JP2004273410A - Waterproof structure of planar wiring body, and method for forming it - Google Patents

Waterproof structure of planar wiring body, and method for forming it Download PDF

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Publication number
JP2004273410A
JP2004273410A JP2003147972A JP2003147972A JP2004273410A JP 2004273410 A JP2004273410 A JP 2004273410A JP 2003147972 A JP2003147972 A JP 2003147972A JP 2003147972 A JP2003147972 A JP 2003147972A JP 2004273410 A JP2004273410 A JP 2004273410A
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JP
Japan
Prior art keywords
wiring body
waterproof member
slit
waterproof
planar wiring
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JP2003147972A
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Japanese (ja)
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JP3960948B2 (en
Inventor
Masaru Kamimura
賢 上村
Kenji Enomoto
憲嗣 榎本
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Priority to JP2003147972A priority Critical patent/JP3960948B2/en
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  • Connector Housings Or Holding Contact Members (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a waterproof structure of a planar wiring body, having a simple structure to enhance waterproof performance, and a simple assembling process, and a method for forming it. <P>SOLUTION: In this waterproof structure of the planar wiring body, wherein a waterproof member 2 is mounted to the outer periphery of the planar wiring body 1 and the waterproof member 2 is stored in the inner space 4 of a housing 3, the waterproof member 2 is formed by a rubber-like elastic material and it has a slit 5 where the planar wiring body 1 is inserted, and the waterproof member 2 is formed so that the width of the slit 5 is narrower than the width of the planar wiring body 1 and the height of the slit 5 is higher than the height of the planar wiring body 1 with the planar wiring body 1 not inserted through the slit 5. The waterproof member 2 is brought into close contact with the periphery of the planar wiring body 1 with the waterproof member 2 stored in the housing 3. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、平面状配線体の接続部などに適用される防水構造に関する。
【0002】
【従来の技術】
配線体を他の配線体と接続する際に、接続部内に水分が浸入しないようにするために、配線体に防水部材を取り付けて防水構造とすることが広く行われている。従来は、配線体として丸型の電線が一般に使用されていたが、最近では、フラットケーブルや回路基板などの平面状配線体も多く使用されるようになってきており、これらの平面状配線体についても、接続部等の防水を図るための防水構造が検討されてきている。
【0003】
例えば、フラットケーブルに用いられる防水コネクタについては、フラットケーブルの端末部付近の外周を覆うようにシール部材を設けることが知られている(特許文献1参照)。また、防水コネクタを構成するフラットケーブルの端末部に複数の弾性ブロック体で構成されるシール部材を設けることも知られている(特許文献2参照)。
【0004】
【特許文献1】特開平6−203910号公報(2ページ2欄25行〜3ページ4欄27行、図1〜図4参照)
【特許文献2】特開平11−16628号公報(3ページ3欄15行〜7ページ12欄48行、図1〜図16参照)
【0005】
【発明が解決しようとする課題】
ところで、特許文献1に記載された防水コネクタにおいては、シール部材を圧縮するための押圧部材が必要であり、防水構造および組立工程が複雑となる問題点があった。また、特許文献2に記載された防水コネクタは、あくまでも組立工程を簡単にしたものであって、さらに防水性を高めることについては具体的に言及されていない。
【0006】
そこで、本発明では、防水性を高めるための構造が簡単で組立工程も簡単な平面状配線体の防水構造およびその形成方法を提供することを目的とする。
【0007】
【課題を解決するための手段】
請求項1の発明は、平面状配線体の外周に防水部材が取り付けられるとともに該防水部材がハウジングに収容されてなる平面状配線体の防水構造において、前記防水部材はゴム状の弾性材料により形成されるとともに前記平面状配線体が挿通されるスリットを有し、前記防水部材は、該防水部材の前記スリットに前記平面状配線体が挿通されていない状態で、前記スリットの幅が前記平面状配線体の幅より狭く形成されているとともに前記スリットの高さが前記平面状配線体の厚さより高くなるように形成されており、前記防水部材が前記ハウジングに収容された状態で、前記防水部材が前記平面状配線体の外周に密着していることを特徴とする。
【0008】
請求項2の発明は、請求項1の発明において、前記スリットは、前記防水部材の内表面から突設した複数の突条により形成されていることを特徴とする。
【0009】
請求項3の発明は、請求項1の発明において、前記ハウジングの内部空間の高さは、前記スリットに前記平面状配線体が挿通された状態の前記防水部材の高さより低く、かつ前記ハウジングの内部空間の断面積は、前記スリットに前記平面状配線体が挿通された状態の前記防水部材の断面積の80%以上100%未満であることを特徴とする。
【0010】
請求項4の発明は、平面状配線体の外周に防水部材を取り付けて該防水部材をハウジングに収容する平面状配線体の防水構造の形成方法において、前記防水部材はゴム状の弾性材料により形成されるとともに前記平面状配線体が挿通されるスリットを有するものであり、前記防水部材は、該防水部材の前記スリットに前記平面状配線体が挿通されていない状態で、前記スリットの幅が前記平面状配線体の幅より狭く形成されているとともに前記スリットの高さが前記平面状配線体の厚さより高くなるように形成されており、前記スリットの幅を前記平面状配線体の幅以上にした状態で前記スリットに前記平面状配線体を挿通し、しかる後に前記防水部材を前記ハウジングに収容して前記防水部材を前記平面状配線体の外周に密着させることを特徴とする。
【0011】
請求項5の発明は、請求項4の発明において、前記平面状配線体の先端部にはあらかじめ面取り加工が施されていることを特徴とする。
【0012】
請求項6の発明は、請求項4の発明において、前記スリットの幅を前記平面状配線体の幅以上にした状態で前記スリットに前記平面状配線体を挿通させる際に、前記防水部材内の雰囲気を加圧して前記スリットの幅を前記平面状配線体の幅以上に拡張することを特徴とする。
【0013】
請求項7の発明は、請求項6の発明において、前記防水部材内の雰囲気を加圧して前記スリットの幅を前記平面状配線体の幅以上に拡張する際に、前記スリットの高さ方向への拡張を抑制する部材を前記防水部材の外部に取り付けることを特徴とする。
【0014】
すなわち、本発明の平面状配線体の防水構造は、上記構成を備えたことにより、平面状配線体に防水部材を簡単に取り付けることが可能で、かつ防水性能が十分な防水構造となる。
【0015】
また、本発明の平面状配線体の防水構造の形成方法により、平面状配線体に防水性能が十分な防水構造を簡単に施すことができる。
【0016】
【発明の実施の形態】
