JP2004304435A - Multiband radio communication module and multiband radio communication terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiband radio communication module which can accurately control a transmission power in a transmission power amplifier without being affected by the temperature, and can be simplified and small-sized. <P>SOLUTION: At least transmission power amplifiers 5, 6, filters 7, 8 for removing higher harmonic waves contained in a transmitting signal amplified by the amplifiers 5, 6, a directional coupler 18 for detecting a transmitting signal level, a detection circuit 19 for detecting the output of the directional coupler 18, a demultiplexer circuit such as a diplexer 15 for demultiplexing or a circuit for selecting a signal for each of communication systems with different frequencies, and high frequency switches 11, 12 for switching transmission/reception are provided to one identical multi-layer printed board. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a multi-band wireless communication module and a multi-band wireless communication terminal using the same in a wireless device such as a mobile phone or a mobile phone, and more particularly to an arrangement structure of a directional coupler, a detection circuit, and a transmission power amplifier. .
[0002]
[Prior art]
In a high-frequency (RF) transmission / reception block of a conventional wireless communication device, in order to perform automatic power control at the time of transmission, as shown in Patent Literature 1, a directional coupler for detecting a transmission signal level in order to monitor transmission power ( Coupler) is placed between the transmission power amplifier and the low-pass filter for preventing and removing harmonic distortion in front of the high-frequency switch for band switching. The output of the directional coupler is detected by the detection circuit, and the automatic power is detected. The control circuit controls the transmission signal power to be a constant transmission signal power level suitable for the situation.
[0003]
In a multi-band wireless device used in a plurality of different frequency bands, such a directional coupler is provided for each band, and a detection circuit is also provided for each band.
[0004]
As described above, Patent Document 2 discloses a configuration in which a directional coupler and a detection circuit are not provided for each band but one of them is used for a simplified configuration. Patent Document 2 discloses a directional coupler provided between an antenna and a diplexer (demultiplexing circuit), a directional coupler, a diplexer, a high-frequency switch for switching between transmission and reception, and the low-pass filter. Are constituted by the same multilayer substrate, and the detection circuit and the automatic power control circuit of the transmission power amplifier are provided outside the multilayer substrate.
[0005]
In Patent Document 3, a directional coupler for each band is arranged at the same position as in Patent Document 1, and a demultiplexing circuit, a high-frequency switch, a directional coupler, And a power amplifier.
[0006]
[Patent Document 1]
JP-A-2000-40969.
[0007]
[Patent Document 2]
JP-A-2001-274723.
[0008]
[Patent Document 3]
JP-A-2003-8470.
[0009]
[Problems to be solved by the invention]
In the above-described conventional module, the detection circuit of the directional coupler for detecting the transmission signal level is arranged in another component or module on the motherboard. However, the detection voltage varies depending on the temperature of the detection circuit. Due to the difference between the temperature of the detection circuit and the temperature of the module containing the transmission power amplifier, detection is performed in accordance with the actual temperature around the transmission power amplifier. Not. For this reason, there is a problem that accurate detection and control of transmission power are not performed.
[0010]
In view of the above problems, an object of the present invention is to provide a multi-band wireless communication module capable of accurately performing transmission power control in a transmission power amplifier without being affected by temperature, and a multi-band wireless communication terminal using the same. . Another object of the present invention is to provide a multi-band wireless communication module and a multi-band wireless communication terminal that can be simplified and downsized.
[0011]
[Means for Solving the Problems]
(1) A multi-band wireless communication module according to the present invention includes at least a transmission power amplifier, a filter, a directional coupler, a detection circuit for detecting an output of the directional coupler, and a frequency A circuit for separating or selecting a signal for each different communication system and a high-frequency switch for switching between transmission and reception are provided.
[0012]
(2) The multi-band wireless communication module of the present invention is characterized in that an automatic power control circuit for controlling an amplifier circuit based on an output signal of the detection circuit is provided on the multilayer substrate.
[0013]
(3) In the multi-band wireless communication module of the present invention, at least the detection circuit is built in on the mounting board (motherboard) side of the multilayer board, and a ground electrode is built in the detection circuit on the side opposite to the mounting board. It is characterized by having done.
