JP2004356025A - Communications package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a communications package which can prevent generation of electrostatic discharge due to contact of a fingertip with a connector and the occurrence of connection failure due to adherence of dusts. <P>SOLUTION: In the protection structure for protecting a connector 4 exposed from a case 1 of a communications package, a protection member 5 which is provided in the case 1 in free appearance and covers the connector 4 at the position of the exit of the case 1, and is hidden in the case pushed by the connector when this connector 4 is inserted into the connector, and an elastic body 6 which elastically energizes the protection member 5 hidden in the case 1 in the direction of coming out of the case 1 are provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a protection structure for protecting connection terminals of a communication package used for an optical transceiver.
[0002]
[Prior art]
In general, as an optical transmission / reception module connected to a motherboard of a communication device, a module called a SFP (Small Form Factor Pluggable) is known.
[0003]
FIG. 6A is a perspective view of the SFP module, and FIG. 6B is an enlarged view of a card edge. FIG. 7 is a perspective view of a communication device to which the SFP module of FIG. 6A is connected.
[0004]
As shown in FIG. 6A, the SFP module 200 is configured to be connected to an optical fiber cable, and various kinds of optical elements such as an optical element optically connected to the optical fiber cable are provided in the housing 1. A communication card 2 on which electronic components and the like are mounted is provided.
[0005]
As shown in FIG. 6B, the communication card 2 has a connection terminal (pin) 4 made of a conductor exposed at the card edge 3 from the housing 1, and as shown in FIG. By connecting the SFP module 200 to the motherboard 100 of the communication device, the connection terminal 4 is inserted into the connector 101 of the motherboard 100 and is electrically connected (for example, see Patent Document 1).
[0006]
[Patent Document 1]
US Pat. No. 6,399,918 B1
[Problems to be solved by the invention]
However, in the SFP module 200, since the connection terminal 4 is exposed from the housing 1, when carrying the SFP module 200, the fingertip of the worker touches the connection terminal 4 exposed from the housing 1 and electrostatic breakdown occurs. There was a risk of doing so.
[0008]
Furthermore, if the SFP module 200 is removed from the motherboard 100 and left as it is, there is a problem that dust which causes a connection failure to the connection terminals 4 adheres.
[0009]
For this reason, when the SFP module 200 is removed from the motherboard 100, it is conceivable to attach a protective cover to the card edge 3. However, if the SFP module 200 and the protective cover are separate, it takes only time and effort to attach. In addition, when work is performed in an environment with a lot of dust, dust easily adheres to the protective cover, and this dust similarly adheres to the connection terminal 4 and causes a poor connection.
[0010]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a communication package capable of preventing the occurrence of electrostatic destruction due to a fingertip touching a connection terminal and the occurrence of a connection failure due to the attachment of dust.
[0011]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention according to claim 1 includes a board on which an optical component for communication and an electronic component are mounted, a housing for protecting the board, and a connection for connecting the board to a transmission device. In a communication package including terminals, a movable protection member for covering the connection terminals is provided.
[0012]
According to a second aspect of the present invention, in addition to the configuration of the first aspect, an elastic body is provided at one end of the protection member, and when the connection terminal is pulled out of a connector of the transmission device, the elastic body is resiliently attached. The protection member is configured to return to its original position by a force.
[0013]
According to a third aspect of the present invention, in addition to the configuration of the first aspect, the protective member is provided with a cleaner that contacts the connection terminal and cleans the connection terminal surface while moving.
[0014]
According to a fourth aspect of the present invention, in addition to the configuration according to any one of the first to third aspects, a projection is formed on a side surface of the protection member, and a groove for supporting the projection is provided in the housing. is there.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0016]
FIG. 1A is a side view of an SFP module to which the present invention is applied, and FIG. 1B is a front view thereof.
[0017]
The SFP module has an optical fiber cable connected thereto. As shown in FIGS. 1A and 1B, the SFP module is optically connected to the optical fiber cable in the housing 1. A communication card 2 on which various electronic components such as optical elements are mounted is provided.
[0018]
The communication card 2 has a card edge 3 exposed from the housing 1 and has a rectangular cross-sectional shape. A connection terminal (pin) 4 made of a conductor is formed on one or both sides of the card edge 3.
[0019]
As shown in FIG. 2, the connection terminal 4 can be inserted into and removed from the connector 101 on the motherboard 100 side, and is electrically connected when inserted into the connector 101.
[0020]
In the present embodiment, the SFP module has a protection structure for protecting the connection terminal 4.
