JP2004273636A - Method for cleaning substrate, process for producing semiconductor device, and equipment for cleaning substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for cleaning a substrate in which burrs occurring on the element forming surface of a substrate through probe test can be removed, and to provide a process for producing a semiconductor device and equipment for cleaning a substrate. <P>SOLUTION: The equipment for cleaning the element forming surface of a wafer 49 comprises a means 10 for supporting the wafer 49 from the side opposite to the element forming surface, and an adhesive roller 1 rolling while touching the outer circumferential surface thereof to the element forming surface of the wafer 49 supported by the supporting means 10 wherein the adhesive roller 1 has an adhesive material 1C on the outer circumferential surface thereof. When the adhesive roller 1 touches a pad electrode, burrs on the pad electrode adhere to the outer circumferential surface of the adhesive roller 1 and are stripped off as the adhesive roller 1 rolls. Consequently, burrs can be removed from the pad electrode. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for cleaning a substrate, a method for manufacturing a semiconductor device, and a substrate cleaning apparatus, and more particularly to a method for cleaning a wafer, a method for manufacturing a semiconductor device, and a method for cleaning a wafer, which removes burrs generated on a pad electrode in a probe test. Things.
[0002]
[Prior art]
In recent years, with the miniaturization of electronic devices such as personal computers and portable terminals, the mounting density of semiconductor devices in these electronic devices has been increasing more and more. Recently, ultra-small packages having almost the same size as IC chips have become widespread, and the mounting density of semiconductor devices has been increased. One example of such an ultra-small package is W-CSP.
[0003]
FIG. 9A is a cross-sectional view illustrating a configuration example of a W-CSP semiconductor device 50. In FIG. 9A, 49 is a silicon wafer, 53 is a pad electrode made of an aluminum alloy, 55 is a passivation film, 57 is a rewiring layer, 59 is a solder resist, 61 is a ball electrode (external terminal), and 63 is a ball electrode (external terminal). Epoxy resin. On the upper surface (element formation surface) of the silicon wafer 49 in FIG. 9A, a plurality of circuit elements (not shown) such as MOS transistors are formed.
[0004]
A feature of the W-CSP illustrated in FIG. 9A is that the rewiring layer 57 is formed in a wafer process (previous process). The rewiring layer 57 is formed by forming a metal thin film such as Cu on the passivation film 55 and the pad electrode 53 by sputtering, electrolytic plating, or the like, and patterning the metal thin film by photolithography. For this reason, the thickness of the package is much thinner than the case where the connection between the pad electrode and the external terminal is made by a bonding wire.
[0005]
In such a semiconductor device 50, when inspecting the electrical characteristics of circuit elements provided on the silicon wafer 49 (hereinafter referred to as probe inspection), as shown in FIG. Before forming, the probe needle 30 is brought into contact with the pad electrode 53. Then, a predetermined electric signal is input to the pad electrode 53 via these probe needles 30, and an output signal of the circuit element corresponding to the input signal is obtained. The electrical characteristics of the circuit element are determined based on the output signal.
[0006]
By the way, since aluminum has a chemical property that it is very easily oxidized at normal temperature in the air, the surface of the pad electrode 53 before the probe test is covered with a thin natural oxide film (Al _X O _Y ). Since this natural oxide film is insulative, it hinders the electrical connection between the probe needle 30 and the pad electrode 5.
For this reason, when performing a probe test on the semiconductor device 50, as shown in FIG. 10, the probe needle 30 is brought into contact with the pad electrode 53 to scrape off the natural oxide film on the surface thereof. If the stripped natural oxide film is left on the pad electrode 53 or the passivation film 55 as it is, the rewiring layer 57 shown in FIG. 9A cannot be formed in a predetermined pattern, and the rewiring layer becomes conductive. There is a risk of causing a defect or the like.
[0007]
Therefore, after the probe inspection, pure water is sprayed onto a silicon wafer (hereinafter, referred to as a wafer) 49 including a pad electrode to remove the shaved natural oxide film. The injection pressure of the pure water with respect to the wafer 49 is set to a pressure range that does not cause electrostatic breakdown of the gate insulating film and the like.
