JP2004319998A - Process for producing multilayer unit of multilayer electronic component and multilayer unit of multilayer electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process for producing the multilayer unit of a multilayer electronic component in which deformation and breakdown of a ceramic green sheet are prevented and solvent in electrode paste is prevented from permeating into the ceramic green sheet, and to provide the multilayer unit of a multilayer electronic component. <P>SOLUTION: The process for producing the multilayer unit of a multilayer electronic component comprises a step for forming a ceramic green sheet 2 on the surface of a first supporting sheet 1, a step for forming a strip layer 5 on the surface of a second supporting sheet 4, a step for forming an electrode layer 6 in a specified pattern on the surface of the strip layer and forming a spacer layer 7 in a pattern complementary to the electrode layer, and a step for forming an adhesive layer 10 containing 0.01-15 wt% of antistatic agent for the binder on the surface of a third supporting sheet 9. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a laminated unit for a laminated electronic component in which a ceramic green sheet and an electrode layer are laminated, and to a laminated unit for a laminated electronic component. It is possible to prevent the solvent in the electrode paste from penetrating into the ceramic green sheet and to prevent the destruction of the ceramic green sheet, and to manufacture a laminate unit in which the ceramic green sheet and the electrode layer are laminated, as desired. The present invention relates to a method of manufacturing a laminated unit for a laminated ceramic electronic component and a laminated unit for a laminated electronic component.

  In recent years, with the miniaturization of various electronic devices, the miniaturization and high performance of electronic components mounted on electronic devices have been demanded. There is a strong demand for an increase in the number and a reduction in the thickness of the laminated unit.

  To manufacture a multilayer ceramic electronic component represented by a multilayer ceramic capacitor, first, a ceramic powder, a binder such as an acrylic resin and a butyral resin, and a plastic such as a phthalate ester, a glycol, an adipic acid, and a phosphate ester are used. The agent and an organic solvent such as toluene, methyl ethyl ketone, and acetone are mixed and dispersed to prepare a dielectric paste.

  Next, the dielectric paste is applied to a support sheet formed of polyethylene terephthalate (PET), polypropylene (PP), or the like using an extrusion coater or a gravure coater, heated, and the coating film is dried. A ceramic green sheet is produced.

  Further, an electrode paste such as nickel is printed on the ceramic green sheet in a predetermined pattern by a screen printer or the like, and dried to form an electrode layer.

  When the electrode layer is formed, the ceramic green sheet on which the electrode layer is formed is peeled from the support sheet to form a laminate unit including the ceramic green sheet and the electrode layer, and a desired number of laminate units are laminated. Then, the obtained laminate is cut into chips to produce a green chip.

  Finally, the binder is removed from the green chip, the green chip is fired, and external electrodes are formed, whereby a multilayer ceramic electronic component such as a multilayer ceramic capacitor is manufactured.

  Due to the demand for miniaturization and high performance of electronic components, it is required at present that the thickness of the ceramic green sheet, which determines the interlayer thickness of the multilayer ceramic capacitor, be 3 μm or 2 μm or less. It is required to laminate a laminate unit including a metal layer and an electrode layer.

  However, when an electrode paste for an internal electrode is printed on an extremely thin ceramic green sheet to form an electrode layer, the solvent in the electrode paste dissolves or swells the binder component of the ceramic green sheet. Thus, there was a problem that the electrode paste soaked into the ceramic green sheet, which caused a short circuit failure.

Therefore, JP-A-63-51616 and JP-A-3-250612 disclose that an internal electrode pattern paste is printed on another support sheet to form an electrode layer, and then the electrode layer is dried and dried. A method of thermally transferring an electrode layer to the surface of a ceramic green sheet has been proposed.
JP-A-63-51616 JP-A-3-250612

  However, this method has a problem that it is difficult to peel the support sheet from the electrode layer transferred to the surface of the ceramic green sheet.

  In addition, in order to thermally transfer and bond the dried electrode layer to the surface of the ceramic green sheet, it is necessary to apply a high pressure at a high temperature under a high temperature. However, there is a problem that the ceramic green sheet is partially broken.

  Therefore, the present invention can prevent deformation and destruction of the ceramic green sheet, prevent the solvent in the electrode paste from seeping into the ceramic green sheet, and form a laminate in which the ceramic green sheet and the electrode layer are laminated. It is an object of the present invention to provide a method of manufacturing a multilayer unit for a multilayer ceramic electronic component and a multilayer unit for a multilayer ceramic electronic component that can manufacture a body unit as desired.

  The object of the present invention is to form a ceramic green sheet on the surface of the first support sheet, a step of forming a release layer on the surface of the second support sheet, Forming an electrode layer in a pattern complementary to the electrode layer in the pattern described above, and forming a spacer layer in a pattern complementary to the electrode layer on the surface of the third support sheet from 0.01% by weight to 15% by weight with respect to the binder. Forming an adhesive layer containing an antistatic agent by weight, and bringing the surface of the adhesive layer formed on the third support sheet into close contact with the surface of the ceramic green sheet; An adhesive layer, a step of adhering to the surface of the ceramic green sheet, a step of peeling the third support sheet from the adhesive layer, and the electrode layer formed on the surface of the second support sheet and A step in which the surface of the spacer layer and the surface of the adhesive layer are brought into close contact with each other, pressed, and bonded to produce a laminate unit in which the ceramic green sheet, the electrode layer, and the spacer layer are laminated This is achieved by a method of manufacturing a multilayer unit for a multilayer ceramic electronic component, characterized by comprising:

  According to the present invention, the electrode layer and the spacer layer are configured to be transferred to the surface of the ceramic green sheet via the adhesive layer adhered to the surface of the ceramic green sheet. And the spacer layer can be transferred to the surface of the ceramic green sheet, thus reliably preventing deformation and destruction of the ceramic green sheet to produce a ceramic green sheet and a laminate unit including the electrode layer and the spacer layer. It becomes possible to do.

  According to the present invention, the electrode layer and the spacer layer are formed on the surface of the second support sheet, dried, and then transferred to the surface of the ceramic green sheet via the adhesive layer. Therefore, the solvent in the electrode paste can reliably prevent the binder component of the ceramic green sheet from dissolving or swelling, and at the same time, reliably prevent the electrode paste from seeping into the ceramic green sheet. It is possible to manufacture a laminate unit including a ceramic green sheet, an electrode layer and a spacer layer.

  Furthermore, according to the present invention, the adhesive layer is formed on the surface of the third support sheet, and after being dried, is configured to be transferred to the surface of the ceramic green sheet. It is possible to reliably prevent permeation into the green sheet, and to manufacture a laminate unit including the ceramic green sheet, the electrode layer, and the spacer layer.

  Further, according to the present invention, the adhesive layer is formed on the surface of the third support sheet, and after being dried, transferred to the surface of the ceramic green sheet, and through the adhesive layer, the electrode layer and the spacer layer, Since it is configured to transfer to the surface of the ceramic green sheet, the adhesive solution is reliably prevented from soaking into the electrode layer and the spacer layer, and the laminate including the ceramic green sheet and the electrode layer and the spacer layer is formed. The unit can be manufactured.

  Furthermore, when a large number of laminate units on which electrode layers are formed are laminated in a predetermined pattern on the ceramic green sheet, the surface of the electrode layer and the surface of the ceramic green sheet on which the electrode layer is not formed are separated. Since a step is formed between the laminate units, a laminate in which a large number of laminate units are laminated is deformed or delamination may occur. Since the spacer layer is formed in a pattern complementary to the electrode layer, a large number of laminate units thus obtained are laminated to effectively prevent the produced laminate from being deformed. And the occurrence of delamination can be effectively prevented.

  Also, when the third support sheet is peeled from the adhesive layer, static electricity is generated, dust adheres, or the adhesive layer is attracted to the third support sheet, and the third Although it may be difficult to peel the support sheet from the adhesive layer, according to the present invention, the adhesive layer contains 0.01% to 15% by weight of the antistatic agent based on the binder. Therefore, the generation of static electricity can be effectively prevented.

  The object of the present invention is also a release layer, on the surface of the release layer, an electrode layer formed in a predetermined pattern and a spacer layer formed in a pattern complementary to the electrode layer, the electrode layer and the An adhesive layer adhered to the surface of the spacer layer, and a ceramic green sheet adhered to the surface of the adhesive layer, wherein the adhesive layer has an antistatic property of 0.01 to 15% by weight with respect to the binder. The present invention is achieved by a laminate unit for a laminated electronic component, characterized by containing an agent.

  In a preferred embodiment of the present invention, the adhesive layer contains 0.01% to 10% by weight of the antistatic agent based on the binder.

  In the present invention, a dielectric paste used to form a ceramic green sheet is usually prepared by kneading a dielectric material and an organic vehicle in which a binder is dissolved in an organic solvent.

  The dielectric material is appropriately selected from various compounds to be a composite oxide or an oxide, for example, a carbonate, a nitrate, a hydroxide, an organometallic compound, and the like, and can be used by mixing them. The dielectric material is usually used as a powder having an average particle size of about 0.1 μm to about 3.0 μm. The particle size of the dielectric material is preferably smaller than the thickness of the ceramic green sheet.

  The binder used for the organic vehicle is not particularly limited, and various ordinary binders such as ethyl cellulose, polyvinyl butyral, and acrylic resin can be used.However, in order to make the ceramic green sheet thinner, polyvinyl butyral is used. Butyral-based resins are preferably used.

  The organic solvent used for the organic vehicle is not particularly limited, and organic solvents such as terpineol, butyl carbitol, acetone, and toluene are used.

  In the present invention, the dielectric paste can also be produced by kneading a dielectric material and a vehicle in which a water-soluble binder is dissolved in water.

  The water-soluble binder is not particularly limited, and polyvinyl alcohol, methyl cellulose, hydroxyethyl cellulose, a water-soluble acrylic resin, an emulsion, or the like is used.

  The content of each component in the dielectric paste is not particularly limited, and may be, for example, about 1% to about 5% by weight of a binder and about 10% to about 50% by weight of a solvent. , A dielectric paste can be prepared.

