JP2004361277A - Light receiving energy measuring device and laser beam machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize a device having the function of measuring energy of laser light. <P>SOLUTION: A laser beam machine 10 is composed of a chamber 14 inserting a glass substrate 12, a laser light unit 16 arranged on the upper part of the chamber 14, and a light receiving energy measuring device 18 measuring energy of the laser light. An XY stage 26 mounting the glass substrate 12 is stored in an inside space 24 of the chamber 14. Furthermore, a rectangular laser light incident window 30 is provided in a top board 28 of the chamber 14, and the laser light incident from the laser light incident window 30 is radiated on a light receiving part 38. The inside space 24 of the chamber 14 is small by lifting the light receiving part 38 with an air cylinder 42, and in the part the device can be miniaturized. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light receiving energy measuring device that measures the light receiving energy of laser light irradiated to a workpiece and a laser processing machine having the light receiving energy measuring device.
[0002]
[Prior art]
For example, in a laser processing machine that processes a workpiece by irradiating the workpiece with laser light, the chamber into which the workpiece is loaded is sealed, and gas is supplied or vacuumed so that the inside of the chamber becomes a predetermined environment. It is configured to irradiate the workpiece with laser light having the necessary energy.
[0003]
As a processing method using this type of laser processing machine, an annealing technique is being developed in which an amorphous silicon film is irradiated with laser light to be transformed into a crystalline silicon film. For example, there is an annealing technique in which an amorphous silicon film on a glass substrate is formed by a plasma CVD method or a low pressure thermal CVD method, and is transformed into a crystalline silicon film by irradiation with laser light.
[0004]
Examples of the contents of annealing include a method of stabilizing the interface by irradiating a laser beam to a silicon film formed on a glass substrate or a quartz substrate, and has a crystallinity and crystallinity of an amorphous silicon film. There are further promotion of crystallinity for the silicon film, recovery of damage by implantation of impurity ions, and activation of impurities.
[0005]
In the laser processing machine that performs the annealing as described above, it is necessary to irradiate the glass substrate (work) with laser light having energy corresponding to the annealing conditions, and the energy of the laser light is measured and irradiated to the glass substrate. The optical system has been adjusted so that the energy of the laser beam is maintained at a predetermined level (see, for example, Patent Document 1).
[0006]
Moreover, in the said apparatus, it is the structure which mounts a glass substrate on the stage in a chamber, and irradiates a laser beam from the upper direction of a glass substrate, The semi-transmission mirror which reflects a part of laser beam to a measuring device in a chamber Is provided. Then, the measuring device measures the irradiation energy density of the received laser beam.
[0007]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 9-213652
[Problems to be solved by the invention]
However, in the conventional apparatus configured as described above, a semi-transmissive mirror and a measuring device are provided in the chamber, so that not only the environment inside the chamber is affected but also the chamber internal volume must be increased. It was difficult to reduce the size of the device.
[0009]
Accordingly, an object of the present invention is to provide a received light energy measuring apparatus and a laser beam machine that have solved the above problems.
[0010]
[Means for Solving the Problems]
In order to solve the above problems, the present invention has the following features.
[0011]
According to the first aspect of the present invention, there is provided a light receiving energy measuring apparatus for measuring the light receiving energy of laser light applied to a workpiece, a photoelectric conversion element that outputs a signal corresponding to the light receiving energy of the laser light, and the light receiving energy of the laser light. And a moving mechanism for moving the photoelectric conversion element to the vicinity of the workpiece processing position, and when not measuring the received light energy of the laser beam, the photoelectric conversion element is separated from the workpiece processing position. This makes it possible to reduce the size of the apparatus.
[0012]
The invention described in claim 2 includes an XY stage on which a workpiece is placed and a sealed container for storing the XY stage, and the photoelectric conversion element is processed by the moving mechanism while the XY stage is retracted. The photoelectric conversion element can be moved inside the sealed container so as not to interfere with the XY stage, the apparatus can be reduced in size, and the workpiece is irradiated. It becomes possible to accurately measure the received light energy.
[0013]
The invention according to claim 3 is for moving the photoelectric conversion element up and down by a moving mechanism provided at the bottom of the hermetic container. When the received light energy of the laser beam is not measured, the photoelectric conversion element is processed into a workpiece. By lowering from the position, it is possible to reduce the size of the apparatus.
[0014]
According to a fourth aspect of the present invention, the moving mechanism includes a cooling means for cooling the photoelectric conversion element, and the apparatus can be downsized by cooling the photoelectric conversion element from the outside. .
