JP2004336027A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004336027A5 JP2004336027A5 JP2004121505A JP2004121505A JP2004336027A5 JP 2004336027 A5 JP2004336027 A5 JP 2004336027A5 JP 2004121505 A JP2004121505 A JP 2004121505A JP 2004121505 A JP2004121505 A JP 2004121505A JP 2004336027 A5 JP2004336027 A5 JP 2004336027A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004121505A JP4502691B2 (ja) | 2003-04-16 | 2004-04-16 | ｐ形オーミック電極構造、それを備えた化合物半導体発光素子及びＬＥＤランプ |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003111725 | 2003-04-16 | ||
| JP2004121505A JP4502691B2 (ja) | 2003-04-16 | 2004-04-16 | ｐ形オーミック電極構造、それを備えた化合物半導体発光素子及びＬＥＤランプ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004336027A JP2004336027A (ja) | 2004-11-25 |
| JP2004336027A5 true JP2004336027A5 (enExample) | 2007-05-10 |
| JP4502691B2 JP4502691B2 (ja) | 2010-07-14 |
Family
ID=33513211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004121505A Expired - Fee Related JP4502691B2 (ja) | 2003-04-16 | 2004-04-16 | ｐ形オーミック電極構造、それを備えた化合物半導体発光素子及びＬＥＤランプ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4502691B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102410788B1 (ko) | 2015-06-30 | 2022-06-21 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY115336A (en) * | 1994-02-18 | 2003-05-31 | Ericsson Telefon Ab L M | Electromigration resistant metallization structures and process for microcircuit interconnections with rf-reactively sputtered titanium tungsten and gold |
| JP3767660B2 (ja) * | 1998-03-17 | 2006-04-19 | 昭和電工株式会社 | 積層構造体及びそれを用いた化合物半導体デバイス |
| JP4083877B2 (ja) * | 1998-06-30 | 2008-04-30 | シャープ株式会社 | 半導体発光素子および半導体発光装置 |
-
2004
- 2004-04-16 JP JP2004121505A patent/JP4502691B2/ja not_active Expired - Fee Related