  If necessary, the dielectric paste may contain additives selected from various dispersants, plasticizers, dielectrics, subcomponent compounds, glass frit, insulators, and the like. When these additives are added to the dielectric paste, the total content is desirably about 10% by weight or less. When a butyral resin is used as the binder resin, the content of the plasticizer is preferably about 25 parts by weight to about 100 parts by weight based on 100 parts by weight of the binder resin. If the amount of the plasticizer is too small, the produced ceramic green sheet tends to be brittle, and if the amount is too large, the plasticizer oozes out and handling becomes difficult, which is not preferable.

  In the present invention, the ceramic green sheet is produced by applying a dielectric paste on the first support sheet and drying it.

  The dielectric paste is applied on the first support sheet using an extrusion coater, a wire bar coater, or the like, to form a coating film.

  As the first support sheet, for example, a polyethylene terephthalate film or the like is used, and the surface thereof is coated with a silicone resin, an alkyd resin, or the like to improve the releasability. The thickness of the first support sheet is not particularly limited, but is preferably about 5 μm to about 100 μm.

  The coating film thus formed is dried, for example, at a temperature of about 50 ° C. to about 100 ° C. for about 1 minute to about 20 minutes to form a ceramic green sheet on the support sheet.

  In the present invention, the thickness of the ceramic green sheet after drying is preferably 3 μm or less, more preferably 1.5 μm or less.

  In the present invention, the electrode layer and the spacer layer are printed on the second support sheet using a printing machine such as a screen printing machine or a gravure printing machine.

  As the second support sheet, for example, a polyethylene terephthalate film or the like is used, and the surface thereof is coated with a silicon resin, an alkyd resin, or the like in order to improve releasability. The thickness of the second support sheet is not particularly limited, and may be the same as or different from the thickness of the support sheet on which the ceramic green sheets are formed, but is preferably about 5 μm to about 5 μm. 100 μm.

  In the present invention, prior to forming the electrode layer and the spacer layer on the second support sheet, first, a dielectric paste is prepared and applied on the second support sheet to form a release layer, Formed on the second support sheet.

  The dielectric paste for forming the release layer preferably contains dielectric particles having the same composition as the dielectric contained in the ceramic green sheet.

  The dielectric paste for forming the release layer contains, in addition to the dielectric particles, a binder and, as optional components, a plasticizer and a release agent. The particle size of the dielectric particles may be the same as the particle size of the dielectric particles contained in the ceramic green sheet, but is preferably smaller.

  As the binder, for example, an acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, a copolymer thereof, or an emulsion thereof can be used.

  The binder contained in the dielectric paste for forming the release layer may or may not be the same as the binder contained in the ceramic green sheet, but is preferably a similar binder. .

  The dielectric paste for forming the release layer is preferably about 2.5 parts by weight to about 200 parts by weight, more preferably about 5 parts by weight to about 30 parts by weight, based on 100 parts by weight of the dielectric particles. Particularly preferably, it contains from about 8 parts to about 30 parts by weight of the binder.

  The plasticizer is not particularly limited, and examples thereof include phthalate, adipic acid, phosphate, and glycols. The plasticizer contained in the dielectric paste for forming the release layer may or may not be the same as the plasticizer contained in the ceramic green sheet.

  The dielectric paste for forming the release layer is about 0 to about 200 parts by weight, preferably about 20 to about 200 parts by weight, and more preferably about 50 parts by weight, based on 100 parts by weight of the binder. Parts to about 100 parts by weight of a plasticizer.

  The release agent contained in the dielectric paste for forming the release layer is not particularly limited, and examples thereof include paraffin, wax, and silicone oil.

  The dielectric paste for forming the release layer is about 0 to about 100 parts by weight, preferably about 2 to about 50 parts by weight, more preferably about 5 parts by weight, based on 100 parts by weight of the binder. Parts to about 20 parts by weight of a release agent.

  In the present invention, the content ratio of the binder to the dielectric contained in the release layer is preferably equal to or lower than the content ratio of the binder to the dielectric contained in the ceramic green sheet. Further, it is preferable that the content ratio of the plasticizer to the dielectric contained in the release layer is equal to or higher than the content ratio of the plasticizer to the dielectric contained in the ceramic green sheet. Further, the content ratio of the release agent to the dielectric contained in the release layer is preferably higher than the content ratio of the release agent to the dielectric contained in the ceramic green sheet.

  By forming the release layer having such a composition, even if the ceramic green sheet is extremely thinned, the strength of the release layer can be made lower than the breaking strength of the green sheet, and the second support sheet can be formed. When peeling, it is possible to reliably prevent the ceramic green sheet from being broken.

  The release layer is formed by applying a dielectric paste on the second support sheet using a wire bar coater or the like.

  The thickness of the release layer is preferably not more than the thickness of the electrode layer formed thereon, preferably not more than about 60% of the thickness of the electrode layer, and more preferably not more than about 60% of the thickness of the electrode layer. 30% or less.

  After formation of the release layer, the release layer is dried, for example, at about 50 ° C. to about 100 ° C. for about 1 minute to about 10 minutes.

  After the release layer is dried, an electrode layer constituting an internal electrode layer is formed in a predetermined pattern on the surface of the release layer after firing.

  In the present invention, the electrode paste used to form the electrode layer is a conductive material made of various conductive metals and alloys, various kinds of oxides that become conductive materials made of various conductive metals and alloys after firing, and organic materials. It is prepared by kneading a metal compound, a resinate, or the like, and an organic vehicle in which a binder is dissolved in an organic solvent.

  As the conductive material used in producing the electrode paste, Ni, a Ni alloy or a mixture thereof is preferably used. The shape of the conductive material is not particularly limited, and may be spherical, scale-like, or a mixture of these shapes. The average particle size of the conductive material is not particularly limited, but usually, a conductive material of about 0.1 μm to about 2 μm, preferably about 0.2 μm to about 1 μm is used.

  The binder used for the organic vehicle is not particularly limited, and ethyl cellulose, acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, or a copolymer of these can be used. However, in particular, a butyral-based binder such as polyvinyl butyral is preferably used.

  The electrode paste preferably contains about 2.5 parts by weight to about 20 parts by weight of the binder with respect to 100 parts by weight of the conductive material.

  As the solvent, for example, a known solvent such as terpineol, butyl carbitol, and kerosene can be used. The content of the solvent is preferably about 20% by weight to about 55% by weight based on the whole electrode paste.

  In order to improve the adhesiveness, it is preferable that the electrode paste contains a plasticizer.

  The plasticizer contained in the electrode paste is not particularly limited, and examples thereof include phthalic acid esters such as benzyl butyl phthalate (BBP), adipic acid, phosphoric acid esters, and glycols. The electrode paste preferably contains about 10 parts by weight to about 300 parts by weight, more preferably about 10 parts by weight to about 200 parts by weight, based on 100 parts by weight of the binder.

  If the amount of the plasticizer is too large, the strength of the electrode layer tends to be significantly reduced, which is not preferable.

  The electrode layer is formed by printing an electrode paste on the surface of the release layer formed on the second support sheet using a printing machine such as a screen printing machine or a gravure printing machine.

  The thickness of the electrode layer is preferably about 0.1 μm to about 5 μm, and more preferably about 0.1 μm to about 1.5 μm.

  On the portion of the surface of the release layer formed on the second support sheet where the electrode layer is not formed, further, using a printing machine such as a screen printing machine or a gravure printing machine, a pattern complementary to the electrode layer. Then, the dielectric paste is printed to form a spacer layer.

  Prior to the formation of the electrode layer, a spacer layer may be formed on the surface of the release layer formed on the second support sheet in a pattern complementary to the electrode layer.

  In the present invention, the dielectric paste used to form the spacer layer is prepared in the same manner as the dielectric paste used to form the ceramic green sheet.

  The dielectric paste for forming the spacer layer preferably contains dielectric particles having the same composition as the dielectric contained in the ceramic green sheet.

  The dielectric paste for forming the spacer layer contains, in addition to the dielectric particles, a binder and, as optional components, a plasticizer and a release agent. The particle size of the dielectric particles may be the same as the particle size of the dielectric particles contained in the ceramic green sheet, but is preferably smaller.

  As the binder, for example, an acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, a copolymer thereof, or an emulsion thereof can be used.

  The binder included in the dielectric paste for forming the spacer layer may or may not be the same as the binder included in the ceramic green sheet, but is preferably the same.

  The dielectric paste for forming the spacer layer is preferably about 2.5 parts by weight to about 200 parts by weight, more preferably about 4 parts by weight to about 15 parts by weight, based on 100 parts by weight of the dielectric particles. Particularly preferably, it contains from about 6 parts to about 10 parts by weight of the binder.

  The plasticizer contained in the dielectric paste for forming the spacer layer is not particularly limited, and examples thereof include phthalate, adipic acid, phosphate, and glycols. The plasticizer contained in the dielectric paste for forming the spacer layer may or may not be the same as the plasticizer contained in the ceramic green sheet.

  The dielectric paste for forming the spacer layer is about 0 to about 200 parts by weight, preferably about 20 to about 200 parts by weight, more preferably about 50 parts by weight, based on 100 parts by weight of the binder. Parts to about 100 parts by weight of a plasticizer.

  The release agent contained in the dielectric paste for forming the spacer layer is not particularly limited, and examples thereof include paraffin, wax, and silicone oil.

  The dielectric paste for forming the spacer layer is about 0 to about 100 parts by weight, preferably about 2 to about 50 parts by weight, more preferably about 5 parts by weight, based on 100 parts by weight of the binder. Parts to about 20 parts by weight of a release agent.

  In the present invention, the electrode layer and the spacer layer satisfy 0.7 ≦ ts / te ≦ 1.3 (where ts is the thickness of the spacer layer and te is the thickness of the electrode layer). Preferably, it is formed so as to satisfy 0.8 ≦ ts / te ≦ 1.2, more preferably 0.9 ≦ ts / te ≦ 1.2.

  The electrode layer and the spacer layer are dried, for example, at a temperature of about 70 ° C. to 120 ° C. for about 5 minutes to about 15 minutes. The drying conditions for the electrode layer and the spacer layer are not particularly limited.

  The ceramic green sheet, the electrode layer and the spacer layer are adhered via an adhesive layer, and a third support sheet is prepared to form the adhesive layer.

  As the third support sheet, for example, a polyethylene terephthalate film or the like is used, and the surface thereof is coated with a silicone resin, an alkyd resin, or the like to improve releasability. The thickness of the third support sheet is not particularly limited, but is preferably about 5 μm to about 100 μm.