[0015]
The invention according to claim 5 is provided such that the sealed container is provided with a window through which the laser beam is incident and the window so as to face the window, and the irradiation range of the laser beam has a size corresponding to the size of the photoelectric conversion element. Is provided with a laser beam regulating means for regulating the width of the laser beam, which makes it possible to measure the light receiving energy of the laser beam received within a certain irradiation range, and to improve the measurement accuracy and to reduce the size It is possible to reduce the size of the apparatus by using the converted photoelectric conversion element.
[0016]
A sixth aspect of the present invention is a laser processing machine comprising the received light energy measuring device according to any of the first to fifth aspects, and when the received light energy of the laser beam is not measured, the photoelectric conversion element is processed into a workpiece. By separating from the position, it is possible to reduce the size of the apparatus.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic configuration diagram showing a laser processing machine to which an embodiment of a received light energy measuring apparatus according to the present invention is applied.
[0018]
As shown in FIG. 1, the laser processing machine 10 is an apparatus that performs annealing that transforms a crystalline silicon film by irradiating a glass substrate 12 with laser light, and a chamber (sealed container) in which the glass substrate 12 is inserted. ) 14, a laser light unit 16 disposed in the upper part of the chamber 14, and a received light energy measuring device 18 for measuring the energy of the laser light.
[0019]
The laser light unit 16 includes a laser light source 20 composed of an excimer laser, and an optical system unit 22 composed of a plurality of lenses and mirrors (not shown) for guiding the laser light emitted from the laser light source 20 to the upper center of the chamber 14. Have.
[0020]
The chamber 14 is formed in a sealed box shape, and an internal space 24 stores an XY stage 26 on which the glass substrate 12 is placed. Further, a rectangular laser light incident window 30 fitted with a transparent quartz plate is provided in the upper surface recess 28 a of the top plate 28 of the chamber 14.
[0021]
The laser light incident window 30 is formed in a rectangular shape extending in the Y direction corresponding to the width dimension in the Y direction of the laser light incident from the optical system unit 22. A slit mechanism (laser light restricting means) 32 for restricting the Y-direction width dimension of the laser light to an arbitrary dimension is provided in the upper surface recess 28 a of the chamber 14 above the laser light incident window 30.
[0022]
A communication hole 36 communicating with the internal space 24 is provided at the center of the bottom plate 34 of the chamber 14. The communication hole 36 has a small light receiving portion 38 smaller than the incident width of the laser beam, and a light receiving portion. A lifting mechanism (moving mechanism) 40 that lifts and lowers the portion 38 is provided. The elevating mechanism 40 includes an air cylinder 42 and is configured to elevate the light receiving unit 38 by supplying compressed air from the air switching unit 44.
[0023]
The air cylinder 42 has pipes 48 and 49 connected to the cooling water supply unit 46 inserted therein, so that the cooling water is supplied to the light receiving unit 38 and temperature rise due to laser light is prevented.
[0024]
The laser light source 20, the XY stage 26, the slit mechanism 32, the light receiving unit 38, the air switching unit 44, and the cooling water supply unit 46 are controlled by the control unit 50. Then, as will be described later, the control unit 50 measures the light reception energy of the laser light, and maintains an optical system so that the light reception energy near the processing position on which the glass substrate 12 is placed is maintained at a predetermined level. The light intensity of the laser beam by the unit 22 is adjusted.
[0025]
The control unit 50 causes the storage device 52 to store the measured value of the received light energy of the laser beam output from the light receiving unit 38. In addition, a preset reference value of the received light energy of the laser beam is registered in the storage device 52.
FIG. 2 is a front view showing a laser processing machine to which an embodiment of the received light energy measuring apparatus according to the present invention is applied. FIG. 3 is a side view of the laser processing machine. FIG. 4 is a plan view of the laser processing machine.
[0026]
As shown in FIGS. 2 to 4, the chamber 14 of the laser processing machine 10 is supported at a predetermined height by a support base 54 combined with a steel pipe. The bottom plate 34 of the chamber 14 is provided with a communication hole 36 through which the light receiving portion 38 supported by the air cylinder 42 of the lifting mechanism 40 is inserted from below. The air cylinder 42 is supported in a vertical state by a support column 60 erected from a support base 58 supported by a beam 56 of a support base 54.
