JP2004361395A5 - - Google Patents

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JP2004361395A5
JP2004361395A5 JP2004131764A JP2004131764A JP2004361395A5 JP 2004361395 A5 JP2004361395 A5 JP 2004361395A5 JP 2004131764 A JP2004131764 A JP 2004131764A JP 2004131764 A JP2004131764 A JP 2004131764A JP 2004361395 A5 JP2004361395 A5 JP 2004361395A5
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Japan
Prior art keywords
forming
electrode
insulating film
frame plate
sheet
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JP2004131764A
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Japanese (ja)
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JP3649245B2 (en
JP2004361395A (en
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Priority to JP2004131764A priority Critical patent/JP3649245B2/en
Priority claimed from JP2004131764A external-priority patent/JP3649245B2/en
Publication of JP2004361395A publication Critical patent/JP2004361395A/en
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Publication of JP3649245B2 publication Critical patent/JP3649245B2/en
Publication of JP2004361395A5 publication Critical patent/JP2004361395A5/ja
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Expired - Fee Related legal-status Critical Current

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Claims (4)

厚み方向に貫通する複数の貫通孔が形成された金属よりなるフレーム板と、このフレーム板の貫通孔の周辺部に支持された接点膜とを具えてなり、前記接点膜は、柔軟な樹脂よりなる絶縁膜と、この絶縁膜にそれぞれ接続すべき電極に対応するパターンに従って配置された、当該接点膜の表面に露出する表面電極部および当該接点膜の裏面に露出する裏面電極部が当該絶縁膜を貫通して伸びる短絡部によって互いに連結されてなる複数の電極構造体とよりなり、当該電極構造体の各々が、前記フレーム板の貫通孔内に位置するよう配置されたシート状プローブを製造する方法であって、A frame plate made of metal in which a plurality of through holes penetrating in the thickness direction is formed, and a contact film supported on a peripheral portion of the through hole of the frame plate. The contact film is made of a flexible resin. The insulating film, and the surface electrode portion exposed on the surface of the contact film and the back electrode portion exposed on the back surface of the contact film, arranged according to the pattern corresponding to the electrode to be connected to the insulating film, respectively. And a plurality of electrode structures connected to each other by a short-circuit portion extending through the electrode, and each of the electrode structures is manufactured so as to be positioned in the through hole of the frame plate. A method,
フレーム板形成用金属板と、このフレーム板形成用金属板上に一体的に積層された絶縁膜形成用シートとを有する積層体を用意し、A laminated body having a metal plate for forming a frame plate and an insulating film forming sheet integrally laminated on the metal plate for forming a frame plate is prepared,
この積層体における絶縁膜形成用樹脂シートに、形成すべき電極構造体のパターンに対応するパターンに従って貫通孔を形成し、当該積層体に対してメッキ処理を施すことにより、当該絶縁膜形成用樹脂シートの貫通孔内に形成され、前記フレーム板形成用金属板に連結された短絡部および当該短絡部に連結された表面電極部を形成し、By forming through holes in the insulating film forming resin sheet in the laminate according to a pattern corresponding to the pattern of the electrode structure to be formed and plating the laminated body, the insulating film forming resin is formed. Formed in the through-hole of the sheet, forming a short-circuit portion connected to the metal plate for frame plate formation and a surface electrode portion connected to the short-circuit portion,
その後、前記フレーム板形成用金属板をエッチング処理することにより、貫通孔が形成されたフレーム板を形成する工程を有することを特徴とするシート状プローブの製造方法。Then, the manufacturing method of the sheet-like probe characterized by having the process of forming the frame board in which the through-hole was formed by etching the said metal plate for frame board formation. 検査対象である回路装置の被検査電極が形成された電極領域に対応してそれぞれ厚み方向に貫通する複数の貫通孔が形成された、金属よりなるフレーム板と、このフレーム板の各貫通孔の周辺部に支持された複数の接点膜とを具えてなり、前記接点膜の各々は、柔軟な樹脂よりなる絶縁膜と、この絶縁膜に前記電極領域における被検査電極のパターンに対応するパターンに従って配置された、当該接点膜の表面に露出する表面電極部および当該接点膜の裏面に露出する裏面電極部が当該絶縁膜を貫通して伸びる短絡部によって互いに連結されてなる複数の電極構造体とよりなり、当該電極構造体の各々が、前記フレーム板の各貫通孔内に位置するよう配置されたシート状プローブを製造する方法であって、A frame plate made of metal in which a plurality of through holes penetrating in the thickness direction are formed corresponding to the electrode regions in which the electrodes to be inspected of the circuit device to be inspected are formed, and A plurality of contact films supported on a peripheral portion, each of the contact films according to a pattern corresponding to the pattern of the electrode to be inspected in the insulating film made of a flexible resin and the insulating film; A plurality of electrode structures in which the surface electrode portion exposed on the surface of the contact film and the back electrode portion exposed on the back surface of the contact film are connected to each other by a short-circuit portion extending through the insulating film; A method of manufacturing a sheet-like probe in which each of the electrode structures is disposed so as to be located in each through hole of the frame plate,
