JP2004331814A - Modified fluororesin composition and modified fluororesin molded product - Google Patents
Modified fluororesin composition and modified fluororesin molded product Download PDFInfo
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Abstract
Description
【０００１】
【発明の属する技術分野】
本発明は、耐摩耗性、耐クリープ性に優れ、摺動部品、シール品、パッキン、ガスケット、半導体製造用容器・治具・配管等に利用できる、ふっ素樹脂を改質してなる組成物及びその成形体に関するものである。
【０００２】
【従来の技術】
ふっ素樹脂は、低摩擦性、耐熱性、電気特性、耐薬品性やクリーン性（非汚染性）に優れており、産業、民生用の各種用途に広く利用されている。しかしふっ素樹脂は摺動環境下や高温での圧縮環境下で、摩耗やクリープ変形が大きく、使用できないケースがあった。このためふっ素樹脂にガラス繊維やカーボン繊維等の充填剤を加えることにより、摩耗やクリープ変形を改善する対策がとられてきた。しかしこのような手法では摺動する相手材がアルミ等の軟質金属であった場合、相手材を削り損傷させてしまうという問題があった。この解決法として、種々の充填剤が検討されている。
【０００３】
相手材を損傷しない充填剤として例えばポリアミドイミド樹脂や芳香族系ポリエステル樹脂等があるが、これらをふっ素樹脂に添加しても、高速や高荷重下あるいは摺動させる相手側の表面粗さが大きい等の苛酷な摺動環境下では、必ずしも耐摩耗性や耐クリープ性が十分とは言えなかった。
【０００４】
一方、充填剤を加えることなく、ふっ素樹脂そのものを改質して、耐摩耗性の優れた摺動部材を得ようとするものとして、特許文献１に示す改質ふっ素樹脂がある。
【０００５】
【特許文献１】
特開２０００−１２９０１９号公報
【０００６】
【発明が解決しようとする課題】
しかしながら、この改質ふっ素樹脂においても、やはり苛酷な摺動環境下では、耐摩耗性や耐クリープ性が十分とは言えなかった。
【０００７】
従って本発明の目的は、過酷な摺動環境下においても優れた耐摩耗性、耐クリープ性を有し、しかも相手材を損傷させることなく、ふっ素樹脂本来の良好な特性を実現できる改質ふっ素樹脂組成物及びその成形体を提供することにある。
【０００８】
【課題を解決するための手段】
上記の目的を達成するため、本発明の改質ふっ素樹脂組成物は、改質用ふっ素樹脂を不活性ガス雰囲気下でその融点以上に加熱した状態で電離性放射線を照射することにより改質した改質ふっ素樹脂と、未改質のふっ素樹脂と、ポリアミドイミド樹脂とを含有することを特徴とする。
【０００９】
また、前記改質ふっ素樹脂の重量が全重量に対し５重量部〜５０重量部、前記ポリアミドイミド樹脂の重量が全重量に対し５重量部〜２０重量部であり、かつ改質ふっ素樹脂とポリアミドイミド樹脂の合計重量が、全重量に対し１０重量部〜６０重量部であることが望ましい。
【００１０】
さらに、前記改質用ふっ素樹脂が、テトラフルオロエチレン系重合体、テトラフルオロエチレン−パーフルオロ（アルキルビニルエーテル）系共重合体及びテトラフルオロエチレン−ヘキサフルオロプロピレン系共重合体から選ばれた少なくとも１種以上とすることができる。
【００１１】
同様に、前記未改質のふっ素樹脂が、テトラフルオロエチレン系重合体、テトラフルオロエチレン−パーフルオロ（アルキルビニルエーテル）系共重合体及びテトラフルオロエチレン−ヘキサフルオロプロピレン系共重合体から選ばれた少なくとも１種以上とすることができる。
【００１２】
また、前記改質用ふっ素樹脂または未改質のふっ素樹脂がテトラフルオロエチレン系重合体であり、更に、１モル％以下の異種フルオロモノマを含有するものとすることができる。
【００１３】
また、前記改質ふっ素樹脂は、結晶化熱量が４０Ｊ／ｇ以下、融点が３２５℃以下であることが望ましい。
【００１４】
さらに、前記改質ふっ素樹脂は、改質用ふっ素樹脂を酸素濃度１０ｔｏｒｒ以下の不活性化ガス雰囲気下で、且つその融点以上に加熱された状態で電離性放射線を照射線量１ｋＧｙ〜１０ＭＧｙの範囲で照射したすることにより形成したものとすることができる。
【００１５】
また、本発明の改質ふっ素樹脂成形体は、改質用ふっ素樹脂を不活性ガス雰囲気下でその融点以上に加熱した状態で電離性放射線を照射することにより改質した改質ふっ素樹脂と、未改質のふっ素樹脂と、ポリアミドイミド樹脂とを含有する改質ふっ素樹脂組成物を所定の形状に成形してなることを特徴とする。