  The adhesive layer is formed by applying an adhesive solution on the third support sheet.

  In the present invention, the adhesive solution contains a binder and an antistatic agent, and as optional components, a plasticizer and a release agent.

  The adhesive solution may include dielectric particles having the same composition as the dielectric particles contained in the ceramic green sheet. When the adhesive solution contains dielectric particles, the ratio of the dielectric particles to the binder weight is preferably smaller than the ratio of the dielectric particles contained in the ceramic green sheet to the binder weight.

  The binder contained in the adhesive solution is preferably the same as the binder contained in the dielectric paste for forming the ceramic green sheet, but is similar to the binder contained in the dielectric paste for forming the ceramic green sheet. It does not have to be.

  The plasticizer contained in the adhesive solution is preferably of the same type as the plasticizer contained in the dielectric paste for forming the ceramic green sheet, but the plasticizer contained in the dielectric paste for forming the ceramic green sheet is preferably used. It does not need to be synonymous with the agent.

  The content of the plasticizer is about 0 to about 200 parts by weight, preferably about 20 to about 200 parts by weight, and more preferably about 50 to about 100 parts by weight, based on 100 parts by weight of the binder. Department.

  In the present invention, the adhesive solution contains 0.01% to 15% by weight of the binder, preferably 0.01% to 10% by weight of the binder.

  In the present invention, the antistatic agent contained in the adhesive solution may be any organic solvent having hygroscopicity, such as ethylene glycol; polyethylene glycol; 2-3 butanediol; glycerin; imidazoline surfactant, polyalkylene. An amphoteric surfactant such as a glycol derivative-based surfactant or a carboxylic acid amidine salt-based surfactant can be used as the antistatic agent contained in the adhesive solution.

  Among these antistatic agents, it is possible to prevent static electricity with a small amount, and it is possible to peel the third support sheet from the adhesive layer with a small peeling force. Preferred are amphoteric surfactants such as surfactants, polyalkylene glycol derivative-based surfactants, and carboxylic acid amidine salt-based surfactants. The imidazoline-based surfactant has a particularly small peeling force and can be used as a third support from the adhesive layer. This is particularly preferable because the sheet can be peeled off.

  The adhesive solution is applied on the third support sheet by, for example, a bar coater, an extrusion coater, a reverse coater, a dip coater, a kiss coater, or the like, preferably from about 0.02 μm to about 0.3 μm, more preferably An adhesive layer having a thickness of about 0.02 μm to about 0.1 μm is formed. When the thickness of the adhesive layer is less than about 0.02 μm, the adhesive strength is reduced. On the other hand, when the thickness of the adhesive layer exceeds about 0.3 μm, defects (gaps) are caused, which is preferable. Absent.

  The adhesive layer is dried, for example, at a temperature from room temperature (25 ° C.) to about 80 ° C. for about 1 minute to about 5 minutes. The conditions for drying the adhesive layer are not particularly limited.

  The adhesive layer formed on the third support sheet is transferred to the surface of the electrode layer and the spacer layer formed on the second support sheet or to the surface of the ceramic green sheet formed on the first support sheet. You.

  When transferring the adhesive layer to the surface of the electrode layer and the spacer layer formed on the second support sheet, the adhesive layer is formed on the surface of the spacer layer and the electrode layer formed on the second support sheet. In contact, at a temperature of about 40 ° C. to about 100 ° C., the adhesive layer, the electrode layer and the spacer layer are pressed at a pressure of about 0.2 MPa to about 15 MPa, preferably about 0.2 MPa to about 6 MPa. The adhesive layer is adhered on the surface of the electrode layer and the spacer layer by applying pressure, and then the third support sheet is peeled off from the adhesive layer.

  In transferring the adhesive layer to the surfaces of the electrode layer and the spacer layer, the second support sheet on which the electrode layer and the spacer layer are formed, and the third support sheet on which the adhesive layer is formed are pressed using a press. Then, pressure may be applied using a pair of pressure rollers, but it is preferable to press the second support sheet and the third support sheet with the pair of pressure rollers.

  When transferring the adhesive layer to the surface of the ceramic green sheet formed on the first support sheet, the adhesive layer is in contact with the surface of the ceramic green sheet formed on the first support sheet. At a temperature of about 40 ° C. to about 100 ° C., the adhesive layer and the ceramic green sheet are pressed at a pressure of about 0.2 MPa to about 15 MPa, preferably at a pressure of about 0.2 MPa to about 6 MPa. Then, the adhesive layer is adhered on the surface of the ceramic green sheet, and then the third support sheet is peeled off from the adhesive layer.

  In transferring the adhesive layer to the surface of the ceramic green sheet, the first support sheet on which the ceramic green sheet is formed and the third support sheet on which the adhesive layer is formed are pressed using a press machine. Alternatively, pressure may be applied using a pair of pressure rollers, but it is preferable that the first support sheet and the third support sheet are pressed by the pair of pressure rollers.

  Next, the ceramic green sheet is bonded to the electrode layer and the spacer layer via the bonding layer.

  The ceramic green sheet, the electrode layer and the spacer layer are interposed via the adhesive layer at a temperature of about 40 ° C. to about 100 ° C. and a pressure of about 0.2 MPa to about 15 MPa, preferably about 0.2 MPa to about 15 MPa. By applying a pressure of 6 MPa, the ceramic green sheet is bonded to the spacer layer and the electrode layer via the bonding layer.

  Preferably, using a pair of pressure rollers, the ceramic green sheet, the adhesive layer, the electrode layer and the spacer layer are pressed, the ceramic green sheet, the electrode layer and the spacer layer, via the adhesive layer, Glued.

  When the adhesive layer is transferred to the surface of the electrode layer and the spacer layer, when the ceramic green sheet and the electrode layer and the spacer layer are bonded via the adhesive layer, the first support sheet is Peeled from ceramic green sheet.

  Next, the adhesive layer is transferred onto the surface of the ceramic green sheet in the same manner as the adhesive layer formed on the surface of the third support sheet is transferred onto the surface of the electrode layer and the spacer layer.

  The laminate thus obtained is cut into a predetermined size, and a laminate unit in which a release layer, an electrode layer, a spacer layer, an adhesive layer, a ceramic green sheet, and an adhesive layer are laminated on a second support sheet Is produced.

  On the other hand, when the adhesive layer is transferred to the surface of the ceramic green sheet, when the ceramic green sheet, the electrode layer and the spacer layer are bonded via the adhesive layer, the second support sheet becomes It is released from the release layer.

  Next, the adhesive layer is transferred to the surface of the release layer in the same manner as the adhesive layer formed on the surface of the third support sheet is transferred to the surface of the ceramic green sheet.

  A laminate unit in which the laminate thus obtained is cut into a predetermined size and a ceramic green sheet, an adhesive layer, an electrode layer, a spacer layer, a release layer, and an adhesive layer are laminated on a first support sheet Is produced.

  As described above, a large number of the laminated units produced are laminated to produce a laminated block.

  In laminating a large number of laminate units, first, a support is fixed on a substrate.

  The support is sucked by air, for example, through a plurality of holes formed in the substrate, and is fixed at a predetermined position on the substrate.

  As the support, for example, a polyethylene terephthalate film or the like is used. The thickness of the support is not particularly limited as long as it can support the laminate unit.

  In the present invention, when the adhesive layer is transferred to the surface of the electrode layer and the spacer layer, first, the laminate unit is formed such that the adhesive layer formed on the ceramic green sheet is in close contact with the surface of the support. Is positioned and pressure is applied on the laminate unit.

  When the adhesive layer formed on the ceramic green sheet is adhered to the surface of the support, the second support sheet is released from the release layer.

  Further, a new laminate unit is placed on the laminate unit adhered to the support so that the adhesive layer formed on the surface of the ceramic green sheet is in close contact with the release layer of the laminate unit adhered to the support. The new stacking unit is pressed toward the substrate, and the new stacking unit is stacked on the stacking unit adhered to the support.

  Next, the second support sheet of the newly laminated unit is released from the release layer.

  Similarly, a predetermined number of laminated units are laminated to form a laminated block, and a predetermined number of laminated blocks are laminated to produce a laminated ceramic electronic component.

  On the other hand, when the adhesive layer is transferred to the surface of the ceramic green sheet, first, the laminate unit is positioned so that the adhesive layer formed on the release layer is in close contact with the surface of the support. Then, pressure is applied on the laminate unit.

  When the adhesive layer formed on the release layer is adhered to the surface of the support, the first support sheet is released from the ceramic green sheet.

  Further, a new laminate unit is placed on the laminate unit bonded to the support such that the adhesive layer formed on the surface of the release layer is in close contact with the ceramic green sheet of the laminate unit bonded to the support. And the new laminate unit is pressed toward the substrate, and the new laminate unit is laminated on the laminate unit adhered to the support.

  Next, the first support sheet of the newly laminated unit is separated from the ceramic green sheet.

  Similarly, a predetermined number of laminated units are laminated to form a laminated block, and a predetermined number of laminated blocks are laminated to produce a laminated ceramic electronic component.

  Advantageous Effects of Invention According to the present invention, it is possible to prevent deformation and destruction of a ceramic green sheet, prevent a solvent in an electrode paste from seeping into a ceramic green sheet, and form a laminate in which a ceramic green sheet and an electrode layer are stacked It is possible to provide a method of manufacturing a multilayer unit for a multilayer ceramic electronic component and a multilayer unit for a multilayer ceramic electronic component that can produce a body unit as desired.

  Hereinafter, a method for manufacturing a multilayer ceramic capacitor according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  In manufacturing a multilayer ceramic capacitor, first, a dielectric paste is prepared for manufacturing a ceramic green sheet.

  The dielectric paste is usually prepared by kneading a dielectric material and an organic vehicle having a binder dissolved in an organic solvent.

  The prepared dielectric paste is applied on the first support sheet using, for example, an extrusion coater or a wire bar coater to form a coating film.

  As the first support sheet, for example, a polyethylene terephthalate film or the like is used, and the surface thereof is coated with a silicone resin, an alkyd resin, or the like to improve the releasability. The thickness of the first support sheet is not particularly limited, but is preferably about 5 μm to about 100 μm.

