 of the detector 4 as a signal.
In the CCD 5, the optical signal is dispersed at different angles for each wavelength. The split light is input to a CCD 5 containing a plurality of light detectors (usually several hundred to several thousand. In the following description, 2048 is assumed for the sake of simplicity). The intensity of the specific wavelength component in the incident light is detected by the detector at the specific position.
In the detector 4, the analog data of the CCD 5 is converted into digital data 6 and transmitted to the emission analysis auxiliary device 7. In the emission analysis auxiliary device 7 (here, a personal computer is assumed as an example), the light level of a specific wavelength incident on the CCD 5 is confirmed based on this data. As a result, a CCD accumulation time command signal 8 is transmitted to the detector 4 to perform automatic light quantity adjustment.
In the emission analysis auxiliary device 7, the multi-wavelength emission data is collected from the detector 4 using the signal 9 that is turned on as an external input, the specific wavelength, the multi-wavelength emission data is stored, and the specific wavelength is processed. The processed waveform data is output from the D / A converter 10 to the host apparatus 12 (for example, a specific plasma processing apparatus or the like) as an analog signal 11. If the light emission intensity level difference of the light source 1 is large and cannot be handled by the automatic light amount adjustment, an abnormal signal 13 is output from the light emission analysis auxiliary device 7 to the host device 12 (for example, a specific plasma processing device) to emit light. The abnormality indicator lamp 15 of the emission analysis auxiliary device 7 is blinked by turning OFF.
[008]
FIG. 2 shows an embodiment of a specific wavelength waveform data processing method according to the present invention.
The raw light waveform data 16 that is the specific wavelength to be analyzed is the waveform data 19 that is automatically adjusted to a predetermined level 18 after the light amount adjustment dead time 17, and then processed by the gain / offset 20. The waveform data 21 is output to the outside.
[0109]
【The invention's effect】
Since the present invention is configured as described above, the following effects can be obtained.
[0010]
In the processing waveform data output of a specific wavelength of the present invention, the light amount of the specific wavelength is stabilized by controlling the CCD accumulation time without changing the software of the target host device (for example, a specific plasma processing apparatus). After performing such automatic light amount adjustment, the waveform data of the specific wavelength is stored, processed, and the processed data is output to a higher-level device (for example, a specific plasma processing device) and the waveform processing data is analyzed by simulation. There is an effect that can be.
[0011]
In addition, there is an effect that multi-wavelength emission data collection and waveform data of a specific wavelength can be processed without being affected by a change in plasma emission itself over time.
[0012]
If you only need to collect emission data, use a laptop computer that is easy to carry and remove, and remove the parts of the daylighting unit to temporarily install it on other target plasma processing equipment. There is an effect that it can be collected.
[0013]
[Brief description of the drawings]
FIG. 1 is an explanatory view of a light emission analysis assisting method and apparatus of a plasma processing apparatus according to the present invention. FIG. 2 is an explanatory view of a processing example of specific wavelength waveform data in the light emission analysis assisting apparatus according to the present invention. ]
1. 1. Light emission source 2. Condensing lens Optical fiber 4. Detector 5. CCD