[0008]
[Patent Document 1]
JP-A-10-268242 [Patent Document 2]
JP-A-4-354145 [0009]
[Problems to be solved by the invention]
By the way, in the prior art, after performing a probe test on the semiconductor device 50, pure water is sprayed onto the wafer 49 including the pad electrode 53 to remove the natural oxide film shaved off by the probe needle. However, as shown in FIG. 10, a part of the natural oxide film shaved off by the probe needle may not be completely separated from the pad electrode 53 and may remain as burrs 71.
[0010]
Such burrs 71 could not be removed by jetting pure water. Further, if the rewiring layer 57 is formed with such burrs 71 remaining on the pad electrode 53, the adhesion between the rewiring layer 57 and the pad electrode 53 may be reduced. If the adhesion between the rewiring layer 57 and the pad electrode 53 decreases, the reliability of the semiconductor device 50 decreases.
[0011]
Therefore, the present invention is to solve such a problem of the prior art, and even if burrs are generated on the element formation surface of the substrate by the probe inspection, the substrate cleaning method and the burrs can be removed. It is an object of the present invention to provide a semiconductor device manufacturing method and a substrate cleaning device.
[0012]
[Means for Solving the Problems]
In order to solve the above-described problems, a first substrate cleaning method according to the present invention provides a method of cleaning a substrate, in which a probe is brought into contact with an element forming surface of a substrate on which a plurality of circuit elements are integrally formed. After inspecting the characteristics, a roller having an adhesive material on the outer peripheral surface is brought into contact with the element forming surface of the substrate and is rolled.
[0013]
Further, in the second substrate cleaning method according to the present invention, in the above-described first substrate cleaning method, the roller is brought into contact with the element forming surface of the substrate and rolled, and then the element forming surface is wet-cleaned. It is characterized by the following.
Here, inspection (probe inspection) of the electrical characteristics of the circuit element formed on the substrate is usually performed by bringing a probe into contact with a pad electrode or the like of the circuit element. In this probe inspection, the surface layer of the pad electrode is shaved by the probe, and part of the shaved surface layer is completely separated from the pad electrode and spreads on the element formation surface of the substrate, and the other part is cut off. Remains as burrs without completely separating from the pad electrode.
[0014]
According to the first and second substrate cleaning methods according to the present invention, when the roller having the adhesive on the outer peripheral surface contacts the pad electrode, the burrs on the pad electrode are adhered to the outer peripheral surface of the roller. Then, the burrs adhered to the outer peripheral surface are peeled off from the pad electrode by rolling of the roller. Therefore, burrs generated on the element formation surface of the substrate can be removed.
[0015]
In a method of manufacturing a semiconductor device according to the present invention, the above-described first or second substrate cleaning method is performed between a step of inspecting electrical characteristics of a circuit element and a step of packaging the circuit element. It is characterized by the following.
According to the method of manufacturing a semiconductor device of the present invention, even if burrs occur on the element formation surface of the substrate in the probe inspection step, the burrs can be removed. Therefore, a wiring pattern can be formed with good adhesion on the element formation surface after the probe test, which can contribute to improvement in reliability of the semiconductor device.
[0016]
A first substrate cleaning apparatus according to the present invention is an apparatus for cleaning an element forming surface of a substrate on which a plurality of circuit elements are integrally formed, and a supporting means for supporting the substrate from a side opposite to the element forming surface. And a roller whose outer peripheral surface is in contact with the element forming surface of the substrate supported by the supporting means and rolls, and the roller has an adhesive on the outer peripheral surface.
[0017]
In the second substrate cleaning apparatus according to the present invention, in the first substrate cleaning apparatus described above, when the first roller is a roller that rolls when the outer peripheral surface is in contact with the element forming surface of the substrate, Is provided with a second roller for bringing the outer peripheral surface into contact with the opposite side of the element formation surface of the substrate, and the second roller rolls while sandwiching the substrate with the first roller. is there.