【００１６】
【発明の実施の形態】
本発明に使用される改質用及び未改質のふっ素樹脂としては、テトラフルオロエチレン系重合体（以下「ＰＴＦＥ」と記す）、テトラフルオロエチレン−フルオロアルコキシトリフルオロエチレン共重合体（以下「ＰＦＡ」と記す）、テトラフルオロエチレン−ヘキサフルオロプロピレン共重合体（以下「ＦＥＰ」と記す）、ポリテトラフルオロエチレン−パーフルオロジオキシソール共重合体（以下「ＴＨＦ／ＰＤＤ」と記す）が挙げられる。
【００１７】
上記ＰＴＦＥの中にはパーフルオロ（アルキルビニルエーテル）、ヘキサフルオロプロピレン、（パーフルオロアルキル）エチレン、あるいはクロロトリフルオロエチレン等の共重合性モノマーに基づく重合単位を０．２モル％以下含有するものも含まれる。また上記ふっ素樹脂の場合、その分子構造中に少量の第３成分を含むこともできる。
【００１８】
本発明において用いられる改質ふっ素樹脂の融点は３２５℃以下、結晶化熱量が４０Ｊ／ｇ以下であることが望ましい。これらの値を越えると耐摩耗性や耐クリープ性が著しく低下することになる。なおふっ素樹脂がＰＦＡのときは、融点が３０５℃以下、結晶化熱量が２６Ｊ／ｇ以下とすることが好ましく、ＦＥＰのときは融点が２７５℃以下、結晶化熱量が１１Ｊ／ｇ以下とすることが好ましい。
【００１９】
上記熱特性の評価には示差走査熱量計（ＤＳＣ）を用い、５０〜３６０℃の間で１０℃／ｍｉｎの昇・降温スピードにより昇温、降温を２サイクル繰り返し、２回目の昇温時のＤＳＣ曲線の吸熱ピーク温度を融点とし、２回目の降温時の発熱ピークとベースラインに囲まれたピーク面積からＪＩＳ Ｋ７１２２に準じ、結晶化熱量を求めた。
【００２０】
本発明において用いられる改質ふっ素樹脂は、改質用ふっ素樹脂を酸素濃度１０ｔｏｒｒ以下の不活性化ガス雰囲気下で、且つその融点以上に加熱された状態において電離性放射線を照射線量１ｋＧｙ〜１０ＭＧｙの範囲で照射することにより製造できる。
【００２１】
本発明において、改質処理に用いられる電離性放射線としては、γ線、電子線、Ｘ線、中性子線あるいは高エネルギーイオン等が挙げられる。
【００２２】
電離性放射線の照射を行う際は、改質用ふっ素樹脂をその結晶融点以上に加熱しておく必要がある。例えばふっ素樹脂としてＰＴＦＥを使用する場合には、この材料の融点である３２７℃よりも高い温度に加熱した状態で電離性放射線を照射する必要があり、またＰＦＡ、ＦＥＰを使用する場合には、前者が３１０℃、後者が２７５℃に特定される融点よりも高い温度に加熱して、放射線を照射する必要がある。
【００２３】
ふっ素樹脂をその融点以上に加熱することは、ふっ素樹脂を構成する主鎖の分子運動を活性化させることになり、その結果、分子間の架橋反応を効率よく促進させることが可能となる。但し、過度の加熱は逆に分子主鎖の切断と分解を招くようになるので、加熱温度はふっ素樹脂の融点よりも１０〜３０℃高い範囲に内に抑えるべきである。
【００２４】
また、本発明の改質ふっ素樹脂成形体は、上述した改質ふっ素樹脂組成物を所定形状を有する金型に充填し、所定圧で成形することにより得ることができる。
【００２５】
本発明による改質ふっ素樹脂成形体の用途としては、無潤滑軸受、ダイナミックシール、複写機用ロール、ベアリングパット等の摺動部材や半導体関連製造部品等の幅広い用途が期待できる。また、用途に応じて２硫化モリブデン、グラファイト等の固体潤滑剤等を併用し、潤滑性を上げることも可能である。
【００２６】
【実施例】
以下、実施例及び比較例に基づき、本発明を具体的に説明すると共に、本発明の効果を実証する。
【００２７】
改質用ふっ素樹脂、未改質のふっ素樹脂として、ＰＴＦＥ粉末（旭硝子社製、商品名：Ｐ−１９２）を使用し、ポリアミドイミド樹脂として、ポリアミドイミド粉末（アモコ製、商品名：トーロン４０００ＴＦ）を使用した。また、他の添加剤として、カーボン繊維（呉羽化学工業製、商品名：クレカチョップＭ−２００７Ｓ）、２硫化モリブデン（ダウコーニング社製、商品名：モリコートＺ）、グラファイト（ＴＩＭＣＡＬ社製、商品名：ＴＩＭＲＥＸ ＫＳ６）を用いた。
【００２８】
改質は、上記ＰＴＦＥを酸素濃度１ｔｏｒｒ、窒素雰囲気下、３４０℃の温度のもとで電子線（加速電圧２ＭｅＶ）を１００ｋＧｙ照射することにより行った。これをジェットミルにより平均粒径２０μｍに微粉砕した。
【００２９】
これらの材料を下記の表１に示す配合組成で、ミキサを用い材料温度及び雰囲気温度を１５℃として混合した。得られたコンパウンドをφ４５×高さ８０ｍｍの金型を使用して５０ＭＰａで５分間加圧して圧縮成形後、金型から取り出し、大気圧下、３６０℃×２時間で焼成を行った。但し、改質ＰＴＦＥとポリアミドイミド樹脂の総重量が３０重量部以上の実施例４、比較例３、比較例４については、常温で圧縮成形し、続いて大気圧で３６０℃×２時間焼成し、その後、常温下に金型ごと取出し成形圧２０ＭＰａで圧縮成形することによりロッドを作製した。このようにして作製したロッドを切削により所定寸法に切り出し、試験片を作製した。