フレーム板形成用金属板と、このフレーム板形成用金属板上に一体的に積層された絶縁膜形成用シートとを有する積層体を用意し、A laminated body having a metal plate for forming a frame plate and an insulating film forming sheet integrally laminated on the metal plate for forming a frame plate is prepared,
この積層体における絶縁膜形成用樹脂シートに、形成すべき電極構造体のパターンに対応するパターンに従って貫通孔を形成し、当該積層体に対してメッキ処理を施すことにより、当該絶縁膜形成用樹脂シートの貫通孔内に形成され、前記フレーム板形成用金属板に連結された短絡部および当該短絡部に連結された表面電極部を形成し、By forming through holes in the insulating film forming resin sheet in the laminate according to a pattern corresponding to the pattern of the electrode structure to be formed and plating the laminated body, the insulating film forming resin is formed. Formed in the through-hole of the sheet, forming a short-circuit portion connected to the metal plate for frame plate formation and a surface electrode portion connected to the short-circuit portion,
その後、前記フレーム板形成用金属板をエッチング処理することにより、複数の貫通孔が形成されたフレーム板を形成する工程を有することを特徴とするシート状プローブの製造方法。Then, the manufacturing method of the sheet-like probe characterized by having the process of forming the frame board in which the several through-hole was formed by carrying out the etching process of the said metal plate for frame board formation. 検査対象である回路装置の被検査電極が形成された電極領域に対応してそれぞれ厚み方向に貫通する複数の貫通孔が形成されたフレーム板と、このフレーム板上に配置されて支持された接点膜とを具えてなり、前記接点膜は、柔軟な樹脂よりなる絶縁膜と、この絶縁膜に前記被検査電極のパターンに対応するパターンに従って配置された、当該接点膜の表面に露出する表面電極部および当該接点膜の裏面に露出する裏面電極部が当該絶縁膜を貫通して伸びる短絡部によって互いに連結されてなる複数の電極構造体とよりなり、当該電極構造体の各々が、前記フレーム板の各貫通孔内に位置するよう配置されたシート状プローブを製造する方法であって、A frame plate in which a plurality of through-holes each penetrating in the thickness direction corresponding to an electrode region in which an electrode to be inspected of a circuit device to be inspected is formed, and a contact disposed and supported on the frame plate The contact film is an insulating film made of a flexible resin, and is disposed on the insulating film according to a pattern corresponding to the pattern of the electrode to be inspected, and is a surface electrode exposed on the surface of the contact film And a plurality of electrode structures in which a back electrode portion exposed on the back surface of the contact film is connected to each other by a short-circuit portion extending through the insulating film, each of the electrode structures being the frame plate A method of manufacturing a sheet-like probe arranged so as to be located in each through-hole,
フレーム板形成用金属板と、このフレーム板形成用金属板上に一体的に積層された絶縁膜形成用シートとを有する積層体を用意し、A laminated body having a metal plate for forming a frame plate and an insulating film forming sheet integrally laminated on the metal plate for forming a frame plate is prepared,
この積層体における絶縁膜形成用樹脂シートに、形成すべき電極構造体のパターンに対応するパターンに従って貫通孔を形成し、当該積層体に対してメッキ処理を施すことにより、当該絶縁膜形成用樹脂シートの貫通孔内に形成され、前記フレーム板形成用金属板に連結された短絡部および当該短絡部に連結された表面電極部を形成し、By forming through holes in the insulating film forming resin sheet in the laminate according to a pattern corresponding to the pattern of the electrode structure to be formed and plating the laminated body, the insulating film forming resin is formed. Formed in the through-hole of the sheet, forming a short-circuit portion connected to the metal plate for frame plate formation and a surface electrode portion connected to the short-circuit portion,
その後、前記フレーム板形成用金属板をエッチング処理することにより、複数の貫通孔が形成されたフレーム板を形成する工程を有することを特徴とするシート状プローブの製造方法。Then, the manufacturing method of the sheet-like probe characterized by having the process of forming the frame board in which the several through-hole was formed by carrying out the etching process of the said metal plate for frame board formation. フレーム板形成用金属板をエッチング処理することにより、貫通孔が形成されたフレーム板を形成すると共に、当該フレーム板形成用金属板の一部によって、短絡部に連結された裏面電極部を形成することを特徴とする請求項１乃至請求項３のいずれかに記載のシート状プローブの製造方法。The frame plate forming metal plate is etched to form a frame plate in which through holes are formed, and a part of the frame plate forming metal plate forms a back electrode portion connected to the short-circuit portion. The method for manufacturing a sheet-like probe according to any one of claims 1 to 3.
JP2004131764A 2003-05-13 2004-04-27 Manufacturing method of sheet-like probe Expired - Fee Related JP3649245B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004131764A JP3649245B2 (en) 2003-05-13 2004-04-27 Manufacturing method of sheet-like probe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003134450 2003-05-13
JP2004131764A JP3649245B2 (en) 2003-05-13 2004-04-27 Manufacturing method of sheet-like probe

