JP2005005314A - Circuit board and method for detecting abnormal condition thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board suitable to simply detect an abnormal state of caulking treatment and to provide a method for detecting the abnormal state of the circuit board. <P>SOLUTION: The circuit board 1 includes a first pad 100b for caulking, formed on one end of a first surface wiring pattern 100a formed on a front side 11 of the circuit board and having a positional relation to be superposed on a fourth pattern 200b for caulking and a rear wiring pattern 200d for conduction, formed on one end part of the first rear wiring pattern 200a formed on the rear side 12 opposed to the first pad 100b. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit board capable of conducting a wiring pattern on one surface of a substrate and a wiring pattern on the other surface by a caulking process, and in particular, easily misaligns due to an abnormal state of the caulking process. The present invention relates to a circuit board suitable for detection.
[0002]
[Prior art]
Conventionally, non-contact type IC tags such as RFID (Radio Frequency IDentification) have a loop antenna formed on a substrate with a conductor, an IC chip is mounted on the substrate, and the loop antenna and both antenna connection portions of the IC chip are connected. It is widely known. Here, the wiring pattern of the board makes the board area effective by making the wiring patterns formed on one side and the other side of the board respectively conductive by through holes or caulking treatment according to the type of board. The pattern used is routed and the number of loops of the loop antenna is increased.
[0003]
In addition, the conventional non-contact type IC tag has (1) pattern mask, etching, (2) caulking process (bridge structure straddling the inner and outer patterns), (3) circuit component mounting, (4) card formation, removal, It is manufactured in the flow of. However, since a plurality of substrates are taken in one sheet of substrate material, the entire sheet is discarded when a certain number of defects occur. This is in order to improve the yield by omitting the trouble of setting the processing table and the trouble of not processing only defective portions.
[0004]
In addition, lots of sheets are managed in lots, and each predetermined number of sheets (100 sheets, one roll, etc.) is inspected for the first and last time of processing, or a predetermined number of sheets are taken out, DC resistance at a predetermined location or resonance frequency measurement of a coil antenna, etc. The pass / fail is judged.
Conventionally, the resonance frequency is measured by bringing a probe into contact with a terminal of a predetermined loop antenna for each circuit board.
[0005]
[Patent Document 1]
JP-A-9-198481 [Patent Document 2]
Japanese Patent Laid-Open No. 11-328343 [Patent Document 3]
Japanese Patent Laid-Open No. 2000-57289 [0006]
[Problems to be solved by the invention]
However, in the above-described conventional method for detecting the abnormal state of the caulking process, the presence or absence of abnormality can be detected for each individual tag, but the inspection is very laborious. Further, in the detection method using the probe, it is not known whether a defect has occurred due to the displacement of the front / back conduction due to caulking or the like, or a defect during previous pattern formation.
[0007]
Therefore, the present invention has been made paying attention to such an unsolved problem of the conventional technology, and is suitable for easily detecting an abnormal state of the caulking process and an abnormality of the circuit board. The object is to provide a state detection method and increase the inspection accuracy in the caulking process.
[0008]
[Means for Solving the Problems]
[Invention 1]
In order to achieve the above object, the circuit board according to the first aspect of the present invention includes a first wiring pattern formed on one surface of the substrate and a second wiring pattern formed on the other surface of the substrate by a conductor. A circuit board that can be made conductive by caulking,
A first pad portion for the caulking process of the first wiring pattern and a second pad portion for the caulking process of the second wiring pattern are provided facing each other across the substrate;
Further, a part of the first pad portion is provided so as to overlap with a third wiring pattern that is on the same plane as the second pad portion and in the vicinity of the second pad portion,
A predetermined output characteristic of the circuit board when the first wiring pattern and the second wiring pattern are brought into conduction by the caulking process, and the first wiring pattern and the third wiring pattern by the caulking process. The first wiring pattern and the third wiring pattern are provided so that the predetermined output characteristics of the circuit board when conducting are different from each other.