  The coating is then dried, for example, at a temperature of about 50 ° C. to about 100 ° C. for about 1 minute to about 20 minutes to form a ceramic green sheet on the first support sheet.

  The thickness of the ceramic green sheet 2 after drying is preferably 3 μm or less, more preferably 1.5 μm or less.

  FIG. 1 is a schematic partial cross-sectional view showing a state where a ceramic green sheet is formed on a surface of a first support sheet.

  Actually, the first support sheet 1 has an elongated shape, and the ceramic green sheets 2 are continuously formed on the surface of the elongated first support sheet 1.

  On the other hand, a second support sheet is prepared separately from the ceramic green sheet 2, and a release layer and an electrode layer are formed on the second support sheet.

  FIG. 2 is a schematic partial cross-sectional view of the second support sheet 4 having a release layer 5 and an electrode layer 6 formed on the surface thereof.

  Actually, the second support sheet 4 has an elongated shape, and the release layer 5 is formed continuously on the surface of the elongated second support sheet 4, and is formed on the surface of the release layer 5. The electrode layer 6 is formed in a predetermined pattern.

  In forming the release layer 5 on the surface of the second support sheet 4, first, a dielectric paste for forming the release layer 5 is prepared in the same manner as in forming the ceramic green sheet 2.

  The dielectric paste for forming the release layer 5 preferably contains dielectric particles having the same composition as the dielectric contained in the ceramic green sheet 2.

  The binder contained in the dielectric paste for forming the release layer 5 may or may not be the same as the binder contained in the ceramic green sheet 2, but is preferably the same. .

  When the dielectric paste is thus prepared, the dielectric paste is applied onto the second support sheet 4 using, for example, a wire bar coater (not shown), and the release layer 5 is formed.

  The thickness of the release layer 5 is preferably not more than the thickness of the electrode layer 6, preferably not more than about 60% of the thickness of the electrode layer 6, more preferably not more than about 30% of the thickness of the electrode layer 6. It is as follows.

  As the second support sheet 4, for example, a polyethylene terephthalate film or the like is used, and the surface thereof is coated with a silicon resin, an alkyd resin, or the like in order to improve releasability. The thickness of the second support sheet 4 is not particularly limited, and may be the same as or different from the thickness of the first support sheet 1, but is preferably about 5 μm to about 100 μm. is there.

  After formation of the release layer 5, the release layer 5 is dried, for example, at about 50 ° C. to about 100 ° C. for about 1 minute to about 10 minutes.

  After the release layer 5 is dried, an electrode layer 6 constituting an internal electrode layer is formed in a predetermined pattern on the surface of the release layer 5 after firing.

  The electrode layer 6 is preferably formed to have a thickness of about 0.1 μm to about 5 μm, more preferably, about 0.1 μm to about 1.5 μm.

  When the electrode layer 6 is formed on the release layer 5, first, a conductive material made of various conductive metals and alloys, and after firing, various oxides that become conductive materials made of various conductive metals and alloys, An electrode paste is prepared by kneading a metal compound or a resinate with an organic vehicle in which a binder is dissolved in an organic solvent.

  As the conductive material used in producing the electrode paste, Ni, a Ni alloy or a mixture thereof is preferably used.

  The average particle diameter of the conductive material is not particularly limited, but usually, a conductive material having a size of about 0.1 μm to about 2 μm, preferably about 0.2 μm to about 1 μm is used.

  The electrode layer 6 is formed by printing an electrode paste on the release layer 5 using a printing machine such as a screen printing machine or a gravure printing machine.

  After an electrode layer 6 having a predetermined pattern is formed on the surface of the release layer 5 by a screen printing method or a gravure printing method, the electrode layer 6 is complementary to the electrode layer 6 on the surface of the release layer 5 where the electrode layer 6 is not formed. The spacer layer is formed in a typical pattern.

  FIG. 3 is a schematic partial cross-sectional view showing a state where the electrode layer 6 and the spacer layer 7 are formed on the surface of the release layer 5.

  Prior to forming the electrode layer 6 on the surface of the release layer 5, the spacer layer 7 may be formed on the surface of the release layer 5 except for the portion where the electrode layer 6 is to be formed.

  In forming the spacer layer 7, a dielectric paste having the same composition as the dielectric paste used when the ceramic green sheet 2 was manufactured is prepared, and the dielectric paste is applied to the electrode paste by screen printing or gravure printing. A pattern complementary to the electrode layer 6 is printed on the surface of the release layer 5 where the layer 6 is not formed.

  In this embodiment, the spacer layer 7 is formed on the release layer 5 so that ts / te = 1.1. Here, ts is the thickness of the spacer layer 7 and te is the thickness of the electrode layer 6.

  In the present embodiment, the ceramic green sheet 2, the electrode layer 6, and the spacer layer 7 are configured to be bonded via an adhesive layer, and the first support sheet on which the ceramic green sheet 2 is formed. 1 and the second support sheet 4 on which the electrode layer 6 and the spacer layer 7 are formed, a third support sheet is further provided, and an adhesive layer is formed on the third support sheet, A layer sheet is produced.

  FIG. 4 is a schematic partial cross-sectional view of the adhesive layer sheet 11 in which the adhesive layer 10 is formed on the surface of the third support sheet 9.

  Actually, the third support sheet 9 has a long shape, and the adhesive layer 10 is continuously formed on the surface of the long third support sheet 9.

  As the third support sheet 9, for example, a polyethylene terephthalate film or the like is used, and the surface thereof is coated with a silicone resin, an alkyd resin, or the like in order to improve the releasability. The thickness of the third support sheet 9 is not particularly limited, but is preferably about 5 μm to about 100 μm.

  In forming the adhesive layer 10, first, an adhesive solution is prepared.

  In this embodiment, the adhesive solution contains a binder, a plasticizer, an antistatic agent, and, as an optional component, a release agent.

  The adhesive solution may include dielectric particles having the same composition as the dielectric particles contained in the ceramic green sheet. When the adhesive solution contains dielectric particles, the ratio of the dielectric particles to the binder weight is preferably smaller than the ratio of the dielectric particles contained in the ceramic green sheet to the binder weight.

  The binder contained in the adhesive solution is preferably a binder of the same type as the binder contained in the dielectric paste for forming the ceramic green sheet, but the binder contained in the dielectric paste for forming the ceramic green sheet is preferred. A binder that is not the same as the above may be used.

  The plasticizer contained in the adhesive solution is preferably a plasticizer of the same type as the plasticizer contained in the dielectric paste for forming the ceramic green sheet, but is preferably used in the dielectric paste for forming the ceramic green sheet. A plasticizer that is not the same as the binder contained may be used.

  The content of the plasticizer is about 0 to about 200 parts by weight, preferably about 20 to about 200 parts by weight, and more preferably about 50 to about 100 parts by weight, based on 100 parts by weight of the binder. Department.

  In this embodiment, the adhesive solution contains 0.01% to 15% by weight of the binder of the antistatic agent.

  In this embodiment, an imidazoline surfactant is used as the antistatic agent.

  The adhesive solution thus prepared is applied on the third support sheet 9 by, for example, a bar coater, an extrusion coater, a reverse coater, a dip coater, a kiss coater, or the like, and preferably has a thickness of about 0.02 μm to about 0.3 μm. More preferably, an adhesive layer 10 having a thickness of about 0.02 μm to about 0.1 μm is formed. When the thickness of the adhesive layer 10 is less than about 0.02 μm, the adhesive strength is reduced. On the other hand, when the thickness of the adhesive layer 10 exceeds about 0.3 μm, defects (gaps) may be generated. Is not preferred.

  The adhesive layer 10 is dried at a temperature of, for example, room temperature (25 ° C.) to about 80 ° C. for about 1 minute to about 5 minutes. The conditions for drying the adhesive layer 10 are not particularly limited.

  FIG. 5 shows that the adhesive layer 10 formed on the third support sheet 9 is adhered to the surface of the ceramic green sheet 2 formed on the first support sheet 1, and the third support sheet is formed from the adhesive layer 10. 9 is a schematic sectional view showing a preferred embodiment of the bonding / peeling device for peeling 9;

  As shown in FIG. 5, the bonding / peeling apparatus according to the present embodiment includes a pair of pressure rollers 15 and 16 maintained at a temperature of about 40 ° C. to about 100 ° C.

  As shown in FIG. 5, the third support sheet 9 on which the adhesive layer 10 is formed is separated from the third support sheet 9 by the tensile force applied to the third support sheet 9. The first support sheet 1 on which the ceramic green sheet 2 is formed is supplied from a diagonally upper side to the first support sheet 1 so that the first support sheet 1 And a pair of pressure rollers 15, 16 in a substantially horizontal direction so that the ceramic green sheet 2 comes into contact with the surface of the adhesive layer 10 formed on the third support sheet 9. Supplied in between.

  The supply speed of the first support sheet 1 and the third support sheet 9 is set to, for example, 2 m / sec, and the nip pressure of the pair of pressure rollers 15, 16 is preferably about 0.2 to about 15 MPa. , More preferably, from about 0.2 MPa to about 6 MPa.

  As a result, the adhesive layer 10 formed on the third support sheet 9 is bonded to the surface of the ceramic green sheet 2 formed on the first support sheet 1.

  As shown in FIG. 5, the third support sheet 9 on which the adhesive layer 10 is formed is conveyed obliquely upward from between the pair of pressure rollers 15, 16. The sheet 9 is peeled off from the adhesive layer 10 adhered to the surface of the ceramic green sheet 2.

  When the third support sheet 9 is peeled from the adhesive layer 10, static electricity is generated, dust adheres, and the adhesive layer is attracted to the third support sheet, and as desired, the third support sheet 9 is removed. In this embodiment, the adhesive layer 10 contains 0.01% to 15% by weight of the imidazoline-based surfactant based on the binder. Therefore, generation of static electricity can be effectively prevented.

  Further, according to the study of the present inventor, when the adhesive layer 10 contains 0.01% to 15% by weight of the binder of the imidazoline surfactant, it is possible to prevent static electricity with a small amount. It has been found that it is possible to peel off the third support sheet 9 from the adhesive layer 10 with a particularly small peeling force, so that it can be easily and as desired. The third support sheet 9 can be peeled off from the adhesive layer 10.

