JP2004310620A - Ic card and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card and its manufacturing method whereby the reliability of the mechanical connection of a contact type communications external electrode base (tab) can be enhanced. <P>SOLUTION: The IC card comprises a card body 11 with an antenna substrate 111 formed with antenna wiring 12 for non-contact communications; an external electrode substrate 16 embedded in the card body in such a way that an external electrode 163 for contact communications is exposed to the surface of the card body; and an IC chip 14 electrically connected to the antenna substrate and the external electrode, respectively, via connection wiring patterns 15, 17 formed on the antenna substrate. The IC card has a double-fluid setting and thermosetting adhesive layer 20 in liquid form between the external electrode substrate and the antenna substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

実施例１及び比較例１の初期剥離試験の結果を表１に示す。
【００６０】
比較例１の歩留まりが９５％であるのに対し、実施例１の歩留まりは１００％であり、熱をかけた時点で硬化していなかった場合にも、養生期間に化学反応により硬化が起こるために、歩留まりが高いことが確認された。
【００６１】
【表２】

【００６２】
【表３】

実施例１及び比較例１の曲げ試験１０００回毎の抵抗測定値の結果を表２にそれぞれ３例示す。また、曲げ試験後の歩留まりを表３に示す。
【００６３】
比較例１には３０００回終了時点から急激に抵抗値が上がり始めたＩＣカードが１０個見られた。特に短辺方向の曲げに弱いことが分かる。比較例１−２のように図８の▲１▼部分が剥離する場合と、比較例１−３のように図８の▲２▼や▲３▼部が剥離する場合とが観察され、接着剤と被着材の間での界面剥離による抵抗増加が見られた。外部電極基板１６の剥離は図８の▲２▼部や▲３▼部の方が顕著に起こった。
【００６４】
これに対して、実施例１のＩＣカードの曲げ試験後の歩留まりは比較例１よりも格段に改善され、ここからも液状の２液反応型・熱硬化型エポキシ系接着剤の優位性を確認することができた。本発明に係るエポキシ系接着剤は比較例１に使用したシート型接着剤よりも安価であり、コスト的にも接着信頼性の高い接着を提供することができる。
【００６５】
実施例２
ポリエチレンナフタレート（以下、ＰＥＮ）製アンテナ基板１１１の両主面に、アルミニウムエッチングによりアンテナ配線１２，コンデンサ１３を形成したのち、アンテナ基板１１１上の所定位置にＩＣチップ１４１を実装し、その上に封止用樹脂１４２として熱硬化型１液エポキシ系接着剤、金属板１４３として５０μｍのステンレス板を用い、ＩＣチップ１４１を封止した。次いで、アンテナ基板１１１の所定位置に外部電極基板１６を接着した。ここで用いた接着剤は、液状の２液反応硬化型かつ熱硬化型エポキシ系接着剤を用いた。主剤としてビスフェノールＡ型エポキシ樹脂、硬化剤としては脂肪族アミンを用いた。接着剤の主剤と硬化剤を重量比１：１で混合し、完全に混ぜ合わせた後、アンテナ基板１１１上に所定量の混合物を滴下し、接着面に一様になるように広げた。この部分に外部電極基板１６を乗せ、１ｋｇｆ／ｍｍ^２、硬化温度７０℃、硬化時間３０分間で硬化させた。硬化温度はＰＥＮのガラス転移温度よりも低い温度である。硬化後のＰＥＮ製アンテナ基板１１１の外部電極基板１６部分が変形した場合は×、変形しない場合は○とした。ｎ＝１０で行った。
【００６６】
実施例３
硬化温度９０℃とした以外は、実施例２と同様の方法で外部電極基板１６の接着及び評価を行った。本例の硬化温度もＰＥＮのガラス転移温度よりも低い温度である。
【００６７】
比較例２
硬化温度１３０℃とした以外は、実施例２と同様の方法で外部電極基板１６の接着及び評価を行った。本例の硬化温度はＰＥＮのガラス転移温度よりも高い温度である。
【００６８】
比較例３
硬化温度１５０℃とした以外は、実施例２と同様の方法で外部電極基板１６の接着及び評価を行った。本例の硬化温度はＰＥＮのガラス転移温度よりも高い温度である。
【００６９】
【表４】

表４に結果を示す。ガラス転移温度以上で接着したアンテナ基板１１１では変形が起こってしまい、ＩＣカード化した際には反りの原因となる可能性が高い。よって外部電極基板１６の硬化温度はＰＥＮ基材のガラス転移温度よりも低い温度で実施することが望ましい。
【００７０】
なお、上記の実施例２及び３では、アンテナ基板１１１の材料としてＰＥＮを用いたが、既述した本発明に係るどの材料を使用しても、実施例２及び実施例３と同等の歩留まりを達成できることは確認済みである。
【００７１】
【発明の効果】
以上述べたように本発明によれば、接触式通信用外部電極基板（タブ）の機械的接続の信頼性を高めることができるＩＣカード及びその製造方法を提供することができる。
【図面の簡単な説明】
【図１】本発明の実施形態に係るＩＣカードを示す正面図である。
【図２】本発明の実施形態に係る外部電極基板を示す正面図である。
【図３】本発明の実施形態に係る外部電極基板を示す、図２のＩＩＩ−ＩＩＩ線に沿う断面図である。
【図４】本発明の実施形態に係るＩＣカードの製造方法を示す工程図である。
【図５】本発明の実施形態に係るＩＣカードの製造方法を示すＩＣカードの断面図（図１のＶ−Ｖ線に相当する断面図）である。
【図６】本発明の実施形態に係るＩＣカードの製造方法を示すＩＣカードの断面図（図１のＶ−Ｖ線に相当する断面図）である。
【図７】本発明の実施形態に係るＩＣカードの等価回路図である。
【図８】本発明の実施例の評価方法を説明するための外部電極基板を示す正面図である。
【符号の説明】
１…ＩＣカード
１１…カード本体
１１１…アンテナ基板
１１２，１１３…導電性パターン層
１２…アンテナ配線
１３…コンデンサ
１４…ＩＣチップ
１４１…ＩＣチップ
１４２…封止用樹脂
１４３…金属板
１５…接続用配線パターン（ＩＣチップとアンテナ配線）
１６…外部電極基板
１６１…絶縁基板
１６２…スルーホール
１６３…外部電極
１６４…導電層
１６５…バンプ（突起端子）
１７…接続用配線パターン（ＩＣチップと外部電極基板）
１８ａ，１８ｂ…外装材
１９ａ，１９ｂ…接着性シート
２０…接着剤層[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an IC card and a method for manufacturing the same, and more particularly, to a contact communication type IC card which receives power and transmits / receives a signal through an electric contact, and an electromagnetic power supply / receiver which transmits / receives a signal without providing an electric contact. The present invention relates to an IC card having both functions of a non-contact communication type IC card performed by a coupling method and a method of manufacturing the same.
[0002]
[Prior art]
An IC card with an IC chip mounted inside the card is characterized by its large storage capacity and high security compared to a conventional magnetic stripe card, and its spread has been spreading in the financial and transportation industries. I have.
[0003]
There are two types of IC cards of this type: contactless communication type and contact communication type. The former is used for transportation such as commuter pass, and the latter is used for financial use such as credit card to which EMV standard is applied. It is mentioned as a method of use. As described above, the specifications of the IC card are different depending on the purpose.