[0018]
Further, a third substrate cleaning apparatus according to the present invention is characterized in that, in the above-described second substrate cleaning apparatus, the second roller has an adhesive material on an outer peripheral surface.
According to the first to third substrate cleaning apparatuses according to the present invention, when the roller having the adhesive on the outer peripheral surface contacts the element forming surface of the substrate, the foreign matter on the element forming surface is adhered to the outer peripheral surface of the roller. You. Then, the foreign matter adhered to the outer peripheral surface is separated from the element forming surface by rolling of the roller. Therefore, burrs generated on the element formation surface of the substrate by the probe inspection can be removed.
[0019]
A fourth substrate cleaning apparatus according to the present invention is an apparatus for cleaning an element forming surface of a substrate on which a plurality of circuit elements are integrally formed, and a supporting means for supporting the substrate from a side opposite to the element forming surface. And a roller whose outer peripheral surface is in contact with the element forming surface of the substrate supported by the support means and rolls, and the roller has a rubber-based resin material on the outer peripheral surface. .
[0020]
According to the fourth substrate cleaning apparatus of the present invention, when the roller having the rubber-based resin material on the outer peripheral surface contacts the element forming surface of the substrate, the foreign matter on the element forming surface is caught on the outer peripheral surface of the roller. Is done. Then, the foreign matter hung on the outer peripheral surface is separated from the element formation surface by the rolling of the roller. Therefore, burrs generated on the element formation surface of the substrate by the probe inspection can be removed.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a wafer cleaning method, a semiconductor device manufacturing method, and a wafer cleaning apparatus according to an embodiment of the present invention will be described with reference to the drawings.
(1) First Embodiment FIG. 1 is a plan view showing a configuration example of a wafer cleaning apparatus 100 according to a first embodiment of the present invention. The wafer cleaning apparatus 100 is an apparatus that cleans an element formation surface of a wafer 49 after a probe test and removes burrs on a pad electrode. In FIG. 1, the wafer cleaning apparatus 100 includes a support means 10 for supporting a wafer 49 from the side opposite to the element forming surface, an adhesive roller 1 which rolls when its outer peripheral surface comes into contact with the element forming surface of the wafer 49, and The apparatus includes a pair of bearings 20 that sandwich the adhesive roller 1 from the Y direction and rotatably support the adhesive roller 1, and a hood 25 that covers the adhesive roller 1 from above.
[0022]
FIG. 2 is a cross-sectional view of the wafer cleaning apparatus 100 shown in FIG. As shown in FIG. 2, the support unit 10 includes a loading stage 11, a loading stage 13, and a transport roller 15. These support means 10 are arranged, for example, along the X direction in FIG. 2, and the carry-in stage 11 is arranged on the left side, and the carry-out stage 13 is arranged on the right side. The transport roller 15 is disposed between the carry-in side stage 11 and the carry-out side stage 13. The positions of the carry-in side stage 11, the carry-out side stage 13, and the transport roller 15 are adjusted such that the upper surfaces thereof are substantially at the same height.
[0023]
The shape of the carry-in side stage 11 and the carry-out side stage 13 is, for example, a rectangular parallelepiped, and its main body is made of metal such as stainless steel. The surfaces of the loading stage 11 and the unloading stage 13 on which the wafers 49 are placed are particularly flattened, and the surfaces thereof are coated with a low-friction resin (not shown) such as a fluororesin. .
The transport roller 15 includes a shaft 15A, a cylindrical body 15B, and rubber 15C. The shaft 15A extends in the Y direction in FIG. 2, and is rotatably wrapped around a bearing 20 that sandwiches the transport roller 15 from the Y direction. The shaft 15A is made of metal such as stainless steel, for example. The cylindrical body 15B extends in the Y direction in FIG. 2, and the center of the XZ section is penetrated by a shaft 15A extending in the Y direction. This cylindrical body 15B is fixed to the shaft 15A. The cylindrical body 15B is made of metal such as stainless steel, for example.