  Thus, the adhesive layer 10 is adhered to the surface of the ceramic green sheet 2 formed on the first support sheet 1, and when the third support sheet 9 is separated from the adhesive layer 10, the ceramic green sheet 2 is formed. The adhesive layer 10 is bonded to the surface of the electrode layer 6 and the spacer layer 7 formed on the second support sheet 4 via the adhesive layer 10.

  FIG. 6 is a schematic cross-sectional view showing a preferred embodiment of the bonding apparatus for bonding the ceramic green sheet 2 to the surfaces of the electrode layer 6 and the spacer layer 7 via the bonding layer 10.

  As shown in FIG. 6, the bonding apparatus according to the present embodiment includes a pair of pressure rollers 17 and 18 maintained at a temperature of about 40 ° C. to about 100 ° C., on which the electrode layer 6 and the spacer layer 7 are formed. The supplied second support sheet 4 is supplied between the pair of pressure rollers 17 and 18 so that the second support sheet 4 contacts the upper pressure roller 17, and the ceramic green sheet 2 and the adhesive layer 10 are provided. Is formed between the pair of pressure rollers 17, 18 such that the first support sheet 1 contacts the lower pressure roller 18.

  In the present embodiment, the pressure roller 17 is constituted by a metal roller, and the pressure roller 18 is constituted by a rubber roller.

  The supply speed of the first support sheet 1 and the second support sheet 4 is set to, for example, 2 m / sec, and the nip pressure between the pair of pressure rollers 17, 18 is preferably about 0.2 to about 15 MPa. , More preferably, from about 0.2 MPa to about 6 MPa.

  In the present embodiment, the ceramic green sheet 2, the electrode layer 6 and the spacer layer 7 are bonded via the bonding layer 10, and the ceramic green sheet 2, the electrode layer 6 and the spacer layer 7 are bonded to each other as in the related art. The ceramic green sheet 2 is not bonded to the electrode layer 6 and the spacer layer 7 by utilizing the adhesive strength of the contained binder and the deformation of the ceramic green sheet 2, the electrode layer 6 and the spacer layer 7. For example, the ceramic green sheet 2 can be bonded to the electrode layer 6 and the spacer layer 7 at a low pressure of about 0.2 MPa to about 15 MPa.

  Therefore, it is possible to prevent the deformation of the ceramic green sheet 2, the electrode layer 6, and the spacer layer 7, and thus, the obtained laminate of the ceramic green sheet 2, the electrode layer 6, and the spacer layer 7 is laminated, It is possible to improve the lamination accuracy when producing a multilayer ceramic capacitor.

  In the present embodiment, the electrode layer 6 and the spacer layer 7 having a lower density and a higher compression ratio than the electrode layer 6 are formed so that ts / te = 1.1. When the spacer layer 7 is transferred onto the ceramic green sheet 2 via the adhesive layer 10, the spacer layer 7 is compressed by pressure, and the spacer layer 7 and the ceramic green sheet are bonded via the adhesive layer 10. 2 can be securely bonded to each other, so that when the second support sheet 4 is peeled, the spacer layer 7 can be reliably prevented from peeling off together with the second support sheet 4. Become.

  Further, in the present embodiment, after the electrode layer 6 formed on the second support sheet 4 is dried, the electrode layer 6 is bonded to the surface of the ceramic green sheet 2 via the adhesive layer 10. Since the electrode paste is formed, the electrode paste dissolves the binder contained in the ceramic green sheet 2 as in the case where the electrode paste is printed on the surface of the ceramic green sheet 2 to form the electrode layer 6. Alternatively, the electrode layer 6 can be formed on the surface of the ceramic green sheet 2 as desired without swelling and without the electrode paste seeping into the ceramic green sheet 2.

  As described above, the electrode layer 6 and the spacer layer 7 formed on the second support sheet 4 are formed on the surface of the ceramic green sheet 2 formed on the first support sheet 1 with the adhesive layer 10 interposed therebetween. Is adhered, the second support sheet 4 is peeled from the release layer 5.

  Thus, on the surface of the first support sheet 1, a laminate is formed in which the ceramic green sheet 2, the adhesive layer 10, the electrode layer 6, the spacer layer 7, and the release layer 5 are laminated.

  Next, the adhesive layer 10 of the adhesive layer sheet 11 is peeled off in exactly the same manner as the transfer of the adhesive layer 10 of the adhesive layer sheet 11 onto the surface of the ceramic green sheet 2 formed on the first support sheet 1. It is transferred to the surface of layer 5.

  The laminate obtained as described above is cut into a predetermined size, and a ceramic green sheet 2, an adhesive layer 10, an electrode layer 6, a spacer layer 7, a release layer is formed on the surface of the first support sheet 1. 5 and the adhesive layer 10 are laminated to produce a laminated unit having a predetermined size.

  FIG. 7 is a schematic cross-sectional view of the laminate unit cut into a predetermined size.

  As shown in FIG. 7, the laminate unit 20 is formed on the surface of the first support sheet 1, and includes a ceramic green sheet 2, an adhesive layer 10, an electrode layer 6, a spacer layer 7, a release layer 5, and an adhesive layer. 10 is included.

  Similarly, the ceramic green sheet 2, the adhesive layer 10, the electrode layer 6, the spacer layer 7, and the release layer 5 are laminated on the surface of the first support sheet 1, and the adhesive layer 10 is formed on the surface of the release layer 5. By transferring, a large number of laminate units 20 each including the ceramic green sheet 2, the adhesive layer 10, the electrode layer 6, the spacer layer 7, the release layer 5, and the adhesive layer 10 are produced.

  The multilayer ceramic capacitor is manufactured by laminating a large number of the multilayer units 20 thus manufactured via the adhesive layer 10 transferred to the surface of the release layer 5.

  FIG. 8 is a schematic partial cross-sectional view showing the first step of the stacking process of the stack unit 20.

  As shown in FIG. 8, when stacking the stacked unit 20, first, a support 28 is set on a substrate 25 in which a large number of holes 26 are formed.

  As the support 28, for example, a polyethylene terephthalate film or the like is used.

  The support 28 is sucked by air through a number of holes 26 formed in the substrate 25 and is fixed at a predetermined position on the substrate 25.

  FIG. 9 is a schematic partial cross-sectional view illustrating a second step of the stacking process of the stack unit 20.

  Next, as shown in FIG. 9, the laminate unit 20 is positioned such that the surface of the adhesive layer 10 transferred to the surface of the release layer 5 contacts the surface of the support 28, and Is pressed by a press or the like.

  As a result, the laminate unit 20 is adhered and laminated on the support 28 fixed on the substrate 25 via the adhesive layer 10 transferred to the surface of the release layer 5.

  FIG. 10 is a schematic partial cross-sectional view showing a third step of the stacking process of the stack unit 20.

  When the laminate unit 20 is adhered and laminated on the support 28 fixed on the substrate 25 via the adhesive layer 10 transferred to the surface of the release layer 5, as shown in FIG. Then, the first support sheet 1 is peeled from the ceramic green sheet 2 of the laminate unit 20.

  Thus, on the release layer 5 of the laminate unit 20 laminated on the support 28 fixed on the substrate 25, via the adhesive layer 10 transferred to the surface of the release layer 5, 20 are stacked.

  FIG. 11 is a schematic partial cross-sectional view illustrating a fourth step of the stacking process of the stack unit 20.

  Then, as shown in FIG. 11, the surface of the adhesive layer 10 transferred to the surface of the release layer 5 is adhered to the support 28 fixed to the substrate 25 and the surface of the ceramic green sheet 2 of the laminate unit 20. The new laminate unit 20 is positioned so as to contact the first laminate sheet 20, and the first support sheet 1 of the new laminate unit 20 is pressed by a press or the like.

  As a result, a new laminate unit 20 is placed on the laminate unit 20 bonded on the support 28 fixed on the substrate 25 via the adhesive layer 10 transferred to the surface of the release layer 5. It is laminated.

  FIG. 12 is a schematic partial cross-sectional view showing a fifth step of the stacking process of the stack unit 20.

  When a new laminate unit 20 is laminated via the adhesive layer 10 on the laminate unit 20 adhered to the support 28 fixed on the substrate 25, as shown in FIG. Then, the first support sheet 1 of the newly laminated unit 20 is separated from the ceramic green sheet 2 of the laminated unit 20.

  Similarly, the laminate units 20 are successively laminated, and a predetermined number of the laminate units 20 are laminated on the support 28 fixed to the substrate 25 to produce a laminate block.

  When a predetermined number of the laminate units 20 are stacked on the support 28 fixed to the substrate 25 to form a laminate block, a predetermined number of the laminate units 20 are placed on the support 28 fixed to the substrate 25. A multilayer block in which a number of multilayer units 20 are stacked is stacked on the outer layer of the multilayer ceramic capacitor.

  FIG. 13 is a schematic partial cross-sectional view showing a first step of a laminating process of laminating a laminate block laminated on a support 28 fixed to a substrate 25 on an outer layer of a multilayer ceramic capacitor.

  As shown in FIG. 13, first, an outer layer 33 on which an adhesive layer 32 is formed is set on a base 30 on which a number of holes 31 are formed.

  The outer layer 33 is sucked by air through a large number of holes 31 formed in the base 30 and fixed at a predetermined position on the base 30.

  Next, as shown in FIG. 13, the stacked block 40, which is sucked by air through the large number of holes 26 and stacked on the support 28 fixed at a predetermined position on the substrate 25, Is positioned so that the surface of the ceramic green sheet 2 of the multilayer unit 20 stacked on the outer layer 33 contacts the surface of the adhesive layer 32 formed on the outer layer 33.

  Next, the suction of the support 28 by the air is stopped, and the substrate 25 is removed from the support 28 supporting the stacked block 40.

  When the substrate 25 is removed from the support 28, the support 28 is pressed by a press or the like.

  As a result, the laminate block 40 is bonded and laminated on the outer layer 33 fixed on the base 30 via the adhesive layer 32.

  FIG. 14 is a schematic partial cross-sectional view showing a second step of the laminating process of laminating the laminated block laminated on the support 28 fixed to the substrate 25 on the outer layer of the multilayer ceramic capacitor.

  When the laminate block 40 is adhered onto the outer layer 33 fixed on the base 30 via the adhesive layer 32 and laminated, as shown in FIG. The adhesive layer 10 is peeled off.