本発明の実施形態を、図面を用いて説明する。
【0017】
図1は、本発明の実施形態である平面状配線体の防水構造の基本的一例を概略的に示す側断面図である。図1において、1は平面状配線体、2は平面状配線体1の外周に設けられた防水部材、3は防水部材2の外周に設けられたハウジングであり、防水部材2はハウジング3の内部空間4に収容されている。防水部材2は、ゴム状の弾性材料、例えば天然ゴム材料、合成ゴム材料(シリコンゴム等)、エラストマー等で形成されている。また、防水部材2には、平面状配線体1を挿通させるためのスリット5が形成されており、スリット5の前後端には平面状配線体1を挿通させる際の作業性を向上させるための面取り部2aが設けられている。
【0018】
図2は、平面状配線体に防水部材を取り付ける工程を説明するための図であって、(イ)は防水部材の正面図、(ロ)は平面状配線体の正面図、(ハ)は平面状配線体に防水部材が取り付けられた状態を示す正面図、(ニ)は平面状配線体に防水部材が取り付けられた状態を示す断面図である。図2において、6は平面状配線体1とスリット5との間の隙間である。
【0019】
なお、図2(ハ)(ニ)において、防水部材2のスリット5に平面状配線体1が挿通された状態における隙間6は、その存在を許容することを示しているものであって、隙間6が存在する必要がないことはいうまでもない。防水部材2のスリット5に平面状配線体1を挿通させる作業を容易に行うことができる観点からは隙間6が若干存在していることが望ましい。
【0020】
また、図2において、防水部材2のスリット5に平面状配線体1が挿通されていない状態で、スリット5の幅Wは平面状配線体1の幅Wより狭く、かつスリット5の高さtは平面状配線体1の厚さtより高くなっている。そして、スリット5に平面状配線体1が挿通されることにより、防水部材2は図面の左右方向に伸び、防水部材2の高さは、平面状配線体1が挿通される前の高さHから、平面状配線体1が挿通された後の高さHに変化する(H>H)。
【0021】
図3は、平面状配線体が挿通された防水部材をハウジングに収容する工程を説明するための図であって、(イ)は平面状配線体が挿通された防水部材の正面図、(ロ)はハウジングの正面図、(ハ)は防水部材がハウジングに収容された状態を示す正面図である。
【0022】
図3(イ)は、前述の図2(ハ)と同様の図であり、防水部材2のスリット5に平面状配線体1が挿通された状態における隙間6の存在が許容されるが、防水部材2がハウジング3に収容された状態では、図3(ハ)に示されるように、防水部材2が平面状配線体1の外周に密着し、隙間6は存在しなくなる。このことにより、平面状配線体1の防水性能が満足される。
【0023】
ここで、平面状配線体1の防水性能が満足されるためには、ハウジング3の内部空間4の高さHは、スリット5に平面状配線体1が挿通された状態の防水部材2の高さHより低く、かつハウジング3の内部空間4の断面積Sが、スリット5に平面状配線体1が挿通された状態の防水部材2の断面積Sの80%以上100%未満である必要がある。これらの条件を満たさない場合は、図3(ハ)においても図3(イ)と同様に、平面状配線体1と防水部材2との間に隙間が形成され、平面状配線体1の防水性能が低下することとなる。
【0024】
また、防水部材2を形成するゴム状の弾性材料は、日本工業規格(JIS K6253)に記載されたデュロメータによる測定結果で硬度A30〜A50の範囲となるものが望ましい。
【0025】
以上、本発明の実施形態の一例を説明したが、これはあくまでも基本的なものであって、例えば防水部材2の形状については、若干の変更が可能である。その例を応用例として以下に説明する。
【0026】
図4は、本発明の実施形態に用いられる防水部材の応用例の一例を示す図であって、(イ)は側面図、(ロ)は正面図、(ハ)は側断面図である。
【0027】
図4において、防水部材2の本体部21の外表面21a(以下、本体部外表面21aとする)には、複数の外周面突起22が円周状に連続して配置されている。また、本体部21の内表面21b(以下、本体部内表面21bとする)には、複数の内周面突起23がスリット5を形成するように配置されている。それ以外の事項については、前述の図2の説明と同様であるため、説明を省略する。
【0028】
図5は、図4の防水部材に平面状配線体が挿通された状態を示す側断面図である。図5においても、図2(ハ)(ニ)および図3(イ)と同様、防水部材2のスリット5に平面状配線体1が挿通された状態における隙間6は、その存在を許容することを示しているものであって、隙間6が存在する必要がないことはいうまでもない。
【0029】
図6は、図5のように平面状配線体が挿通された防水部材をハウジングに収容した状態を示す側断面図である。前述のとおり、図5においては、防水部材2のスリット5に平面状配線体1が挿通された状態における隙間6の存在が許容されるが、図6に示されるように防水部材2がハウジング3に収容された状態では、図3(ハ)に示されたものと同様に、防水部材2が平面状配線体1の外周に密着し、隙間6は存在しなくなる。このことにより、平面状配線体1の防水性能が満足される。
【0030】
以上、本発明の平面状配線体の防水構造について説明したが、本発明の平面状配線体の防水構造については、好適な形成方法がある。以下、その実施形態について説明する。
【0031】
本発明の実施形態である平面状配線体の防水構造の形成方法は、具体的には図2または図4に例示されている防水部材を用いて、図1または図6に例示された平面状配線体の防水構造を形成する方法である。以下、図1ないし図6に示された符号を用いて説明する。
【0032】
ここで、本実施形態の特徴は、防水部材2を平面状配線体1に取り付ける工程にあって、防水部材2については、そのスリット5に平面状配線体1が挿通されていない状態で、スリット5の幅が平面状配線体1の幅より狭く形成されているとともにスリット5の高さが平面状配線体1の厚さより高くなるように形成されていることである。
【0033】
また、防水部材2を平面状配線体1に取り付けるに際し、防水部材2のスリット5の幅を平面状配線体1の幅以上にした状態でスリット5に平面状配線体1を挿通することも本実施形態の特徴となっている。
【0034】
そして、しかる後に防水部材2をハウジング3に収容して防水部材2を平面状配線体1の外周に密着させることにより、平面状配線体の防水構造を形成することができる。以下、本実施形態の具体例を挙げて説明する。
【0035】
図7は、本発明の実施形態である平面状配線体の防水構造の形成方法を実現するための防水部材取付装置の一例を概略的に示す説明図である。なお、図7において、図4に示された防水部材を用いて説明するが、防水部材の形状については図4に示されたものに限られず、適宜変更しても差し支えない。
【0036】
また、図8は、図7に例示された防水部材取付装置により平面状配線体に防水構造が形成される工程を概略的に説明する断面図であって、(イ)は初期状態、(ロ)は防水部材が平面状配線体に取り付けられる直前の状態、(ハ)は防水部材が加圧により膨張している状態、(ニ)は防水部材が平面状配線体に取り付けられた状態をそれぞれ示す。
【0037】
図7および図8において、7は防水部材2を平面状配線体1に取り付けるための防水部材取付装置であって、第1の箱状部71と第2の箱状部72とで構成される。そして、防水部材取付装置7の使用時には、第1の箱状部71と第2の箱状部72とは、防水部材2を介して連結される。
【0038】
第1の箱状部71には、平面状配線体1を導入する導入部73が設けられている。第1の箱状部71の内部には空間71aが設けられ、導入部73の内部には空間73aが設けられ、空間71aと空間73aとは連通されている。また、第1の箱状部71には空間71aに達する貫通孔74が設けられている。一方、第2の箱状部72の内部には空間72aが設けられている。
【0039】
また、第1の箱状部71と第2の箱状部72とが防水部材2を介して連結される際には、空間71a、空間72a、空間73aは連通されることとなり、貫通孔74から空気等の気体を空間71aへ送り込むことにより、空間71a、72a、73a内および防水部材2内が加圧されて防水部材2のスリット5が拡張され、平面状配線体1をスリット5内に容易に挿通させることが可能となる。
【0040】
なお、図7および図8において、導入部73の入口(以下「導入部入口」とする)75は、貫通孔74から供給された気体が導入部73内の空間73aから容易に抜けないような構造であること、例えば、導入部入口75を気密構造とすることなどが望ましい。
【0041】
上記のように、図7および図8に例示された防水部材取付装置7を用いた平面状配線体の防水構造の形成方法は、防水部材2のスリット5の幅を平面状配線体1の幅以上にした状態でスリット5に平面状配線体1を挿通させる際に、防水部材2内の雰囲気を加圧してスリット5の幅を平面状配線体1の幅以上に拡張するものである。以下、図7に例示された防水部材取付装置7を用いた平面状配線体の防水構造の形成方法のステップを、図8(イ)〜(ニ)を参照して説明する。
【0042】
ステップ1:図8(イ)に示されるように、第1の箱状部71と第2の箱状部72とを対向させ、第2の箱状部72に防水部材2を取り付ける。また、第1の箱状部71の導入部73に平面状配線体1を挿通させる。
【0043】
ステップ2:図8(ロ)に示されるように、第1の箱状部71と第2の箱状部72とを防水部材2を介して連結し、防水部材取付装置7を組み立てる。なお、このステップまでは、防水部材2のスリット5の幅は、平面状配線体1の幅より狭くなっている。
【0044】
ステップ3:図8(ハ)に示されるように、貫通孔74から空気等の気体を空間71aへ送り込み、防水部材2内の雰囲気を加圧して防水部材2のスリット5の幅を平面状配線体1の幅以上に拡張させて、スリット5内に平面状配線体1を挿通させやすくする。
【0045】