[0009]
With such a configuration, a part of the first pad portion is overlapped with the third wiring pattern on the same plane as the second pad portion and in the vicinity of the second pad portion. Since the first wiring pattern is provided, the first wiring pattern and the third wiring pattern are easily conducted when the caulking position is shifted in the caulking process for the first pad portion. Further, the first wiring pattern and the third wiring pattern are made conductive so that the predetermined output characteristic of the circuit board is different from the predetermined output characteristic when the first wiring pattern and the second wiring pattern are made conductive. Therefore, it is possible to easily detect the occurrence of abnormality due to the caulking process at the manufacturing stage.
[0010]
Here, the caulking process generally means that the joint is firmly fixed by hitting or tightening a nail or a metal fitting fitted in the joint with a tool without using an adhesive or the like. Here, a caulking pin is pressed against the pad portion on one surface of the substrate to remove the pad portion, and the pattern on one surface of the substrate is electrically connected to the pattern on the other surface.
In addition, the caulking process includes, for example, a method of conducting conduction between the front and back patterns by applying pressure after heating with a laser.
[0011]
In addition, there is a predetermined output characteristic, which is a change in the output signal waveform, resonance frequency, etc. of the circuit board when the first wiring pattern and the third wiring pattern are conducted by caulking. is there.
[Invention 2]
Furthermore, the circuit board of the invention 2 is the circuit board of the invention 1,
When there are a plurality of locations to be conducted by the caulking process, only the specific one of the first pad portions respectively corresponding to the plurality of locations faces the specific first pad portion. It is characterized in that it is provided so as to overlap the third wiring pattern that is on the same plane as the pad portion and in the vicinity of the second pad portion.
[0012]
With such a configuration, when a displacement of the caulking position occurs, only a specific one of the plurality of first pad portions for caulking processing is electrically connected to the third wiring pattern. The effect that it can be clarified is obtained.
[Invention 3]
Furthermore, the circuit board of the invention 3 is the circuit board of the invention 2,
The distance between the second pad portion facing the specific first pad portion and the third wiring pattern in the vicinity thereof,
It is characterized in that the distance is shorter than the distance between the second pad portion facing the first pad portion other than the specific first pad portion and the third wiring pattern in the vicinity thereof.
[0013]
With such a configuration, the distance between the second pad portion facing the specific first pad portion and the third wiring pattern in the vicinity thereof is the first other than the specific first pad portion. When the caulking position is shifted to some extent, for example, a specific first pad The caulking pin for caulking processing corresponding to the first pad portion other than the portion is shifted toward the third wiring pattern in the vicinity thereof and the specific first pad portion and the third pad portion are opened before the pattern is opened. As a result, it is possible to detect an abnormality in the caulking process before the caulking position shift width becomes large.
[Invention 4]
Furthermore, the circuit board of the invention 4 is the circuit board of any one of the inventions 1 to 3,
A resonance circuit is formed using the first to third wiring patterns.
[0014]
In such a configuration, since the resonance circuit is formed using the first to third wiring patterns, the resonance frequency of the resonance circuit is measured as the predetermined output, and the caulking process is abnormal due to the resonance frequency. Can be detected. Therefore, it is possible to detect the caulking process abnormality before mounting the main components such as an IC.
[Invention 5]
Furthermore, in the circuit board abnormal state detection method of the invention 5, the resonance frequency of the resonance circuit when the caulking process of the circuit board of the invention 4 is abnormal is measured in advance, and the first resonance frequency for comparison is determined. Aside,
Irradiating electromagnetic waves to the plurality of circuit boards,
Measuring a second resonance frequency which is a resonance frequency of a resonance circuit of the plurality of circuit boards with respect to the electromagnetic wave;
Comparing the first resonance frequency and the second resonance frequency;
Based on the comparison result, it is detected whether there is a caulking process abnormality among the plurality of circuit boards.
