JP2005005300A - Inspection stage and inspection method for vacuum probe apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection stage for a probe apparatus which can inspect electrical characteristics of an element to be inspected under vacuum environment suitable for an inspection. <P>SOLUTION: The inspection stage for the probe apparatus 100 inspects the element to be inspected formed on a wafer-like substrate W in vacuum state. This inspection stage includes an atmospheric stage 10 disposed under an air atmosphere, a first supporting mechanism 14 disposed on the atmospheric stage and constituted to support the wafer-like substrate W, a first moving mechanism 13 constituted to move the first supporting mechanism in X, Y and Z directions, an imaging mechanism 15 for alignment provided at the arm, a vacuum chamber 21 (the vacuum chamber has a vacuum exhausting mechanism 21a, an opening, and an opening and closing mechanism 22b for opening and closing the opening), and a probe mechanism disposed in the vacuum chamber. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention generally relates to a probe apparatus for inspecting an object to be inspected in a vacuum. In particular, the present invention relates to a probe apparatus that inspects the electrical characteristics of an integrated circuit, a micromachine, or a liquid crystal display device formed on a wafer-like substrate such as a silicon wafer in a vacuum.
[0002]
[Prior art]
As a micromachine, for example, there is a micro electromechanical system (MEMS) to which micromachine technology having a size of several millimeters or less and further a submillimeter or less is applied. Micromachines are made into various wafers by microfabrication (microfabrication technology) that performs three-dimensional microfabrication such as etching technology and bonding technology for digging deep grooves as well as photofabrication technology used in the manufacture of semiconductor integrated circuits. Can be made on a substrate.
[0003]
Micromachines can be made on the surface of a semiconductor wafer-like substrate. The micromachine has a very fine mechanism, and the movement of the element is affected by the flow of air and heat conduction to the atmosphere. Such inspection of the electrical characteristics of the micromachine is required to be performed in a vacuum environment.
[0004]
Patent Document 1 discloses a prober that performs electrical property evaluation of a flat panel or the like in a vacuum. This prober is characterized by a structure in which air and vacuum are separated by a substrate (probing card) to which probe pins are fixed.
[0005]
The purpose of this prober is to create a high vacuum environment for highly reliable evaluation, and it is possible to keep the inside of the chamber at a high vacuum while minimizing the gas emitted from the chamber. However, it is not necessary to create a high vacuum environment using such a structure if the characterization is not a special assessment that is affected by the emitted gas.
[0006]
Patent Document 2 discloses a vacuum contactor. This vacuum contactor has a structure in which contact pressure is applied by inserting an O-ring between a wafer-like substrate and a contactor to create a sealed space and evacuating it. The contact pressure can be changed by changing the vacuum force. The purpose of the degree of vacuum of the sealed space is to vary the contact pressure, and the degree of vacuum as an inspection environment is not considered.
[0007]
Patent Document 3 discloses a probe device 100x for inspecting an object to be inspected in a vacuum environment as shown in FIG. The sealed chamber of the probe device is formed by a cylindrical body 10x provided at the lower part of the head plate 12x and an upper surface of the main chuck 6x that is lifted in the Z direction by a moving mechanism. In the sealed chamber, a probing card 14x facing the main chuck and having a plurality of probes is arranged. The sealed chamber is evacuated, and the electrical characteristics of the test object are inspected in a state in which the probes of the probing card are in contact with the electrodes of the test object placed on the main chuck.
[0008]
This probe apparatus does not need to evacuate the entire probe chamber, and since the volume of the sealed space is small, a desired degree of vacuum can be reached in a short time. However, since the main chuck cannot move in the XY directions in a vacuum state, it is necessary to repeatedly create a vacuum state and an atmospheric state each time each inspection object is inspected. Therefore, there is a problem that the throughput is slow.
[0009]
Patent Document 4 discloses a low-temperature test apparatus that is performed in a vacuum environment. This low temperature test apparatus evacuates the entire probe. The XYZθ axis of the main chuck moving mechanism needs to correspond to a vacuum and requires a high-capacity vacuum pump. Therefore, the probe device is very expensive.
[0010]
[Patent Document 1] Japanese Patent Laid-Open No. 11-337572
[0011]
[Patent Document 2] JP-A-10-256323
[0012]
[Patent Document 3] Japanese Patent Application No. 2002-28991
[0013]
[Patent Document 4] Japanese Patent Laid-Open No. 2001-284417
[0014]
[Problems to be solved by the invention]
The present invention improves the inspection stage used in the conventional probe apparatus, solves at least one of the problems of the above-described conventional techniques, and inspects the object Wo in a vacuum environment suitable for inspection. It is an object to provide an inspection stage for a probe apparatus that can inspect the electrical characteristics of the probe device.
[0015]
Other objects and advantages of the present invention are set forth in the following specification, a portion of which is obvious from the description, or may be obtained by practice of the invention.
[0016]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided an inspection stage for inspecting an object to be inspected formed on a wafer-like substrate in a vacuum state, comprising:
An air stage (the air stage is disposed in an air atmosphere), a first support mechanism disposed on the air stage and configured to support a wafer-like substrate (the first support mechanism is an arm) A first moving mechanism configured to move the first support mechanism in the X, Y, and Z directions; and a vacuum stage. (The vacuum stage is disposed in a vacuum atmosphere), a probe mechanism disposed in the vacuum stage portion.