[0004]
Under such circumstances, an IC card called a dual interface card has attracted attention. A dual interface card is an IC card that employs both a contact communication type and a non-contact communication type. The dual interface card is used for a credit card or the like in a contact portion, and used for a traffic use or the like in a non-contact portion. It is a convenient card that can be used for two purposes with this card.
[0005]
Furthermore, there are two types of dual interface cards: a combination card that operates on one IC chip and a hybrid card that operates on two or more IC chips. Combination cards that operate on IC chips have attracted attention.
[0006]
In such a combination card, an external electrode substrate (hereinafter, also referred to as a tab) for connecting to an external reading / writing device for controlling the function of a contact communication type IC card is embedded in the card substrate, while non-contact communication is performed. Antenna wiring for controlling the function of the type IC card is formed on the card substrate. Then, a wiring pattern for connecting each of the external electrode substrate and the antenna wiring to one IC chip is provided on the card substrate.
[0007]
A conventional combination card can be manufactured, for example, by the manufacturing method of Patent Document 1. In the method of manufacturing an IC card described in Patent Document 1, first, an antenna sheet on which an antenna wiring for non-contact communication is formed is sandwiched between card base materials, laminated, and a hole for attaching a tab is formed. The wiring pattern formed by counterbore processing is exposed to connect to the tab, and the tab is buried in the hole, so that the tab and the wiring pattern are electrically connected. The tab and the wiring pattern were generally bonded in a short time using a sheet-type adhesive.
[0008]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2001-155128
[Problems to be solved by the invention]
However, when a tab and a wiring pattern are bonded using a sheet-type adhesive, bonding can be performed only during the time and part where heat is applied. Therefore, if a non-bonded portion occurs during bonding, the tab remains unbonded. In such a case, there is a problem that the adhesive strength between the tab and the card base material is reduced.
[0010]
[Means for Solving the Problems]
An object of the present invention is to provide an IC card capable of improving the reliability of mechanical connection of a contact type external electrode substrate (tab) for communication, and a method of manufacturing the same.
[0011]
(1) According to the present invention, a card main body having an antenna substrate on which an antenna wiring for non-contact communication is formed, and an external electrode for contact communication is embedded in the card main body such that the external electrode is exposed on the surface of the card main body. An external electrode substrate, and an IC chip electrically connected to each of the antenna substrate and the external electrodes via a connection wiring pattern formed on the antenna substrate, wherein An IC card having a liquid two-component reaction-curable and thermosetting adhesive layer between an external electrode substrate and the antenna substrate is provided.
[0012]
Further, according to the present invention, a card body having an antenna substrate on which an antenna wiring for non-contact communication is formed, and an external electrode for contact communication is buried in the card body so as to be exposed on the surface of the card body. A method for manufacturing an IC card, comprising: an external electrode substrate; and an IC chip electrically connected to each of the antenna substrate and the external electrode via a connection wiring pattern formed on the antenna substrate. And a method of manufacturing an IC card including a step of mounting the external electrode substrate on the antenna substrate using a liquid two-component reaction-curable and thermosetting adhesive.