ステップ4:図8(ニ)に示されるように、防水部材2のスリット5を拡張させた状態のままで平面状配線体1を挿通させる。
【0046】
ステップ5:空間71a、72a、73a内の圧力をほぼ大気圧に戻し、その後防水部材取付装置7を取り外す。
【0047】
このように、本実施形態においては、上記5つのステップにより、平面状配線体に防水性能が十分な防水構造を簡単に施すことができる。
【0048】
ここで、上記ステップ5において、防水部材取付装置7を取り外しやすくする観点から望ましい事項を挙げる。例えば、第1の箱状部71および導入部73については、それぞれ2つ以上に分割可能として平面状配線体1を挟み込むような構造とすることが望ましく、第2の箱状部72については、空間72a内の圧力をほぼ大気圧に戻すための貫通孔等(図示せず)を設けておくことが望ましい。
【0049】
また、図7および図8に例示した防水部材取付装置7において、防水部材2内の雰囲気を加圧してスリット5の幅を平面状配線体1の幅以上に拡張する際に、スリット5の高さ方向への拡張を抑制する部材を防水部材2の外部に取り付けることが望ましい。以下に例を説明する。
【0050】
図9は、本発明の実施形態である平面状配線体の防水構造の形成方法を実現するための防水部材取付装置に、防水部材のスリットの高さ方向への拡張を抑制する部材を取り付けた例を概略的に示す説明図である。図9において、8は防水部材2のスリット5の高さ方向への拡張を抑制する部材(以下、「整形部材」とする)である。
【0051】
この整形部材8は、例えば防水部材2を挟んで上側の部材(以下、「上側部材」とする)8aと下側の部材(以下、「下側部材」とする)8bにより構成され、図8に例示した防水部材取付装置7においては、第2の箱状部72に設置され、上述のステップ3の開始前までに、上側部材8aは防水部材2の上側に、下側部材8bは防水部材2の下側にそれぞれ配置される。
【0052】
この整形部材8により、防水部材2内の雰囲気を加圧する際にスリット5の幅を平面状配線体1の幅以上に効率よく拡張することが可能となる。
【0053】
以上、防水部材2内の雰囲気を加圧してスリット5の幅を平面状配線体1の幅以上に拡張した後にスリット5に平面状配線体1を挿通する方法について説明したが、本発明の実施形態の平面状配線体の防水構造の形成方法は上述のものには限られない。以下に例を説明する。
【0054】
例えば、図9に示された整形部材8と類似する形状の部材を、防水部材2の外部に取り付けて防水部材2のスリット5の高さ方向に押圧することにより、防水部材2のスリット5の幅を拡張させて平面状配線体1の幅以上にした状態でスリット5に平面状配線体1を挿通することも可能である。
【0055】
また、本実施形態の平面状配線体の防水構造の形成方法を実現するために、防水部材2の構造を最適化すること、平面状配線体1の先端部の構造を最適化することなども効果的である。以下に例を説明する。
【0056】
図10は、本発明の実施形態である平面状配線体の防水構造の形成方法に適した防水部材の一例を示す断面図であって、(イ)は初期状態、(ロ)は平面状配線体が挿通される直前の状態、(ハ)は平面状配線体が挿通された状態をそれぞれ示す。
【0057】
図10に例示された防水部材2において、内周面突起23は、実質的に防水部材2のスリット5の高さのみを規定するように形成されている。このように内周面突起23を形成することで、スリット5に平面状配線体1を挿通する際に内周面突起23の一部に必要以上の応力がかかることを防止することができる。
【0058】
図11は、本発明の実施形態である平面状配線体の防水構造の形成方法に適した平面状配線体の先端部の形状の一例を示す斜視図である。図11において、平面状配線体1の先端部には面取り部11が形成されている。このように、あらかじめ先端部が加工された平面状配線体1を用いることで、防水部材2のスリット5に平面状配線体1を挿通する際に内周面突起23の一部に必要以上の応力がかかることを防止することができる。
【0059】
なお、図11に示される面取り部11を有する平面状配線体1を用いる場合、防水部材2のスリット5の幅と平面状配線体1の幅との関係は、防水部材2のスリット5に平面状配線体1が挿通されていない状態で、スリット5の幅が平面状配線体1のうち面取り部11が形成されていない部分の幅より狭ければよく、防水部材2のスリット5に平面状配線体1を挿通する際には、スリット5の幅が平面状配線体の面取り部11が形成された箇所の幅以上であればよい。よって、面取り部11の形状によっては、スリット5の幅を拡張させることなくスリット5に平面状配線体1を挿通させることもできる。
【0060】
このように、本発明は、上述のような実施形態をとりうるが、これらはあくまでも一例であって、本発明の実施形態は、特許請求の範囲に記載された事項の範囲内で種々の変更を許容することが可能であり、上述の事項に限定されることがないことはいうまでもない。
【0061】
【発明の効果】
以上のとおり、本発明によれば、平面状配線体の外周に防水部材が取り付けられるとともに該防水部材がハウジングに収容されてなる平面状配線体の防水構造において、前記防水部材はゴム状の弾性材料により形成されるとともに前記平面状配線体が挿通されるスリットを有し、前記防水部材は、該防水部材の前記スリットに前記平面状配線体が挿通されていない状態で、前記スリットの幅が前記平面状配線体の幅より狭く形成されているとともに前記スリットの高さが前記平面状配線体の厚さより高くなるように形成されており、前記防水部材が前記ハウジングに収容された状態で、前記防水部材が前記平面状配線体の外周に密着しているため、平面状配線体に防水部材を簡単に取り付けることが可能で、かつ防水性能が十分な防水構造となる。
【0062】
また、本発明において、前記ハウジングの内部空間の高さは、前記スリットに前記平面状配線体が挿通された状態の前記防水部材の高さより低く、かつ前記ハウジングの内部空間の断面積は、前記スリットに前記平面状配線体が挿通された状態の前記防水部材の断面積の80%以上100%未満である場合には、防水性能がさらに向上した防水構造となる。
【0063】
また、本発明の平面状配線体の防水構造の形成方法は、防水部材のスリットに平面状配線体が挿通されていない状態で、スリットの幅が平面状配線体の幅より狭く形成されているとともにスリットの高さが平面状配線体の厚さより高くなるように形成され、また、防水部材2を平面状配線体1に取り付けるに際し、防水部材2のスリット5の幅を平面状配線体1の幅以上にした状態でスリット5に平面状配線体1を挿通するため、平面状配線体に防水性能が十分な防水構造を簡単に施すことができる。
【図面の簡単な説明】
【図1】本発明の実施形態である平面状配線体の防水構造の基本的一例を概略的に示す側断面図である。
【図2】平面状配線体に防水部材を取り付ける工程を説明するための図であって、(イ)は防水部材の正面図、(ロ)は平面状配線体の正面図、(ハ)は平面状配線体に防水部材が取り付けられた状態を示す正面図、(ニ)は平面状配線体に防水部材が取り付けられた状態を示す断面図である。
【図3】平面状配線体が挿通された防水部材をハウジングに収容する工程を説明するための図であって、(イ)は平面状配線体が挿通された防水部材の正面図、(ロ)はハウジングの正面図、(ハ)は防水部材がハウジングに収容された状態を示す正面図である。
【図4】本発明の実施形態に用いられる防水部材の応用例の一例を示す図であって、(イ)は側面図、(ロ)は正面図、(ハ)は側断面図である。
【図5】図4の防水部材に平面状配線体が挿通された状態を示す側断面図である。
【図6】図5のように平面状配線体が挿通された防水部材をハウジングに収容した状態を示す側断面図である。
【図7】本発明の実施形態である平面状配線体の防水構造の形成方法を実現するための防水部材取付装置の一例を概略的に示す説明図である。
【図8】図7に例示された防水部材取付装置により平面状配線体に防水構造が形成される工程を概略的に説明する断面図であって、(イ)は初期状態、(ロ)は防水部材が平面状配線体に取り付けられる直前の状態、(ハ)は防水部材が加圧により膨張している状態、(ニ)は防水部材が平面状配線体に取り付けられた状態をそれぞれ示す。
【図9】本発明の実施形態である平面状配線体の防水構造の形成方法を実現するための防水部材取付装置に、防水部材のスリットの高さ方向への拡張を抑制する部材を取り付けた例を概略的に示す説明図である。
【図10】本発明の実施形態である平面状配線体の防水構造の形成方法に適した防水部材の一例を示す断面図であって、(イ)は初期状態、(ロ)は平面状配線体が挿通される直前の状態、(ハ)は平面状配線体が挿通された状態をそれぞれ示す。
【図11】本発明の実施形態である平面状配線体の防水構造の形成方法に適した平面状配線体の先端部の形状の一例を示す斜視図である。
【符号の説明】
1 平面状配線体
2 防水部材
2a 面取り部
3 ハウジング
4 内部空間
5 スリット
6 隙間
7 防水部材取付装置
8 整形部材
8a 上側部材
8b 下側部材
11 面取り部
21 本体部
21a 本体部外表面
21b 本体部内表面
22 外周面突起
23 内周面突起
71 第1の箱状部
72 第2の箱状部
73 導入部
74 貫通孔
75 導入部入口
71a、72a、73a 空間
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a waterproof structure applied to a connection portion of a planar wiring body or the like.
[0002]
[Prior art]