[0017]
The inspection stage preferably includes at least one of the following a) to j). Further, the inspection stage preferably includes a combination of two or more of the following a) to j).
[0018]
a) An alignment photographing mechanism provided on the arm portion of the first support mechanism.
[0019]
b) A vacuum chamber in which the inspection stage is disposed (the vacuum chamber includes an evacuation mechanism, an opening, an opening / closing mechanism for opening / closing the opening, and the first support mechanism is a The substrate is moved between the inside and outside of the vacuum chamber through the opening).
[0020]
c) The alignment photographing mechanism includes at least one of the first camera disposed on the upper surface of the arm and the second camera disposed on the lower surface of the arm.
[0021]
d) The support comprises a vacuum pad.
[0022]
e) The probe mechanism comprises:
A chuck top mechanism configured to place a wafer-like substrate W, a second moving mechanism configured to move the chuck top mechanism in the X, Y, and θ directions, and disposed in an upper portion of the vacuum chamber And a third moving mechanism for moving the probing card in the Z direction.
[0023]
f) At least one of the second moving mechanism and the third moving mechanism includes the following driving mechanism.
One shaft disposed through the vacuum chamber, bellows disposed on the outer periphery of the shaft portion located outside the vacuum chamber, a moving mechanism for moving the shaft in the axial direction, and chucking the end of the X-axis An attachment mechanism for attaching to the top mechanism (the attachment mechanism attaches the tip of each axis to the chuck top mechanism so that the chuck top mechanism is slidable in a direction perpendicular to each axis and in the horizontal direction).
[0024]
g) The probe mechanism further comprises:
A chuck top mechanism configured to place a wafer-like substrate W, and a fixing mechanism for the wafer-like substrate W provided in the chuck top mechanism (the fixing mechanism is a pressing member (the pressing member is a wafer-like member). When the wafer-shaped substrate W is fixed by pressing the substrate W on the chuck top, a first lifting mechanism configured to lift and lower the pressing tool is provided.
[0025]
h) A plurality of support bodies configured to raise and lower the wafer-like substrate W on the chuck top mechanism, and a second lifting mechanism configured to raise and lower the plurality of support bodies.
[0026]
i) The atmospheric stage of the inspection stage includes a fixed target for checking at least one of an optical axis position and a focal position of an imaging mechanism for alignment.
[0027]
j) The object to be inspected is one of a micromachine and an integrated circuit formed on a wafer-like substrate.
[0028]
According to a second aspect of the present invention, there is provided an inspection method for inspecting the electrical characteristics of an object to be inspected formed on a wafer-like substrate, comprising the following (s1) to (s13) under vacuum. (The inspection method is carried out on an inspection stage having an atmospheric stage in an atmospheric environment and a vacuum stage in a vacuum environment)
(S1) to obtain data relating to the optical axis position and the focal position of the alignment imaging mechanism disposed on the atmospheric stage in the atmospheric environment;
(S2) Take out the wafer-like substrate from the wafer cassette of the loader unit, and pass the wafer-like substrate to the first support mechanism arranged on the atmospheric stage.
(S3) The first support mechanism moves the tip of the arm onto a vacuum stage in the vacuum chamber, and the wafer-like substrate supported by the tip is placed on the vacuum stage. Place and fix on top,
(S4) Above the object to be inspected and the chuck top by using the photographing data by at least one camera provided at the tip of the first support mechanism and the data on the optical axis position and the focal position of the photographing mechanism. Align with the probing card placed in the
(S5) The first support mechanism is withdrawn from the vacuum chamber, the gate valve is closed, and the vacuum chamber has a predetermined degree of vacuum.
(S6) The probing card is lowered, and the plurality of probes are brought into contact with each electrode of the device under test in an overdrive state.
(S7) Inspecting the electrical characteristics of the object to be inspected,
(S8) Raise the probing card and move the wafer-like substrate to the next object to be inspected.
(S9) By repeating the above (S6) to (S8), the inspection of the electrical characteristics of the predetermined object to be inspected is terminated.
(S10) Making the wafer-like substrate movable from the chuck top.
(S11) The inside of the vacuum chamber is set to atmospheric pressure.
(S12) The support portion provided at the tip of the first support mechanism receives the inspected wafer-like substrate from the chuck top, carries it out of the vacuum stage, and returns it to the wafer cassette of the loader portion.
(S13) The above (S2) to (S12) are repeated a predetermined number of times.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
The accompanying drawings are incorporated in and constitute a part of the specification and illustrate a preferred embodiment of the present invention. The drawings contribute to the description of the invention by the general description given above and the detailed description of the preferred embodiment described below.
[0030]
In the present invention, various electronic circuit components such as a micromachine, an integrated circuit, or a liquid crystal display panel formed on a wafer-like substrate such as a silicon wafer can be tested. However, for the sake of convenience in describing the present invention more specifically, a probe apparatus and a probe method for inspecting the electrical characteristics of an integrated circuit formed on a silicon wafer-like substrate will be described below as the object to be inspected Wo.