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004362951A Division JP3781048B2 (en) 2003-05-13 2004-12-15 Sheet probe and its application

Publications (3)

Publication Number Publication Date
JP2004361395A JP2004361395A (en) 2004-12-24
JP3649245B2 JP3649245B2 (en) 2005-05-18
JP2004361395A5 true JP2004361395A5 (en) 2005-06-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004131764A Expired - Fee Related JP3649245B2 (en) 2003-05-13 2004-04-27 Manufacturing method of sheet-like probe

Country Status (1)

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JP (1) JP3649245B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1744166A1 (en) * 2004-04-27 2007-01-17 JSR Corporation Sheet-like probe, method of producing the probe, and application of the probe
KR101167750B1 (en) * 2004-10-29 2012-07-23 제이에스알 가부시끼가이샤 Probe member for wafer inspection, probe card for wafer inspection and wafer inspection equipment
WO2006051845A1 (en) * 2004-11-12 2006-05-18 Jsr Corporation Probe member for wafer inspection, probe card for wafer inspection and wafer inspection apparatus
JP2006237242A (en) * 2005-02-24 2006-09-07 Jsr Corp Probe card for wafer testing and wafer testing device
JP2008089377A (en) * 2006-09-29 2008-04-17 Jsr Corp Sheet-like probe, its manufacturing method, and its application
KR200445395Y1 (en) * 2007-08-13 2009-07-27 주식회사 아이에스시테크놀러지 Conductive contactor
JP5112496B2 (en) * 2010-10-29 2013-01-09 日本航空電子工業株式会社 IC socket

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