[0015]
That is, with the circuit board of the invention 4, by measuring the resonance frequency at the time of abnormality in advance, before mounting main components such as an IC, for example, the substrate material on which a plurality of circuit boards are formed By irradiating the electromagnetic wave to each sheet or the like, the abnormality due to the caulking process can be detected by comparing the resonance frequency of the circuit board against the electromagnetic wave and the resonance frequency at the time of abnormality. There is an effect that it is possible to detect whether or not there is a circuit board having an abnormality due to the caulking process.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIGS. 1 to 7 are diagrams showing an embodiment in which the circuit board according to the present invention is applied to a circuit board of a non-contact type IC tag.
First, the configuration of a circuit board according to the present invention will be described with reference to FIGS. 1 is a plan view showing the configuration of the front side of the circuit board according to the present invention, and FIG. 2 is a perspective plan view of the configuration of the back side of the circuit board according to the present invention as seen from the front side. FIG. 4 is a perspective plan view showing a positional relationship between a wiring pattern formed on the front surface side and a wiring pattern formed on the back surface side of the circuit board according to the present invention, and FIG. FIG. 5 is a cross-sectional view taken along the line AA ′ in FIG. 4.
[0017]
As shown in FIG. 1, the configuration of the front surface side 11 of the substrate 10 of the circuit board 1 is formed at a first surface wiring pattern 100a that forms a loop antenna and at one end of the first surface wiring pattern 100a. A first pad portion 100b for caulking, an IC mounting pad portion 100c formed at the other end of the first surface wiring pattern 100a, and a second surface wiring pattern forming a loop antenna 101a, a second pad portion 101b for caulking formed at both ends of the second surface wiring pattern 101a, a third surface wiring pattern 102a forming a loop antenna, and the third surface wiring pattern A third pad portion 102b for caulking formed at one end of 102a and an IC mounting formed at the other end of the third surface wiring pattern 102a A pad portion 102c, and a.
[0018]
Further, as shown in FIG. 2, the configuration of the back surface side 12 of the substrate 10 of the circuit board 1 includes a first back surface wiring pattern 200a forming a loop antenna and one end portion of the first back surface wiring pattern 200a. When the caulking position is shifted from the fourth pad portion 200b for caulking formed on the fifth pad portion 200c for caulking formed on the other end of the first back surface wiring pattern 200a Conductive backside wiring pattern 200d that is part of first backside wiring pattern 200a that conducts with first pad portion 100b, second backside wiring pattern 201a that forms a loop antenna, and the second backside wiring pattern And a sixth pad portion 201b for caulking formed at both ends of 201a. The distance 13 between the fourth pad portion 200b and the conductive backside wiring pattern 200d is based on the distance 14 between the fifth and sixth pad portions 200c and 201b and the second backside wiring pattern 201a in the vicinity thereof. Is also shorter.
[0019]
Further, the positional relationship between the wiring pattern formed on the front surface side 11 and the wiring pattern formed on the back surface side 12 is the first pad portion 100b formed on the front surface side 11 as shown in FIGS. However, there is a positional relationship in which the fourth pad portion 200b formed on the back surface 12 facing this and the back wiring pattern 200d for conduction overlap.
[0020]
That is, as shown in FIG. 5, the first pad portion 100b is formed so as to partially overlap the conductive backside wiring pattern 200d. Further, the first to third front surface wiring patterns 100a to 102a and the first back surface wiring pattern 200a and the second back surface wiring pattern 201a are formed so as not to overlap each other as much as possible when viewed from the front surface side 11. Has been.
[0021]
Further, an example of conducting the wiring patterns on the front and back surfaces by caulking processing will be described with reference to FIGS. FIG. 6 is a diagram illustrating an example of a normal caulking process, and FIG. 7 is a diagram illustrating an example when the caulking position is shifted in the caulking process.
As shown in FIG. 6A, first, the caulking process is performed by plural caulking jigs provided in the caulking jig in accordance with the positions of the caulking process pad parts (four pad parts in the present embodiment). The pin 60 is positioned in advance. A plurality of crimping processes are performed at a time by simultaneously pressing the plurality of crimping pins 60 that have been positioned against a plurality of pad portions of the circuit board 1.