[0021]
The protection structure is provided in the housing 1 of the SFP module so as to be freely retractable, and covers the connection terminal 4 at a position protruding from the housing 1 and is pushed by the connector 101 when the connection terminal 4 is inserted into the connector 101. A protection member 5 immersed in the body 1 and an elastic body 6 such as a spring that resiliently urges the protection member 5 immersed in the housing 1 in a direction of coming out of the housing 1 are provided.
[0022]
The protection member 5 is formed of a protection plate that covers the outside of the housing of the card edge 3, and is arranged in parallel with the connection terminal 4 and extending in the front-rear direction. Further, the protection member 5 has an abutting portion 7 which abuts on the connector 101 and is pushed by the connector 101.
[0023]
At the end of the protection member 5 on the connector 101 side, a cleaning unit 11 for cleaning the connection terminal 4 is provided.
[0024]
The cleaning unit 11 includes a holding member 8 formed so as to surround the card edge 3 and a cleaner 12 provided on an inner wall of an insertion hole 8h formed in the holding member 8 to insert the card edge 3; In addition, the cleaner 12 is formed of a shape and a material that can efficiently prevent dust when the cleaner 12 slides.
[0025]
Further, the housing 1 is formed with a guide groove 10 for guiding the protection member 5 which is pushed back against the connector 101 when the connection terminal 4 is inserted into the connector 101 into the housing 1.
[0026]
Specifically, the guide groove 10 is formed with a width capable of supporting the protrusions 9 extending in the width direction on both sides of the protection member 5, and is parallel to the both sides of the card edge 3, and the protection member 5 is 3 is formed so as to be movable from a position covering the third connection terminal 4 to a position that can be accommodated in the housing 1.
[0027]
The elastic body 6 is provided between the housing 1 and the pushing-side end of the protection member 7 so that the protection member 5 can be pushed out of the housing 1 along the guide groove 10. .
[0028]
Next, the operation of the present embodiment will be described with reference to FIGS.
[0029]
As shown in FIG. 2, when the SFP module to which the present invention is applied is connected to the motherboard 100 of the communication device, the connection terminal 4 is inserted into the connector 101 of the motherboard 100 and is electrically connected. At this time, the contact portion 7 of the protection member 5 comes into contact with the connector 101 and is pushed, and the protection member 5 is pushed into the housing 1 while being guided by the guide groove 10. This does not hinder the operation of inserting the connection terminal 4 into the connector 101.
[0030]
Further, the cleaner 12 slides in parallel with the card edge 3 in a state in which the cleaner 12 is in contact with the connection terminal 4 as the protection member 5 is pushed in, so that the connection terminal 4 is rubbed and cleaned.
[0031]
When the connection terminal 4 is pulled out from the connector 101, as shown in FIG. 1A, the protection member 5 is pushed out of the housing 1 while being guided by the guide groove 10 assisted by the elastic force of the elastic body 6. The connection terminal 4 is automatically returned to the original position and covers the connection terminal 4, so that the connection terminal 4 is protected from dust and static electricity. However, the elastic force of the elastic body 6 does not have such a force that when the connection terminal 4 is attached to the connector 101, it is naturally pulled out.
[0032]
Further, when the protection member 5 is pushed out of the housing and is pushed in, the cleaner 12 attached to the holding member 8 slides in parallel with the card edge 3 in a state of contact with the connection terminal 4, so that the connection terminal 4 is rubbed and cleaned.
[0033]
As described above, when the connection terminal 4 of the SFP module is not inserted into the connector 101, the protection member 5 covers the connection terminal 4, so that the occurrence of electrostatic breakdown due to the fingertip touching the connection terminal 4 can be prevented.
[0034]
Furthermore, even if dust adheres to the connection terminal 4 of the card edge 3, the dust adhered to the connection terminal 4 is surely removed when the SFP module is inserted or removed, so that the occurrence of poor connection due to dust can be prevented. Can be prevented.
[0035]
Next, a modified example of the present embodiment will be described.
[0036]
FIG. 3 is a side view showing a modified example of the SFP module of FIG.
[0037]
As shown in FIG. 3, this protection structure has a basic configuration similar to that of the present embodiment, but includes a protection member 35 including a plurality of protection plates 31, 32, and 33 surrounding the card edge 3. It is a thing.
[0038]
With this configuration, it is possible to more reliably prevent the occurrence of electrostatic breakdown due to the fingertip touching the connection terminal 4 and completely prevent dust from adhering.
[0039]
FIG. 4 is a side view showing another modified example of the SFP module of FIG.
[0040]
As shown in FIG. 4, in this protection structure, an elastic body 46 having a larger elastic force is provided instead of the elastic body shown in FIG.