[0031]
Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 10. FIG. 1 is a top view of a main body of a probe apparatus 100 according to an embodiment of the present invention. FIG. 2 is a front view of the same. As shown in FIGS. 1 and 2, an inspection stage 40 having an atmospheric stage 10 and a vacuum stage 20 can be disposed on the top plate 29 a of the prober chamber 29. The inspection stage 40 having the atmospheric stage 10 and the vacuum stage 20 can also be disposed in the prober chamber. The vacuum stage 20 is disposed in a vacuum chamber 21 having an opening 22a.
[0032]
The probe apparatus 100 according to the present embodiment includes an inspection stage 40 on the top plate 29a of the prober chamber 29 (FIG. 2). The inspection stage 40 includes an atmospheric stage 10 and a vacuum stage 20.
[0033]
1 and 3, the loader unit 1 includes a wafer cassette 3 in which a plurality of wafer-like substrates W are accommodated. For example, the tweezers-like transport mechanism 2 takes out the wafer-like substrates W one by one from the wafer cassette 3 and delivers them to the atmospheric stage 10 (described later). The wafer-like substrate W taken out from the cassette 3 of the loader unit 1 by the transport mechanism 2 is received by the support unit 14 c of the first support mechanism 14 disposed on the atmospheric stage 10. In this operation, as shown in FIG. 3, the wafer-like substrate W can be directly transferred from the transport mechanism 2 to the support portion 14c. However, as shown in FIGS. 4A and 4B, the wafer-like substrate W can be transferred from the transport mechanism 2 to the support portion 14c via the transfer table 2b.
[0034]
The first support mechanism 14 can have an arm portion 14a. The arm part 14a can be fixed to a lifting shaft 13d disposed on the X table. The elevating shaft 13d is raised and lowered in the guide cylinder 13e by the elevating mechanism 13i. The arm part 14a has a support part 14C at its tip part 14b. The support portion 14C receives the wafer-like substrate W transferred by the transfer mechanism 2 and supports the wafer-like substrate W. As the first support mechanism 14, any support mechanism that can receive and support the wafer-like substrate W can be adopted.
[0035]
As shown in FIG. 3, the first support mechanism 14 can be moved in the X, Y, and Z directions by the first moving mechanism 13. The first moving mechanism 13 includes an elevating mechanism 13f including an elevating shaft 13d, a guide cylinder 13e, and an elevating mechanism 13i in order to move the first support mechanism 14 in the Z direction. The elevating mechanism 13f can further include a rotating mechanism for rotating the elevating shaft 13d.
[0036]
Furthermore, the first moving mechanism 13 includes an X-direction moving mechanism 13g and a Y-direction moving mechanism 13h for moving the first support mechanism 14 in the X and Y directions. The X-direction moving mechanism 13g can include an X table 13a, a pair of guide rails 13b, and a motor 13c. The X table can be moved in the X direction on the guide rail 13b by the driving force of the motor 13c.
[0037]
The Y-direction moving mechanism 13h can include a Y table 16a, a pair of guide rails 16b, and a motor 16c. The Y table 16a can move in the Y direction by the driving force of the motor 16C.
[0038]
The first support mechanism 14 is placed on the X table 13a, and the X table 13a is placed on the Y table 16a. The first support mechanism 14 can move the first support mechanism in the X, Y, and Z directions by the elevating mechanism 13f, the first X direction moving mechanism 13g, and the first Y direction moving mechanism 13h.
[0039]
The first moving mechanism 13 is not limited to the mechanism shown in FIG. In short, any mechanism that can move the first support mechanism 14 in the X, Y, and Z directions can be employed as the first movement mechanism. For example, instead of the first X-direction moving mechanism 13g and the first Y-direction moving mechanism 13h, the first support mechanism 14 is moved in the X and Y directions on one table based on the principle of a linear motor. A mechanism that can also be adopted
As shown in FIGS. 1, 2, and 5, a vacuum chamber 21 is disposed in the prober chamber 29 adjacent to the atmospheric stage 10. The vacuum chamber 21 can include an opening 22 a, an opening / closing mechanism (hereinafter referred to as “gate valve”) 22 b for opening and closing the opening 22 a, and the vacuum stage 20.
[0040]
In FIG. 5, a vacuum stage 20, a chuck top mechanism (hereinafter referred to as “chuck top”) 24 and a probing card 28 on the vacuum stage 20 can be disposed in the vacuum chamber 21. The first support mechanism 14 disposed on the atmospheric stage 10 moves the wafer-like substrate W supported by the support portion 14c onto the chuck top 24 through the opening 22a.
[0041]
6 and 7 show an example of the second moving mechanism 23 configured to move the chuck top 24 in the X, Y, and θ directions.
[0042]
The second moving mechanism 23 moves the X table 25a supporting the chuck top 24, the X table moving mechanism 25 for moving the X table 25a, the Y table 27a supporting the X table 25a, and the Y table. The Y table moving mechanism 27 and the θ-axis driving mechanism 26 for rotating the chuck top can be provided.
[0043]
The X table moving mechanism 25 moves the X table 25a by moving the X axis rod 25b disposed through the vacuum chamber 21. The tip of the X-axis rod 25a is attached to the X table 25a via an attachment mechanism 25i. The X table moving mechanism 25 can also be disposed in the vacuum chamber 21. In this case, the rotary shaft 25f, the motor 25g, and the guide 25h need to be vacuum-compatible components.