[0013]
That is, in the present invention, when the external electrode substrate is attached to the antenna substrate, a liquid two-component reaction-curable and thermosetting adhesive is used.
[0014]
Since the liquid two-component reaction-curable and thermosetting adhesive according to the present invention is in a liquid state, it is easily adapted to irregularities on the surface of the antenna substrate, thereby securing a bonding area.
[0015]
Further, since the liquid two-component reaction-curable and thermosetting adhesive according to the present invention is cured by a chemical reaction simultaneously with curing by heat, it is completely cured by a subsequent chemical reaction without being completely cured by heat. be able to. As a result, even if an unbonded portion occurs, complete curing can be finally achieved, so that a highly reliable bonding strength can be secured without lowering the yield. Moreover, it is cheaper than the conventional sheet type adhesive, and has an advantage in cost.
[0016]
(2) Although not particularly limited in the above invention, the external electrode substrate preferably has a projection terminal electrically connected to the connection wiring pattern on a main surface opposite to the main surface on which the external electrodes are formed. Preferred (see claims 2 and 8).
[0017]
By bringing the protruding terminals into contact with the connection wiring pattern, the reliability and workability of the electrical connection are further improved.
[0018]
(3) In the above invention, the step of mounting the external electrode substrate on the antenna substrate is not particularly limited. For example, an antenna wiring and a wiring pattern for connection are formed on the antenna substrate, and are attached to at least one main surface of the antenna substrate. A hole corresponding to the external electrode substrate is formed in the exterior material, an IC chip is mounted on the antenna substrate on which the antenna wiring and the wiring pattern for connection are formed, and the antenna substrate on which the antenna wiring and the wiring pattern for connection are formed, It is possible to adopt a method of manufacturing an IC card in which an external electrode substrate is mounted using a liquid two-component reaction-curable and thermosetting adhesive, and an exterior material having a hole is attached to the antenna substrate. (See claim 4).
As a result, the external electrode substrate can be mounted on the antenna substrate without the counterboring of the hole corresponding to the external electrode substrate after the exterior material is attached to the antenna substrate. Reliability of mechanical connection and mechanical connection can be improved.
[0019]
In this case, the external electrode substrate may be mounted on the antenna substrate regardless of whether the step of attaching the exterior material having the hole corresponding to the external electrode substrate to the antenna substrate or the step of mounting the polar substrate on the antenna substrate externally. After mounting on the antenna substrate, an exterior material having a hole formed thereon may be attached to the antenna substrate (see claim 5). Alternatively, the exterior material having the hole formed may be attached to the antenna substrate and then passed through the hole. Mounting the external electrode substrate on the antenna substrate (see claim 6) is also within the scope of the present invention.
[0020]
Furthermore, an antenna wiring and a connection wiring pattern are formed on the antenna substrate, an IC chip is mounted on the antenna substrate on which the antenna wiring and the connection wiring pattern are formed, and an exterior material is attached to at least one main surface of the antenna substrate, A hole corresponding to the external electrode substrate is formed in the exterior material attached to one main surface of the antenna substrate, and a liquid two-component reaction-curable and thermosetting adhesive is formed on the antenna substrate through the hole. A method of manufacturing an IC card on which an external electrode substrate is mounted using the method described above can also be adopted (see claim 7).
[0021]
(4) The “liquid” of the liquid two-component reaction-curable and thermosetting adhesive according to the present invention is a non-solvent that is not dissolved in an organic solvent such as toluene, methyl ethyl ketone, or acetone. The former means that there is fluidity and there is almost no volatile solvent.
[0022]
The liquid two-component reaction-curable and thermosetting adhesives according to the present invention include various adhesives including epoxy and acrylic, and are not particularly limited, but are two-component reaction-curable and thermosetting adhesives. It is desirable to use an epoxy adhesive. Epoxy adhesives have the advantage of being excellent in heat resistance, solvent resistance and weather resistance in addition to their high adhesiveness. In addition, since it is a thermosetting type among epoxy adhesives, the curing reaction is accelerated by heat, and the pot life is long at room temperature, but it can be cured in a short time by heating after bonding There is an advantage.
[0023]
In the case of a two-component reaction-curable and thermosetting epoxy-based adhesive, bisphenol A and bisphenol F are desirable as main ingredients. Epoxy resins using these are tough, excellent in heat resistance, and strong in chemical resistance. In addition to bisphenol A and bisphenol F, bisphenol AD, phenol novolak type, cresol novolak type, butyl glycidyl ether, and the like can be cited as main components of the epoxy resin. On the other hand, examples of the curing agent include aliphatic amines, alicyclic amines, aromatic amines, polyamidoamines, adducts, aliphatic acid anhydrides, alicyclic acid anhydrides, aromatic acid anhydrides, and halogen-based oxides. A representative example is given.