6). Digital data7. Emission analysis auxiliary device 8. 8. CCD accumulation time command signal 9. Light-on signal D / A converter 11. Analog signal (processing waveform data)
12 Host device 13. Abnormal signal 14. Turn off the light
15. Abnormal indicator light 16. Raw waveform data 17. Light amount adjustment dead time 18. Predetermined level 19. Automatically adjusted waveform data20. Gain / offset 21. Processed waveform data

Claims (13)

プラズマ処理装置における、プラズマ発光の変化を捉えて処理の状態を把握する目的で設置した、採光部と、採光光量を調整する手段と、採取した発光データを解析し、処理状態に対する判定(例えば処理終点判定など)を行う判定ユニットから成る、プラズマ処理装置の発光解析装置において、多波長あるいは特定波長の採光光量を自動調整し、保存する機能と、さらにこの自動調整された特定波長発光強度レベル並びに信号変化率を予め指定された値に加工処理する機能と、この加工後のデータをデータ解析および判定ユニットに出力する機能を有する事を特徴とする、プラズマ処理装置の発光解析補助方法。In a plasma processing apparatus, a lighting unit, a means for adjusting the amount of light collected, and a sampled emission data set for the purpose of grasping the change of plasma emission and grasping the state of the process, and analyzing the collected emission data (for example, processing) In the light emission analysis device of the plasma processing apparatus, which comprises a determination unit that performs an end point determination, etc., the function of automatically adjusting and storing the amount of light collected at multiple wavelengths or specific wavelengths, and the automatically adjusted specific wavelength emission intensity level and A method for assisting in light emission analysis of a plasma processing apparatus, characterized by having a function of processing a signal change rate to a predetermined value and a function of outputting the processed data to a data analysis and determination unit. 請求項1に示す装置において、採光部にCCDを使用した事を特徴としたプラズマ処理装置の発光解析補助装置。The apparatus shown in claim 1, wherein a CCD is used for the daylighting unit. 請求項1、2に示す装置において、採光時のデータ保存に際し、多波長と特定波長の選択を可能とした事を特徴としたプラズマ処理装置の発光解析補助装置。The apparatus according to claim 1 or 2, characterized in that a multi-wavelength and a specific wavelength can be selected at the time of data storage at the time of daylighting. 請求項2、3に示す装置において、採光開始後の指定時間経過時点で、処理状態を把握する為の指定された特定波長の発光により、CCDがオーバーフローしない範囲となるように、特定波長の発光信号のCCDへの照射蓄積時間を自動調整する機能を有する事を特徴としたプラズマ処理装置の発光解析補助装置。4. An apparatus according to claim 2 or 3, wherein a specified wavelength of light is emitted so that the CCD does not overflow due to light emission of a specified wavelength for grasping a processing state when a specified time has elapsed after the start of daylighting. A light emission analysis auxiliary device for a plasma processing apparatus having a function of automatically adjusting an irradiation accumulation time of a signal to a CCD. 請求項4に示す装置において、CCDにより採光される特定波長または、多波長の光量が自動調整範囲外の場合、解析が不可である異常信号を外部へ出力及び警報表示を行う機能を有する事を特徴としたプラズマ処理装置の発光解析補助装置。5. The apparatus according to claim 4, which has a function of outputting an abnormal signal that cannot be analyzed to the outside and displaying an alarm when the specific wavelength or multi-wavelength light collected by the CCD is outside the automatic adjustment range. A light emission analysis auxiliary device for the plasma processing device. 請求項1、2、3、4、5に示す装置において、何らかの影響(例えば、プラズマ処理装置のチャンバ内の汚れ等)で採光光量が低下し、光量を自動調整するパラメータの設定値が予め設定した値を越えた場合に警告表示(例えば、プラズマ処理装置のチャンバ内の全掃要求等)を行なう機能を有する事を特徴としたプラズマ処理装置の発光解析補助装置。In the apparatus according to any one of claims 1, 2, 3, 4, and 5, the amount of collected light decreases due to some influence (for example, dirt in the chamber of the plasma processing apparatus), and a setting value of a parameter for automatically adjusting the amount of light is preset. An emission analysis auxiliary device for a plasma processing apparatus having a function of displaying a warning (for example, a request for sweeping the inside of a chamber of the plasma processing apparatus) when the measured value is exceeded. 請求項1、2、3、4、5、6に示す装置において、対象となるプラズマ発光を採光部1ヶ所から光伝送手段にて、その発光信号を1台のCCDにて採光する事により、特定の1波長あるいは、複数の異なる特定波長の波形データの加工を可能とした事を特徴としたプラズマ処理装置の発光解析補助装置。