【００３０】
【表１】
次に、試料の特性評価について説明する。なお、測定数は各試料３点とし、これらの算術平均を平均値とした。
【００３２】
（１）引張特性
試験はＪＩＳ Ｋ７１６１に準拠し、試験片厚さ０．５ｍｍ、引張試験速度２００ｍｍ／ｍｉｎで行った。
【００３３】
（２）耐摩耗特性
試験にはスラスト摩耗試験装置を使用し、ＪＩＳ Ｋ７２１８に準じ、ＳＵＳ３０４製の円筒リング（外径２５．６ｍｍ、内径２０．６ｍｍ）に試験片（外径２５．６ｍｍ、内径２０．６ｍｍ、厚さ１ｍｍ）を貼り合せ、相手材にはＡＤＣ１２板（縦３０ｍｍ、横３０ｍｍ、厚さ５ｍｍ、表面粗さＲａ０．４μｍ）を用い、圧力１ＭＰａ、速度５０ｍ／ｍｉｎの条件で行った。２４時間後重量減少を測定し、比摩耗量ＶＳＡは下記の式から求めた。また、相手材損傷については、摩耗試験前後の重量変化で調べた。
ＶＳＡ＝Ｖ／（Ｐ・Ｌ）
Ｖ：摩耗量、Ｐ：試験荷重、Ｌ：平均滑り距離
【００３４】
得られた特性（引張特性、耐摩耗特性）結果を以下の表２に示す。
【００３５】
【表２】
上記結果より、ＰＴＦＥ、改質ＰＴＦＥ及びポリアミドイミド樹脂を主体とした組成から成る本実施例の成形体は何れも引張特性が良好であり、耐摩耗特性に優れていた。また摩耗試験後、相手材のアルミは上記材料が転移膜を形成することにより重量が増加し、損傷は見られなかった。
【００３７】
これに対し、比較例１〜４の成形体は、いずれも面圧の高い条件下では耐摩耗性が低く、特にポリアミドイミド樹脂の添加量が多い比較例４では重量が減少し、相手材を損傷した。またポリアミドイミド樹脂以外の充填剤を添加した比較例５では相手材を削り、損傷が見られた。
【００３８】
以上の実施例と比較例の対比からも明らかなように、本実施例の成形体では優れた引張特性、耐摩耗特性を付与でき、アルミのような軟質の金属に対しても損傷を抑えることができ、ふっ素樹脂の応用範囲を広げる上で大きく貢献するものである。
【００３９】
【発明の効果】
本発明の改質ふっ素樹脂組成物は、改質ふっ素樹脂の他にポリアミドイミド樹脂を含有しているので、過酷な摺動環境下においても相手材を損傷させることなく優れた耐摩耗性、耐クリープ性を付与することが可能となる。
【００４０】
また、前記改質ふっ素樹脂の重量が全重量に対し５重量部〜５０重量部、前記ポリアミドイミド樹脂の重量が全重量に対し５重量部〜２０重量部であり、かつ改質ふっ素樹脂とポリアミドイミド樹脂の合計重量が、全重量に対し１０重量部〜６０重量部とすることにより、上記耐摩耗性、耐クリープ性を付与でき、かつふっ素樹脂本来の良好な特性を損なうことがないものとなる。
【００４１】
更に、上記改質ふっ素樹脂組成物を所定の形状に成形して改質ふっ素樹脂成形体とすることにより、無潤滑軸受、ダイナミックシール、複写機用ロール、ベアリングパット等の摺動部材や半導体関連製造部品等の幅広い用途に利用することが可能となる。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides a composition obtained by modifying a fluororesin, which is excellent in abrasion resistance, excellent in creep resistance, can be used for sliding parts, seal products, packing, gaskets, containers, jigs, piping, etc. for semiconductor production. It relates to the molded article.
[0002]
[Prior art]
Fluororesins are excellent in low friction, heat resistance, electrical properties, chemical resistance and cleanliness (non-staining), and are widely used in various industrial and consumer applications. However, in some cases, the fluororesin cannot be used because of abrasion and creep deformation under a