[0024]
Further, the rubber 15C is provided on the outer peripheral surface of the cylindrical body 15B. As shown in FIG. 2, the surface of the rubber 15C comes into contact with the lower surface of the wafer 49 (the side opposite to the element forming surface).
On the other hand, the adhesive roller 1 is provided above the transport roller 15 with the wafer 49 to be cleaned interposed therebetween. The adhesive roller 1 includes a shaft 1A, a cylindrical body 1B, and an adhesive 1C. The shaft 1A extends in the Y direction in FIG. 2, and is rotatably wrapped around a bearing 20 that sandwiches the transport roller 15 from the Y direction. The shaft 1A is rotated by, for example, a motor (not shown) in a direction indicated by an arrow in FIG. 2 (counterclockwise). This shaft 1A is made of metal such as stainless steel, for example.
[0025]
The cylindrical body 1B extends in the Y direction in FIG. 2, and the center of the XZ section is penetrated by an axis 1A extending in the Y direction. This cylindrical body 1B is fixed to the shaft 1A. This cylindrical body 1B is made of metal such as stainless steel, for example.
Further, the adhesive 1C is provided on the outer peripheral surface of the cylindrical body 1B. As shown in FIG. 2, the surface of the adhesive 1C is in contact with the upper surface (element formation surface) of the wafer 49. The adhesive material 1C is, for example, water-soluble, and has an adhesive force enough to prevent the passivation film 55 (see FIG. 9) from being peeled off from the wafer 49 and to adhere burrs, shavings, and the like on the pad electrode. The adhesive roller 1 can be easily detached from the bearing 20 shown in FIG. 1, and the adhesive 1C can be periodically washed with water.
[0026]
In the wafer cleaning apparatus 100, when the adhesive roller 1 rotates counterclockwise, for example, by the power of a motor (not shown), the wafer 49 that comes into contact with the adhesive roller 1 is sent out to the right in FIG. In addition, as the wafer 49 moves rightward, the transport roller 15 that contacts the lower surface of the wafer 49 rotates clockwise.
[0027]
Next, a method for cleaning the element forming surface of the wafer 49 after the probe inspection by using the wafer cleaning apparatus 100 will be described.
FIGS. 6A, 6B and 7 are process diagrams showing examples of cleaning of the wafer 49 (Nos. 1 and 2). Here, it is assumed that burrs 71 and shavings as shown in FIG. 10 are generated on the element formation surface of the wafer 49 by the probe inspection.
[0028]
First, the adhesive roller 1 shown in FIG. 2 is rotated counterclockwise by the power of a motor (not shown). In addition, a wafer 49 shown in FIG. 6A is placed on the loading stage 11.
Next, the wafer 49 is advanced to the adhesive roller 1 side shown in FIG. 2 and is sandwiched between the adhesive roller 1 and the transport roller 15. This pinching operation is performed manually by an operator. In the wafer cleaning apparatus 100, since the adhesive roller 1 is covered with the hood 25, even in the case of manual operation by an operator, there is no risk of pinching a fingertip or the like between the adhesive roller 1 and the transport roller, and the operation can be performed safely. The wafer 49 sandwiched between the adhesive roller 1 and the transport roller 15 is sent out from the loading stage 11 to the unloading stage 13 by the relative rotation of the adhesive roller 1 with respect to the wafer 49.
[0029]
Further, in the course of this feeding, as shown in FIG. 6B, the adhesive roller 1 comes into contact with the element forming surface on the wafer 49. By this contact, the burrs 71 and shavings on the pad electrode 53 are adhesively held by the adhesive 1C. Further, by the relative rolling of the adhesive roller 1 with respect to the wafer 49, the burrs 71 held by the adhesive 1 </ b> C are peeled off from the pad electrode 53. As a result, as shown in FIG. 7, burrs and shavings generated on the pad electrode 53 can be removed on the element formation surface of the wafer 49.