[0027]
The air cylinder 42 has a movable part 42a that moves up and down by the pressure of compressed air, and a light receiving part 38 is attached to the movable part 42a. The light receiving unit 38 includes a photoelectric conversion element (also referred to as “Joule meter”) 62 that outputs an electrical signal corresponding to the intensity of light received in the case.
[0028]
Further, the light receiving unit 38 is cooled by the cooling water supplied from the cooling water supply unit 46 in order to reduce the heat generation of the photoelectric conversion element 62 that has received the laser light.
[0029]
The chamber 14 is provided with an insertion port 66 into which the glass substrate 12 is inserted into the right side plate 64, and a gate valve 68 for opening and closing the insertion port 66 is attached to the outer wall of the right side plate 64.
[0030]
The glass substrate 12 carried in from the insertion port 66 by a transfer robot (not shown) is placed on the work placement table 70 of the XY stage 26. The XY stage 26 includes an X-direction moving base 72 that is provided on the bottom plate 34 and moves in the X direction, and a Y-direction moving base 74 that is placed on the X-direction moving base 72 and moves in the Y direction. A work mounting table 70 is mounted on the Y-direction moving base 74.
[0031]
The X direction moving base 72 and the Y direction moving base 74 are guided in the moving direction by an X direction linear guide 76 and a Y direction linear guide 78.
[0032]
The XY stage 26 moves the X-direction moving base 72 and the Y-direction moving base 74 in the X and Y directions in a state where the glass substrate 12 is placed on the work placing table 70, so that the X- and Y-direction moving bases 72 are moved. The relative position of the glass substrate 12 is moved.
[0033]
In addition, the XY stage 26 moves the workpiece mounting table 70 away from the center of the chamber 14 in the Y direction (see FIG. 3) before raising the light receiving unit 38 to the measurement position (indicated by a two-dot chain line in FIG. 3). To avoid interference with the light receiving unit 38.
[0034]
As shown in FIG. 4, the width of the rectangular laser light incident window 30 provided at the center of the top plate 28 of the chamber 14 is restricted by the slit mechanism 32. The top plate 28 of the chamber 14 is provided with a plurality of maintenance openings, and each maintenance opening is closed by a lid member 80.
[0035]
FIG. 5 is a rear view showing the lifting mechanism 40 in an enlarged manner.
As shown in FIG. 5, the elevating mechanism 40 has an air cylinder 42 that elevates and lowers the light receiving unit 38. When not measuring the energy of the laser beam, the elevating mechanism 40 lowers the light receiving unit 38 to a standby position indicated by a solid line. Yes. This standby position is a position where the light receiving unit 38 does not interfere with the XY stage 26 and is located above the bottom plate 34 of the chamber 14.
[0036]
Thus, when the light receiving energy of the laser beam is not measured, the inner space 24 of the chamber 14 can be made smaller by moving the light receiving unit 38 away from the workpiece processing position and lowering it to the bottom of the chamber 14. The size of the apparatus can be reduced.
[0037]
Further, the lifting mechanism 40 raises the light receiving unit 38 to a measurement position indicated by a two-dot chain line when measuring the energy of the laser beam. This measurement position is a height position at which the light receiving surface 62a of the photoelectric conversion element 62 built in the light receiving unit 38 is in the vicinity of the glass substrate 12 placed on the work placing table 70 of the XY stage 26.
[0038]
In this embodiment, in order to receive the laser beam over the entire area of the light receiving surface 62a, the light receiving surface 62a of the photoelectric conversion element 62 has a dimension L (for example, L = 85 cm) than the mounting position of the glass substrate 12. ), The operating range of the air cylinder 42 is set so as to stand still at a low height position. Thus, the laser light incident from the laser light incident window 30 is received by the photoelectric conversion element 62 at a height position where the X-direction width dimension is substantially the same as the X-direction width of the light-receiving surface 62a of the photoelectric conversion element 62. The
[0039]
Therefore, since the photoelectric conversion element 62 can directly receive the laser light in the vicinity of the processing height on which the glass substrate 12 is placed, the energy of the laser light irradiated on the glass substrate 12 can be accurately measured. Can do.
[0040]
Here, the configuration of the slit mechanism 32 will be described.
FIG. 6 is an enlarged plan view showing the slit mechanism 32. FIG. 7 is an enlarged rear view showing the slit mechanism 32.
[0041]
6 and 7, the slit mechanism 32 includes a pair of slit plates 82 and 83, a Y-direction drive mechanism 84 that drives the slit plates 82 and 83 in the Y direction, and a Y-direction drive mechanism 84. The X-direction drive mechanism 87 is configured to move the moved base 86 in the X direction.