[0044]
The attachment mechanism 25i can attach the tip end of the X-axis rod to the chuck top 24 so that the chuck top 24 can slide at right angles to the X-axis rod and in the horizontal direction. The attachment mechanism 25i can employ a slide structure.
[0045]
An example of a mechanism for moving the X-axis rod 25b in the vertical direction on the paper will be described. The other end of the X-axis rod can be fixed to the moving body 25e. A bellows 25d is preferably disposed on the outer periphery of the X-axis rod 25b outside the vacuum chamber 21. The bellows 25d can be arranged to block between the vacuum chamber 21 and the atmosphere.
[0046]
The moving body 25e has a female screw, and the rotating shaft 25f has a male screw. The rotating shaft 25f is attached to the moving body 25e in a state where these two screws are fitted. As the rotary shaft 25f is rotated by the motor 25g, the moving body 25e moves along the guide 25h.
[0047]
By the movement of the moving body 25e, the X-axis rod whose other end is fixed to the moving body 25e is also guided by the guide roll 25c and moved in the vertical direction on the paper surface. By the movement of the X-axis rod 25b, the X table 25a attached to the tip of the X-axis rod 25b via the attachment mechanism 25i moves on the pair of guide rails 13b and 13b in the arrow X direction.
[0048]
The mechanism for moving the X-axis rod 25b in the vertical direction of the drawing, which can be adopted by the present invention, is not limited to the above example. For example, a mechanism for directly moving the X-axis rod 25b with a linear motor can be employed.
[0049]
The pair of guide rails 13b and 13b are fixed on the Y table 27a. The Y table 27 a can be moved in the arrow Y direction by a Y table moving mechanism 27 similar to the X table moving mechanism 25.
[0050]
In this embodiment, the Y table moving mechanism 27 includes a Y-axis rod 27b, a bellows 27d, a moving body 27e, a rotating shaft 27f, a motor 27g, and a guide 27h. The Y table moving mechanism 27 can also be disposed in the vacuum chamber 21. In this case, the rotary shaft 27f, the motor 27g, and the guide 27h need to be vacuum-compatible parts.
[0051]
The Y table moving mechanism 27 moves the Y table 27a in the arrow Y direction on a pair of guide rails 16b and 16b fixed on the vacuum stage.
[0052]
An example of the θ-axis drive mechanism 26 for rotating the chuck top 24 rotatably arranged on the X table 25a will be described. A θ-axis drive mechanism 26 is disposed on the outer periphery of the chuck top 24. The θ-axis drive mechanism 26 applies a rotational force to the outer periphery of the chuck top 24. The chuck top 24 rotates in the direction of the arrow θ by this rotational force. The θ-axis drive mechanism 26 is not limited to the above example. For example, the θ-axis drive mechanism 26 may be a mechanism that directly rotates a rotation shaft that supports the chuck top 24.
[0053]
As described above, the inspected object Wo is brought into contact with the probe for alignment of the inspected object Wo placed on the chuck top 24 or when inspecting the electrical characteristics of the individual inspected objects Wo. For this reason, the chuck top 24 can be accurately moved in the X, Y, and θ directions by the X table moving mechanism 25, the Y table moving mechanism 27, and the θ-axis drive mechanism 26. In this embodiment, the chuck top 24 is configured to be movable in the X, Y, and θ directions. Further, the chuck top 24 can be configured to be movable also in the Z direction.
[0054]
With reference to FIG. 7, the probing card 28 disposed in the vacuum chamber 21 and the third moving mechanism 30 for moving the probing card 28 in the Z direction will be described.
[0055]
In the vacuum chamber 21, there are a vacuum stage 20, a Y table 27a disposed on a base 20a on the vacuum stage 20, an X table 25a disposed on the Y table, and a chuck top 24 disposed on the X table 25a. Can be arranged. Further, a probing card 28 can be arranged above the X table 24 so as to be movable in the arrow Z direction.
[0056]
The probing card 28 has a plurality of probes 28g. These probes 28g are connected to a tester 34 (FIG. 1). The probing card 28 can be supported by a probing card support mechanism 28a including a plurality of support columns 28e and a support body 28b. The probing card 28 can be replaceably attached to the probing card support mechanism 28a. The support 28e and the probing card 28 can be moved in the Z direction by the third moving mechanism 30.
[0057]
The third moving mechanism 30 can be the same mechanism as the X table moving mechanism 25. That is, the third moving mechanism 30 can include a Z-axis rod 30b penetrating the vacuum chamber 21, a guide roller 30c, a bellows 30d, a moving body 30e, a rotating shaft 30f, a motor 30g, and a guide 30h. The guide roller 30c preferably sandwiches the Z-axis rod 30b from four directions.
[0058]
The probing card support mechanism 28a and the third moving mechanism 30 are not limited to the above embodiment. For example, the Z-axis rod 30 b can be disposed in the vacuum chamber 21 without penetrating the vacuum chamber 21. In this case, the required space of the vacuum chamber 21 is increased. The Z-axis rod 30b can be moved directly in the Z direction by a motor.