[0030]
Next, after removing burrs using the wafer cleaning apparatus 100, it is desirable to wash the wafer 49 with pure water or the like. This is for two reasons. The first reason is that shavings and the like that have been adhesively held by the adhesive 1C may peel off from the adhesive 1C due to the rolling of the adhesive roller, and may reattach to the wafer 49. The adhesive 1C does not peel off the passivation film 55 (see FIG. 9) from above the wafer 49, and has an adhesive force that is small enough to adhere burrs, shavings, and the like on the pad electrodes. Therefore, there is a possibility that shavings and the like are peeled off from the adhesive 1C.
[0031]
The second reason is that the adhesive 1C may remain on the element forming surface of the wafer 49. If the wafer 49 is flowed to the next step with the adhesive 1C left on the element formation surface, there is a possibility that the manufacturing apparatus in the next step will be contaminated depending on the type of the adhesive. Therefore, the wafer 49 is washed with water to remove the adhesive remaining on the element formation surface.
[0032]
As described above, according to the wafer cleaning apparatus 100 according to the first embodiment of the present invention, when the adhesive roller 1 having the adhesive material 1C on the outer peripheral surface contacts the pad electrode 53 of the wafer 49, the pad electrode 53 The burrs 71 are adhered to the outer peripheral surface of the adhesive roller 1. The burrs 71 adhered to the outer peripheral surface are peeled off from the pad electrodes by the rolling of the adhesive roller 1. Therefore, burrs 71, shavings, and the like generated on the pad electrode 53 by the probe inspection can be removed.
[0033]
Further, since the flash 71 is removed from the pad electrode 53, the rewiring layer 57 can be formed on the pad electrode 53 with good adhesion. As shown in FIG. 9A, after forming the rewiring layer 57, a solder resist 59, a ball electrode 61, and an epoxy resin 63 are sequentially formed. Then, the wafer 49 whose element formation surface is resin-sealed with the epoxy resin 63 is diced. Thus, the semiconductor device 50 is completed.
[0034]
In the first embodiment, the adhesive roller 1 corresponds to the first roller of the present invention, and the transport roller 15 corresponds to the second roller. Further, the wafer 49 including the pad electrode 53 corresponds to the substrate of the present invention, and the probe needle 30 corresponds to the probe of the present invention.
In the first embodiment, a case has been described in which the adhesive roller 1 is moved (rolled) in only one direction relative to the wafer 49 as shown by the arrow in FIG. Is not limited to one direction.
[0035]
For example, as shown in FIG. 8, the direction of the wafer 49 may be changed by 90 degrees with respect to the transport direction of the wafer cleaning apparatus 100, and the adhesive roller may be rolled four times from each direction. Arrows (1) to (4) in FIG. 8 indicate the direction of movement of the adhesive roller relative to the wafer 49. Thereby, the burrs on the pad electrode 53 can be adhered from four directions, respectively, and the burrs can be removed without being affected by the direction of the burrs.
(2) Second Embodiment In the above-described first embodiment, a case has been described in which the support unit 10 is configured by the carry-in side stage 11, the carry-out side stage 13, and the transport roller 15. The configuration example is not limited to this.
[0036]
FIG. 3 is a sectional view showing a configuration example of a wafer cleaning apparatus 200 according to the second embodiment of the present invention. In the wafer cleaning apparatus 200 shown in FIG. 3, portions having the same structure as the wafer cleaning apparatus 100 shown in FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.
In the wafer cleaning apparatus 200 shown in FIG. 3, the support means 10 'includes a carry-in device 11', a carry-out device 13 ', and a transfer roller 15. For example, the loading device 11 'is arranged on the left side of FIG. 3, the unloading device 13' is arranged on the right side of FIG. 3, and the transport rollers 15 are respectively arranged between the loading device 11 'and the unloading device 13'. ing.