2. Description of the Related Art When a wiring body is connected to another wiring body, it is widely practiced to attach a waterproof member to the wiring body to have a waterproof structure in order to prevent moisture from entering a connection portion. In the past, round electric wires were generally used as wiring bodies. Recently, however, flat wiring bodies such as flat cables and circuit boards have been increasingly used, and these flat wiring bodies have been used. As for, a waterproof structure for waterproofing the connection portion and the like has been studied.
[0003]
For example, for a waterproof connector used for a flat cable, it is known to provide a seal member so as to cover an outer periphery near a terminal portion of the flat cable (see Patent Document 1). It is also known to provide a sealing member made up of a plurality of elastic blocks at a terminal portion of a flat cable constituting a waterproof connector (see Patent Document 2).
[0004]
[Patent Document 1] JP-A-6-203910 (page 2, column 2, line 25 to page 3, column 4, line 27; see FIGS. 1 to 4)
[Patent Document 2] Japanese Patent Application Laid-Open No. H11-16628 (page 3, column 3, line 15 to page 7, column 12, line 48; see FIGS. 1 to 16)
[0005]
[Problems to be solved by the invention]
By the way, in the waterproof connector described in Patent Literature 1, a pressing member for compressing the seal member is required, and there is a problem that a waterproof structure and an assembling process are complicated. Further, the waterproof connector described in Patent Document 2 simplifies the assembling process to the last, and does not specifically mention further enhancing the waterproofness.
[0006]
Therefore, an object of the present invention is to provide a waterproof structure for a planar wiring body having a simple structure for enhancing waterproofness and an easy assembling process, and a method for forming the same.
[0007]
[Means for Solving the Problems]
According to a first aspect of the present invention, in the waterproof structure of a flat wiring body in which a waterproof member is attached to an outer periphery of the flat wiring body and the waterproof member is housed in a housing, the waterproof member is formed of a rubber-like elastic material. The waterproof member has a slit through which the flat wiring body is inserted, and the width of the slit is the same as that of the flat wiring body when the flat wiring body is not inserted through the slit of the waterproof member. The waterproof member is formed so as to be narrower than the width of the wiring body and the height of the slit is higher than the thickness of the planar wiring body, and the waterproof member is housed in the housing. Are in close contact with the outer periphery of the planar wiring body.
[0008]
According to a second aspect of the present invention, in the first aspect, the slit is formed by a plurality of ridges protruding from an inner surface of the waterproof member.
[0009]
According to a third aspect of the present invention, in the first aspect of the present invention, the height of the internal space of the housing is lower than the height of the waterproof member in a state where the planar wiring body is inserted into the slit, and A cross-sectional area of the internal space is 80% or more and less than 100% of a cross-sectional area of the waterproof member in a state where the planar wiring body is inserted into the slit.
[0010]
According to a fourth aspect of the present invention, in the method for forming a waterproof structure of a flat wiring body in which a waterproof member is attached to an outer periphery of the flat wiring body and the waterproof member is housed in a housing, the waterproof member is formed of a rubber-like elastic material. The waterproof member has a slit through which the planar wiring body is not inserted into the slit of the waterproof member. The slit is formed to be narrower than the width of the planar wiring body, and the height of the slit is formed to be higher than the thickness of the planar wiring body, and the width of the slit is set to be equal to or larger than the width of the planar wiring body. In this state, the flat wiring body is inserted into the slit, and thereafter, the waterproof member is housed in the housing so that the waterproof member is brought into close contact with the outer periphery of the flat wiring body. And butterflies.
