JP2004358615A - Sucking nozzle for minute fragile amorphous chip, and assembling and mounting device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an sucking nozzle which picks up even a minute fragile amorphous chip without damaging the chip and mounts it on an object with stable positioning accuracy, and also to provide an assembling and mounting device using the same. <P>SOLUTION: The sucking nozzle has a rubber thin film 8 firmly attached to the tip thereof, and the thin film 8 has a hole 8a formed therein at a location that matches with a nozzle hole. The size of the hole is determined such that a pressure difference of about 15 kPa is generated between the time the chip is sucked and the time the chip is not sucked. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a device for precisely mounting and assembling a micro-fragile irregular-shaped chip used for a semiconductor component, a crystal, an optical communication-related component, etc. on a substrate or a holder coated with an adhesive, and a chip suction nozzle used for the device. .
[0002]
[Prior art]
As a method of handling and mounting general semiconductor parts, crystal, and micro-fragile irregular-shaped chip parts related to optical communication, chip parts are supplied from parts feeders and chip parts dug out from trays dug according to chip shape. There is a method in which a chip is picked up by a vacuum suction chuck using a metal nozzle, the shape of the chip is recognized using an image processing method, and the chip is mounted at a predetermined mounting position (see Patent Document 1).
In addition, as another method, a method of handling by mechanical chucking instead, and mounting chip components by using image processing method, or a method of positioning by mechanical centering and mounting chip components There is.
Further, there is a method of mechanically correcting the position of a chip component after mounting the chip component and positioning the chip component.
[0003]
[Patent Document 1]
JP 2000-357894 A
[Problems to be solved by the invention]
However, micro-fragile irregular-shaped chips often break when supplied from a parts feeder, and therefore need to be taken out of a dug-out tray according to the chip shape. Conventionally, for this purpose, there is a method of using a metal nozzle and removing chips from a tray by vacuum suction. In this method, the chips placed in the dug of the tray can move by the clearance between the dug and the tip. Nozzle portion is taken in. For this reason, the shape of the chip cannot be accurately recognized, and it is necessary to check the chip position in the tray by image recognition or the like before taking out the chip.
[0005]
Also, in the case of a chip with a small irregular shape, even if the contact area between the nozzle and the chip or the suction port area of the nozzle is maximized according to the chip shape, the chip holding capacity is weak, and the chip is mounted on a substrate or holder. If the chip comes into contact with the adhesive at a moment, the chip moves away from the nozzle, so that the mounting position cannot be stabilized.
[0006]
In addition, when mounting using chucking for handling, the chip holding force is improved, but it is necessary to increase the clearance between the chip and the holder and the chip interval. When one to three micro-fragile irregular shaped chips 3 or 4 with different dimensions and shapes of about 1 mm are mounted on a shaped holder 1 or a flat substrate 2 as shown in FIG. However, there is a disadvantage that the mounting density is lowered.
[0007]
Also, when recognizing the chip shape by image processing, the chuck portion of the chip is taken in together, so that the chip shape cannot be accurately recognized, and the structure of the chuck needs to be changed depending on the product type. There is also a disadvantage that it cannot be easily handled.
[0008]
In addition, handling by chucking, mechanical positioning of the chip, and correcting the position after mounting the chip on the substrate or holder may cause scratches, dirt, damage, etc. on the surface if the chip is micro-fragile irregular shape There is a problem that it is easy and the structure itself of the assembling and mounting apparatus becomes complicated and expensive.
[0009]
Also, in any of the above methods, when the chip is taken out of the tray, or when the chip taken out is mounted on a substrate or a holder, the chip is easily damaged and cannot be pressed strongly, so that the adhesive material is Has the disadvantage that it does not go around.
[0010]
The present invention has been made in view of the above-described problems of the related art, and has as its object the purpose of picking up a micro-fragile irregular-shaped chip without damaging the chip. An object of the present invention is to provide a suction nozzle and an assembling / mounting device which can be mounted with stable positional accuracy.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the suction nozzle according to the present invention has a rubber thin film adhered and fixed to the tip end, and a position aligned with the nozzle hole of the thin film is approximately 15 kPa during suction and non-suction. Is formed by providing a hole having a size such that a pressure difference is generated.
[0012]
According to the present invention, the surface of the suction nozzle is matte black.
[0013]
The assembling and mounting apparatus according to the present invention is equipped with the suction nozzle described above, and is picked up and brought by the suction nozzle onto a metal or ceramic substrate or holder coated with an adhesive on the surface. An assembling / mounting apparatus in which the chip is positioned and then released to assemble the chip on a substrate or a holder.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the illustrated embodiments. 1A and 1B are side views of an embodiment of a suction nozzle according to the present invention, in which FIG. 1A shows an exploded state, and FIG. 1B shows an assembled state. FIG. 2 is a developed view of a thin film applied to the suction nozzle, and FIG. 3 is an enlarged end view of the suction nozzle shown in FIG.