[0037]
As shown in FIG. 3, the carry-in device 11 ′ and the carry-out device 13 ′ include, for example, a pair of metal pulleys 17 and an endless belt 18 suspended on the metal pulley 17. As shown in FIG. 3, when the pair of metal pulleys 17 of the loading device 11 'rotates clockwise, the endless belt 18 also rotates clockwise, and the wafer 49 is automatically loaded between the adhesive rollers 1 and 15'. You. Further, similarly to the loading device 11 ', the metal pulley 17 and the endless belt 18 of the loading device 13' also rotate clockwise, and the wafer 49 after the burrs are removed by the adhesive roller 1 is automatically moved to a predetermined position. It is carried out.
[0038]
In the wafer cleaning device 200, the rotation speed of the motor (not shown) for rotating the adhesive roller 1 and the rotation speed of the motor (not shown) for rotating the metal pulleys of the loading device 11 'and the unloading device 13' are different. Adjusted, the wafer 49 moves on the supporting means 10 'at a constant speed from the loading position of the wafer 49 to the unloading position. Therefore, as compared with the wafer cleaning apparatus 100, the loading and unloading operations of the wafer 49 can be performed automatically, so that the work load of the operator can be reduced, which is convenient.
(3) Third Embodiment FIG. 4 is a sectional view showing a configuration example of a wafer cleaning apparatus 300 according to a third embodiment of the present invention. This wafer cleaning apparatus 300 is different from the above-described wafer cleaning apparatus 200 according to the second embodiment in that the transport roller 15 is replaced with an adhesive roller 15 ′. Therefore, in the wafer cleaning apparatus 300 shown in FIG. 4, portions having the same structure as the wafer cleaning apparatus 200 shown in FIG. 3 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0039]
As shown in FIG. 4, in the wafer cleaning apparatus 300, the support means 10 'is composed of a carry-in device 11', a carry-out device 13 ', and an adhesive roller 15'. It is arranged between the device 11 'and the unloading device 13'. The adhesive roller 15 'is composed of a shaft 15A, a cylindrical body 15B, and an adhesive 15C'.
[0040]
The shaft 15A is rotatably suspended around the bearing 20 (see FIG. 1). Unlike the shaft 1A, the shaft 15A is not connected to a motor or the like. Further, the cylindrical body 15B is fixed to the shaft 15A in a state where the center portion is penetrated by the shaft 15A. Further, the adhesive material 15C 'is provided on the outer peripheral surface of the cylindrical body 15B, and the surface thereof comes into contact with the lower surface of the wafer 49. This adhesive 15C 'is water-soluble.
[0041]
In the wafer cleaning device 300 shown in FIG. 4, the wafer 49 receives the counterclockwise rotation of the adhesive roller 1 and moves rightward, and the rightward movement of the wafer 49 causes the adhesive roller 15 'to rotate clockwise. I do. Therefore, as compared with the wafer cleaning apparatuses 100 and 200, not only the upper surface of the wafer 49 but also the lower surface thereof (the side opposite to the element forming surface) can be cleaned.
(4) Fourth Embodiment In the first to third embodiments described above, the case where the adhesive roller 1 is brought into contact with the element forming surface side of the wafer 49 and the burrs on the pad electrode are adhered to the adhesive roller 1 and removed. explained. However, burrs on the pad electrode can be removed by using a resin roller having a rubber-based resin material on the outer peripheral surface instead of the adhesive roller 1.
[0042]
FIG. 5 is a sectional view showing a configuration example of a wafer cleaning apparatus 400 according to the fourth embodiment of the present invention. In the wafer cleaning apparatus 400 shown in FIG. 4, portions having the same structure as the wafer cleaning apparatus 100 shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.
The wafer cleaning device 400 includes a resin roller 1 ′ instead of the above-described adhesive roller 1. The resin roller 1 'is composed of, for example, a shaft 1A, a cylindrical body 1B, and a rubber-based resin 1C'.
[0043]
The rubber-based resin 1C 'is provided on the outer peripheral surface of the cylindrical body 1B, and the surface thereof comes into contact with the element forming surface of the wafer 49. The surface of the rubber-based resin 1C 'is, for example, porous, so that burrs on the pad electrode, shavings, and the like are easily applied to the holes on the surface.