[0022]
Here, as shown in FIG. 6B, the caulking pin 60 has a pointed tip, and its diameter is longer than the distance 14 described above. Therefore, the caulking pin 60 does not fit in the position between the fourth pad portion 200b and the conductive backside wiring pattern 200d, and the first pad portion, the fourth pad portion 200b, or the conductive backside surface is always provided. The wiring pattern 200d is caulked.
[0023]
Then, a portion of the pad portion is removed by pressing the end portion of the caulking pin 60 against the caulking processing pad portion. As a result of this extraction, a part of the pad portion on the front surface side 11 of the circuit board 1 reaches the corresponding pad portion on the rear surface side 12 to establish conduction.
Alternatively, there is a method in which the conductors of the pad portions on the front and back surfaces are melted by performing a heat treatment with a laser or the like, and conduction is performed by pressing and bonding the portions.
[0024]
Furthermore, as shown in FIG. 7A, the position of the caulking pin 60 is shifted by continuing the caulking process, or the positioning of the caulking pin 60 is failed. The case will be described. Thus, when the caulking position is shifted and the end of the first pad portion 100b is caulked, the caulking pin 60 is moved toward the end of the first pad portion 100b as shown in FIG. 7B. The conductive back wiring pattern 200d on the opposite side of this portion is removed. For the other caulking portions (the second pad portion 101b and the fifth pad portion 200c and the third pad portion 102b and the sixth pad portion 201b), the caulking pin 60 is caulked as shown in FIG. Although the position is shifted, the ends of the pad portions are caulked. Here, when the caulking pin 60 caulks outside the pad portions and the pad portions facing each other are not connected to each other and this portion is opened, the resonance circuit itself is not formed.
[0025]
Therefore, in the example shown in FIG. 7A, the first front surface wiring pattern 100a and the first back surface wiring pattern 200a, the second and third front surface wiring patterns 101a and 102a, and the second back surface wiring pattern 201a. And are respectively conducted to form a loop antenna.
In general, the caulking jig for performing the caulking process shifts the position of the caulking pin 60 or the position of the sheet when used for a long time. The direction in which the caulking pin 60 is displaced can be understood to some extent by the fixing structure of the caulking jig being used. Therefore, when designing the circuit board 1, the circuit design is performed such that the conductive backside wiring pattern 200 d is positioned in the direction in which the caulking pin 60 is displaced.
[0026]
As described above, in the caulking process, when the caulking position is shifted, only the first front surface wiring pattern 100a and the first back surface wiring pattern 200a can be made conductive. Therefore, the length of the loop antenna is shorter than that when the caulking process is normally performed, and the resonance frequency of the resonance circuit constituted by the loop antenna is also different from the normal time.
[0027]
Furthermore, as described above, the resonance frequency of the circuit board 1 in a state where only the first front surface wiring pattern 100a and the first back surface wiring pattern 200a are conductive is measured in advance, and at the time of manufacturing the circuit board 1, etc. Irradiate an electromagnetic wave to a sheet of substrate material on which a plurality of circuit boards 1 are formed, measure the resonance frequency of the resonance circuit of the circuit board 1 generated by the electromagnetic waves, and compare with the resonance frequency at the time of abnormality. Thus, it is possible to perform a check for detecting the presence of the circuit board 1 in which the caulking process has failed. That is, by performing the above comparison process, when the resonance frequency that is the same as the resonance frequency at the time of abnormality is measured, it is determined that the circuit board 1 that has measured the resonance frequency has an abnormality due to the failure of the caulking process. Can do. Accordingly, it is possible to easily detect whether or not there is an abnormal state due to failure of the caulking process in the plurality of circuit boards 1.