[0024]
The bonding temperature of the liquid two-component reaction-curable and thermosetting adhesive according to the present invention is not particularly limited, but it is preferable to bond the adhesive at a glass transition temperature or lower of the material used as the antenna substrate. This is because if the external electrode substrate is bonded at a temperature higher than the glass transition temperature, the antenna substrate is locally deformed, which may cause variation in thickness and warpage of the IC card when the IC card is formed.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a front view showing an IC card according to an embodiment of the present invention, FIG. 2 is a front view showing an external electrode substrate according to an embodiment of the present invention, and FIG. 3 is a view showing an external electrode substrate according to an embodiment of the present invention. FIG. 4 is a sectional view taken along the line III-III of FIG. 2, FIG. 4 is a process chart showing a method of manufacturing the IC card according to the embodiment of the present invention, and FIGS. FIG. 7 is a sectional view of an IC card showing a method (a sectional view corresponding to line VV in FIG. 1), and FIG. 7 is an equivalent circuit diagram of the IC card according to the embodiment of the present invention.
[0026]
First, the structure of the IC card 1 according to the present embodiment will be described with reference to FIGS. 1, 2, 6F, and 7. FIG.
[0027]
The IC card 1 of the present embodiment is the combination card described above, which has functions of both the contact communication system and the non-contact communication system, and is operated by one IC chip 14. . As shown in the equivalent circuit diagram of FIG. 7, in order to control the function of the contact communication method of the two communication methods, an external electrode substrate 16 for executing communication by contacting an external read / write device is provided. It is electrically connected to the IC chip 14 via the wiring pattern 17. The antenna wiring 12 is electrically connected to the IC chip 14 via the connection wiring pattern 15 in order to control the function of the non-contact communication method, which is the other communication method. Thus, one IC chip 14 can control the functions of both the contact communication method and the non-contact communication method.
[0028]
As shown in FIG. 6F, the card body 11 includes an electrically insulating antenna substrate 111, conductive pattern layers 112 and 113 attached to the front and back surfaces of the antenna substrate 111, and further, And electrically insulating exterior materials 18a and 18b attached to the conductive pattern layers 112 and 113 via adhesive sheets 19a and 19b.
[0029]
The antenna substrate 111 is made of a material having high mechanical strength and excellent heat resistance such as polyimide, but also uses an ester-based polymer material represented by glass epoxy, polyethylene terephthalate, or polyethylene naphthalate. You can also. The conductive pattern layers 112 and 113 are made of copper, aluminum, an alloy containing copper, an alloy containing aluminum, or the like. Further, a sheet material such as hot melt or polyethylene terephthalate glycol is used for the adhesive sheets 19a and 19b, and a mixed sheet of polybutylene terephthalate and polycarbonate is used for the exterior materials 18a and 18b.
[0030]
The antenna wiring 12, a part of the capacitor 13, and the connection wiring patterns 15 and 17 shown in the front view of the IC card 1 in FIG. 1 and the equivalent circuit diagram in FIG. 7 are formed on the conductive pattern layer 112 by, for example, etching. It is formed. The remaining part of the capacitor 13 is formed on the conductive pattern layer 113 on the back surface of the antenna substrate 111. In the front view of FIG. 1, the capacitor 13 formed on the conductive pattern layer 112 is shown by a solid line, and the capacitor 13 formed on the conductive pattern layer 113 on the back is shown by a dotted line. The capacitor 13 of the present embodiment is a film capacitor using the electrically insulating antenna substrate 111 as a dielectric layer. By forming electrodes on each of the conductive pattern layers 112 and 113 laminated with the antenna substrate 111 interposed therebetween. A capacitor 13 is configured.
[0031]
The IC chip 14 is electrically connected to the connection wiring patterns 15 and 17 of the antenna substrate 111 by flip-chip mounting as shown in FIG. FIG. 6F shows the IC chip itself at 141, and the IC chip 14 of this example is sealed together with the metal plate 143 by the sealing resin 142 as shown in FIG. The metal plate 143 is for protecting the IC chip 141 from external force, and is made of, for example, a circular stainless steel plate having a thickness of 200 μm to 20 μm (preferably 150 μm to 30 μm). If the thickness of the metal plate 143 is 30 μm or less, the strength of the metal plate 143 is weakened, and the IC chip 141 is damaged by bending or the like. This is because the antenna substrate 111 cannot be arranged, which causes the card to be warped, which causes a reduction in yield. In the example shown in the figure, the metal plate 143 is provided only on one side (the upper surface in the figure) of the IC card 1, but the same metal plate is also provided on the back surface (the lower surface in the figure) of the IC chip 141 itself. The IC chip 141 may be sandwiched between two metal plates 143 to enhance the mechanical strength.
[0032]
Details of the external electrode substrate 16 are shown in FIGS. As shown in FIGS. 1 and 6 (F), the external electrode substrate 16 is provided with an adhesive (adhesive layer 20) on the surface of the exterior material 18a on one main surface of the IC card 1 so that the external electrodes 163 are exposed. ), And physically communicates with an external read / write device to perform communication. As shown in FIG. 3, the external electrode substrate 16 has a conductive film made of gold or the like (which constitutes the external electrode 163) on one main surface (the upper surface in FIG. 3) of an insulating substrate 161 made of glass epoxy or the like. It is formed by plating or the like, and is electrically connected to a conductive layer 164 formed on the back surface of the insulating substrate 161 via through holes 162 formed at a plurality of locations. Then, by connecting the bumps (protrusion terminals) 165 formed on the conductive layer 164 to the connection wiring patterns 17 (see FIG. 1) formed on the antenna substrate 111 of the IC card 1, the external electrode substrate 16 is connected to the IC chip. 14 is electrically connected. As the bump 165, for example, a gold stud type bump, a ball bump, an electroless / electrolytic plating bump, or the like can be adopted.