In the apparatus shown in claim 1, 2, 3, 4, 5, 6, by subjecting the target plasma emission to light transmission means from one daylighting unit, and the light emission signal by one CCD, A light emission analysis auxiliary device for a plasma processing apparatus characterized by enabling processing of waveform data of one specific wavelength or a plurality of different specific wavelengths. 請求項1、2、3、4、5、6に示す装置において、対象となるプラズマ発光を採光部1ヶ所から光伝送経路である光ファイバーを複数分岐、あるいは採光部を複数ヶ所設け各々の発光信号を複数台のCCDにて採光する事により、複数の異なる特定波長の波形データの加工を可能とした事を特徴としたプラズマ処理装置の発光解析補助装置。7. The apparatus shown in claim 1, 2, 3, 4, 5, or 6, wherein the target plasma emission is branched from one light collecting unit to a plurality of optical fibers as light transmission paths, or a plurality of light collecting units are provided to each light emission signal. A light emission analysis auxiliary device for a plasma processing apparatus characterized in that a plurality of waveform data of different specific wavelengths can be processed by collecting light with a plurality of CCDs. 請求項1、2、3に示す装置において、保存した多波長の発光データを使用し、シミュレーションにて波長選択を行ない、その時の波形データの表示及び発光強度レベル並びに信号変化率を特定された範囲内で、任意に指定する事でデータの加工を行う事が出来、結果の表示及び保存した発光データのファイル出力が可能な機能を有する事を特徴としたプラズマ処理装置の発光解析補助装置。The apparatus according to any one of claims 1, 2, and 3, wherein the stored multi-wavelength emission data is used, the wavelength is selected by simulation, and the waveform data display and emission intensity level and signal change rate at that time are specified. A plasma analysis apparatus emission analysis auxiliary device characterized in that it can perform data processing by arbitrarily specifying, and has a function of displaying a result and outputting a file of saved emission data. 請求項1、2、3、7、8、9に示す装置において、容易に持運びが可能で、特定のプラズマ処理装置等での固定設置方式ではなく、複数の装置への移動仮設置による、発光データの採取を可能とした事を特徴ととしたプラズマ処理装置の発光解析補助装置。In the apparatus shown in claims 1, 2, 3, 7, 8, and 9, it can be easily carried, not by a fixed installation method in a specific plasma processing apparatus, but by temporary installation in a plurality of apparatuses, Emission analysis assisting device for plasma processing equipment characterized by enabling emission data collection. 請求項1に示す装置において、上位装置(例えば、特定のプラズマ処理装置等)との通信(ウェハ処理情報等)を不要とした場合は、ローカル運用での追設が可能であり、また、上位装置(例えば、特定のプラズマ処理装置等)との通信(ウェハ処理情報等)を行なう事で自動運用が可能である事を特徴としたプラズマ処理装置の発光解析補助装置。In the apparatus according to claim 1, when communication (wafer processing information, etc.) with a host apparatus (for example, a specific plasma processing apparatus, etc.) is not required, additional installation in local operation is possible. An emission analysis auxiliary device for a plasma processing apparatus, characterized in that automatic operation is possible by performing communication (wafer processing information or the like) with an apparatus (for example, a specific plasma processing apparatus or the like). 請求項1、2、3、4、5、6、7、8、9、10、11に示す装置において、処理状態に対する判定(例えば処理終点判定など)機能を付加した事を特徴としたプラズマ処理装置の発光解析補助装置。12. The plasma processing according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or 11, to which a function for determining a processing state (for example, processing end point determination or the like) is added. Device emission analysis auxiliary device. 請求項1、2、3、4、12に示す装置において、採取した発光データの各波長に対して、その該当元素成分または分子成分を予め準備したデータテーブルとの照合などにより特定し、表示する機能を有する事を特徴としたプラズマ処理装置の発光解析補助装置。In the apparatus shown in Claims 1, 2, 3, 4, and 12, for each wavelength of the collected emission data, the corresponding element component or molecular component is identified and displayed by collating with a data table prepared in advance. A light emission analysis auxiliary device for a plasma processing apparatus characterized by having a function.
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JP2017092116A (en) * 2015-11-04 2017-05-25 株式会社日立ハイテクノロジーズ Plasma processing apparatus and processing state detection method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017092116A (en) * 2015-11-04 2017-05-25 株式会社日立ハイテクノロジーズ Plasma processing apparatus and processing state detection method

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