[0042]
The slit plates 82 and 83 are formed in an L shape having restriction portions 82a and 83a extending in the Y direction and arm portions 82b and 83b extending in the X direction so as to support the restriction portions 82a and 83a. ing. In addition, a flow path (not shown) through which cooling water flows is formed inside the slit plates 82 and 83, and a cooling water supply pipe 88 is connected to both sides of the arm portions 82b and 83b. ing. Therefore, the slit plates 82 and 83 are heated when the width of the laser beam in the Y direction is restricted, but are cooled by the cooling water supplied from the cooling water supply unit 46.
[0043]
The Y-direction drive mechanism 84 is slidably provided on the moving base 86, and a pair of slide bases 90 and 91 that support the slit plates 82 and 83, and a pair of screws screwed to the female screws of the slide bases 90 and 91. The feed screws 92 and 93, a drive motor 94 that rotationally drives the pair of feed screws 92 and 93, and a coupling 96 that connects the feed screws 92 and 93 on the same axis. One of the feed screws 92 and 93 is a right-hand thread and the other is a left-hand thread. Therefore, when the drive motor 94 rotationally drives the feed screws 92 and 93, the slide bases 90 and 91 slide in directions close to each other, and the drive motor 94 rotationally drives the feed screws 92 and 93 in the reverse direction. As a result, the slide tables 90 and 91 slide in directions away from each other.
[0044]
Accordingly, the slit plates 82 and 83 slide in the proximity or separation direction above the rectangular laser light incident window 30 to arbitrarily adjust the Y direction width of the laser light incident on the laser light incident window 30. It becomes possible to regulate to the dimension of. In addition, the slit plates 82 and 83 have a gap between the restricting portions 82a and 83a even in the closest state, and do not block the laser light, but allow a part of the laser light extending in the Y direction to enter. It is something to regulate.
[0045]
The gap S between the restricting portions 82a and 83a is the Y-direction width of the laser light incident on the laser light incident window 30, and is the same as the Y-direction width dimension of the light receiving surface 62a of the photoelectric conversion element 62. It is set (indicated by a two-dot chain line in FIG. 3). Therefore, it is possible to reduce the size of the apparatus using the downsized photoelectric conversion element 62.
[0046]
The X-direction drive mechanism 87 includes a pair of linear guides 98 and 99 that guide the movement base 86 in the X direction, an air cylinder 100 that drives the movement base 86 in the X direction, a movable portion 100a of the air cylinder 100, and the movement base 86. It is comprised from the connection part 102 which connects the edge part of this. Therefore, the X-direction drive mechanism 87 drives the movement base 86 in the X direction to restrict the Y-direction width of the laser beam from the standby position (shown by a solid line in FIG. 6) (indicated by a two-dot chain line in FIG. 6). Move to (shown). Then, the restriction portions 82 a and 83 a of the slit plates 82 and 83 extending in the X direction from the moving base 86 are moved to the restriction position so as to cover the laser light incident window 30.
[0047]
Here, the control process executed by the control unit 50 together with the measurement operation of the light reception energy measuring device 18 configured as described above will be described with reference to the flowchart of FIG.
[0048]
Note that the control process of FIG. 8 may be executed periodically, at the time of maintenance, or may be performed by the operator at an arbitrary timing.
[0049]
As shown in FIG. 8, the control unit 50 turns on a measurement start switch (not shown) for measuring the energy of the laser beam in step S11 (hereinafter, “step” is omitted). Proceeding to S12, the X-direction moving base 72 and the Y-direction moving base 74 of the XY stage 26 are moved to separate the workpiece mounting table 70 from the center of the chamber 14 (see FIG. 3).
[0050]
In the next S13, compressed air is supplied from the air switching unit 44 to the lifting mechanism 40 to raise the movable part 42a of the air cylinder 42, and the light receiving part 38 is shown at the measurement position (indicated by a two-dot chain line in FIGS. 3 and 5). Position).
[0051]
Subsequently, in S <b> 14, cooling water is supplied from the cooling water supply unit 46 to the light receiving unit 38 and the slit plates 82 and 83, and the temperature rise of the light receiving unit 38 is suppressed. In S15, the drive motor 94 of the Y-direction drive mechanism 84 of the slit mechanism 32 and the air cylinder 100 of the X-direction drive mechanism 87 are driven so that the restricting portions 82a and 83a of the slit plates 82 and 83 are moved to the laser light incident window. The gap S in the Y direction of the slit plates 82 and 83 is the same as the width dimension in the Y direction of the light receiving surface 62a of the photoelectric conversion element 62. (Indicated by a two-dot chain line in FIG. 3).