[0033]
In particular, in the present embodiment, the external electrode substrate 16 and the antenna substrate 111 are bonded using a liquid two-component reaction-curable and thermosetting epoxy-based adhesive (the adhesive layer 20 is illustrated). Since this adhesive is in a liquid state, it can easily conform to irregularities on the surface of the antenna substrate 111 and can secure an adhesive area. In addition, since it is a two-component reaction curing type and a thermosetting type, curing can be promoted by heating in the process, but it is a two-component reaction type even if an unbonded portion occurs in the bonding process. As a result, complete bonding is achieved after the bonding step.
[0034]
Next, a method for manufacturing the IC card according to the present embodiment configured as described above will be described with reference to FIGS.
[0035]
First, in step 1 shown in FIGS. 4 and 5 (A), a base material having copper foils 112 and 113 attached to both surfaces of a polyimide sheet 111 is prepared, and the step shown in FIGS. 4 and 5 (B) is performed. 2, predetermined areas of the copper foils 112 and 113 on both sides of the base material are copper-etched, so that the antenna wiring 12, one of the capacitors 13, and the connection wiring patterns 15 and 17 are formed on the upper surface of FIG. And the other of the capacitors 13 is formed on the lower surface of FIG. The other side of the capacitor 13 and the connection wiring pattern 15 are electrically connected through a through hole or the like.
[0036]
In the next step 3, as shown in FIG. 5C, the IC chip 141 of the antenna substrate 111 is mounted by flip chip bonding. After the IC chip 141 is mounted, a sealing resin 142 such as a thermosetting epoxy adhesive is dropped on the IC chip 141, and a metal plate 143 such as stainless steel is placed thereon. Then, the sealing resin is dried for a predetermined time. In order to suppress thermal shrinkage when the sealing resin is cured, it is desirable to add a filler made of a non-conductive material such as alumina or titanium oxide to the sealing resin.
[0037]
In the next step 4, the external electrode substrate 16 is bonded to a predetermined position of the connection wiring pattern 17 of the antenna substrate 111 as shown in FIG. When bonding the external electrode substrate 16, it is necessary to satisfy electrical connection and physical bonding. However, regarding physical bonding, the surface of the external electrode substrate 16 on which the conductive layer 164 is formed and the antenna substrate 111 are bonded. By using a liquid two-component reaction-curable and thermosetting adhesive.
[0038]
On the other hand, the electrical connection is set so that the bump 165 formed on the conductive layer 164 of the external electrode substrate 16 is embedded in a predetermined position of the connection wiring pattern 17 of the antenna substrate 111 at the time of bonding. As a result, the electrical connection is achieved, but the method is not limited to the method using the bump 165 as long as the electrical connection can be established.
[0039]
The mounting of the IC chip 14 in step 3 and the mounting of the external electrode substrate 16 in step 4 may be performed in any order, regardless of whether the external electrode substrate 16 is mounted first or simultaneously. good. This is because the mounting positions of the IC chip 14 and the external electrode substrate 16 are different, so that they do not interfere with each other and are not affected by the order.
[0040]
After the mounting of the IC chip 14 and the external electrode substrate 16 is completed, the capacitor 13 formed on the conductive pattern layers 112 and 113 of the antenna substrate 111 is trimmed. This trimming is performed so that the resonance frequency of the non-contact communication system in the completed state of the IC card 1 becomes 13.56 MHz, and may be performed in a state where the IC chip 14 and the external electrode substrate 16 are mounted. desirable. In particular, since the IC chip 14 has a parasitic capacitance, the capacitance of the capacitor changes by mounting, and as a result, the resonance frequency changes.
[0041]
At about the same time, in Step 5, as shown in FIG. 6 (E), a hole 181 is formed in a portion of one of the package members 18a made of a non-stretched polyethylene terephthalate sheet where the external electrode substrate 16 is embedded. I do. The hole 181 has a shape corresponding to the outer diameter of the external electrode substrate 16. The other exterior material 18b is used without forming the hole 181.
[0042]
In the last step 6, the exterior materials 18a and 18b obtained in step 5 are adhered to the front and back surfaces of the antenna substrate 111 on which the IC chip 14 and the external electrode substrate 16 obtained in step 4 are mounted, respectively. The sheets are superposed via the sheets 19a and 19b, and are formed into a card by heat fusion such as a hot press. It is desirable that the exterior materials 18a and 18b and the adhesive sheets 19a and 19b have the same material and the same thickness, respectively. If the material and the thickness dimension are different in the thickness direction, the IC card may be warped.