  Thus, the laminate block 40 in which the predetermined number of the laminate units 20 are laminated on the outer layer 33 fixed on the base 30 via the adhesive layer 32 is laminated.

  When the laminate block 40 is laminated on the outer layer 33 fixed on the base 30 via the adhesive layer 32, the laminate block laminated on the outer layer 33 fixed on the base 30 A predetermined number of the laminate units are placed on the adhesive layer 10 of the uppermost laminate unit 20 of the forty and on the support 28 fixed to the substrate 25 according to the steps shown in FIGS. 20 are laminated, and a new laminated block 40 thus produced is laminated.

  FIG. 15 is a schematic partial cross-sectional view showing a third step of the laminating process of laminating the laminated block laminated on the support 28 fixed to the substrate 25 on the outer layer of the laminated ceramic capacitor.

  As shown in FIG. 15, the stacked block 40 newly sucked on the support 28 fixed at a predetermined position on the substrate 25 by the air is sucked through the many holes 26, The surface of the ceramic green sheet 2 of the laminate unit 20 laminated on the surface of the adhesive layer 10 of the uppermost laminate unit 20 of the laminate block 40 laminated on the outer layer 33 fixed on the base 30 Is positioned so as to come into contact with.

  Next, the suction of the support 28 by the air is stopped, and the substrate 25 is removed from the support 28 supporting the stacked block 40.

  When the substrate 25 is removed from the support 28, the support 28 is pressed by a press or the like.

  As a result, the newly laminated block 40 is bonded via the adhesive layer 10 to the laminated block 40 laminated on the outer layer 33 fixed on the base 30 and laminated.

  FIG. 16 is a schematic partial cross-sectional view showing a fourth step of the lamination process of laminating the laminated block laminated on the support 28 fixed to the substrate 25 on the outer layer of the multilayer ceramic capacitor.

  When the newly laminated block 40 is adhered to the laminated block 40 laminated on the outer layer 33 fixed on the base 30 via the adhesive layer 10 and laminated, FIG. As shown in (2), the support 28 is peeled off from the adhesive layer 10 of the newly laminated block 40.

  In this way, the newly laminated block 40 is bonded and laminated on the laminated block 40 laminated on the outer layer 33 fixed on the base 30 via the adhesive layer 10.

  Similarly, the laminate blocks 40 laminated on the support 28 fixed to the substrate 25 are sequentially laminated, and a predetermined number of the laminate blocks 40 and, therefore, a predetermined number of the laminate units 20 are stacked. Are laminated on the outer layer 33 of the multilayer ceramic capacitor.

  In this way, when a predetermined number of the multilayer units 20 are stacked on the outer layer 33 of the multilayer ceramic capacitor, the other outer layer (not shown) is bonded via an adhesive layer, and the predetermined number of A laminate including the body unit 20 is created.

  Next, the multilayer body including the predetermined number of multilayer units 20 is cut into a predetermined size, and a large number of ceramic green chips are manufactured.

  The ceramic green chip thus manufactured is placed in a reducing gas atmosphere, the binder is removed, and the chip is fired.

  Next, necessary external electrodes and the like are attached to the fired ceramic green chip, and a multilayer ceramic capacitor is manufactured.

  According to the present embodiment, the ceramic green sheet 2, the electrode layer 6, and the spacer layer 7 are bonded via the bonding layer 10, and the ceramic green sheet 2, the electrode layer 6, and the spacer layer 7 are formed in a conventional manner. The ceramic green sheet 2 is not bonded to the electrode layer 6 and the spacer layer 7 by utilizing the adhesive force of the binder contained in the ceramic green sheet 2 and the deformation of the ceramic green sheet 2, the electrode layer 6 and the spacer layer 7. Therefore, the ceramic green sheet 2 can be bonded to the electrode layer 6 and the spacer layer 7 at a low pressure of, for example, about 0.2 MPa to about 15 MPa.

  Therefore, it is possible to prevent the deformation of the ceramic green sheet 2, the electrode layer 6, and the spacer layer 7, and thus, the obtained laminate of the ceramic green sheet 2, the electrode layer 6, and the spacer layer 7 is laminated, It is possible to improve the lamination accuracy when producing a multilayer ceramic capacitor.

  Further, according to this embodiment, after the electrode layer 6 formed on the second support sheet 4 is dried, it is configured to adhere to the surface of the ceramic green sheet 2 via the adhesive layer 10. Then, as in the case where the electrode paste is printed on the surface of the ceramic green sheet 2 to form the electrode layer 6, the electrode paste dissolves or swells the binder contained in the ceramic green sheet 2. Thus, the electrode layer 6 can be formed on the surface of the ceramic green sheet 2 as desired without causing the electrode paste to permeate into the ceramic green sheet 2.

  Further, when the third support sheet 9 is peeled off from the adhesive layer 10, static electricity is generated, dust adheres, or the adhesive layer 10 is attracted to the third support sheet 9, and the third In some cases, it may be difficult to peel off the third support sheet 9 from the adhesive layer 10, but according to the present embodiment, the adhesive layer 10 may have a content of 0.01% by weight to 15% by weight based on the binder. Since it contains an imidazoline-based surfactant, it is possible to effectively prevent the generation of static electricity.

  According to the research of the present inventor, when the bonding layer 10 contains 0.01% to 15% by weight of the imidazoline surfactant of the binder, it is possible to prevent static electricity with a small amount. It has been found that the third support sheet 9 can be peeled from the adhesive layer 10 with a particularly small peeling force. Therefore, according to the present embodiment, And it becomes possible to peel off the third support sheet 9 from the adhesive layer 10 as desired.

  Further, according to the present embodiment, the electrode layer 6 and the spacer layer 7 having a lower density and a higher compressibility than the electrode layer 6 are formed so as to satisfy ts / te = 1.1. When the spacer 6 and the spacer layer 7 are transferred onto the ceramic green sheet 2 via the adhesive layer 10, the spacer layer 7 is compressed by the pair of pressure rollers 17, 18, so that not only the spacer layer 7 but also The electrode layer 6 is also securely adhered to the surface of the ceramic green sheet 2 via the adhesive layer 10, and therefore, when the second support sheet 4 is peeled off, the electrode layer 6 is removed together with the second support sheet 4. Thus, peeling from the ceramic green sheet 2 can be effectively prevented.

  Hereinafter, in order to further clarify the effects of the present invention, Examples and Comparative Examples will be given.

Example 1
Preparation of Dielectric Paste for Ceramic Green Sheet A dielectric powder having the following composition was prepared.

BaTiO ₃ powder (manufactured by Sakai Chemical Industry Co., Ltd .: trade name “BT-02”)
100 parts by weight MgCO ₃ 0.72 parts by weight MnO 0.13 parts by weight (Ba _0.6 Ca _0.4 ) SiO ₃ 1.5 parts by weight Y ₂ O ₃ 1.0 parts by weight

  An organic vehicle having the following composition was added to 100 parts by weight of the dielectric powder thus prepared, and mixed for 20 hours using a ball mill to prepare a dielectric paste for a ceramic green sheet.

Polyvinyl butyral resin (binder) 6 parts by weight Bis (2-ethylhexyl) phthalate 3 parts by weight (DOP: plasticizer)
78 parts by weight of ethanol 78 parts by weight of n-propanol 14 parts by weight of xylene 7 parts by weight of mineral spirit 0.7 part by weight of dispersant

Preparation of Adhesive Paste An organic vehicle having the following composition was prepared, and the obtained organic vehicle was diluted 10-fold with methyl ethyl ketone to prepare a paste for an adhesive.

Polyvinyl butyral resin (binder) 100 parts by weight Bis (2-ethylhexyl) phthalate 50 parts by weight (DOP: plasticizer)
Methyl ethyl ketone 900 parts by weight Imidazoline surfactant 5 parts by weight

Preparation of Ceramic Green Sheet Using a wire bar coater, a dielectric paste for a ceramic green sheet was applied to the surface of the polyethylene terephthalate film and dried to prepare a 1.0 μm thick ceramic green sheet.

Formation of Adhesive Layer An adhesive paste was applied to the surface of another polyethylene terephthalate film using a wire bar coater to form an adhesive layer having a thickness of 0.1 μm.

Transfer of the Adhesive Layer The adhesive layer formed on the surface of the polyethylene terephthalate film is adhered to the surface of the ceramic green sheet at a nip pressure of 0.5 MPa using the adhesive / peeling apparatus shown in FIG. Then, the polyethylene terephthalate film was peeled off, and the adhesive layer was transferred to the surface of the ceramic green sheet.

  Shinko Co., Ltd .: Using a digital electrostatic potential measuring device "SSS-1" (trade name), measure the amount of static electricity generated when the polyethylene terephthalate film is peeled off from the adhesive layer, and use Iiko Engineering Co., Ltd. Manufacture: The peeling force required to peel off the polyethylene terephthalate film from the adhesive layer was measured using a digital load meter “MODEL-1311D” (trade name).

Example 2
A ceramic green sheet was formed on the surface of a polyethylene terephthalate film and another polyethylene terephthalate was formed in the same manner as in Example 1 except that an adhesive paste was prepared by adding 10% by weight of an imidazoline surfactant. An adhesive layer is formed on the surface of the film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and a pressure of 0.5 MPa is applied to cause the adhesive to adhere. The terephthalate film was peeled off, and in the same manner as in Example 1, the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer and the peeling force required to peel off the polyethylene terephthalate film from the adhesive layer were measured.

Example 3
A ceramic green sheet was formed on the surface of a polyethylene terephthalate film and another polyethylene terephthalate was formed in the same manner as in Example 1 except that an adhesive paste was prepared by adding 15% by weight of an imidazoline surfactant. An adhesive layer is formed on the surface of the film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and a pressure of 0.5 MPa is applied to cause the adhesive to adhere. The terephthalate film was peeled off, and in the same manner as in Example 1, the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer and the peeling force required to peel off the polyethylene terephthalate film from the adhesive layer were measured.

Example 4
Instead of the imidazoline-based surfactant, 5% by weight of a polyalkylene glycol derivative-based surfactant was added to prepare an adhesive paste, and in the same manner as in Example 1, the surface of the polyethylene terephthalate film was While forming a ceramic green sheet, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and a pressure of 0.5 MPa is applied. After bonding, the polyethylene terephthalate film was peeled off from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled off from the adhesive layer and the polyethylene terephthalate film were removed in the same manner as in Example 1. Required to peel from The peel force was measured that.