[0014]
(4) The multi-band wireless communication module according to the present invention is characterized in that the directional coupler is provided between an antenna and a circuit that separates or selects a signal for each communication system having a different frequency. I do.
[0015]
(5) The multi-band wireless communication module according to the present invention is characterized in that a semiconductor IC and a chip-like element are mounted on the multilayer substrate.
[0016]
(6) Further, the multi-band wireless communication terminal of the present invention includes any one of the modules (1) to (5).
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a block diagram showing one embodiment of the multi-band wireless communication module of the present invention. In the present embodiment, a multi-communication system including a GSM system (900 MHz band) and a DCS system (1800 MHz band) will be described. In FIG. 1, a portion 1 surrounded by a dotted line is a portion of a multi-band wireless communication module configured by a multilayer substrate configured according to the present invention. The multi-band wireless communication terminal according to the present invention includes the module 1.
[0018]
In FIG. 1, reference numerals 2 and 3 denote terminal portions connected to a GSM-system and DCS-system transmission circuit, respectively, reference numerals 5 and 6 denote GSM-system and DCS-system transmission power amplifiers, and reference numerals 7 and 8 denote transmission power amplifiers 5 and 6, respectively. High-frequency filters comprising low-pass filters for removing higher harmonics, 9 and 10, impedance matching circuits between the amplifiers 5, 6 and the filters 7, 8, respectively; 11, 12 high-frequency switches for GSM and DCS, respectively; , For switching reception. Reference numerals 13 and 14 denote terminal portions connected to the GSM-system and DCS-system reception circuits, respectively. Reference numeral 15 denotes a diplexer, which prevents GSM (DCS) -system transmission signals and reception signals from flowing to the other party's DCS (GSM) system. Is what you do.
[0019]
An antenna 16 is connected to the terminal 17 of the module 1. Reference numeral 18 denotes a directional coupler disposed between the antenna 16 and the diplexer 15, which is also used for detecting transmission signal levels of the GSM system and the DCS system. Reference numeral 19 denotes a detection circuit for detecting (rectifying) the output signal of the directional coupler 18, and this detection circuit 19 is also provided in the module 1. Reference numeral 20 denotes a terminal for connecting an output signal of the detection circuit 19 to an automatic gain control (APC) circuit (not shown) provided outside the module 1. Reference numeral 21 denotes a terminal for applying a control signal from the automatic gain control circuit.
[0020]
FIG. 2 is a diagram showing an example of the circuit of FIG. 1. In FIG. 2, the matching circuit 9 (10) includes inductors L1, L2 (L3, L4) and capacitors C1 to C4 (C5 to 8). , And a power supply terminal T1 (T2).
[0021]
The high-frequency switch 11 (12) includes PIN diodes D1, D2 (D3, D4), inductors L5, L6 (L7, L8), capacitors C9 to C12 (C13 to C16), and a resistor R1 (R2). And a control terminal T3 (T4) for applying a control voltage for switching between transmission and reception. The detection circuit 19 includes a detection diode D5, capacitors C17 and C18, and a resistor R3.
[0022]
FIG. 3 is a layer configuration diagram of the module 1 of the present invention. The module 1 is formed by laminating a base material 24 made of a resin having a conductor pattern 22 and a via hole 23 for interlayer connection or the like or a composite material obtained by mixing a functional material powder such as a dielectric powder or a magnetic powder with the resin. It is composed of a multilayer substrate 25 configured. Reference numeral 26 denotes an area mainly handling an RF signal (hereinafter referred to as an RF area), and reference numeral 27 denotes an area mainly handling an IF signal including an IC detection circuit 19 (hereinafter referred to as an IF area).
[0023]
A cavity 28 is formed in the IF region 27 on the mounting board side of the multilayer board 25, and the detection circuit 19 is built therein by making necessary electrical connection, and IC terminal strength, board flexure strength, IC moisture resistance In consideration of insulation, heat dissipation, and instability of IC operation due to a change in air temperature in the cavity, it is covered with a mold resin 29. A ground electrode 30 for shielding the detection circuit 19 mainly against the RF region is built in the multilayer substrate 25 near the side opposite to the mounting substrate with respect to the detection circuit 19.