sliding environment or a high temperature compression environment. For this reason, measures have been taken to improve wear and creep deformation by adding a filler such as glass fiber or carbon fiber to the fluororesin. However, such a method has a problem in that when the sliding partner is a soft metal such as aluminum, the partner is shaved and damaged. As a solution to this, various fillers have been studied.
[0003]
Examples of fillers that do not damage the mating material include polyamide imide resin and aromatic polyester resin. However, even when these are added to the fluororesin, the mating surface to be slid under high speed or high load or has a large surface roughness. Under a severe sliding environment such as that described above, the wear resistance and creep resistance were not always sufficient.
[0004]
On the other hand, there is a modified fluororesin disclosed in Patent Literature 1 as an attempt to obtain a sliding member having excellent wear resistance by modifying the fluororesin itself without adding a filler.
[0005]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2000-129019
[Problems to be solved by the invention]
However, even in the case of this modified fluororesin, the abrasion resistance and the creep resistance were not sufficient even under a severe sliding environment.
[0007]
Accordingly, an object of the present invention is to provide a modified fluorine resin having excellent abrasion resistance and creep resistance even in a severe sliding environment, and capable of realizing good characteristics inherent to the fluororesin without damaging the mating material. It is to provide a resin composition and a molded article thereof.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the modified fluororesin composition of the present invention was modified by irradiating ionizing radiation with the modified fluororesin heated to above its melting point under an inert gas atmosphere. It is characterized by containing a modified fluororesin, an unmodified fluororesin, and a polyamideimide resin.