Example 5
Instead of the imidazoline-based surfactant, 10% by weight of a polyalkylene glycol derivative-based surfactant was added to prepare an adhesive paste, and in the same manner as in Example 1, the surface of the polyethylene terephthalate film was While forming a ceramic green sheet, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and a pressure of 0.5 MPa is applied. After bonding, the polyethylene terephthalate film was peeled off from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled off from the adhesive layer and the polyethylene terephthalate film were removed in the same manner as in Example 1. To peel from The peel force was measured.

Example 6
In place of the imidazoline-based surfactant, a polyalkylene glycol derivative-based surfactant was added in an amount of 15% by weight to prepare an adhesive paste, in the same manner as in Example 1, except that the surface of the polyethylene terephthalate film was While forming a ceramic green sheet, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and a pressure of 0.5 MPa is applied. After bonding, the polyethylene terephthalate film was peeled off from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled off from the adhesive layer and the polyethylene terephthalate film were removed in the same manner as in Example 1. To peel from The peel force was measured.

Example 7
Instead of the imidazoline-based surfactant, 5% by weight of a carboxylic acid amidine salt-based surfactant was added to prepare an adhesive paste in the same manner as in Example 1, except that the surface of the polyethylene terephthalate film was While forming a ceramic green sheet, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and a pressure of 0.5 MPa is applied. After bonding, the polyethylene terephthalate film was peeled off from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled off from the adhesive layer and the polyethylene terephthalate film were removed in the same manner as in Example 1. Peeling force required to peel from It was measured.

Example 8
Instead of the imidazoline-based surfactant, 10% by weight of a carboxylic acid amidine salt-based surfactant was added to prepare an adhesive paste, and in the same manner as in Example 1, the surface of the polyethylene terephthalate film was While forming a ceramic green sheet, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and a pressure of 0.5 MPa is applied. After bonding, the polyethylene terephthalate film was peeled off from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled off from the adhesive layer and the polyethylene terephthalate film were removed in the same manner as in Example 1. Peeling required for peeling from It was measured.

Example 9
Instead of the imidazoline-based surfactant, 15% by weight of a carboxylic acid amidine salt-based surfactant was added to prepare an adhesive paste in the same manner as in Example 1, except that the surface of the polyethylene terephthalate film was While forming a ceramic green sheet, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and a pressure of 0.5 MPa is applied. After bonding, the polyethylene terephthalate film was peeled off from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled off from the adhesive layer and the polyethylene terephthalate film were removed in the same manner as in Example 1. Peeling required for peeling from It was measured.

Example 10
A ceramic green sheet is formed on the surface of a polyethylene terephthalate film in the same manner as in Example 1 except that an adhesive paste is prepared by adding 5% by weight of ethylene glycol instead of the imidazoline-based surfactant. At the same time, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and after applying a pressure of 0.5 MPa, the adhesive layer is adhered. Then, the polyethylene terephthalate film was peeled from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer and the polyethylene terephthalate film required to peel the polyethylene terephthalate film from the adhesive layer in the same manner as in Example 1. The peel force was measured.

Example 11
A ceramic green sheet is formed on the surface of a polyethylene terephthalate film in the same manner as in Example 1 except that an adhesive paste is prepared by adding 10% by weight of ethylene glycol instead of the imidazoline-based surfactant. At the same time, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and after applying a pressure of 0.5 MPa, the adhesive layer is adhered. Then, the polyethylene terephthalate film was peeled from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer and the polyethylene terephthalate film required to peel the polyethylene terephthalate film from the adhesive layer in the same manner as in Example 1. The peel force was measured.

Example 12
A ceramic green sheet is formed on the surface of a polyethylene terephthalate film in the same manner as in Example 1 except that an adhesive paste is prepared by adding 15% by weight of ethylene glycol instead of the imidazoline-based surfactant. At the same time, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and after applying a pressure of 0.5 MPa, the adhesive layer is adhered. Then, the polyethylene terephthalate film was peeled from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer and the polyethylene terephthalate film required to peel the polyethylene terephthalate film from the adhesive layer in the same manner as in Example 1. The peel force was measured.

Example 13
A ceramic green sheet is formed on the surface of a polyethylene terephthalate film in the same manner as in Example 1 except that an adhesive paste is prepared by adding 5% by weight of polyethylene glycol instead of the imidazoline-based surfactant. At the same time, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and after applying a pressure of 0.5 MPa, the adhesive layer is adhered. Then, the polyethylene terephthalate film was peeled from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer and the polyethylene terephthalate film required to peel the polyethylene terephthalate film from the adhesive layer in the same manner as in Example 1. Peel force was measured

Example 14
A ceramic green sheet is formed on the surface of a polyethylene terephthalate film in the same manner as in Example 1 except that an adhesive paste is prepared by adding 10% by weight of polyethylene glycol instead of the imidazoline-based surfactant. At the same time, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and after applying a pressure of 0.5 MPa, the adhesive layer is adhered. Then, the polyethylene terephthalate film was peeled from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer and the polyethylene terephthalate film required to peel the polyethylene terephthalate film from the adhesive layer in the same manner as in Example 1. Measure the peel force .

Example 15
A ceramic green sheet is formed on the surface of a polyethylene terephthalate film in the same manner as in Example 1 except that an adhesive paste is prepared by adding 15% by weight of polyethylene glycol instead of the imidazoline-based surfactant. At the same time, an adhesive layer is formed on the surface of another polyethylene terephthalate film, the adhesive layer is brought into close contact with the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and after applying a pressure of 0.5 MPa, the adhesive layer is adhered. Then, the polyethylene terephthalate film was peeled from the adhesive layer, and the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer and the polyethylene terephthalate film required to peel the polyethylene terephthalate film from the adhesive layer in the same manner as in Example 1. Measure the peel force .

Comparative Example A ceramic green sheet was formed on the surface of a polyethylene terephthalate film and the surface of another polyethylene terephthalate film was formed in the same manner as in Example 1 except that an adhesive paste was prepared without adding an antistatic agent. An adhesive layer is formed on the surface of the ceramic green sheet formed on the polyethylene terephthalate film, and the adhesive layer is applied by applying a pressure of 0.5 MPa, and then the polyethylene terephthalate film is removed from the adhesive layer. After peeling, the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer and the peeling force required to peel the polyethylene terephthalate film from the adhesive layer were measured in the same manner as in Example 1.

  FIG. 17 shows the results of measuring the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer in Examples 1 to 3 and Comparative Example.

  On the other hand, in Examples 4 to 6 and Comparative Example, the results of measuring the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer are shown in FIG.

  Further, in Examples 7 to 9 and Comparative Example, the results of measuring the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer are shown in FIG.

  FIG. 20 shows the results of measuring the amount of static electricity generated when the polyethylene terephthalate film was peeled off from the adhesive layer in Examples 10 to 12 and Comparative Example.

  On the other hand, in Examples 13 to 15 and Comparative Example, the results of measuring the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer are shown in FIG.

  As is clear from FIGS. 17 to 21, when an antistatic agent is added to the adhesive paste, it is possible to reduce static electricity generated when the polyethylene terephthalate film is peeled from the adhesive layer, In particular, when an imidazoline-based surfactant, a polyalkylene glycol derivative-based surfactant or a carboxylic acid amidine salt-based surfactant is added as an antistatic agent to prepare an adhesive paste, 2.5% It was found that when an adhesive layer containing a surfactant was formed, the generation of static electricity was almost zero.

  FIG. 22 shows the results of measuring the peeling force required for peeling the polyethylene terephthalate film from the adhesive layer in Examples 1 to 3 and Comparative Example.

  On the other hand, in Examples 4 to 6 and Comparative Example, the results of measuring the peel force required to peel the polyethylene terephthalate film from the adhesive layer are shown in FIG.

  Further, in Examples 7 to 9 and Comparative Example, the results of measuring the peel force required to peel the polyethylene terephthalate film from the adhesive layer are shown in FIG.

  Further, in Examples 10 to 12 and Comparative Example, the results of measuring the peel force required to peel the polyethylene terephthalate film from the adhesive layer are shown in FIG.

  On the other hand, in Examples 13 to 15 and Comparative Example, the results of measuring the peeling force required to peel the polyethylene terephthalate film from the adhesive layer are shown in FIG.

  As is clear from FIGS. 22 to 26, when an adhesive paste was prepared by adding ethylene glycol or polyethylene glycol as an antistatic agent, the polyethylene terephthalate film was added to the adhesive layer as the amount of addition increased. When the adhesive force is increased, the peeling force required for peeling from the adhesive increases, and a polyalkylene glycol derivative-based surfactant or a carboxylic acid amidine salt-based surfactant is added as an antistatic agent to prepare an adhesive paste. As the amount increases, the peeling force required to peel the polyethylene terephthalate film from the adhesive layer gradually increases, whereas an imidazoline surfactant is added as an antistatic agent, when an adhesive paste is prepared. For polyethylene in the range of 5% to 10% by weight The terephthalate film, peel force required to peel the adhesive layer was found to decrease.

  Therefore, when an adhesive paste is prepared by adding 2.5% of an imidazoline-based surfactant to a butyral-based resin, the generation of static electricity is prevented, and the polyethylene terephthalate film is removed with a small peeling force. , Which was found to be the most preferable.

  The present invention is not limited to the above embodiments, and various changes can be made within the scope of the invention described in the claims, and these are also included in the scope of the present invention. Needless to say.

  For example, in the above embodiment, the adhesive layer 10 contains 0.01% to 15% by weight of the binder of the imidazoline surfactant, but the adhesive layer 10 contains 0.01% to 15% by weight of the binder. It is not necessary to contain imidazoline surfactant by weight. In the present invention, it is most preferable to use an imidazoline surfactant as an antistatic agent for the adhesive layer 10, but other amphoteric surfactants such as a polyalkylene glycol derivative surfactant and a carboxylic acid amidine salt surfactant. Surfactants can also be preferably used as an antistatic agent for the adhesive layer 10, and furthermore, ethylene glycol, polyethylene glycol, 2-3 butanediol, glycerin and the like can be used as an antistatic agent for the adhesive layer 10. , Can also be used.