[0059]
A support portion 14 c for supporting the wafer-like substrate W is provided at the distal end portion 14 b of the arm portion 14 a of the first support mechanism 14 of the probe apparatus 100 of the present embodiment. The support portion 14c may employ any structure capable of moving the wafer-like substrate W between the atmospheric stage 10 and the vacuum stage 20 while supporting the wafer-like substrate W. it can. For example, a tweezer structure 14c ′ shown in FIG. 11A or a vacuum pad structure 14d shown in FIG. 11B can be adopted.
[0060]
FIG. 9 shows an example of a fixing mechanism 24 a for fixing the wafer-like substrate W on the main chuck 24. The fixing mechanism 24a employs a presser (hereinafter referred to as a clamp ring) 24c that presses the periphery of the wafer-like substrate W.
[0061]
As shown in FIG. 10A, the clamp ring 24c can include a ring 24ca, a ring-shaped collar portion 24cb, and a screw hole 24cc. As shown in FIG. 10B, the clamp ring 24 c is fixed to the chuck top 24 by pressing the wafer-like substrate W by being fixed to the chuck top 24 with a fixture (eg, screw) 40. Can do.
[0062]
A mechanism in which an elastic body (eg, spring material) 24n is used as the fixing mechanism 24a will be described with reference to FIG. 9A. As shown in FIG. 9A, the fixing mechanism 24a includes a plurality of support columns 24d disposed through the chuck top support 24b, a spring material 24n disposed around the support columns 24d, and a plurality of support columns 24d. A fixing member 24k for fixing the fixing members 24k and a lifting mechanism 24p for lifting and lowering the fixing member 24k can be provided.
[0063]
The lifting mechanism 24p includes a rod 24g that can be lifted and lowered through the bottom 24j of the vacuum chamber, a bellows 24h disposed on the outer periphery of the rod 24g, a drive mechanism 24q that lifts and lowers the rod 24g, and a washer 24f that is pressed by the tip of the rod 24g. Can be provided.
[0064]
As shown in FIG. 9A, when the drive mechanism 24q lowers the rod 24g, the clamp ring 24c is pushed down by the compression force of the spring material 24n. As a result, the wafer-like substrate W is pressed and fixed onto the chuck top 24 by the clamp ring 24c. In this pressed state, the electrical characteristics of the inspection object Wo are inspected.
[0065]
9A and 9B show a mechanism for automating the operation of pressing the wafer-like substrate W by the clamp ring 24c.
[0066]
FIG. 9B shows a state in which, after the inspection of the electrical characteristics of the object to be inspected Wo is completed, for example, the drive mechanism 24q raises the rod 24g and raises the fixing member 24k via the washer 24f. In this state, the clamp ring 24 c is separated from the wafer-like substrate W, and the wafer-like substrate W is movable on the chuck top 24.
[0067]
As shown in FIG. 9A, a plurality of pins 24i can be provided on the fixing member 24k. As shown in FIG. 9B, after the fixing member 24 k is raised and the clamp ring 24 c is separated from the wafer-like substrate W, these pins 24 i are also raised to lift the wafer-like substrate W from the chuck top 24. The lifted wafer-like substrate W is supported by inserting the support portion 14c shown in FIG. 11A into the lower portion thereof and lifting the support portion 14c (or by lowering the rod 24g, thereby supporting the wafer-like substrate W. To the part 14c.
[0068]
FIG. 8 shows another mechanism for automating the operation of pressing the wafer-like substrate W by a plurality of pressing tools 24c. The fixing mechanism 24a shown in FIG. 8 can be composed of a pressing tool 24c, a moving body 24r, and a driving mechanism 24s. The pressing member 24c is fixed to the moving body 24r, and the moving body 24r is moved in the direction of the arrow in the figure (the direction of moving back and forth toward the wafer-like substrate W) by the drive mechanism 24s. FIG. 8 shows a state where the presser 24c fixes the wafer-like substrate W. These parts can be arranged on the base 24t.
[0069]
An alignment mechanism 15 that can be employed in the probe apparatus 100 of the present embodiment will be described.
[0070]
11A and 11B, an imaging mechanism (for example, a CCD camera; hereinafter referred to as a camera) 15 for alignment can be provided at the distal end portion 14b of the arm portion 14a of the first support mechanism 14. The camera 15 can be provided with an upper camera 15a and a lower camera 15b on the upper surface and the lower surface of the distal end portion 14b, respectively. However, if it is not necessary, only one of the cameras can be employed. The upper camera 15a captures an alignment mark (eg, probe tip) of the probing card, and the lower camera 15b captures an alignment mark (eg, pad) on the wafer-like substrate W.
[0071]
There are cases where it is necessary to check the optical axis positions and the focal positions of the upper camera 15a and the lower camera 15b before entering the alignment operation. These checks can be performed using a fixed mark 33 (eg, 30 μm in diameter) on the thin transparent glass shown in FIG. 12A. As shown in FIG. 12B, the fixed mark 33 can be attached to the tip of the beam member 31b. The other end of the beam member 31 b can be fixed to a support base 31 c fixed to the base 31 d on the atmospheric base 10.