[0024]
On the multilayer substrate 25, a semiconductor IC 32 constituting the transmission power amplifiers 5 and 6, a chip-like element 33 such as the diodes D1 to D4, capacitors C1 to C16, and a part of inductors L1 to L8 are mounted. Is electrically connected to and mounted on a pad 34 formed on the surface (the surface opposite to the mounting substrate side).
[0025]
In this module, the signal coupled by the directional coupler 17 outputs a voltage corresponding to the coupling power level from the terminal section 20 of the detection circuit 19 built in the multilayer substrate 25, and outputs the voltage to an automatic power control circuit (not shown). Sent. The transmission power amplifiers 5 and 6 receive a control signal from the automatic power control circuit via the terminal unit 21 and are controlled to output a transmission signal of a predetermined level.
[0026]
Here, in the present invention, since the detection circuit 19 is provided on the same substrate 25 as the transmission power amplifiers 5 and 6, they operate in the same temperature environment. Of a transmission signal from a target level due to a difference in temperature (when the temperature of the amplifiers 5 and 6 is higher than that of the detection circuit 19) in the case of being configured as a substrate or a substrate, and accurate level control. It can be performed.
[0027]
Further, since the transmission power amplifiers 5 and 6, the filters 7 and 8, the directional coupler 18, the detection circuit 19, the diplexer 15, and the high-frequency switches 11 and 12 are provided on the same multilayer substrate 25, each element The number of matching circuits for ensuring characteristics such as matching, attenuation, and isolation between circuits can be reduced, and wiring can be simplified, so that insertion loss can be improved.
[0028]
Further, since the detection circuit 19 is shielded from the RF region 26 by the ground electrode 30, it is possible to prevent the detection circuit 19 from being affected by signals other than the transmission signal to be detected. Further, since the RF region 26 and the IF region 27 are vertically separated by the ground electrode 30, the shield case covers only the upper part of the module including the RF region 26 that mainly causes noise emission, though not shown. The structure may be reduced, and the weight of the module and the weight of the terminal can be reduced.
[0029]
In the present embodiment, since the directional coupler 18 is disposed between the antenna 16 and the diplexer 15, it is necessary to provide the directional coupler 18 and the detection circuit 19 for different communication systems (GSM, DCS). And further simplification of the circuit and miniaturization of the module 1 can be achieved.
[0030]
Further, in the present embodiment, since directional coupler 17 is arranged at a position near antenna 16, a power value close to the actual transmission power can be detected, and more accurate automatic power control can be performed. it can.
[0031]
In practicing the present invention, the detection circuit 19 may be provided with a diode D6 for temperature compensation, as shown in FIG. In FIG. 4, R4 to R6 are resistors, and T5 is a terminal for applying a predetermined voltage.
[0032]
FIG. 5 shows another embodiment of the module of the present invention, in which the automatic power control circuit 35 is included in one module 1 by the output of the detection circuit 19 (that is, provided on the same substrate). . With such a configuration, since the automatic power control circuit 35 also operates in the same temperature environment as the detection circuit 19 and the amplifiers 5 and 6, the influence of the temperature difference is reduced as compared with the case where the automatic power control circuit is individually mounted. Transmission power can be controlled. Further, the configuration can be further simplified and downsized.
[0033]
FIG. 6 shows another embodiment of the module of the present invention, in which high-frequency switches 36 and 37 using FETs as switching elements are used instead of the high-frequency switches using diodes. T3 and T4 are control terminals for applying control signals for switching transmission and reception of the high frequency switches 36 and 37, respectively.
[0034]
FIG. 7 shows another embodiment of the module of the present invention. Instead of the high-frequency switch and the diplexer using the diode, a switching element composed of an FET having a transmission / reception selection function shared by a plurality of communication systems is selected by a selection circuit 38. It was used for T5 is a control terminal for applying the switching signal of the selection circuit 38. In the case of this circuit configuration, the directional coupler 18 is provided between the selection circuit 38 and the antenna terminal 17. According to this configuration, the configuration can be further simplified and downsized.