  Further, in the above embodiment, the electrode layer 6 and the spacer layer 7 are formed on the surface of the release layer 5 so that ts / te = 1.1 (where ts is the thickness of the spacer layer 7). , Te is the thickness of the electrode layer 6), preferably 0.8 ≦ ts / te ≦ 1.1, more preferably, so that 0.7 ≦ ts / te ≦ 1.3. The electrode layer 6 and the spacer layer 7 may be formed so that 0.9 ≦ ts / te ≦ 1.1, and the electrode layer 6 and the spacer layer 7 may be formed such that ts / te = 1.1. It is not necessary to do so.

  In the above embodiment, the electrode layer 6 and the spacer layer 7 are bonded to the surface of the ceramic green sheet 2 via the bonding layer 10 using the bonding device shown in FIG. The second support sheet 4 is peeled off from the release layer 5, and the electrode layer 6 and the spacer layer 7 are separated through the adhesive layer 10 by using the bonding / peeling device shown in FIG. The second support sheet 4 may be peeled from the release layer 5 while being adhered to the surface of the second support sheet 4.

FIG. 1 is a schematic partial cross-sectional view showing a state where a ceramic green sheet is formed on a surface of a first support sheet. FIG. 2 is a schematic partial cross-sectional view of a second support sheet having a release layer and an electrode layer formed on its surface. FIG. 3 is a schematic partial cross-sectional view showing a state where an electrode layer and a spacer layer are formed on the surface of the release layer. FIG. 4 is a schematic partial cross-sectional view of an adhesive layer sheet having an adhesive layer formed on the surface of a third support sheet. FIG. 5 shows an adhesion / adhesion method in which the adhesive layer formed on the third support sheet is adhered to the surface of the ceramic green sheet formed on the first support sheet, and the third support sheet is separated from the adhesive layer. 1 is a schematic sectional view showing a preferred embodiment of a peeling device. FIG. 6 is a schematic cross-sectional view showing a preferred embodiment of the bonding apparatus for bonding the electrode layer and the spacer layer to the surface of the ceramic green sheet via the bonding layer. FIG. 7 is a schematic cross-sectional view of a laminate unit in which a ceramic green sheet, an adhesive layer, an electrode layer, a spacer layer, a release layer, and an adhesive layer are laminated on a first support sheet. FIG. 8 is a schematic partial cross-sectional view showing the first step of the stacking process of the stack unit. FIG. 9 is a schematic partial cross-sectional view illustrating a second step of the stacking process of the stack unit. FIG. 10 is a schematic partial cross-sectional view showing a third step of the stacking process of the stack unit. FIG. 11 is a schematic partial cross-sectional view showing a fourth step of the stacking process of the stack unit. FIG. 12 is a schematic partial cross-sectional view showing a fifth step of the stacking process of the stack unit. FIG. 13 is a schematic partial cross-sectional view showing a first step of a lamination process of laminating a laminate block laminated on a support sheet fixed to a substrate on an outer layer of a multilayer ceramic capacitor. FIG. 14 is a schematic partial cross-sectional view showing a second step of a laminating process of laminating a laminate block laminated on a support sheet fixed to a substrate on an outer layer of a multilayer ceramic capacitor. FIG. 15 is a schematic partial cross-sectional view showing a third step of the laminating process of laminating the laminated block laminated on the support sheet fixed to the substrate on the outer layer of the multilayer ceramic capacitor. FIG. 16 is a schematic partial cross-sectional view showing a fourth step of a laminating process of laminating a laminate block laminated on a support sheet fixed to a substrate on an outer layer of a multilayer ceramic capacitor. FIG. 17 is a graph showing the results of measuring the amount of static electricity generated when peeling the polyethylene terephthalate film from the adhesive layer in Examples 1 to 3 and Comparative Example. FIG. 18 is a graph showing the results of measuring the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer in Examples 4 to 6 and Comparative Example. FIG. 19 is a graph showing the results of measuring the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer in Examples 7 to 9 and Comparative Example. FIG. 20 is a graph showing the results of measuring the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer in Examples 10 to 12 and Comparative Example. FIG. 21 is a graph showing the results of measuring the amount of static electricity generated when the polyethylene terephthalate film was peeled from the adhesive layer in Examples 13 to 15 and Comparative Example. FIG. 22 is a graph showing the results of measuring the peel force required to peel the polyethylene terephthalate film from the adhesive layer in Examples 1 to 3 and Comparative Example. FIG. 23 is a graph showing the results of measuring the peel force required to peel the polyethylene terephthalate film from the adhesive layer in Examples 4 to 6 and Comparative Example. FIG. 24 is a graph showing the results of measuring the peeling force required to peel the polyethylene terephthalate film from the adhesive layer in Examples 7 to 9 and Comparative Example. FIG. 25 is a graph showing the results of measuring the peel force required to peel the polyethylene terephthalate film from the adhesive layer in Examples 10 to 12 and Comparative Example. FIG. 26 is a graph showing the results of measuring the peel force required to peel the polyethylene terephthalate film from the adhesive layer in Examples 13 to 15 and Comparative Example.

Explanation of reference numerals

REFERENCE SIGNS LIST 1 first support sheet 2 ceramic green sheet 4 second support sheet 5 release layer 6 electrode layer 7 spacer layer 9 third support sheet 10 adhesive layer 11 adhesive layer sheet 15, 16 pressure roller 17, 18 pressure roller Reference Signs List 20 laminated unit 25 substrate 26 hole 28 support 30 base 31 hole 32 adhesive layer 33 outer layer 40 of laminated ceramic capacitor laminated block

Claims (19)

A step of forming a ceramic green sheet on the surface of the first support sheet, a step of forming a release layer on the surface of the second support sheet, and forming an electrode layer on the surface of the release layer in a predetermined pattern. Forming and forming a spacer layer in a pattern complementary to the electrode layer, and applying 0.01 to 15% by weight of an antistatic agent to the surface of the third support sheet with respect to the binder. A step of forming an adhesive layer including: a surface of the adhesive layer formed on the third support sheet, and a surface of the ceramic green sheet are brought into close contact with each other and pressed, so that the adhesive layer is formed of the ceramic green sheet. A step of bonding to the surface of a sheet, a step of peeling the third support sheet from the adhesive layer, and a surface of the electrode layer and the spacer layer formed on the surface of the second support sheet. A step of producing a laminate unit in which the ceramic green sheet, the electrode layer, and the spacer layer are laminated by bringing the surface of the adhesive layer into close contact, pressing, and bonding. A method of manufacturing a multilayer unit for a multilayer ceramic electronic component. 2. The method according to claim 1, wherein the adhesive layer contains 0.01 to 10% by weight of an antistatic agent with respect to the binder. . 2. The method according to claim 1, wherein the antistatic agent is an amphoteric surfactant selected from the group consisting of an imidazoline surfactant, a polyalkylene glycol derivative surfactant, and a carboxylic acid amidine salt surfactant. 3. The method for manufacturing a multilayer unit for a multilayer ceramic electronic component according to item 2. The method according to claim 3, wherein an imidazoline surfactant is used as the antistatic agent. 5. The method according to claim 1, wherein after forming the electrode layer on the surface of the release layer, the spacer layer is formed on the surface of the release layer in a pattern complementary to the electrode layer. 6. 2. The method for producing a multilayer unit for a multilayer ceramic electronic component according to claim 1. After forming the spacer layer in a pattern complementary to the pattern of the electrode layer to be formed on the surface of the release layer, the electrode layer is formed on the surface of the release layer. The method for manufacturing a multilayer unit for a multilayer ceramic electronic component according to any one of claims 1 to 4. 7. The multilayer ceramic electronic component according to claim 1, wherein the release layer includes a dielectric having the same composition as a dielectric included in the ceramic green sheet. 8. A method for manufacturing a laminate unit. The laminate unit for a multilayer ceramic electronic component according to any one of claims 1 to 7, wherein the release layer includes a binder similar to a binder contained in the ceramic green sheet. Manufacturing method. The multilayer unit for a multilayer ceramic electronic component according to any one of claims 1 to 8, wherein the adhesive layer includes a binder similar to a binder included in the ceramic green sheet. Manufacturing method. 10. The multilayer ceramic electronic component according to claim 1, wherein the spacer layer includes a dielectric having the same composition as a dielectric included in the ceramic green sheet. 11. A method for manufacturing a laminate unit. The multilayer unit for a multilayer ceramic electronic component according to any one of claims 1 to 10, wherein the spacer layer includes a binder similar to a binder included in the ceramic green sheet. Manufacturing method. The method of manufacturing a multilayer unit for a multilayer ceramic electronic component according to claim 1, wherein the adhesive layer is formed to a thickness of 0.1 μm or less. The method according to any one of claims 1 to 12, wherein the ceramic green sheet is formed to a thickness of 3 m or less. 14. The multilayer body unit for a multilayer ceramic electronic component according to claim 1, wherein the ceramic green sheet and the adhesive layer are pressed at a pressure of 0.2 to 15 MPa. Manufacturing method. The method according to any one of claims 1 to 14, wherein the first support sheet, the second support sheet, and the third support sheet are formed of a resin selected from the group consisting of polyethylene terephthalate and polypropylene. The method for producing a multilayer unit for a multilayer ceramic electronic component according to claim 1. A release layer, an electrode layer formed in a predetermined pattern on a surface of the release layer, a spacer layer formed in a pattern complementary to the electrode layer, and a surface of the electrode layer and the spacer layer. An adhesive layer and a ceramic green sheet adhered to the surface of the adhesive layer, wherein the adhesive layer contains 0.01% to 15% by weight of an antistatic agent with respect to a binder. A laminated unit for laminated electronic components. 17. The laminate unit for a multilayer ceramic electronic component according to claim 16, wherein the adhesive layer contains 0.01% to 10% by weight of an antistatic agent with respect to the binder. The adhesive layer is characterized in that the antistatic agent contains an amphoteric surfactant selected from the group consisting of an imidazoline surfactant, a polyalkylene glycol derivative surfactant, and a carboxylic acid amidine salt surfactant. A laminate unit for a laminated electronic component according to claim 16. The laminate unit for a laminated electronic component according to claim 18, wherein the adhesive layer contains an imidazoline-based surfactant as an antistatic agent.

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