[0015]
In the figure, 5 is an intake pipe connected to an intake device (not shown), 6 is a metal nozzle which is exchangeably fixed to the tip of the intake pipe 5 by a set bolt 7 and has a conical tip 6a and a neck 6b. Is made of a rubber material such as silicon, PVC, vinyl or the like having a thickness of 0.1 to 0.3 mm, and has a hole 8a at the center and cuts 8b at both sides of the center as shown in FIG. The thin film 9 is an O-ring fitted to the nozzle neck 6b to fix the thin film 8 to the nozzle 6 when the thin film 8 is applied to the nozzle 6.
When the size of the micro-fragile amorphous chip to be sucked is about 1 mm, the hole 8a has a size such that a pressure difference of about 15 kPa is obtained between when the chip is sucked and when the chip is not sucked, specifically, 0.2 to 0. It is opened to have a diameter of 0.3 mm. The hole 8a may be opened using a predetermined tool after the thin film 8 is fitted to the nozzle 6.
[0016]
At the time of use, a strip-shaped thin film 8 is fitted to a predetermined nozzle 6 by bending it as shown in FIG. 1 (a), and an O-ring 9 is fitted thereon, and this is fitted into the neck 6b. Then, the thin film 8 can be fixed to the nozzle 6. In this case, since the thin film 8 has the cut 8b, it can be easily folded in half, and when it is put on the nozzle 6, the hole 8a and the nozzle opening can be easily aligned.
[0017]
FIG. 4 shows another embodiment of the nozzle according to the present invention. In this embodiment, instead of providing the neck portion 6b on the metallic nozzle 6, a double-sided adhesive tape 10 is wound around the base of the nozzle 6 in advance, and when the thin film 8 is bent and fitted to the nozzle 6, both end portions thereof are This embodiment is different from the above embodiment in that the adhesive tape is attached to the outer surface. According to this embodiment, there is an advantage that attachment of the thin film 8 becomes simpler.
[0018]
FIG. 5 shows a main configuration of an embodiment of the assembling and mounting apparatus according to the present invention. In the figure, reference numeral 11 denotes a nozzle unit which is moved in the X and Y directions by a known XY moving mechanism (not shown). The nozzle unit 11 has three nozzles 6A, 6B, 6C, a Z-axis motor 14 for rotating a vertical ball screw 13 screwed to a nut 12 integral with the nozzles 6A, 6B, 6C to move the nozzles 6A, 6B, 6C up and down, and a belt 15 for the nozzles 6A, 6B. , 6C, and a back blade 17 mounted on the nozzles 6A, 6B, 6C, as shown in FIG. 5, the three nozzles 6A, 6B, 6C are held in a row in the transport direction (X direction) of the holder 1 or the substrate 2.
The nozzle unit 11 is moved in the Y direction from the position shown in the figure by the XY moving mechanism, and the nozzles 6A, 6B, 6C vacuum-adsorb the extremely weak chip 3 of about 1 mm stored in the tray 18. Then, the chuck is returned to the illustrated position again.
Further, in FIG. 5, reference numeral 19 denotes a cover case housing the lens system, which is provided with a horizontally long slit opening 21 on the upper surface of a central cylindrical portion 20, and a half mirror 22 and a CCD 23a are linearly arranged below the slit opening 21. A line sensor 23 arranged in a shape is provided, and a monitor camera 24 is provided beside the half mirror 22. The slit 21 and the line sensor 23 are provided with their longitudinal directions directed in the Y direction orthogonal to the direction of conveyance (X direction) of the holder 1 or the substrate 2.
A line light emitting section 26 is provided on the upper surface of the box section 25 of the cover case 19. The line light emitter 26 emits slit-like light from below toward the back plate 17 of the nozzles 6A, 6B, 6C passing over the slit 21. The light reflected by the back plate 17 enters the line sensor 23 and the monitor camera 24 through the slit 21, and the chip 3 is observed as a black silhouette in the brightly shining back plate 17.