[0028]
In the said embodiment, the 1st-3rd surface wiring patterns 100a-102a respond | correspond to the 1st wiring pattern of the invention 1 and the invention 4, and the 1st-3rd pad parts 100b-102b are the invention 1. The fourth pad portion 200b, the fifth pad portion 200c, and the sixth pad portion 201b correspond to the second pad portion of the first to third aspects of the invention. The pad portion 100b corresponds to the specific first pad portion of the inventions 2 and 3, and the conductive backside wiring pattern 200d corresponds to the third wiring pattern of the inventions 1 to 4.
[0029]
In the above embodiment, the circuit board 1 is applied to the circuit board of the non-contact type IC tag. However, the present invention is not limited to this and may be applied to other things.
In addition, the wiring pattern and the pad portion are configured so that the resonance frequency of the resonance circuit formed by the circuit board 1 is changed when the caulking process is failed. The circuit may be configured so that the output characteristics of the circuit change.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration of a surface side of a circuit board according to the present invention.
FIG. 2 is a perspective plan view of the configuration of the back side of the circuit board according to the present invention as seen from the front side.
FIG. 3 is a perspective plan view showing a positional relationship between a wiring pattern formed on the front surface side and a wiring pattern formed on the back surface side of the circuit board according to the present invention.
FIG. 4 is an enlarged perspective view of a portion of the circuit board 1 that performs a caulking process.
5 is a cross-sectional view taken along line AA ′ in FIG.
FIG. 6 is a diagram illustrating an example of a normal caulking process.
FIG. 7 is a diagram illustrating an example when the caulking position is shifted in the caulking process.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Circuit board, 10 ... Board | substrate, 11 ... Front side, 12 ... Back side, 100a ... 1st surface wiring pattern, 101a ... 2nd surface wiring pattern, 102a ... 1st surface wiring pattern, 100b ... 1st 101b ... second pad portion, 102b ... third pad portion, 100c, 102c ... pad portion for mounting IC, 200a ... first backside wiring pattern, 201a ... second backside wiring pattern, 200b ... 4th pad part, 200c ... 5th pad part, 200d ... Back wiring pattern for conduction, 201b ... 6th pad part

Claims (5)

A circuit board capable of conducting a first wiring pattern formed on one surface of the substrate by a conductor and a second wiring pattern formed on the other surface of the substrate by caulking;
A first pad portion for the caulking process of the first wiring pattern and a second pad portion for the caulking process of the second wiring pattern are provided facing each other across the substrate;
Further, a part of the first pad portion is provided so as to overlap with a third wiring pattern that is on the same plane as the second pad portion and in the vicinity of the second pad portion,
A predetermined output characteristic of the circuit board when the first wiring pattern and the second wiring pattern are brought into conduction by the caulking process, and the first wiring pattern and the third wiring pattern by the caulking process. A circuit board, wherein the first wiring pattern and the third wiring pattern are provided so that the predetermined output characteristics of the circuit board when conducting are different from each other. In claim 1,
When there are a plurality of locations to be conducted by the caulking process, only the specific one of the first pad portions respectively corresponding to the plurality of locations faces the specific first pad portion. A circuit board which is provided so as to overlap with the third wiring pattern which is on the same plane as the pad portion and which is in the vicinity of the second pad portion. In claim 2,
The distance between the second pad portion facing the specific first pad portion and the third wiring pattern in the vicinity thereof,
A circuit characterized in that it is shorter than the distance between the second pad portion facing the first pad portion other than the specific first pad portion and the third wiring pattern in the vicinity thereof. substrate. In any of claims 1 to 3,
A circuit board, wherein a resonance circuit is formed using the first to third wiring patterns. The resonance frequency of the resonance circuit at the time of abnormality in the caulking process of the circuit board according to claim 4 is measured in advance to determine a first resonance frequency for comparison,
Irradiating electromagnetic waves to the plurality of circuit boards,
Measuring a second resonance frequency which is a resonance frequency of a resonance circuit of the plurality of circuit boards with respect to the electromagnetic wave;
Comparing the first resonance frequency and the second resonance frequency;
An abnormal state detection method for a circuit board, comprising: detecting whether there is an abnormality in the caulking process among the plurality of circuit boards based on the comparison result.

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