[0009]
Further, the weight of the modified fluororesin is 5 to 50 parts by weight based on the total weight, the weight of the polyamide imide resin is 5 to 20 parts by weight based on the total weight, and the modified fluororesin and polyamide are used. It is desirable that the total weight of the imide resin is 10 parts by weight to 60 parts by weight based on the total weight.
[0010]
Further, the modifying fluororesin is at least one member selected from a tetrafluoroethylene-based polymer, a tetrafluoroethylene-perfluoro (alkyl vinyl ether) -based copolymer and a tetrafluoroethylene-hexafluoropropylene-based copolymer. The above can be considered.
[0011]
Similarly, the unmodified fluororesin is at least one selected from a tetrafluoroethylene-based polymer, a tetrafluoroethylene-perfluoro (alkyl vinyl ether) -based copolymer, and a tetrafluoroethylene-hexafluoropropylene-based copolymer. One or more types can be used.
[0012]
Further, the modified fluororesin or the unmodified fluororesin is a tetrafluoroethylene-based polymer, and may further contain 1 mol% or less of a different fluoromonomer.
[0013]
Further, the modified fluororesin preferably has a heat of crystallization of 40 J / g or less and a melting point of 325 ° C. or less.
[0014]
Further, the modified fluororesin is irradiated with ionizing radiation in a range of 1 kGy to 10 MGy in a state where the modifying fluororesin is heated to an oxygen concentration of 10 torr or less in an inert gas atmosphere and heated to a temperature equal to or higher than its melting point. It can be formed by irradiation.
[0015]
Further, the modified fluororesin molded article of the present invention is a modified fluororesin modified by irradiating with ionizing radiation in a state where the modifying fluororesin is heated to its melting point or higher under an inert gas atmosphere, A modified fluororesin composition containing an unmodified fluororesin and a polyamideimide resin is formed into a predetermined shape.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Examples of the modified and unmodified fluororesin used in the present invention include a tetrafluoroethylene-based polymer (hereinafter referred to as “PTFE”) and a tetrafluoroethylene-fluoroalkoxytrifluoroethylene copolymer (hereinafter referred to as “PFA”). "), A tetrafluoroethylene-hexafluoropropylene copolymer (hereinafter referred to as" FEP "), and a polytetrafluoroethylene-perfluorodioxysol copolymer (hereinafter referred to as" THF / PDD "). .
[0017]
Some of the above-mentioned PTFEs contain not more than 0.2 mol% of polymerized units based on copolymerizable monomers such as perfluoro (alkyl vinyl ether), hexafluoropropylene, (perfluoroalkyl) ethylene or chlorotrifluoroethylene. included. In the case of the above-mentioned fluororesin, a small amount of the third component can be contained in its molecular structure.
[0018]
It is desirable that the modified fluororesin used in the present invention has a melting point of 325 ° C. or less and a heat of crystallization of 40 J / g or less. If these values are exceeded, the wear resistance and creep resistance will be significantly reduced. When the fluororesin is PFA, the melting point is preferably 305 ° C. or less and the heat of crystallization is preferably 26 J / g or less, and when FEP, the melting point is 275 ° C. or less and the heat of crystallization is 11 J / g or less. Is preferred.
[0019]
A differential scanning calorimeter (DSC) was used to evaluate the thermal characteristics, and the temperature was raised and lowered at 50 ° C./min. With the endothermic peak temperature of the DSC curve as the melting point, the heat of crystallization was determined from the exothermic peak at the time of the second temperature decrease and the peak area surrounded by the baseline according to JIS K7122.
[0020]
The modified fluororesin used in the present invention is obtained by applying the ionizing radiation to the modified fluororesin under an inert gas atmosphere having an oxygen concentration of 10 torr or less and being heated to a temperature equal to or higher than its melting point at a dose of 1 kGy to 10 MGy. It can be manufactured by irradiating in a range.
[0021]
In the present invention, examples of the ionizing radiation used in the modification treatment include γ-rays, electron beams, X-rays, neutron beams, and high-energy ions.