According to the wafer cleaning apparatus 400, when the resin roller 1 'comes into contact with the element forming surface of the wafer 49, the burrs on the pad electrodes are hooked on the rubber-based resin 1C'. The burrs hung on the rubber-based resin 1C 'are peeled off from the pad electrodes by the rolling of the resin roller 1'. Therefore, similar to the wafer cleaning apparatus 100 described above, burrs, shavings, and the like on the pad electrodes can be removed.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration example of a wafer cleaning apparatus 100.
FIG. 2 is a sectional view taken along the line X1-X2, showing a configuration example of the wafer cleaning apparatus 100.
FIG. 3 is a sectional view showing a configuration example of a wafer cleaning apparatus 200.
FIG. 4 is a sectional view showing a configuration example of a wafer cleaning apparatus 300.
FIG. 5 is a sectional view showing a configuration example of a wafer cleaning device 400.
FIG. 6 is a process chart showing an example of cleaning the wafer 49 (part 1).
FIG. 7 is a process chart showing an example of cleaning the wafer 49 (part 2).
FIG. 8 is a conceptual diagram illustrating an example of rolling of an adhesive roller 1 with respect to a wafer 49.
FIG. 9 is an example of a probe test in the semiconductor device 50;
FIG. 10 shows an example of burrs 71 generated on a pad electrode 53.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Adhesive roller, 1A shaft, 1B cylindrical body, 1C adhesive material, 1 'resin roller, 1C' rubber-based resin, 10 and 10 'support means, 11 carry-in stage, 11' carry-in device, 13 carry-out stage, 13 ' Unloading device, 15 transport roller, 15A shaft, 15B cylinder, 15C rubber, 15 'adhesive roller, 15C' adhesive, 17 metal pulley, 18 endless belt, 20 bearing, 25 hood, 30 probe needle, 49 silicon wafer, Reference Signs List 50 semiconductor device, 53 pad electrode, 55 passivation film, 57 redistribution layer, 59 solder resist, 61 ball electrode, 63 epoxy resin, 71 flash, 100, 200, 300, 400 wafer cleaning device

Claims (7)

After inspecting the electrical characteristics of the circuit elements by contacting the probe with the element forming surface of the substrate on which the plurality of circuit elements are integrally formed,
A method for cleaning a substrate, comprising: bringing a roller having an adhesive material on an outer peripheral surface thereof into contact with an element forming surface of the substrate and rolling the substrate. The substrate cleaning method according to claim 1, wherein after the roller is brought into contact with the element forming surface of the substrate and rolled, the element forming surface is wet-cleaned. 3. A method for manufacturing a semiconductor device, comprising: performing the substrate cleaning method according to claim 1 or 2 between a step of inspecting electrical characteristics of the circuit element and a step of packaging the circuit element. Method. An apparatus for cleaning an element forming surface of a substrate on which a plurality of circuit elements are integrally formed,
Support means for supporting the substrate from the side opposite to the element forming surface,
Rollers that contact the outer peripheral surface with the element forming surface of the substrate supported by the supporting means and roll,
The said roller has an adhesive material on the outer peripheral surface, The board | substrate cleaning apparatus characterized by the above-mentioned. When the roller is a first roller,
The support means,
A second roller for bringing the outer peripheral surface into contact with the opposite side of the element formation surface of the substrate,
The second roller is
The substrate cleaning apparatus according to claim 4, wherein the substrate is rolled while sandwiching the substrate with the first roller. The substrate cleaning apparatus according to claim 5, wherein the second roller has an adhesive material on an outer peripheral surface. An apparatus for cleaning an element forming surface of a substrate on which a plurality of circuit elements are integrally formed,
Support means for supporting the substrate from the side opposite to the element forming surface,
Rollers that contact the outer peripheral surface with the element forming surface of the substrate supported by the supporting means and roll,
The substrate cleaning apparatus, wherein the roller has a rubber-based resin material on an outer peripheral surface.

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