[0072]
The checking operation of the optical axis position and the focal position of the upper camera 15a will be described with reference to FIG. 12B. The upper camera 15 a is moved to the lower part of the fixed mark 33. The first support mechanism 14 is moved in the X, Y, and Z directions, and the upper camera 15a accurately photographs the fixed mark. From this photographing position, data of the optical axis position and the focal position of the upper camera 15a can be obtained. As shown in FIG. 12C, the first support mechanism 14 is retracted from below the fixed mark 33, and the lower camera 15 b is moved to the upper part of the fixed mark 33 as shown in FIG. 12D. Similarly to FIG. 12B, the first support mechanism 14 is moved, and the fixed mark is accurately photographed by the lower camera. From this photographing position, data of the optical axis position and the focal position of the lower camera 15b can be obtained. In obtaining these data, it is preferable to consider the thickness and refractive index of the transparent glass.
[0073]
With reference to FIG. 13, the alignment work process will be described. As shown in FIG. 5, the arm of the first support mechanism 14 is inserted into the vacuum chamber 21 through the opening 22 a, and the camera 15 is placed above the wafer-like substrate W placed on the chuck top 24. Move to. This movement can be performed by moving the first support mechanism 14 by the first movement mechanism 13 (see FIG. 3) arranged on the atmospheric stage 10.
[0074]
Since the first moving mechanism 13 is arranged in an atmospheric environment, the specifications of the parts (eg, the lifting / lowering rotating mechanism 13i and the motors 13c, 16c) constituting the first moving mechanism 13 are compatible with the vacuum environment. The condition that
[0075]
Referring to FIG. 13, the upper camera 15 a is moved in the X, Y, and Z directions by the first moving mechanism 13, and the upper camera 15 a is used for alignment of the probing card 28 arranged at the upper part in the vacuum chamber 21. A mark (eg, the tip of a predetermined probe 28g) is photographed. The position of the probing card 28 is specified from this photographing position and the above-mentioned data relating to the optical axis position and the focal position of the upper camera 15a.
[0076]
Similarly, the first support mechanism 14 installed on the atmospheric stage is moved in the X, Y, and Z directions by the first moving mechanism 13 so that the alignment mark on the wafer-like substrate W is moved by the lower camera 15b. Take a picture. At the time of photographing, the chuck top 24 is rotated in the θ direction, and the lower camera 15b and the alignment mark are also aligned. The position of the wafer-like substrate W is specified from this photographing position and the above-described data relating to the optical axis position and the focal position of the lower camera 15b. Further, after the lower camera 15b is focused on the alignment mark on the wafer-like substrate W, the position of the lower camera 15b is fixed, and the chuck top 24 is rotated in the X, Y, and θ directions for alignment. be able to.
[0077]
The chuck top 24 is moved in the X and Y directions based on the grasped position of the probing card 28 and the position of the wafer-like substrate W, and the wafer-like substrate W and the probing card 28 are moved. Align.
[0078]
Next, a method for inspecting the electrical characteristics of the wafer-like object Wo in a vacuum using the probe apparatus 100 using the inspection stage according to the present embodiment will be described.
[0079]
(S1) As described with reference to FIGS. 12A to 12D, data on the optical axis position and the focal position of the alignment camera is obtained.
[0080]
(S 2) The transfer device 2 of the loader unit 1 takes out the wafer-like substrate W from the wafer cassette 3 and delivers the wafer-like substrate W to the support portion 14 c of the first support mechanism 14 on the atmospheric stage 10.
[0081]
(S3) The first support mechanism 14 is moved in the X, Y, and Z directions by the first moving mechanism 13, and the tip 14b of the arm 14a is moved into the vacuum chamber 21 through the opening 22a. . The wafer-like substrate W supported by the front end portion 14 b is placed on the chuck top 24.
[0082]
The lifting mechanism 24p lowers the rod 24g. The clamp ring 24c is lowered, and the wafer-like substrate W is pressed onto the chuck top 24 by the clamp ring 24c and fixed.
[0083]
(S4) Cameras 15 (15a, 15b) provided at the tip 14b of the first support mechanism 14 and second moving mechanisms 25, 26, 27 for moving the chuck top 24 in the X, Y, and θ directions, Using the third moving mechanism 30 that moves the probing card 28 in the Z direction, the object Wo and the probing card 28 are aligned.
[0084]
(S5) The first support mechanism 14 leaves the vacuum chamber 21, and the gate valve 22b of the vacuum chamber 21 is closed. The exhaust pump 21b exhausts air from the inside of the vacuum chamber 21 through the valve 21a, and makes the inside of the vacuum chamber 21 have a predetermined degree of vacuum.
[0085]
(S6) The third moving mechanism 30 lowers the probing card 28 and brings the plurality of probes into contact with the electrodes of the object to be examined Wo in an overdrive state.
[0086]
The tester 34 inspects the electrical characteristics of the inspected object Wo by transmitting and receiving measurement signals and measurement result signals to and from the inspected object Wo through the plurality of probes 28g. The inspection of electrical characteristics can be performed for each object to be inspected (integrated circuit) or for each of a plurality of objects to be inspected.
[0087]
(S7)) The probing card is raised and the wafer-like substrate is moved to the next object to be inspected.
[0088]
(S8) By repeating the above (S6) to (S7), the inspection of the electrical characteristics of the predetermined object to be inspected is terminated.
(S9) The third moving mechanism 30 raises the probing card 28. The drive mechanism 24q raises the rod 24g to raise the clamp ring 24c. As a result, the wafer-like substrate W is made movable from the chuck top.