[0022]
When irradiating with ionizing radiation, it is necessary to heat the modifying fluororesin above its crystalline melting point. For example, when using PTFE as a fluororesin, it is necessary to irradiate with ionizing radiation while being heated to a temperature higher than 327 ° C., which is the melting point of this material, and when using PFA or FEP, The former must be heated to a temperature higher than the melting point specified at 310 ° C. and the latter at 275 ° C., and irradiated with radiation.
[0023]
Heating the fluororesin above its melting point activates the molecular motion of the main chain constituting the fluororesin, and as a result, it is possible to efficiently promote a cross-linking reaction between molecules. However, excessive heating will cause the main chain of the molecule to be broken and decomposed, so that the heating temperature should be kept within a range of 10 to 30 ° C. higher than the melting point of the fluororesin.
[0024]
Further, the modified fluororesin molded article of the present invention can be obtained by filling the above-mentioned modified fluororesin composition into a mold having a predetermined shape and molding it under a predetermined pressure.
[0025]
As the use of the modified fluororesin molded article according to the present invention, a wide range of uses such as sliding members such as non-lubricated bearings, dynamic seals, rolls for copiers, bearing pads, and semiconductor-related production parts can be expected. It is also possible to increase the lubricity by using a solid lubricant such as molybdenum disulfide and graphite in combination depending on the application.
[0026]
【Example】
Hereinafter, the present invention will be specifically described based on Examples and Comparative Examples, and the effects of the present invention will be demonstrated.
[0027]
PTFE powder (manufactured by Asahi Glass Co., Ltd., trade name: P-192) is used as the modified fluororesin and unmodified fluororesin, and polyamideimide powder (manufactured by Amoco, trade name: Torlon 4000TF) is used as the polyamideimide resin. It was used. As other additives, carbon fiber (Kureha Chemical Industry, trade name: Creca Chop M-2007S), molybdenum disulfide (Dow Corning, trade name: Molycoat Z), graphite (TIMCAL, trade name) : TIMREX KS6) was used.
[0028]
The reforming was performed by irradiating the above-mentioned PTFE with 100 kGy of an electron beam (acceleration voltage: 2 MeV) at a temperature of 340 ° C. in a nitrogen atmosphere at an oxygen concentration of 1 torr. This was finely pulverized with a jet mill to an average particle size of 20 μm.
[0029]
These materials were mixed with the compounding compositions shown in Table 1 below using a mixer at a material temperature and ambient temperature of 15 ° C. The obtained compound was pressed at 50 MPa for 5 minutes using a mold having a diameter of 45 mm and a height of 80 mm, compression-molded, taken out of the mold, and fired at 360 ° C. for 2 hours under atmospheric pressure. However, for Example 4, Comparative Example 3, and Comparative Example 4 in which the total weight of the modified PTFE and the polyamide-imide resin was 30 parts by weight or more, compression molding was performed at room temperature, and then baked at 360 ° C. for 2 hours at atmospheric pressure. Thereafter, the rod was produced by taking out the entire mold at room temperature and performing compression molding at a molding pressure of 20 MPa. The rod thus produced was cut into a predetermined size by cutting to produce a test piece.
[0030]
[Table 1]
Next, the characteristic evaluation of the sample will be described. The number of measurements was three for each sample, and the arithmetic average of these was taken as the average value.
[0032]
(1) The tensile property test was performed according to JIS K7161 at a test piece thickness of 0.5 mm and a tensile test speed of 200 mm / min.
[0033]
(2) A test piece (outer diameter 25.6 mm, inner diameter) was attached to a SUS304 cylindrical ring (outer diameter 25.6 mm, inner diameter 20.6 mm) according to JIS K7218 using a thrust wear tester for the wear resistance characteristic test. 20.6 mm, thickness 1 mm) are bonded together, using an ADC12 plate (length 30 mm, width 30 mm, thickness 5 mm, surface roughness Ra 0.4 μm) as a mating material, at a pressure of 1 MPa and a speed of 50 m / min. Was. After 24 hours, the weight loss was measured, and the specific wear amount VSA was determined from the following equation. In addition, the damage of the mating material was examined by a change in weight before and after the wear test.