[0043]
As described above, according to the method for manufacturing an IC card of the present embodiment, the external electrode substrate 16 and the antenna substrate 111 are bonded using the liquid two-component reaction-curable and thermosetting epoxy adhesive 20. However, since the adhesive is in a liquid state, the adhesive easily conforms to irregularities on the surface of the antenna substrate 111 and can secure an adhesive area. In addition, since it is a two-component reaction curing type and a thermosetting type, curing can be promoted by heating in the process, but it is a two-component reaction type even if an unbonded portion occurs in the bonding process. As a result, complete bonding is achieved after the bonding step.
[0044]
In addition, since the external electrode substrate 16 is mounted in a state where the connection wiring pattern 17 on which the external electrode substrate 16 is to be mounted is exposed, as in the conventional example of Patent Literature 1, the remaining material of the exterior material due to the counterboring process is reduced. There are no problems such as overshooting. Therefore, the reliability of not only the electrical connection between the external electrode substrate 16 and the connection wiring pattern 17 (and the antenna substrate 111) but also the mechanical connection by the adhesive is significantly increased.
[0045]
The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.
[0046]
For example, in the above-described embodiment, after mounting the external electrode substrate 16 on the antenna substrate 111 in step 4, the exterior material 18 a having the hole 181 obtained in step 5 is replaced with the antenna substrate 111 in step 6. However, step 4 and step 6 may be reversed.
[0047]
That is, after the exterior material 18a in which the hole 181 obtained in step 5 is formed is attached to the antenna substrate 111 as in step 6, the hole 181 formed in the exterior material 18a is The external electrode substrate 16 is mounted as described above. Even in such a case, when the external electrode substrate 16 is mounted, the connection wiring pattern 17 is exposed in a clean state without any foreign matter adhering through the hole 181 and without being scraped off. Therefore, the reliability of the electrical connection between the external electrode substrate 16 and the connection wiring pattern 17 (and, consequently, the antenna substrate 111) and the reliability of the mechanical connection by the adhesive are significantly increased.
[0048]
Further, after performing Step 1 → Step 2 → Step 3 in FIG. 4, Step 6 is performed, and then the facing material 18a at the mounting position of the external electrode substrate 16 is counterbored, and the external electrode substrate 16 is The mounting may be performed using a two-component reaction curing type and thermosetting type adhesive.
[0049]
【Example】
The present invention will be described with reference to examples that further embody the present invention.
[0050]
Example 1
After forming the antenna wiring 12 and the capacitor 13 by copper etching on both main surfaces of the polyimide antenna substrate 111, an IC chip 141 is mounted at a predetermined position on the antenna substrate 111, and a heat sealing resin 142 is formed thereon as a sealing resin 142. The IC chip 141 was sealed by using a 50 μm stainless steel plate as the hardening type one-component epoxy adhesive and the metal plate 143. Next, the external electrode substrate 16 was bonded to a predetermined position of the antenna substrate 111. As the adhesive used here, a liquid two-component reaction-curable and thermosetting epoxy-based adhesive was used. A bisphenol F type epoxy resin was used as a main agent, and an aliphatic amine was used as a curing agent. The main agent of the adhesive and the curing agent were mixed at a weight ratio of 1: 1 and completely mixed. After that, a predetermined amount of the mixture was dropped on the antenna substrate 111 and spread evenly on the bonding surface. The external electrode substrate 16 was placed on this portion, and cured at 1 kgf / mm ² , a curing temperature of 100 ° C., and a curing time of 10 minutes.
[0051]
The electrical connection at the same time as the bonding with the adhesive was achieved by embedding a gold bump 165 formed on the back side of the external electrode substrate 16 in a conductive portion on the antenna substrate 111. Next, the capacitor 13 on the antenna substrate 111 was trimmed to adjust to a predetermined resonance frequency.
[0052]
Next, an amorphous PET exterior material 18a in which a hole for the escape of the IC chip 14 and a hole 181 corresponding to the external electrode substrate 16 are formed in advance, and the same amorphous material in which no hole is formed is formed. The IC card 1 was produced by thermal fusion using the PET exterior material 18b.
[0053]
With respect to the IC card 1 thus obtained, the yield of the bonding performance of the external electrode substrate 16 was verified at n = 50. The yield of the adhesive performance was evaluated based on whether or not the external electrode substrate 16 peeled off when the vicinity of the external electrode substrate 16 of the IC card was slightly bent.
[0054]
Further, a bending test was performed on the IC card 1 that did not peel even if it was bent slightly, and a continuity test was performed after the test. The card bending test was performed 1,000 times in each of the four directions of the long side surface, the long side back surface, the short side surface, and the short side back surface. The judgment of OK / NG was made based on the resistance value after the bending test. The measurement of the resistance value was performed by the two-terminal method for the points (1), (2) and (3) shown in FIG. The evaluation was performed at n = 50.
[0055]
Comparative Example 1
After forming the antenna wiring 12 and the capacitor 13 by copper etching on both main surfaces of the polyimide antenna substrate 111, an IC chip 141 is mounted at a predetermined position on the antenna substrate 111, and a heat sealing resin 142 is formed thereon as a sealing resin 142. The IC chip 141 was sealed by using a 50 μm stainless steel plate as the hardening type one-component epoxy adhesive and the metal plate 143. Next, the capacitor 13 on the antenna substrate 111 was trimmed to adjust to a predetermined resonance frequency.