[0052]
In the next step S <b> 16, the laser light emitted from the laser light source 20 is irradiated onto the laser light incident window 30 of the chamber 14 through the optical system unit 22. At this time, the range in which the laser light is irradiated onto the laser light incident window 30 is regulated by the gap S between the slit plates 82 and 83 of the slit mechanism 32, and the laser light is irradiated onto a predetermined area of the light receiving surface 62 a of the photoelectric conversion element 62. In this way, by keeping the light receiving area of the laser light applied to the light receiving surface 62a of the photoelectric conversion element 62 constant, the measured light receiving energy can be compared with a preset reference value.
[0053]
Subsequently, in S <b> 17, a laser beam measurement value (light reception energy value) is obtained from the electrical signal output from the photoelectric conversion element 62, the measurement value is stored in the storage device 52, and the difference between the measurement value and the reference value is determined. From this, the deterioration rate of the laser beam can be obtained.
[0054]
In the next S18, the intensity of the laser beam is adjusted to a reference value by a laser beam adjusting mechanism (not shown) provided in the optical system unit 22 based on the measured value of the laser beam. In S19, it is confirmed whether or not a measurement end switch (not shown) is turned on. In S19, when a measurement end switch (not shown) is off, the processes of S16 to S19 are executed again. However, if a measurement end switch (not shown) is turned on in S19, the process proceeds to S20, the energization to the laser light source 20 is stopped, and the laser light irradiation is stopped.
[0055]
Subsequently, in S21, the supply destination of the compressed air from the air switching unit 44 to the lifting mechanism 40 is switched to lower the movable part 42a of the air cylinder 42, and the light receiving part 38 is moved to the standby position (shown by a solid line in FIGS. 3 and 5). Return to the indicated position).
[0056]
In S22, the drive motor 94 of the Y-direction drive mechanism 84 of the slit mechanism 32 and the air cylinder 100 of the X-direction drive mechanism 87 are driven to move the slit plates 82 and 83 from the restriction position to the standby position (solid line in FIG. 6). Move to In S23, the X-direction moving base 72 and the Y-direction moving base 74 of the XY stage 26 are moved to return the workpiece mounting table 70 to the center of the chamber 14 (see FIG. 2).
[0057]
Thereafter, the process proceeds to S24, and the supply of cooling water from the cooling water supply unit 46 to the light receiving unit 38 and the slit plates 82 and 83 is stopped.
[0058]
As described above, in the received light energy measuring device 18, the energy of the laser light is measured by raising the light receiving unit 38 in the vicinity of the mounting position of the glass substrate 12, and therefore, the actual decrease in the laser light can be accurately measured. This makes it possible to adjust the intensity of the laser beam so as to always maintain the reference value.
[0059]
In the above embodiment, when a measurement start switch (not shown) is turned on, the control process shown in FIG. 8 is executed. The energy of the laser beam may be automatically measured based on preset conditions (date, time, number of processes, number of times of laser irradiation, etc.).
[0060]
Moreover, in the said embodiment, although the structure which raises / lowers the light-receiving part 38 from the bottom part of the chamber 14 was mentioned as an example, not only this but the structure which horizontally moves the light-receiving part 38 from the side surface of the chamber 14 is good. Of course.
[0061]
Moreover, although the case where the received light energy measuring apparatus was used for the laser processing machine was described in the above embodiment, the present invention is not limited to this, and any apparatus other than the laser processing machine can be applied as long as the apparatus uses laser light. Needless to say.
[0062]
Moreover, in the said embodiment, the laser processing machine which processes the glass substrate 12 was mentioned as an example, However, Of course, this invention is applicable also when processing workpiece | work other than the glass substrate 12. FIG.
[0063]
In the above-described embodiment, the configuration in which the light receiving portion 38 is inserted into the internal space of the chamber 14 has been described.
[0064]
【The invention's effect】
As described above, according to the first aspect of the present invention, in the light receiving energy measuring device that measures the light receiving energy of the laser light irradiated onto the workpiece, the photoelectric conversion element that outputs a signal corresponding to the light receiving energy of the laser light; And a moving mechanism that moves the photoelectric conversion element to the vicinity of the workpiece processing position when measuring the received light energy of the laser beam. Therefore, when the received energy of the laser beam is not measured, the photoelectric conversion element is moved from the workpiece processing position. By separating them, the apparatus can be reduced in size.