V SA = V / (P · L)
V: wear amount, P: test load, L: average sliding distance
The results of the obtained characteristics (tensile characteristics, wear resistance characteristics) are shown in Table 2 below.
[0035]
[Table 2]
From the above results, all of the molded articles of the present example composed of a composition mainly composed of PTFE, modified PTFE, and polyamide-imide resin had good tensile properties and excellent wear resistance. After the abrasion test, the aluminum of the mating material increased in weight due to the formation of the transition film by the above material, and no damage was observed.
[0037]
On the other hand, the molded articles of Comparative Examples 1 to 4 all have low abrasion resistance under the condition of high surface pressure, and the weight is reduced particularly in Comparative Example 4 in which the added amount of the polyamideimide resin is large, and Damaged. In Comparative Example 5 in which a filler other than the polyamide-imide resin was added, the mating material was shaved and damage was observed.
[0038]
As is clear from the comparison between the above examples and comparative examples, the molded article of this example can impart excellent tensile properties and wear resistance, and can suppress damage to soft metals such as aluminum. This greatly contributes to expanding the application range of fluororesin.
[0039]
【The invention's effect】
Since the modified fluororesin composition of the present invention contains a polyamideimide resin in addition to the modified fluororesin, it has excellent abrasion resistance and resistance without damaging the mating material even in a severe sliding environment. It becomes possible to provide creep properties.
[0040]
Further, the weight of the modified fluororesin is 5 to 50 parts by weight based on the total weight, the weight of the polyamide imide resin is 5 to 20 parts by weight based on the total weight, and the modified fluororesin and polyamide are used. By setting the total weight of the imide resin to 10 parts by weight to 60 parts by weight with respect to the total weight, the abrasion resistance and creep resistance can be imparted, and the good properties inherent to the fluororesin are not impaired. Become.
[0041]
Further, by forming the modified fluororesin composition into a predetermined shape to form a modified fluororesin molded body, sliding members such as non-lubricated bearings, dynamic seals, copying machine rolls, bearing pads, etc. It can be used for a wide range of applications such as manufacturing parts.
Claims (8)
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| JP2003129491A JP2004331814A (en) | 2003-05-07 | 2003-05-07 | Modified fluororesin composition and modified fluororesin molded product |
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| JP2006234020A (en) * | 2005-02-22 | 2006-09-07 | Youwa:Kk | Piping unit and its manufacturing method |
| JP2007169426A (en) * | 2005-12-21 | 2007-07-05 | Nissan Motor Co Ltd | Resin composition, sliding member and sliding device |
| JP2007186676A (en) * | 2005-12-16 | 2007-07-26 | Hitachi Cable Ltd | Modified fluororesin composition and its molded article |
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| US7572839B2 (en) * | 2003-10-02 | 2009-08-11 | Nissan Motor Co., Ltd. | Seal ring and seal device |
| JP2006234020A (en) * | 2005-02-22 | 2006-09-07 | Youwa:Kk | Piping unit and its manufacturing method |
| JP4621041B2 (en) * | 2005-02-22 | 2011-01-26 | 株式会社陽和 | Manufacturing method of piping unit |
| US7544732B2 (en) | 2005-05-25 | 2009-06-09 | Hitachi Cable, Ltd. | Modified fluororesin composition and modified fluororesin molded article |
| JP2007186676A (en) * | 2005-12-16 | 2007-07-26 | Hitachi Cable Ltd | Modified fluororesin composition and its molded article |
| JP2007169426A (en) * | 2005-12-21 | 2007-07-05 | Nissan Motor Co Ltd | Resin composition, sliding member and sliding device |
| JP2007186597A (en) * | 2006-01-13 | 2007-07-26 | Hitachi Cable Ltd | Modified fluororesin composition and molded product composed of the same |
| JP4645453B2 (en) * | 2006-01-13 | 2011-03-09 | 日立電線株式会社 | Modified fluororesin composition and molded article comprising the same |
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| JP2010037382A (en) * | 2008-08-01 | 2010-02-18 | Hitachi Cable Ltd | Modified fluororesin composition and modified fluororesin molded product |
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