[0056]
Next, an amorphous PET exterior material 18a in which a hole for the escape of the IC chip 14 and a hole 181 corresponding to the external electrode substrate 16 are formed in advance, and the same amorphous material in which no hole is formed is formed. The IC card 1 was produced by thermal fusion using the PET exterior material 18b.
[0057]
Next, the external electrode substrate 16 was bonded to a predetermined position of the antenna substrate 111 via the hole 181 of the exterior material 18a. The adhesive used here was a sheet-like phenol / nitrile structural adhesive. The sheet was cut into a predetermined size, and temporarily fixed to the bonding surface at 130 ° C. for 10 seconds. Next, the external electrode substrate 16 was placed on the adhesive sheet, and was fixed at 160 ° C. for 60 seconds for bonding. The electrical connection at the same time as the adhesion by the adhesive was achieved by embedding the gold bump 165 formed on the back side of the external electrode substrate 16 in the connection wiring pattern 17 which is a conductive portion on the polyimide antenna substrate 111.
[0058]
Evaluation of the IC card 1 thus obtained was performed in the same manner as in Example 1.
[0059]
[Table 1]

Table 1 shows the results of the initial peel test of Example 1 and Comparative Example 1.
[0060]
The yield of Comparative Example 1 was 95%, whereas the yield of Example 1 was 100%. Even when the composition was not cured at the time of applying heat, the composition was cured by a chemical reaction during the curing period. Then, it was confirmed that the yield was high.
[0061]
[Table 2]

[0062]
[Table 3]

Table 2 shows three examples of the results of resistance measurement values of Example 1 and Comparative Example 1 every 1000 bending tests. Table 3 shows the yield after the bending test.
[0063]
In Comparative Example 1, ten IC cards whose resistance values began to increase sharply from the end of the 3,000 cycles were observed. In particular, it can be seen that it is weak to bending in the short side direction. The case where the portion (1) in FIG. 8 is peeled off as in Comparative Example 1-2 and the case where the portions (2) and (3) in FIG. 8 are peeled off as in Comparative Example 1-3 are observed. An increase in resistance due to interfacial delamination between the agent and the adherend was observed. The peeling of the external electrode substrate 16 occurred more remarkably in the portions (2) and (3) in FIG.
[0064]
On the other hand, the yield of the IC card of Example 1 after the bending test was remarkably improved as compared with Comparative Example 1, and the superiority of the liquid two-part reactive thermosetting epoxy adhesive was confirmed from this point. We were able to. The epoxy adhesive according to the present invention is less expensive than the sheet-type adhesive used in Comparative Example 1, and can provide highly reliable bonding in terms of cost.
[0065]
Example 2
After the antenna wiring 12 and the capacitor 13 are formed on both main surfaces of the polyethylene naphthalate (hereinafter, PEN) antenna substrate 111 by aluminum etching, the IC chip 141 is mounted at a predetermined position on the antenna substrate 111, and is mounted thereon. The IC chip 141 was sealed using a thermosetting one-liquid epoxy adhesive as the sealing resin 142 and a 50 μm stainless plate as the metal plate 143. Next, the external electrode substrate 16 was bonded to a predetermined position of the antenna substrate 111. As the adhesive used here, a liquid two-component reaction-curable and thermosetting epoxy-based adhesive was used. A bisphenol A type epoxy resin was used as a main agent, and an aliphatic amine was used as a curing agent. After the main component of the adhesive and the curing agent were mixed at a weight ratio of 1: 1 and completely mixed, a predetermined amount of the mixture was dropped on the antenna substrate 111 and spread evenly on the bonding surface. The external electrode substrate 16 was placed on this portion, and cured at 1 kgf / mm ² , a curing temperature of 70 ° C., and a curing time of 30 minutes. The curing temperature is a temperature lower than the glass transition temperature of PEN. When the portion of the external electrode substrate 16 of the PEN antenna substrate 111 after curing was deformed, it was evaluated as x, and when it was not deformed, it was evaluated as o. Performed with n = 10.
[0066]
Example 3
The adhesion and evaluation of the external electrode substrate 16 were performed in the same manner as in Example 2, except that the curing temperature was 90 ° C. The curing temperature in this example is also lower than the glass transition temperature of PEN.
[0067]
Comparative Example 2
The adhesion and evaluation of the external electrode substrate 16 were performed in the same manner as in Example 2 except that the curing temperature was 130 ° C. The curing temperature in this example is a temperature higher than the glass transition temperature of PEN.
[0068]
Comparative Example 3
The adhesion and evaluation of the external electrode substrate 16 were performed in the same manner as in Example 2 except that the curing temperature was set to 150 ° C. The curing temperature in this example is a temperature higher than the glass transition temperature of PEN.
[0069]
[Table 4]

Table 4 shows the results. The antenna substrate 111 bonded at a temperature higher than the glass transition temperature is likely to be deformed, and is likely to be warped when it is formed into an IC card. Therefore, it is desirable that the curing temperature of the external electrode substrate 16 be lower than the glass transition temperature of the PEN substrate.