[0065]
According to a second aspect of the present invention, the photoelectric conversion element is provided with an XY stage on which the workpiece is placed and a sealed container for storing the XY stage, and the photoelectric conversion element is moved by the moving mechanism while the XY stage is retracted. Therefore, the photoelectric conversion element can be moved inside the sealed container so as not to interfere with the XY stage, the apparatus can be reduced in size, and the workpiece is irradiated with the photoelectric conversion element. The received light energy can be accurately measured.
[0066]
According to the third aspect of the present invention, the photoelectric conversion element is moved up and down by the moving mechanism provided at the bottom of the sealed container. Therefore, when the received light energy of the laser beam is not measured, the photoelectric conversion element is processed into the workpiece. The apparatus can be reduced in size by being lowered from the position.
[0067]
According to the invention described in claim 4, since the moving mechanism includes the cooling means for cooling the photoelectric conversion element, the apparatus can be miniaturized by cooling the photoelectric conversion element from the outside.
[0068]
According to the invention of claim 5, the hermetically sealed container is provided with a window through which the laser light is incident, and the window is opposed to the window, and the irradiation range of the laser light has a size according to the size of the photoelectric conversion element. Since the laser beam restricting means that regulates the width of the laser beam is provided, it is possible to measure the light receiving energy of the laser beam received in a certain irradiation range, and the measurement accuracy can be improved and the size can be reduced. The device can be miniaturized using the photoelectric conversion element.
[0069]
Further, according to the invention described in claim 6, since the laser processing machine includes the light receiving energy measuring device according to any one of claims 1 to 5, when the light receiving energy of the laser beam is not measured, the photoelectric conversion element is used. By separating the workpiece from the machining position, the apparatus can be reduced in size.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing a laser processing machine to which an embodiment of a received light energy measuring apparatus according to the present invention is applied.
FIG. 2 is a front view showing a laser processing machine to which an embodiment of the received light energy measuring apparatus according to the present invention is applied.
FIG. 3 is a side view of the laser processing machine.
FIG. 4 is a plan view of a laser processing machine.
FIG. 5 is a rear view showing the lifting mechanism 40 in an enlarged manner.
6 is an enlarged plan view showing a slit mechanism 32. FIG.
7 is an enlarged rear view showing the slit mechanism 32. FIG.
FIG. 8 is a flowchart for explaining control processing executed by a control unit 50;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Laser processing machine 12 Glass substrate 14 Chamber 16 Laser light unit 18 Light reception energy measuring device 20 Laser light source 22 Optical system unit 26 XY stage 30 Laser light incident window 32 Slit mechanism 38 Light receiving part 40 Lifting mechanism 42 Air cylinder 44 Air switching unit 46 Cooling water supply unit 50 Control unit 62 Photoelectric conversion element 70 Work placement table 72 X-direction moving base 74 Y-direction moving base 82, 83 Slit plate 84 Y-direction driving mechanism 86 Moving base 87 X-direction driving mechanisms 90, 91 Sliding Base 92, 93 Feed screw 94 Drive motor 100 Air cylinder

Claims (6)

In the light receiving energy measuring device that measures the light receiving energy of the laser beam irradiated to the workpiece,
A photoelectric conversion element that outputs a signal corresponding to the received light energy of the laser beam;
A moving mechanism that moves the photoelectric conversion element to a position near the machining position of the workpiece when measuring the light receiving energy of the laser beam;
A light receiving energy measuring device comprising: An XY stage on which the workpiece is placed;
A sealed container for storing the XY stage,
The received light energy measuring apparatus according to claim 1, wherein the moving mechanism moves the photoelectric conversion element to a vicinity of a machining position of the workpiece while the XY stage is retracted. The received light energy measuring apparatus according to claim 2, wherein the moving mechanism is provided at a bottom portion of the sealed container and moves the photoelectric conversion element up and down. 4. The received light energy measuring apparatus according to claim 1, wherein the moving mechanism includes a cooling unit for cooling the photoelectric conversion element. The sealed container is
A window into which the laser beam is incident;
Laser light restricting means that is provided facing the window and restricts the width of the laser light so that the irradiation range of the laser light is a size corresponding to the size of the photoelectric conversion element;
The light receiving energy measuring device according to claim 2, comprising: A laser processing machine comprising the received light energy measuring device according to any one of claims 1 to 5.

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