[0089]
(S10) The valve 21a of the vacuum chamber 21 is opened, the inside of the vacuum chamber 21 is set to atmospheric pressure, and the gate valve 22b is opened.
[0090]
(S11) The support portion 14c of the first support mechanism 14 on the atmospheric stage 10 is inserted into the vacuum chamber, and the support portion 14c receives the inspected wafer-like substrate W from the chuck top 24 and carries it out of the vacuum chamber 21. To do. The first support mechanism 14 delivers the inspected wafer-like substrate W carried out of the vacuum chamber 21 to the transport mechanism 2 of the loader unit 1.
[0091]
(S 12) The transport mechanism 2 of the loader unit 1 stores the inspected wafer-like substrate W in, for example, the wafer cassette 3, and takes out the uninspected wafer-like substrate W from the wafer cassette 3. The first support mechanism 14 is handed over.
[0092]
Thereafter, by repeating the operations (S1) to (S12), the inspection for all wafer-like substrates W is completed.
[0093]
Additional features and modifications will occur to those skilled in the art. Thus, the present invention is based on a broader perspective and is not limited to the specific details and exemplary embodiments disclosed herein. Accordingly, various modifications can be made without departing from the scope and interpretation of the broad inventive concept defined in the claims and equivalents thereof.
[0094]
【The invention's effect】
According to the embodiment of the present invention, the minimum required inspection equipment such as a chuck top and a probing card is arranged on a vacuum stage in a vacuum environment, while the moving mechanism and alignment mechanism of the object to be inspected are in an atmospheric environment. To place. As a result, the moving mechanism and alignment mechanism of the object to be inspected do not need to have specifications for dealing with the vacuum environment, and simple and inexpensive equipment can be used. Also, the amount of gas released from the vacuum chamber is small.
[0095]
According to the embodiment of the present invention, the electrical characteristics of the object Wo to be inspected, such as a micromachine and an integrated circuit, can be implemented in a vacuum chamber having a minimum necessary volume. In addition, the vacuum chamber and its related structure can be simplified. Since there is no need for a large exhaust pump necessary for evacuating the entire probe apparatus, and the time required to obtain a predetermined degree of vacuum is short, the inspection time can be increased. Further, the volume of the vacuum chamber can be minimized, and the vacuum chamber can be quickly brought to a high vacuum.
According to the embodiment of the present invention, the electrical characteristics of the object Wo to be inspected, such as a micromachine and an integrated circuit, can be inspected under vacuum using the equipment arranged on the atmospheric stage 10. As a result, it is possible to eliminate the necessity of countermeasures against vacuum for the devices arranged on the atmospheric stage.
[0096]
According to the embodiment of the present invention, the degree of vacuum of the vacuum chamber can be determined from the viewpoint of ensuring the inspection environment (environment under a predetermined degree of vacuum) necessary for the inspection.
[0097]
According to the embodiment of the present invention, it is possible to employ a mechanism for bringing the plurality of probes and the object to be inspected into contact with each other by moving the probing card up and down. By adopting this mechanism, a predetermined overdrive state can be set accurately.
[0098]
According to the embodiment of the present invention, an opening / closing mechanism for opening / closing the opening of the vacuum chamber can be employed. By adopting this, the sealed space for the vacuum chamber can be realized by a simpler mechanism.
[Brief description of the drawings]
FIG. 1 is a top view of an inspection stage in an embodiment of the present invention.
FIG. 2 is a front view of a probe apparatus having an inspection stage in an embodiment of the present invention.
FIG. 3 is an overview diagram of an atmospheric stage constituting an inspection stage in an embodiment of the present invention.
FIG. 4 is a schematic view of an atmospheric stage including a substrate delivery table in an embodiment of the present invention. FIG. 4A is a perspective view thereof, and FIG. 4B is a diagram illustrating an example of a situation of substrate delivery.
FIG. 5 is a schematic view of a vacuum stage constituting the inspection stage in the embodiment of the present invention.
6 is a top view of an X and Y table moving mechanism for moving a chuck top mechanism in an embodiment of the present invention. FIG.
FIG. 7 is a side view of a third moving mechanism for moving the probing card in the Z direction in the embodiment of the present invention.
FIG. 8 is a side view of a wafer-like substrate fixing mechanism in an embodiment of the present invention.
FIG. 9 is a side view of another wafer-like substrate fixing mechanism in the embodiment of the present invention. FIG. 9A shows a state where the wafer-like substrate is fixed, and FIG. 9B shows a state where the wafer-like substrate is not fixed.
FIG. 10 is a view showing a clamp ring in an embodiment of the present invention. FIG. 10A is a schematic view of the clamp ring, and FIG. 10B is a side view of the clamp ring.
FIG. 11 is a side view of an arm portion in an embodiment of the present invention. FIG. 11A is a side view of an arm portion having a tweezer-shaped support portion, and FIG. 11B is a side view of an arm portion having a support portion of a vacuum pad.
FIGS. 12A to 12D are diagrams for explaining an optical axis position and focal position detection mechanism of an imaging mechanism in an embodiment of the present invention. FIGS.
FIG. 13 is a diagram illustrating a situation in which a probing card and an object to be inspected are aligned in an embodiment of the present invention.