[0011]
A fifth aspect of the present invention is characterized in that, in the fourth aspect of the present invention, a chamfering process is applied to a front end portion of the planar wiring body in advance.
[0012]
According to a sixth aspect of the present invention, in the fourth aspect, when the flat wiring body is inserted through the slit in a state where the width of the slit is equal to or larger than the width of the flat wiring body, The width of the slit is expanded to be equal to or greater than the width of the planar wiring body by pressurizing the atmosphere.
[0013]
According to a seventh aspect of the present invention, in the invention of the sixth aspect, when the width of the slit is expanded to be equal to or larger than the width of the planar wiring body by pressurizing the atmosphere in the waterproof member, the height of the slit is increased. A member for suppressing the expansion of the waterproof member is attached to the outside of the waterproof member.
[0014]
That is, the waterproof structure of the planar wiring body of the present invention has the above-described configuration, so that the waterproof member can be easily attached to the planar wiring body, and the waterproof structure has a sufficient waterproof performance.
[0015]
Further, according to the method for forming a waterproof structure of a planar wiring body of the present invention, a waterproof structure having sufficient waterproof performance can be easily applied to the planar wiring body.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings.
[0017]
FIG. 1 is a side sectional view schematically showing a basic example of a waterproof structure for a planar wiring body according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a planar wiring body, 2 denotes a waterproof member provided on the outer periphery of the planar wiring body 1, 3 denotes a housing provided on the outer periphery of the waterproof member 2, and the waterproof member 2 is provided inside the housing 3. It is housed in the space 4. The waterproof member 2 is formed of a rubber-like elastic material, for example, a natural rubber material, a synthetic rubber material (eg, silicone rubber), an elastomer, or the like. Further, the waterproof member 2 is formed with a slit 5 through which the planar wiring body 1 is inserted. The front and rear ends of the slit 5 are provided to improve workability when the planar wiring body 1 is inserted. A chamfer 2a is provided.
[0018]
2A and 2B are diagrams for explaining a process of attaching a waterproof member to a planar wiring body, wherein FIG. 2A is a front view of the waterproof member, FIG. 2B is a front view of the planar wiring body, and FIG. FIG. 3D is a front view illustrating a state where a waterproof member is attached to the planar wiring body, and FIG. 4D is a cross-sectional view illustrating a state where the waterproof member is attached to the planar wiring body. In FIG. 2, reference numeral 6 denotes a gap between the planar wiring body 1 and the slit 5.
[0019]
2 (c) and 2 (d), the gap 6 in the state where the planar wiring body 1 is inserted through the slit 5 of the waterproof member 2 indicates that the gap 6 is allowed to exist. It goes without saying that 6 need not be present. From the viewpoint that the work of inserting the planar wiring body 1 into the slit 5 of the waterproof member 2 can be easily performed, it is desirable that the gap 6 slightly exists.
[0020]
Further, in FIG. 2, in a state in which the planar wiring member 1 to the slit 5 of the waterproof member 2 is not inserted, the width W 1 of the slit 5 is narrower than the width W 2 of the planar wiring member 1, and the slits 5 high is t 1 is higher than the thickness t 2 of the planar wiring member 1. When the flat wiring body 1 is inserted through the slit 5, the waterproof member 2 extends in the left-right direction in the drawing, and the height of the waterproof member 2 is the height H before the flat wiring body 1 is inserted. 1, changes in the height H 2 of after the planar wiring member 1 is inserted (H 1> H 2).
[0021]
3A and 3B are diagrams for explaining a process of housing a waterproof member into which a flat wiring body has been inserted into a housing. FIG. 3A is a front view of the waterproof member through which a flat wiring body has been inserted. () Is a front view of the housing, and (C) is a front view showing a state in which the waterproof member is housed in the housing.
[0022]
FIG. 3A is a view similar to FIG. 2C described above, and the existence of the gap 6 in a state where the planar wiring body 1 is inserted into the slit 5 of the waterproof member 2 is allowed. In a state where the member 2 is accommodated in the housing 3, as shown in FIG. 3 (c), the waterproof member 2 comes into close contact with the outer periphery of the planar wiring body 1, and the gap 6 does not exist. Thus, the waterproof performance of the planar wiring body 1 is satisfied.
[0023]
Here, in order to satisfy the waterproof performance of the planar wiring body 1, the height H 3 of the internal space 4 of the housing 3 is determined by the height of the waterproof member 2 in a state where the planar wiring body 1 is inserted through the slit 5. The cross-sectional area S 2 of the internal space 4 of the housing 3 is lower than the height H 2 , and is 80% or more and less than 100% of the cross-sectional area S 1 of the waterproof member 2 in a state where the planar wiring body 1 is inserted into the slit 5. Need to be When these conditions are not satisfied, a gap is formed between the planar wiring body 1 and the waterproof member 2 in FIG. 3C as in FIG. Performance will be degraded.
[0024]
The rubber-like elastic material forming the waterproof member 2 preferably has a hardness in the range of A30 to A50 as measured by a durometer described in Japanese Industrial Standards (JIS K6253).
[0025]
As described above, an example of the embodiment of the present invention has been described. However, this is merely a basic one. For example, the shape of the waterproof member 2 can be slightly changed. The example will be described below as an application example.
[0026]
FIGS. 4A and 4B are views showing an example of an application example of the waterproof member used in the embodiment of the present invention, wherein FIG. 4A is a side view, FIG. 4B is a front view, and FIG.
[0027]
In FIG. 4, a plurality of outer peripheral surface projections 22 are circumferentially arranged on an outer surface 21 a of the main body 21 of the waterproof member 2 (hereinafter, referred to as a main body outer surface 21 a). A plurality of inner peripheral surface protrusions 23 are arranged on the inner surface 21 b of the main body 21 (hereinafter, referred to as the main body inner surface 21 b) so as to form the slit 5. Other items are the same as those described with reference to FIG.
[0028]
FIG. 5 is a side sectional view showing a state in which the planar wiring body is inserted through the waterproof member of FIG. In FIG. 5, as in FIGS. 2 (c), (d) and FIG. 3 (a), the gap 6 in the state where the planar wiring body 1 is inserted into the slit 5 of the waterproof member 2 is allowed to exist. It is needless to say that the gap 6 does not need to exist.
[0029]
FIG. 6 is a side sectional view showing a state in which the waterproof member into which the planar wiring body is inserted as shown in FIG. 5 is housed in the housing. As described above, in FIG. 5, the existence of the gap 6 in a state where the planar wiring body 1 is inserted through the slit 5 of the waterproof member 2 is allowed, but as shown in FIG. 3C, the waterproof member 2 is in close contact with the outer periphery of the planar wiring body 1 as in the case shown in FIG. Thus, the waterproof performance of the planar wiring body 1 is satisfied.
[0030]
As described above, the waterproof structure of the planar wiring body of the present invention has been described. However, there is a suitable forming method for the waterproof structure of the planar wiring body of the present invention. Hereinafter, the embodiment will be described.