[0070]
Although PEN was used as the material of the antenna substrate 111 in the above Examples 2 and 3, the same yield as that of Examples 2 and 3 can be obtained by using any of the materials according to the present invention described above. It has been confirmed that this can be achieved.
[0071]
【The invention's effect】
As described above, according to the present invention, it is possible to provide an IC card capable of improving the reliability of mechanical connection of an external electrode substrate (tab) for contact-type communication and a method of manufacturing the same.
[Brief description of the drawings]
FIG. 1 is a front view showing an IC card according to an embodiment of the present invention.
FIG. 2 is a front view showing an external electrode substrate according to the embodiment of the present invention.
FIG. 3 is a cross-sectional view illustrating the external electrode substrate according to the embodiment of the present invention, taken along line III-III of FIG. 2;
FIG. 4 is a process chart showing a method for manufacturing an IC card according to the embodiment of the present invention.
FIG. 5 is a cross-sectional view (a cross-sectional view corresponding to line VV in FIG. 1) of the IC card illustrating the method for manufacturing the IC card according to the embodiment of the present invention;
FIG. 6 is a cross-sectional view (a cross-sectional view corresponding to line VV in FIG. 1) of the IC card illustrating the method for manufacturing the IC card according to the embodiment of the present invention;
FIG. 7 is an equivalent circuit diagram of the IC card according to the embodiment of the present invention.
FIG. 8 is a front view showing an external electrode substrate for explaining an evaluation method according to the embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... IC card 11 ... Card main body 111 ... Antenna substrates 112 and 113 ... Conductivity pattern layer 12 ... Antenna wiring 13 ... Capacitor 14 ... IC chip 141 ... IC chip 142 ... Sealing resin 143 ... Metal plate 15 ... Connection wiring Pattern (IC chip and antenna wiring)
16 External electrode substrate 161 Insulating substrate 162 Through hole 163 External electrode 164 Conductive layer 165 Bump (protrusion terminal)
17 ... Wiring pattern for connection (IC chip and external electrode substrate)
18a, 18b: Exterior materials 19a, 19b: Adhesive sheet 20: Adhesive layer

Claims (8)

A card body having an antenna substrate on which an antenna wiring for contactless communication is formed, an external electrode substrate embedded in the card body such that an external electrode for contact communication is exposed on a surface of the card body, and the antenna An IC card comprising: an IC chip electrically connected to each of the antenna substrate and the external electrodes via a connection wiring pattern formed on a substrate,
An IC card having a liquid two-component reaction-curable and thermosetting adhesive layer between the external electrode substrate and the antenna substrate. 2. The IC card according to claim 1, wherein the external electrode substrate has, on a main surface opposite to the main surface on which the external electrodes are formed, projecting terminals that are electrically connected to the connection wiring pattern. 3. A card body having an antenna substrate on which an antenna wiring for non-contact communication is formed, an external electrode substrate embedded in the card body such that an external electrode for contact communication is exposed on a surface of the card body, and the antenna A method for manufacturing an IC card, comprising: an IC chip electrically connected to each of the antenna substrate and the external electrode via a connection wiring pattern formed on a substrate,
A method of manufacturing an IC card, comprising a step of mounting the external electrode substrate on the antenna substrate using a liquid two-component reaction-curable and thermosetting adhesive. Forming the antenna wiring and the connection wiring pattern on the antenna substrate;
Forming a hole corresponding to the external electrode substrate in an exterior material attached to at least one main surface of the antenna substrate,
Mounting the IC chip on an antenna substrate on which the antenna wiring and the connection wiring pattern are formed;
A step of mounting the external electrode substrate on the antenna substrate on which the antenna wiring and the connection wiring pattern are formed, using the liquid two-component reaction-curable and thermosetting adhesive;
4. The method for manufacturing an IC card according to claim 3, further comprising: attaching an exterior material having the hole formed to the antenna substrate. After mounting the external electrode substrate and the IC chip on the antenna substrate on which the antenna wiring and the connection wiring pattern are formed,
The method for manufacturing an IC card according to claim 4, wherein an exterior material having the hole is attached to the antenna substrate on which the external electrode substrate and the IC chip are mounted. Mounting the IC chip on an antenna substrate on which the antenna wiring and the connection wiring pattern are formed,
After attaching the exterior material having the hole to the antenna substrate on which the IC chip is mounted,
5. The IC card manufacturing method according to claim 4, wherein the external electrode substrate is mounted on the antenna substrate on which the antenna wiring and the connection wiring pattern are formed. Forming the antenna wiring and the connection wiring pattern on the antenna substrate;
Mounting the IC chip on an antenna substrate on which the antenna wiring and the connection wiring pattern are formed;
A step of attaching an exterior material to at least one main surface of the antenna substrate,
Forming a hole corresponding to the external electrode substrate in an exterior material attached to the one main surface of the antenna substrate;
4. The IC card according to claim 3, further comprising: mounting the external electrode substrate on the antenna substrate using the liquid two-component reaction-curable and thermosetting adhesive through the hole. Manufacturing method. The external electrode substrate according to any one of claims 3 to 7, wherein the external electrode substrate has a projection terminal electrically connected to the connection wiring pattern on a main surface opposite to a main surface on which the external electrode is formed. IC card manufacturing method.

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