FIG. 14 is a side view of a conventional vacuum probing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Loader part, 2 ... Conveyance mechanism, 3 ... Wafer cassette, 10 ... Atmospheric stage, 14 ... First support mechanism, 15 ... Imaging mechanism, 20 ... Vacuum stage, 21 ... Vacuum chamber.

Claims (12)

An inspection stage for inspecting an object to be inspected formed on a wafer-like substrate in a vacuum state, the inspection stage includes:
An atmospheric stage, the atmospheric stage being placed in an atmospheric atmosphere;
A first support mechanism disposed on the atmospheric stage and configured to support a wafer-like substrate, the first support mechanism includes an arm portion, and a support portion provided at a tip portion of the arm portion. Comprising
A first movement mechanism configured to move the first support mechanism in the X, Y, and Z directions;
A vacuum stage, which is placed in a vacuum atmosphere;
A probe mechanism disposed on the vacuum stage. The inspection stage according to claim 1, further comprising an alignment imaging mechanism provided on the arm portion of the first support mechanism. The inspection stage according to claim 2, further comprising a vacuum chamber in which the inspection stage is disposed, wherein the vacuum chamber includes a vacuum exhaust mechanism, an opening, and an opening / closing mechanism for opening and closing the opening. The first support mechanism moves the supported wafer-like substrate between the inside and the outside of the vacuum chamber through the opening. The alignment photographing mechanism includes at least one of a first camera disposed on an upper surface portion of the arm portion and a second camera disposed on a lower surface portion of the arm portion. Inspection stage described in. The inspection stage according to claim 2, wherein the support part includes a vacuum pad. The inspection stage according to claim 2, wherein the probe mechanism further comprises:
A chuck top mechanism configured to place a wafer-like substrate W;
A second moving mechanism configured to move the chuck top mechanism in the X, Y and θ directions;
A probing card located at the top of the vacuum chamber,
A third moving mechanism for moving the probing card in the Z direction. The inspection stage according to claim 6, wherein at least one of the second moving mechanism and the third moving mechanism includes the following driving mechanism:
One axis placed through the vacuum chamber;
A bellows disposed on the outer periphery of the portion of the shaft located outside the vacuum chamber;
A moving mechanism for moving the shaft in the axial direction;
An attachment mechanism for attaching the end portion of the X axis to the chuck top mechanism, and the attachment mechanism attaches the tip end of each axis to the chuck top mechanism so that the chuck top mechanism can slide at right angles to each axis and horizontally. The inspection stage according to claim 2, wherein the probe mechanism further comprises:
A chuck top mechanism configured to place a wafer-like substrate W;
Wafer-like substrate W fixing mechanism provided on the chuck top mechanism The wafer-like substrate fixing mechanism comprises the following:
A presser, the presser fixing the wafer-like substrate by pressing the wafer-like substrate onto the chuck top;
A first elevating mechanism configured to raise and lower the presser. The inspection stage according to claim 8, wherein the inspection stage further moves up and down the plurality of support bodies configured to raise and lower the wafer-like substrate W on the chuck top mechanism. The 2nd raising / lowering mechanism comprised is comprised. The inspection stage described in claim 2 and the atmospheric stage of the inspection stage include a fixed target for checking at least one of the optical axis position and the focal position of the imaging mechanism for alignment. The inspection stage according to claim 2, wherein the object to be inspected is one of a micromachine and an integrated circuit formed on a wafer-like substrate. An inspection method for inspecting the electrical characteristics of an object to be inspected formed on a wafer-like substrate under a vacuum, the inspection method comprising an atmospheric stage under an atmospheric environment and an inspection with a vacuum stage under a vacuum environment Performed on the stage, the inspection method comprises:
(S1) obtaining data relating to an optical axis position and a focal position of an alignment imaging mechanism disposed on an atmospheric stage in an atmospheric environment;
(S2) The wafer-like substrate is taken out from the wafer cassette of the loader unit, and the wafer-like substrate is transferred to the first support mechanism arranged on the atmospheric stage.
(S3) The first support mechanism moves the tip of the arm onto a vacuum stage in the vacuum chamber, and the wafer-like substrate supported by the tip is placed on the vacuum stage. Place on top and secure.
(S4) Above the object to be inspected and the chuck top by using the photographing data by at least one camera provided at the tip of the first support mechanism and the data on the optical axis position and the focal position of the photographing mechanism. Align with the probing card placed in
(S5) The first support mechanism is withdrawn from the vacuum chamber, and the gate valve is closed to make the vacuum chamber have a predetermined degree of vacuum.
(S6) The probing card is lowered, and the plurality of probes are brought into contact with each electrode of the device under test in an overdrive state.
(S7) Inspect the electrical characteristics of the object to be inspected.
(S8) The probing card is raised and the wafer-like substrate is moved to the next object to be inspected.
(S9) By repeating the above (S6) to (S8), the inspection of the electrical characteristics of a predetermined object to be inspected is completed.
(S10) The wafer-like substrate is moved from the chuck top.
(S11) The vacuum chamber is set to atmospheric pressure.
(S12) The support portion provided at the tip of the first support mechanism receives the inspected wafer-like substrate from the chuck top, carries it out of the vacuum stage, and returns it to the wafer cassette of the loader portion.
(S13) The above (S2) to (S12) are repeated a predetermined number of times.

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