[0041]
Further, the protection structure is such that when the protection member 5 is pushed into the housing 1, the hook 40 is engaged with the protection member 5 to regulate the protection member 5 from sliding toward the connector 101 of the motherboard 100. And an operation member (not shown) for operating the hook 40 from outside.
[0042]
The hook 40 is provided with a lever 42 pivotally supported by the housing 1, a claw 41 provided at one end (operating end) of the lever 42, and a spring 41 for urging the claw 41 toward the protective member 5. And a spring (not shown) for energizing it. The hook 40 has a relief surface 41n for releasing the claw portion 41 from the slide path of the protection member 5 when the hook 40 contacts the protection member 5 that slides forward. Specifically, the relief surface 41n is formed on the slide path of the protrusion 9 of the protection member 5 so as to be inclined downward.
[0043]
When the protection member 5 is pushed into the housing 1 by inserting the card edge 3 of the SFP module into the connector 101, the projection 9 of the protection member 5 hits the relief surface 41n and pushes the claw 41 upward. Then, when the projection 9 passes below the claw portion 41, the hook 40 rotates to return the claw 41 to the original position by the elastic force of the spring, and the claw portion 41 is engaged with the projection 9. At this time, the insertion of the card edge 3 into the connector 101 is completed. When removing the SFP module from the connector 101, the hook 40 is rotated against the elastic force of the spring by operating the operation member, and the claw portion 41 is detached from the projection 9. As a result, the slide restriction of the protection member 5 is released, and the elastic force of the elastic body 46 is transmitted to the connector 101. Since the elastic body 46 has a sufficiently larger elastic force than the elastic body 6 described above, the card edge 3 can be assisted with a larger force when the card edge 3 is pulled out from the connector 101, and the SPF module can be easily pulled out from the connector 101. Can be.
[0044]
FIG. 5 is a side view showing another modified example of the SFP module of FIG.
[0045]
As shown in FIG. 5, this protection structure has the same basic configuration as that of the present embodiment, but includes a dustproof curtain 51 for preventing dust from entering from the side of the card edge 3. Things.
[0046]
The dustproof curtain 51 is formed of a flexible thin material such as cloth, for example, and is provided on both sides of the card edge 3. Specifically, the dustproof curtain 51 is provided to extend between the extended end of the protection member 5 and the housing 1.
[0047]
With this configuration, when the card edge 3 is not inserted into the connector 101, the dustproof curtain 51 can be stretched to prevent dust from adhering to the connection terminals 4 of the card edge 3. Further, when the card edge 3 is inserted into the connector 101, the dustproof curtain 51 is loosened and folded, so that it does not hinder the insertion of the card edge 3 into the connector 101.
[0048]
In this embodiment, the case where the present invention is applied to the SFP module has been described. However, it is needless to say that the present invention can be applied to other types of optical transmitting and receiving modules.
[0049]
【The invention's effect】
In short, according to the present invention, it is possible to prevent the occurrence of electrostatic breakdown due to the fingertip touching the connection terminal and the occurrence of a connection failure due to the attachment of dust.
[Brief description of the drawings]
FIG. 1A is a side view of an SFP module to which the present invention is applied, and FIG. 1B is a front view thereof.
FIG. 2 is an explanatory diagram when a card edge of the SFP module of FIG. 1 is inserted into a connector.
FIG. 3 is a side view showing a modified example of the SFP module of FIG. 1;
FIG. 4 is a side view showing a modified example of the SFP module of FIG. 1;
FIG. 5 is a side view showing a modified example of the SFP module of FIG. 1;
FIG. 6A is a perspective view of an SFP module, and FIG. 6B is an enlarged view of a card edge portion of FIG.
FIG. 7 is a perspective view of a communication device to which the SFP module is connected.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Case 3 Card edge 4 Connection terminal 5 Protective member 6 Elastic body 7 Contact part 11 Cleaner

Claims (4)

A communication package comprising a substrate on which a communication optical component and an electronic component are mounted, a housing for protecting the substrate, and a connection terminal for connecting the substrate to a transmission device, covers the connection terminal. A communication package comprising a movable protection member. An elastic body is provided at one end of the protection member, and when the connection terminal is pulled out from the connector of the transmission device, the protection member returns to the original position by the elastic force of the elastic body. Communication package described. The communication package according to claim 1, wherein the protection member is provided with a cleaner that contacts the connection terminal and cleans the connection terminal surface while moving. The communication package according to any one of claims 1 to 3, wherein a protrusion is formed on a side surface of the protection member, and a groove for supporting the protrusion is provided in the housing.

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