[0031]
The method for forming the waterproof structure of the planar wiring body according to the embodiment of the present invention specifically uses the planar member illustrated in FIG. 1 or FIG. 6 using the waterproof member illustrated in FIG. 2 or FIG. This is a method for forming a waterproof structure of the wiring body. Hereinafter, description will be made using the reference numerals shown in FIGS.
[0032]
Here, the feature of the present embodiment is in the step of attaching the waterproof member 2 to the planar wiring body 1, and the waterproof member 2 is slit when the planar wiring body 1 is not inserted through the slit 5. 5 is formed to be narrower than the width of the planar wiring body 1 and the height of the slit 5 is formed to be higher than the thickness of the planar wiring body 1.
[0033]
Further, when attaching the waterproof member 2 to the planar wiring body 1, the flat wiring body 1 may be inserted through the slit 5 with the width of the slit 5 of the waterproof member 2 being equal to or greater than the width of the planar wiring body 1. This is a feature of the embodiment.
[0034]
After that, the waterproof member 2 is housed in the housing 3 and the waterproof member 2 is brought into close contact with the outer periphery of the planar wiring body 1, whereby a waterproof structure of the planar wiring body can be formed. Hereinafter, a specific example of the present embodiment will be described.
[0035]
FIG. 7 is an explanatory view schematically showing an example of a waterproof member attaching device for realizing the method for forming a waterproof structure of a planar wiring body according to the embodiment of the present invention. In FIG. 7, the description will be made using the waterproof member shown in FIG. 4, but the shape of the waterproof member is not limited to that shown in FIG. 4, and may be changed as appropriate.
[0036]
FIG. 8 is a cross-sectional view schematically illustrating a step of forming a waterproof structure on a planar wiring body by the waterproof member attaching device illustrated in FIG. 7, wherein FIG. ) Shows a state immediately before the waterproof member is attached to the planar wiring body, (c) shows a state where the waterproof member is expanded by pressure, and (d) shows a state where the waterproof member is attached to the planar wiring body. Show.
[0037]
7 and 8, reference numeral 7 denotes a waterproof member attaching device for attaching the waterproof member 2 to the planar wiring body 1 and includes a first box-shaped portion 71 and a second box-shaped portion 72. . When the waterproof member mounting device 7 is used, the first box-shaped portion 71 and the second box-shaped portion 72 are connected via the waterproof member 2.
[0038]
The first box-shaped portion 71 is provided with an introduction portion 73 for introducing the planar wiring body 1. A space 71a is provided inside the first box-shaped portion 71, a space 73a is provided inside the introduction portion 73, and the space 71a and the space 73a communicate with each other. Further, the first box-shaped portion 71 is provided with a through hole 74 reaching the space 71a. On the other hand, a space 72a is provided inside the second box-shaped portion 72.
[0039]
When the first box-shaped portion 71 and the second box-shaped portion 72 are connected via the waterproof member 2, the space 71a, the space 72a, and the space 73a communicate with each other, and the through-hole 74 is provided. When the gas such as air is sent into the space 71a from the outside, the spaces 71a, 72a, 73a and the inside of the waterproof member 2 are pressurized, and the slit 5 of the waterproof member 2 is expanded. It can be easily inserted.
[0040]
In FIGS. 7 and 8, an inlet 75 of the introduction portion 73 (hereinafter, referred to as an “introduction portion entrance”) is provided so that gas supplied from the through hole 74 does not easily escape from the space 73 a in the introduction portion 73. It is desirable to have a structure, for example, to make the introduction part entrance 75 an airtight structure.
[0041]
As described above, in the method of forming the waterproof structure of the planar wiring body using the waterproof member mounting device 7 illustrated in FIGS. 7 and 8, the width of the slit 5 of the waterproof member 2 is changed to the width of the planar wiring body 1. When the planar wiring body 1 is inserted into the slit 5 in the above state, the atmosphere in the waterproof member 2 is pressurized to expand the width of the slit 5 to be equal to or greater than the width of the planar wiring body 1. Hereinafter, steps of a method of forming a waterproof structure of a planar wiring body using the waterproof member attaching device 7 illustrated in FIG. 7 will be described with reference to FIGS.
[0042]
Step 1: As shown in FIG. 8A, the first box-shaped portion 71 and the second box-shaped portion 72 are opposed to each other, and the waterproof member 2 is attached to the second box-shaped portion 72. Further, the planar wiring body 1 is inserted through the introduction portion 73 of the first box-shaped portion 71.
[0043]
Step 2: As shown in FIG. 8B, the first box-shaped portion 71 and the second box-shaped portion 72 are connected via the waterproof member 2, and the waterproof member attaching device 7 is assembled. Until this step, the width of the slit 5 of the waterproof member 2 is smaller than the width of the planar wiring body 1.
[0044]
Step 3: As shown in FIG. 8C, a gas such as air is sent into the space 71a from the through hole 74, and the atmosphere in the waterproof member 2 is pressurized to change the width of the slit 5 of the waterproof member 2 to a planar wiring. The flat wiring body 1 can be easily inserted into the slit 5 by extending the width of the flat wiring body 1 beyond the width of the body 1.
[0045]
Step 4: As shown in FIG. 8D, the planar wiring body 1 is inserted with the slit 5 of the waterproof member 2 expanded.
[0046]
Step 5: The pressure in the spaces 71a, 72a, 73a is returned to substantially the atmospheric pressure, and then the waterproof member attaching device 7 is removed.
[0047]
As described above, in the present embodiment, a waterproof structure having sufficient waterproof performance can be easily applied to the planar wiring body by the above five steps.
[0048]
Here, in Step 5 described above, desirable items from the viewpoint of making the waterproof member attaching device 7 easy to remove are described. For example, it is desirable that the first box-shaped portion 71 and the introduction portion 73 be configured to be able to be divided into two or more so as to sandwich the planar wiring body 1. It is desirable to provide a through-hole or the like (not shown) for returning the pressure in the space 72a to substantially the atmospheric pressure.
[0049]
In the waterproof member mounting device 7 illustrated in FIGS. 7 and 8, when the width of the slit 5 is expanded to be equal to or more than the width of the planar wiring body 1 by pressurizing the atmosphere in the waterproof member 2, the height of the slit 5 is increased. It is desirable to attach a member that suppresses expansion in the vertical direction to the outside of the waterproof member 2. An example will be described below.
[0050]
FIG. 9 shows a waterproof member mounting device for realizing a method for forming a waterproof structure of a planar wiring body according to an embodiment of the present invention, in which a member for suppressing expansion of a slit of a waterproof member in a height direction is mounted. It is explanatory drawing which shows an example schematically. In FIG. 9, reference numeral 8 denotes a member (hereinafter, referred to as a "shaping member") that suppresses expansion of the slit 5 of the waterproof member 2 in the height direction.
[0051]
The shaping member 8 is composed of, for example, an upper member (hereinafter, referred to as an “upper member”) 8a and a lower member (hereinafter, referred to as a “lower member”) 8b with the waterproof member 2 interposed therebetween. In the waterproof member mounting device 7 illustrated in FIG. 2, the upper member 8a is installed on the upper side of the waterproof member 2 and the lower member 8b is installed on the waterproof member 2 respectively.
[0052]
The shaping member 8 allows the width of the slit 5 to be efficiently expanded to be equal to or larger than the width of the planar wiring body 1 when the atmosphere in the waterproof member 2 is pressurized.
