JP2004282092A5 - - Google Patents

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Publication number
JP2004282092A5
JP2004282092A5 JP2004140147A JP2004140147A JP2004282092A5 JP 2004282092 A5 JP2004282092 A5 JP 2004282092A5 JP 2004140147 A JP2004140147 A JP 2004140147A JP 2004140147 A JP2004140147 A JP 2004140147A JP 2004282092 A5 JP2004282092 A5 JP 2004282092A5
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JP
Japan
Prior art keywords
cerium oxide
water
polishing
slurry
soluble
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Withdrawn
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JP2004140147A
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Japanese (ja)
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JP2004282092A (en
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Priority to JP2004140147A priority Critical patent/JP2004282092A/en
Priority claimed from JP2004140147A external-priority patent/JP2004282092A/en
Publication of JP2004282092A publication Critical patent/JP2004282092A/en
Publication of JP2004282092A5 publication Critical patent/JP2004282092A5/ja
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Claims (13)

結晶粒界を有する酸化セリウムを含み、酸化セリウム粒子分に対する硫酸イオン濃度が５，０００ｍｇ／ｋｇ以下であるスラリーからなる酸化セリウム研磨剤。   A cerium oxide abrasive comprising a slurry containing cerium oxide having a crystal grain boundary and having a sulfate ion concentration of 5,000 mg / kg or less with respect to cerium oxide particles. 酸化セリウム粒子分に対するスラリー中の硫酸イオン濃度が１，５００ｍｇ／ｋｇ以下である請求項１記載の酸化セリウム研磨剤。   The cerium oxide abrasive according to claim 1, wherein the concentration of sulfate ion in the slurry with respect to the cerium oxide particle content is 1,500 mg / kg or less. スラリーが媒体として水を含む請求項１または請求項２に記載の酸化セリウム研磨剤。   The cerium oxide abrasive according to claim 1 or 2, wherein the slurry contains water as a medium. スラリーが分散剤を含む請求項１〜３のいずれかに記載の酸化セリウム研磨剤。   The cerium oxide abrasive according to any one of claims 1 to 3, wherein the slurry contains a dispersant. 分散剤が水溶性有機高分子、水溶性陰イオン性界面活性剤、水溶性非イオン性界面活性剤及び水溶性アミンから選ばれる少なくとも１種の化合物である請求項４記載の酸化セリウム研磨剤。   The cerium oxide abrasive according to claim 4, wherein the dispersant is at least one compound selected from a water-soluble organic polymer, a water-soluble anionic surfactant, a water-soluble nonionic surfactant and a water-soluble amine. ｐＨが７以上１０以下である請求項１〜５のいずれかに記載の酸化セリウム研磨剤。   pH is 7-10, The cerium oxide abrasive | polishing agent in any one of Claims 1-5. 請求項１〜６のいずれかに記載の酸化セリウム研磨剤で、所定の基板を研磨することを特徴とする基板の研磨法。   A method of polishing a substrate, comprising polishing a predetermined substrate with the cerium oxide abrasive according to claim 1. 所定の基板が酸化珪素絶縁膜の形成された半導体素子である請求項７記載の基板の研磨法。   8. The method for polishing a substrate according to claim 7, wherein the predetermined substrate is a semiconductor element on which a silicon oxide insulating film is formed. 媒体と、結晶粒界を有する酸化セリウムとを含み、酸化セリウム粒子分に対する硫酸イオン濃度が５，０００ｍｇ／ｋｇ以下である研磨用スラリー。   A polishing slurry comprising a medium and cerium oxide having a crystal grain boundary and having a sulfate ion concentration of 5,000 mg / kg or less with respect to the cerium oxide particle content. 酸化セリウム粒子分に対するスラリー中の硫酸イオン濃度が１，５００ｍｇ／ｋｇ以下である請求項９記載の研磨用スラリー。   The polishing slurry according to claim 9, wherein the concentration of sulfate ion in the slurry with respect to the cerium oxide particle content is 1,500 mg / kg or less. 分散剤を含む請求項９または請求項１０に記載の研磨用スラリー。   The polishing slurry according to claim 9 or 10, comprising a dispersant. 分散剤が水溶性有機高分子、水溶性陰イオン性界面活性剤、水溶性非イオン性界面活性剤及び水溶性アミンから選ばれる少なくとも１種の化合物である請求項１１記載の研磨用スラリー。   The polishing slurry according to claim 11, wherein the dispersant is at least one compound selected from a water-soluble organic polymer, a water-soluble anionic surfactant, a water-soluble nonionic surfactant, and a water-soluble amine. ｐＨが７以上１０以下である請求項９〜１２のいずれかに記載の研磨用スラリー。
The polishing slurry according to any one of claims 9 to 12, having a pH of 7 or more and 10 or less.
JP2004140147A 2004-05-10 2004-05-10 Cerium oxide abrasive and substrate polishing method Withdrawn JP2004282092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004140147A JP2004282092A (en) 2004-05-10 2004-05-10 Cerium oxide abrasive and substrate polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004140147A JP2004282092A (en) 2004-05-10 2004-05-10 Cerium oxide abrasive and substrate polishing method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP10364982A Division JP2000186277A (en) 1998-12-22 1998-12-22 Cerium oxide abrasive and method for polishing substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004244790A Division JP2004336082A (en) 2004-08-25 2004-08-25 Cerium oxide abrasive and method of grinding substrate

Publications (2)

Publication Number Publication Date
JP2004282092A JP2004282092A (en) 2004-10-07
JP2004282092A5 true JP2004282092A5 (en) 2006-03-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004140147A Withdrawn JP2004282092A (en) 2004-05-10 2004-05-10 Cerium oxide abrasive and substrate polishing method

Country Status (1)

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JP (1) JP2004282092A (en)

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