JP2004279471A5 - - Google Patents

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Publication number
JP2004279471A5
JP2004279471A5 JP2003067010A JP2003067010A JP2004279471A5 JP 2004279471 A5 JP2004279471 A5 JP 2004279471A5 JP 2003067010 A JP2003067010 A JP 2003067010A JP 2003067010 A JP2003067010 A JP 2003067010A JP 2004279471 A5 JP2004279471 A5 JP 2004279471A5
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JP
Japan
Prior art keywords
group
hydrogen atom
atom
general formula
alkyl group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003067010A
Other languages
English (en)
Japanese (ja)
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JP2004279471A (ja
JP4166598B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003067010A priority Critical patent/JP4166598B2/ja
Priority claimed from JP2003067010A external-priority patent/JP4166598B2/ja
Priority to EP04004961A priority patent/EP1457819A3/en
Priority to US10/796,083 priority patent/US7118846B2/en
Publication of JP2004279471A publication Critical patent/JP2004279471A/ja
Publication of JP2004279471A5 publication Critical patent/JP2004279471A5/ja
Application granted granted Critical
Publication of JP4166598B2 publication Critical patent/JP4166598B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003067010A 2003-03-12 2003-03-12 ポジ型レジスト組成物 Expired - Fee Related JP4166598B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003067010A JP4166598B2 (ja) 2003-03-12 2003-03-12 ポジ型レジスト組成物
EP04004961A EP1457819A3 (en) 2003-03-12 2004-03-03 Positive resist composition and method of forming a resist pattern using the same
US10/796,083 US7118846B2 (en) 2003-03-12 2004-03-10 Positive resist composition and method of forming a resist pattern using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003067010A JP4166598B2 (ja) 2003-03-12 2003-03-12 ポジ型レジスト組成物

Publications (3)

Publication Number Publication Date
JP2004279471A JP2004279471A (ja) 2004-10-07
JP2004279471A5 true JP2004279471A5 (US06780888-20040824-C00057.png) 2005-09-29
JP4166598B2 JP4166598B2 (ja) 2008-10-15

Family

ID=32767944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003067010A Expired - Fee Related JP4166598B2 (ja) 2003-03-12 2003-03-12 ポジ型レジスト組成物

Country Status (3)

Country Link
US (1) US7118846B2 (US06780888-20040824-C00057.png)
EP (1) EP1457819A3 (US06780888-20040824-C00057.png)
JP (1) JP4166598B2 (US06780888-20040824-C00057.png)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639062B2 (ja) 2003-11-21 2011-02-23 富士フイルム株式会社 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法
JP5675070B2 (ja) * 2009-07-30 2015-02-25 富士フイルム株式会社 感活性光線性または感放射線性樹脂組成物、及び該組成物を用いたパターン形成方法
JP5331624B2 (ja) * 2009-09-04 2013-10-30 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、及びそれを用いたパターン形成方法
KR101810520B1 (ko) * 2009-07-30 2017-12-19 후지필름 가부시키가이샤 감활성 광선성 또는 감방사선성 수지 조성물 및 그것을 사용한 패턴 형성 방법
JP5621432B2 (ja) * 2009-09-17 2014-11-12 住友化学株式会社 レジスト組成物
JP5556522B2 (ja) * 2009-09-17 2014-07-23 住友化学株式会社 レジスト組成物
US9726976B2 (en) * 2009-09-17 2017-08-08 Sumitomo Chemical Company, Limited Photoresist composition
US9223208B2 (en) 2011-12-29 2015-12-29 Fujifilm Corporation Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition
KR20150101074A (ko) * 2014-02-26 2015-09-03 삼성전자주식회사 포토레지스트 조성물, 이를 이용한 패턴 형성 방법 및 반도체 소자의 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3591672B2 (ja) * 1996-02-05 2004-11-24 富士写真フイルム株式会社 ポジ型感光性組成物
WO2000017712A1 (en) 1998-09-23 2000-03-30 E.I. Du Pont De Nemours And Company Photoresists, polymers and processes for microlithography
AU4678100A (en) * 1999-05-04 2000-11-17 E.I. Du Pont De Nemours And Company Fluorinated polymers, photoresists and processes for microlithography
TWI224713B (en) * 2000-01-27 2004-12-01 Fuji Photo Film Co Ltd Positive photoresist composition
US20020155376A1 (en) * 2000-09-11 2002-10-24 Kazuhiko Hashimoto Positive resist composition
JP3876968B2 (ja) 2001-04-26 2007-02-07 信越化学工業株式会社 高分子化合物、化学増幅レジスト材料及びパターン形成方法
US7108951B2 (en) * 2002-02-26 2006-09-19 Fuji Photo Film Co., Ltd. Photosensitive resin composition
KR100955454B1 (ko) * 2002-05-31 2010-04-29 후지필름 가부시키가이샤 포지티브 레지스트 조성물

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