[0053]
As described above, the method of inserting the planar wiring body 1 into the slit 5 after expanding the width of the slit 5 to be equal to or more than the width of the planar wiring body 1 by pressurizing the atmosphere in the waterproof member 2 has been described. The method for forming the waterproof structure of the planar wiring body according to the embodiment is not limited to the above-described method. An example will be described below.
[0054]
For example, by attaching a member having a shape similar to the shaping member 8 shown in FIG. 9 to the outside of the waterproof member 2 and pressing the member in the height direction of the slit 5 of the waterproof member 2, It is also possible to insert the flat wiring body 1 into the slit 5 in a state where the width is increased to be equal to or larger than the width of the flat wiring body 1.
[0055]
In addition, in order to realize the method for forming a waterproof structure of a planar wiring body according to the present embodiment, it is also possible to optimize the structure of the waterproof member 2 and optimize the structure of the distal end of the planar wiring body 1. It is effective. An example will be described below.
[0056]
FIG. 10 is a cross-sectional view showing an example of a waterproof member suitable for the method for forming a waterproof structure of a planar wiring body according to an embodiment of the present invention, wherein (a) is an initial state, and (b) is a planar wiring. (C) shows a state immediately before the body is inserted, and (c) shows a state in which the planar wiring body is inserted.
[0057]
In the waterproof member 2 illustrated in FIG. 10, the inner peripheral surface protrusion 23 is formed so as to substantially define only the height of the slit 5 of the waterproof member 2. By forming the inner peripheral surface protrusions 23 in this manner, it is possible to prevent a part of the inner peripheral surface protrusions 23 from being subjected to an unnecessary stress when the planar wiring body 1 is inserted into the slit 5.
[0058]
FIG. 11 is a perspective view showing an example of the shape of the distal end portion of the flat wiring body suitable for the method for forming the waterproof structure of the flat wiring body according to the embodiment of the present invention. In FIG. 11, a chamfer 11 is formed at the tip of the planar wiring body 1. As described above, by using the planar wiring body 1 whose front end is processed in advance, when the planar wiring body 1 is inserted into the slit 5 of the waterproof member 2, a part of the inner peripheral surface projection 23 is more than necessary. It is possible to prevent stress from being applied.
[0059]
In the case where the flat wiring body 1 having the chamfered portion 11 shown in FIG. 11 is used, the relationship between the width of the slit 5 of the waterproof member 2 and the width of the flat wiring body 1 It is sufficient that the width of the slit 5 is smaller than the width of the portion where the chamfered portion 11 is not formed in the planar wiring body 1 in a state where the wiring body 1 is not inserted. When the wiring body 1 is inserted, the width of the slit 5 only needs to be equal to or greater than the width of the portion where the chamfered portion 11 of the planar wiring body is formed. Therefore, depending on the shape of the chamfered portion 11, the flat wiring body 1 can be inserted through the slit 5 without expanding the width of the slit 5.
[0060]
As described above, the present invention can take the above-described embodiments. However, these are merely examples, and the embodiments of the present invention may be variously modified within the scope of the matters described in the claims. Can be allowed, and it is needless to say that the present invention is not limited to the above.
[0061]
【The invention's effect】
As described above, according to the present invention, in the waterproof structure of a flat wiring body in which a waterproof member is attached to the outer periphery of the flat wiring body and the waterproof member is housed in the housing, the waterproof member is made of rubber-like elastic material. The waterproof member has a slit formed of a material and through which the planar wiring body is inserted, and the width of the slit is reduced in a state where the planar wiring body is not inserted into the slit of the waterproof member. The flat wiring body is formed to be narrower than the width and the height of the slit is formed to be higher than the thickness of the flat wiring body, and the waterproof member is housed in the housing, Since the waterproof member is in close contact with the outer periphery of the planar wiring body, the waterproof member can be easily attached to the planar wiring body, and the waterproof structure has a sufficient waterproof performance. That.
[0062]
In the present invention, the height of the internal space of the housing is lower than the height of the waterproof member in a state where the planar wiring body is inserted into the slit, and the cross-sectional area of the internal space of the housing is When the cross-sectional area of the waterproof member in a state where the planar wiring body is inserted through the slit is 80% or more and less than 100%, the waterproof structure is further improved in waterproof performance.
[0063]
In the method for forming a waterproof structure of a planar wiring body according to the present invention, the width of the slit is formed to be smaller than the width of the planar wiring body in a state where the planar wiring body is not inserted into the slit of the waterproof member. In addition, the height of the slit is formed to be higher than the thickness of the planar wiring body, and when attaching the waterproof member 2 to the planar wiring body 1, the width of the slit 5 of the waterproof member 2 is changed to the width of the planar wiring body 1. Since the flat wiring body 1 is inserted through the slit 5 in a state where the width is equal to or more than the width, a waterproof structure with sufficient waterproof performance can be easily applied to the flat wiring body.
[Brief description of the drawings]
FIG. 1 is a side sectional view schematically showing a basic example of a waterproof structure of a planar wiring body according to an embodiment of the present invention.
FIGS. 2A and 2B are views for explaining a process of attaching a waterproof member to the planar wiring body, wherein FIG. 2A is a front view of the waterproof member, FIG. 2B is a front view of the planar wiring body, and FIG. FIG. 3D is a front view illustrating a state where a waterproof member is attached to the planar wiring body, and FIG. 4D is a cross-sectional view illustrating a state where the waterproof member is attached to the planar wiring body.
FIGS. 3A and 3B are views for explaining a process of housing a waterproof member into which a planar wiring body is inserted in a housing, wherein FIG. 3A is a front view of the waterproof member through which the planar wiring body is inserted; () Is a front view of the housing, and (C) is a front view showing a state in which the waterproof member is housed in the housing.
FIG. 4 is a view showing an example of an application example of the waterproof member used in the embodiment of the present invention, wherein (A) is a side view, (B) is a front view, and (C) is a side sectional view.
FIG. 5 is a side sectional view showing a state where a planar wiring body is inserted into the waterproof member of FIG. 4;
FIG. 6 is a side sectional view showing a state in which the waterproof member into which the planar wiring body is inserted as shown in FIG. 5 is accommodated in a housing.
FIG. 7 is an explanatory view schematically showing an example of a waterproof member mounting device for realizing the method for forming a waterproof structure of a planar wiring body according to an embodiment of the present invention.
8A and 8B are cross-sectional views schematically illustrating a process of forming a waterproof structure on a planar wiring body by the waterproof member attaching device illustrated in FIG. 7, wherein FIG. 8A is an initial state, and FIG. A state immediately before the waterproof member is attached to the planar wiring body, (C) shows a state where the waterproof member is expanded by pressurization, and (D) shows a state where the waterproof member is attached to the planar wiring body.
FIG. 9 shows a waterproof member mounting device for realizing a method for forming a waterproof structure of a planar wiring body according to an embodiment of the present invention, in which a member for suppressing expansion of a slit of a waterproof member in a height direction is mounted. It is explanatory drawing which shows an example schematically.
FIGS. 10A and 10B are cross-sectional views illustrating an example of a waterproof member suitable for the method for forming a waterproof structure of a planar wiring body according to an embodiment of the present invention, wherein FIG. (C) shows a state immediately before the body is inserted, and (c) shows a state in which the planar wiring body is inserted.