[0035]
In practicing the present invention, the transmission power amplifiers 5 and 6 may be incorporated in the cavity 2 instead of the detection circuit 19, and the detection circuit 19 may be mounted on a multilayer substrate together with the above-described diodes and the like. In this case, since the upper and lower positional relations of the RF region and the IF region of the multilayer substrate are reversed, it is preferable to arrange the shielding ground electrode 30 near the upper surface of the multilayer substrate.
[0036]
In addition, the present invention provides not only a combination of the GSM system and the DCS system but also a triple band including such two systems and a PCS (Personal Communication Services) system, GSM, DCS, W-CDMA (Wide-band). Code Division Multiple Access (Triple Band) system, GSM, DCS, PCS, W-CDMA four bands, PCS system and Advanced Mobile Phone Services (AMPS) system combination, PHS (Personal Handyphone-DigitalSonyPhoneDigitalSonyPhone) (Cellular) combination, etc., and the more systems that are handled, the more the structure can be simplified and the effect of miniaturization can be exhibited.
[0037]
【The invention's effect】
According to the present invention, the detection circuit and the transmission power amplifier are provided on the same multilayer substrate as a multi-band wireless communication module, so that transmission power control in the transmission power amplifier can be performed accurately without being affected by temperature, and the module can be simplified, The size can be reduced.
[Brief description of the drawings]
FIG. 1 is a block diagram showing one embodiment of a multi-band wireless communication module of the present invention.
FIG. 2 is a diagram illustrating an example of the circuit of FIG. 1;
FIG. 3 is a layer configuration diagram of the module of FIGS. 1 and 2;
FIG. 4 is a circuit diagram showing another example of the detection circuit in the present embodiment.
FIG. 5 is a block diagram showing another embodiment of the multi-band wireless communication module of the present invention.
FIG. 6 is a circuit diagram showing another embodiment of the multi-band wireless communication module of the present invention.
FIG. 7 is a circuit diagram showing another embodiment of the multi-band wireless communication module of the present invention.
[Explanation of symbols]
1: Multi-band wireless communication module, 2, 3: transmission terminal section, 5, 6: transmission power amplifier, 7, 8: filter, 9, 10: matching circuit, 11, 12: high-frequency switch, 13, 14: reception terminal , 15: diplexer, 16: antenna, 17: antenna terminal, 18: directional coupler, 19: detection circuit, 20: detection output terminal, 21: APC circuit terminal, 22: conductor pattern, 23: via hole , 24: base material, 25: multilayer substrate, 26: RF region, 27: IF region, 28: cavity, 29: mold resin, 30: ground electrode, 32: semiconductor IC, 33: chip element, 34: pad, 35: automatic power control circuit, 36, 37: high frequency switch, 38: selection circuit

Claims (6)

On the same multilayer substrate, at least a transmission power amplifier, a filter, a directional coupler, a detection circuit for detecting an output of the directional coupler, and a circuit for separating or selecting a signal for each communication system having a different frequency And a high-frequency switch for switching between transmission and reception. 2. The multi-band wireless communication module according to claim 1, wherein an automatic power control circuit for controlling an amplifier circuit based on an output signal of the detection circuit is provided on the multilayer substrate. The multi-band wireless communication module according to claim 1 or 2,
A multi-band wireless communication module, wherein at least the detection circuit is incorporated on the mounting substrate side of the multilayer substrate, and a ground electrode is incorporated on a side of the detection circuit opposite to the mounting substrate. The multi-band wireless communication module according to any one of claims 1 to 3,
A multi-band wireless communication module, wherein the directional coupler is provided between an antenna and a circuit that separates or selects a signal for each communication system having a different frequency. The multi-band wireless communication module according to any one of claims 1 to 4,
A multi-band wireless communication module, wherein a semiconductor IC and a chip-like element are mounted on the multilayer substrate. A multi-band wireless communication terminal comprising the multi-band wireless communication module according to any one of claims 1 to 5.

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