[0019]
This assembling and mounting apparatus operates as follows. First, the nozzle unit 11 is moved from the illustrated position in the Y direction, brought to a position immediately above the tray 18, and stopped. Then, the Z-axis motor 14 is driven to lower any one of the nozzles 6A, 6B, 6C, and to vacuum-chuck the chip 3 stored in the tray 18 to the tips of the nozzles 6A, 6B, 6C. Pick up. Next, after operating the XY moving mechanism again to return the nozzle unit 11 to the position shown in the figure, the nozzles 6A, 6B, and 6C are moved linearly above the slit 21 in the X direction, and the line sensor is moved. 23 sequentially captures the images of the respective chips 3. From the image thus captured, the position of each chip 3 is recognized by a recognition unit (not shown). Based on the recognition result, the XY moving mechanism and the .theta. Motor 16 are driven one after another to correct the displacement of the chips 3 in the X, Y, and .theta. Directions. Are mounted one after another at predetermined coordinate positions. Each chip 3 mounted in this manner is fixed to the holder 1 or the substrate 2 by an adhesive applied in advance.
The basic configuration and operation of the above-described assembling and mounting apparatus except for the nozzles 6A, 6B, and 6C are known, and for example, refer to Patent Document 1 in more detail.
[0020]
As is apparent from the above description, in the assembling and mounting apparatus according to the present invention, the nozzle 6 can be easily replaced by the set bolt 7, so that even if the type of the micro-fragile irregular shaped chip 3 is changed, The optimum nozzle 6 can be easily associated. The nozzle 6 is provided with a rubber thin film 8 serving as a cushion, and is provided with a hole 8a for generating an appropriate suction force. In addition to being able to damage the chip 3 or deform the chip 3, the chip 3 can be prevented from being separated from the nozzle tip at the moment when the chip 3 comes into contact with the adhesive. And the chip 3 can be stably mounted on the substrate 2.
Further, by applying a black mat to the rubber thin film 8, light reflected from other than the chip 3 can be cut off at the time of image recognition of the micro-fragile irregular-shaped chip 3. Even if the position of the chip adsorbed on the nozzle is slightly shifted from the normal position, the clearance between the nozzles makes it possible to very clearly recognize only the chip. Since the O-ring and the double-sided adhesive tape are used for attaching the thin film 8 to the nozzle 6, the thin film 8 can be easily replaced.
[0021]
【The invention's effect】
As described above, according to the present invention, it is possible to provide an assembling / mounting apparatus capable of performing image processing by stable shape recognition even with a micro-fragile irregular-shaped chip and stabilizing the mounting accuracy of the chip on a holder or a substrate. . Further, according to the present invention, it is possible to provide a suction nozzle suitable for an assembling and mounting apparatus or the like, which can be strongly pressed without causing damage or deformation to the chip and can be replaced easily and in a short time.
[Brief description of the drawings]
FIG. 1 is a side view of one embodiment of a suction nozzle according to the present invention, wherein (a) shows an exploded state and (b) shows an assembled state.
FIG. 2 is a development view of a thin film applied to a suction nozzle.
FIG. 3 is an enlarged end view of the suction nozzle shown in FIG. 1 (b).
4A and 4B are side views of another embodiment of the suction nozzle according to the present invention, wherein FIG. 4A shows an exploded state, and FIG. 4B shows an assembled state.
FIG. 5 is a configuration diagram of a main part of an embodiment of the assembling and mounting apparatus according to the present invention.
FIG. 6 shows an example of a chip mounted on a concave metal or ceramic holder, wherein (a) is a plan view and (b) is a side view.
7A and 7B show another example of a chip mounted on a metal or ceramic substrate, wherein FIG. 7A is a plan view and FIG. 7B is a side view.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 concave metal or ceramic holder 2 metal or ceramic substrate 3, 4 micro-fragile irregular shaped chip 5 suction pipe 6 suction nozzle 7 set bolt 8 rubber thin film 9 O-ring 10 double-sided adhesive tape 11 nozzle unit 12 nut 13 ball screw 14 Z-axis motor 14
15 Belt 15
16 θ motor 16
17 Back Blade 18 Tray 19 Cover Case 20 Central Cylindrical Part 21 Slit Opening 22 Half Mirror 23 Line Sensor 24 Monitor Camera

Claims (3)

A rubber thin film is adhered and fixed to the tip portion, and a hole having a size such that a pressure difference of about 15 kPa is generated at the time of suction and at the time of non-suction at a position aligned with the nozzle hole of the thin film, Suction nozzle for micro-fragile irregular shaped chips. 2. The suction nozzle for a micro-fragile irregular shaped chip according to claim 1, wherein the surface has a matte black color. A micro-fragile irregular shaped chip which is provided with the suction nozzle according to claim 1 or 2 and is picked up and brought by the suction nozzle on a metal or ceramic substrate or holder coated with an adhesive on the surface. An assembling and mounting apparatus wherein the chip is mounted on the substrate or holder by releasing after positioning.

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