FIG. 11 is a perspective view showing an example of a shape of a front end portion of a flat wiring body suitable for a method for forming a waterproof structure of a flat wiring body according to an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Planar wiring body 2 Waterproof member 2a Chamfer part 3 Housing 4 Internal space 5 Slit 6 Gap 7 Waterproof member mounting device 8 Shaping member 8a Upper member 8b Lower member 11 Chamfer 21 Main part 21a Main part outer surface 21b Main part inner surface 22 Outer peripheral surface protrusion 23 Inner peripheral surface protrusion 71 First box-shaped portion 72 Second box-shaped portion 73 Introducing portion 74 Through hole 75 Introducing portion entrances 71a, 72a, 73a Space

Claims (7)

平面状配線体の外周に防水部材が取り付けられるとともに該防水部材がハウジングに収容されてなる平面状配線体の防水構造において、
前記防水部材はゴム状の弾性材料により形成されるとともに前記平面状配線体が挿通されるスリットを有し、
前記防水部材は、該防水部材の前記スリットに前記平面状配線体が挿通されていない状態で、前記スリットの幅が前記平面状配線体の幅より狭く形成されているとともに前記スリットの高さが前記平面状配線体の厚さより高くなるように形成されており、
前記防水部材が前記ハウジングに収容された状態で、前記防水部材が前記平面状配線体の外周に密着していることを特徴とする平面状配線体の防水構造。
In a waterproof structure of a flat wiring body, a waterproof member is attached to the outer periphery of the flat wiring body and the waterproof member is housed in a housing.
The waterproof member has a slit formed by a rubber-like elastic material and through which the planar wiring body is inserted,
The waterproof member is formed such that the width of the slit is smaller than the width of the planar wiring body in a state where the planar wiring body is not inserted into the slit of the waterproof member, and the height of the slit is It is formed to be higher than the thickness of the planar wiring body,
The waterproof structure for a planar wiring body, wherein the waterproof member is in close contact with the outer periphery of the planar wiring body in a state where the waterproof member is housed in the housing.
前記スリットは、前記防水部材の内表面から突設した複数の突条により形成されていることを特徴とする、請求項1記載の平面状配線体の防水構造。The waterproof structure for a planar wiring body according to claim 1, wherein the slit is formed by a plurality of protrusions protruding from an inner surface of the waterproof member. 前記ハウジングの内部空間の高さは、前記スリットに前記平面状配線体が挿通された状態の前記防水部材の高さより低く、かつ前記ハウジングの内部空間の断面積は、前記スリットに前記平面状配線体が挿通された状態の前記防水部材の断面積の80%以上100%未満であることを特徴とする、請求項1または請求項2記載の平面状配線体の防水構造。The height of the internal space of the housing is lower than the height of the waterproof member in a state where the planar wiring body is inserted into the slit, and the cross-sectional area of the internal space of the housing is such that the planar wiring is formed in the slit. The waterproof structure for a planar wiring body according to claim 1 or 2, wherein the cross-sectional area of the waterproof member in a state where the body is inserted is 80% or more and less than 100%. 平面状配線体の外周に防水部材を取り付けて該防水部材をハウジングに収容する平面状配線体の防水構造の形成方法において、
前記防水部材はゴム状の弾性材料により形成されるとともに前記平面状配線体が挿通されるスリットを有するものであり、
前記防水部材は、該防水部材の前記スリットに前記平面状配線体が挿通されていない状態で、前記スリットの幅が前記平面状配線体の幅より狭く形成されているとともに前記スリットの高さが前記平面状配線体の厚さより高くなるように形成されており、
前記スリットの幅を前記平面状配線体の幅以上にした状態で前記スリットに前記平面状配線体を挿通し、しかる後に前記防水部材を前記ハウジングに収容して前記防水部材を前記平面状配線体の外周に密着させることを特徴とする平面状配線体の防水構造の形成方法。
In a method for forming a waterproof structure of a flat wiring body in which a waterproof member is attached to an outer periphery of the flat wiring body and the waterproof member is housed in a housing,
The waterproofing member is formed of a rubber-like elastic material and has a slit through which the planar wiring body is inserted,
The waterproof member is formed such that the width of the slit is smaller than the width of the planar wiring body in a state where the planar wiring body is not inserted into the slit of the waterproof member, and the height of the slit is It is formed to be higher than the thickness of the planar wiring body,
The flat wiring body is inserted through the slit in a state where the width of the slit is equal to or larger than the width of the flat wiring body. Thereafter, the waterproof member is housed in the housing and the waterproof member is connected to the flat wiring body. A method for forming a waterproof structure for a planar wiring body, comprising:
前記平面状配線体の先端部にはあらかじめ面取り加工が施されていることを特徴とする、請求項4記載の平面状配線体の防水構造の形成方法。The method for forming a waterproof structure for a planar wiring body according to claim 4, wherein a chamfering process is performed on a front end of the planar wiring body in advance. 前記スリットの幅を前記平面状配線体の幅以上にした状態で前記スリットに前記平面状配線体を挿通させる際に、前記防水部材内の雰囲気を加圧して前記スリットの幅を前記平面状配線体の幅以上に拡張することを特徴とする、請求項4記載の平面状配線体の防水構造の形成方法。When the flat wiring body is inserted into the slit with the width of the slit being equal to or larger than the width of the flat wiring body, the atmosphere in the waterproof member is pressurized to reduce the width of the slit to the flat wiring body. 5. The method for forming a waterproof structure for a planar wiring body according to claim 4, wherein the expansion is performed to a width equal to or greater than the width of the body. 前記防水部材内の雰囲気を加圧して前記スリットの幅を前記平面状配線体の幅以上に拡張する際に、前記スリットの高さ方向への拡張を抑制する部材を前記防水部材の外部に取り付けることを特徴とする、請求項6記載の平面状配線体の防水構造の形成方法。When the atmosphere in the waterproof member is pressurized and the width of the slit is expanded to be equal to or greater than the width of the planar wiring body, a member that suppresses the expansion of the slit in the height direction is attached to the outside of the waterproof member. 7. The method for forming a waterproof structure for a planar wiring body according to claim 6, wherein:
JP2003147972A 2003-01-17 2003-05-26 Waterproof structure of planar wiring body and method for forming the same Expired - Fee Related JP3960948B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101430419B1 (en) * 2013-07-05 2014-08-14 (주)우주일렉트로닉스 Waterproof connector for ffc
JP2016046157A (en) * 2014-08-25 2016-04-04 イリソ電子工業株式会社 Waterproof connector
CN106439240A (en) * 2016-12-16 2017-02-22 中国工程物理研究院总体工程研究所 Flat cable penetration sealing device with high sealing property in dynamic environment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101430419B1 (en) * 2013-07-05 2014-08-14 (주)우주일렉트로닉스 Waterproof connector for ffc
JP2016046157A (en) * 2014-08-25 2016-04-04 イリソ電子工業株式会社 Waterproof connector
CN106439240A (en) * 2016-12-16 2017-02-22 中国工程物理研究院总体工程研究所 Flat cable penetration sealing device with high sealing property in dynamic environment

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