JP2004237404A - Cutting die and cutting die manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting die easily inserting a blade, having a strong blade retention performance and providing the blade with high vertical precision to a base plate and to provide a manufacturing method for the cutting die. <P>SOLUTION: This cutting die is provided with a press-cutting blade for pushingly cutting a sheet material and the base plate formed with an insertion groove for retaining the press-cutting blade. The base plate is a stuck base plate formed by sticking a plurality of sub-base plates formed with the insertion grooves together into a prescribed stuck thickness. The manufacturing method for the cutting die is provided with and insertion groove forming process of forming the insertion groove such that the insertion grooves in the stuck faces of the plurality of sub-base plates having the prescribed thickness by sticking are agreed with one another; a sub-base plate sticking process of providing the base plate wherein the the plurality of sub-base plates formed with the insertion grooves are stuck together into the prescribed thickness with the insertion grooves agreed with one another; and a press-cutting blade insertion process of inserting the press-cutting blade for pushingly cutting the sheet material into the insertion groove and allowing the base plate to retain the press-cutting blade. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention belongs to the technical field of a die for punching a sheet-like article into a predetermined shape in a platen punching machine, a pressing machine, and the like, and a die manufacturing method.
[0002]
[Prior art]
In the manufacturing process of a paper container, which is a packaging container made of paper, after printing the picture of the paper container on a large-sized base paper (carton) with multiple impositions, it is cut into a blank shape as one of the processes of processing into individual paper containers. , Ie, a platen punching step.
In the industry, the term "punching" has been traditionally used, rather than "cutting" or "push-off". The term "punching" has a strong meaning of "cutting through" from the front surface to the back surface, but in the platen punching step, a large-sized printed material that is cut out (cut) is obtained. Blanks are individually separated from this large format print and then processed into paper containers.
[0003]
In the platen punching step, for example, a platen punching machine as shown in FIG. 16 is used. As shown in FIG. 16, a die is attached to an upper surface plate fixed to a frame of a platen punching machine, and a face plate is attached to a lower surface plate. The lower platen moves up and down in synchronism with the supply of a large-size print by combining a rotation mechanism and a link mechanism. That is, the platen punching machine has a die and a face plate opposed to each other, and supplies a large-sized printed material between them, and a press cutting blade provided in the die by the vertical movement of a lower platen (instead of a general “cutting blade” here). The “pressing blade” is pressed against the face plate to press and cut a large-size printed matter (see FIG. 17).
[0004]
In the platen punching step, not only the above-mentioned cut is made, but also other processing is performed at the same time. For example, a process of forming perforations, a process of forming a fold in a portion to be folded when three-dimensionally processing a paper container, a zipper process of opening a predetermined portion when taking out the contents of the paper container, and the like are simultaneously performed. For this purpose, a sewing machine blade, a ruled blade, and a zipper blade are used in addition to the press cutting blade. Here, a press cutting blade will be mainly described as a representative of a plurality of types of blades. The description can be similarly applied to other types of blades.
[0005]
These blades generally have the same thickness and are gripped by insertion grooves in the substrate, like the push-off blades. In addition, these blades have appropriate heights so that when the substrate is inserted and pressed against the face plate, all appropriate processing is performed on the large-sized printed matter.
In addition, for example, a concave portion for forming a fold is provided at the position of the face plate facing the ruled blade (see FIG. 17).
[0006]
In this punching die, steel, resin, plywood, a composite plate in which plywood is sandwiched by steel, etc. are used as a substrate for gripping a blade such as a pressing blade, but from the viewpoint of cost and ease of production. Generally, plywood is often used. For the production of a blanking die, it is necessary to form an insertion groove for holding the blade in this plywood. The insertion groove is required to be easily insertable, to have a strong gripping force of the blade, and to have high vertical accuracy with respect to the substrate. In addition, when the number of times of punching is large, the sharpness of the blade becomes poor, or the blade is broken, the blade is replaced. Even in that case, similar characteristics are required for the insertion groove. In order for the replacement blade to obtain the same characteristics as the new blade, the insertion groove is appropriate so that irreversible characteristic changes (deformation, etc.) do not occur due to excessive force acting at the time of insertion of the new blade. It is necessary to be something.
[0007]
[Problems to be solved by the invention]
Processing means for forming the insertion groove include a saw (thread saw), a laser cutting device, a luter, and the like.
The processing cross section of the groove by the saw is generally straight as shown in FIG. By processing the groove width in the processed cross section narrower than the blade thickness, the number of contact points supporting the blade can be increased, and the gripping force for gripping the blade can be increased. However, there is a problem that machining accuracy is poor in the groove machining using a saw. For example, as shown in FIG. 13B, the groove may be oblique in the processed cross section. The blade to be inserted follows the processing cross section of the groove, so that the blade is tilted, which adversely affects punching accuracy and durability of the blade.
[0008]
As shown in FIG. 14A, the processing cross section of the groove by the laser cutting device generally has a shape called a drum shape in which the upper and lower portions are narrow and the middle is expanded. This shape is obtained by condensing the laser beam with a lens and setting the focal point at an appropriate position above the material to be cut. By processing the groove width of the upper and lower narrow portions in the processed cross section to be smaller than the thickness of the blade, the gripping force for supporting the blade at two points and gripping the blade can be increased. However, it is only in an ideal case that a shape having a predetermined groove width in an upper and lower narrow portion as shown in FIG. Due to variations such as a change in the distance between the laser focal point and the surface of the plywood due to warping or undulation of the plywood itself, the processed cross section may deviate from its ideal drum shape.
[0009]
Further, in order to process the drum into an ideal drum shape, it is necessary to control the scanning speed and output of the laser to a high degree. In particular, at the time of laser scanning acceleration / deceleration at the end of the groove or at the R portion (curved portion), control becomes impossible and the shape is disturbed. Further, the groove width on the laser beam irradiation side in the processed cross section can be controlled by the focal position of the laser beam, but the groove width on the opposite side cannot be controlled due to a difference in the material of the plywood or a local change in physical properties. Therefore, as shown in FIG. 14B, the upper and lower narrow portions do not have a predetermined groove width, and the gripping force of the contact portion supporting the blade may be insufficient or may not be gripped.
[0010]
In the process of forming a groove by rotating an end mill at high speed by a router, as shown in FIG. 15, the processed cross section of the groove has a tapered shape. This is because, as a shape for imparting strength to the end mill, the side of the handle added to the luter in the end mill is thicker and the tip side is thinner. Since the processed cross section of the groove is tapered in this manner, the contact point supporting the blade is limited to a narrow portion of the groove in the processed cross section of the groove. May not be done. For this reason, it adversely affects the punching accuracy and the durability of the blade.
[0011]
Apart from the problems in the respective processing methods described above, there is a case where the back side of the blade used for the punching is tapered (see FIG. 12). Normally, the blade is inserted into the groove from the back side, but the taper processing of this blade facilitates the insertion. Further, the blade can have cushioning properties. Due to this taper processing, the width of the blade is narrower than the groove width of the portion where the blade is gripped, and the gripping force of the blade may be insufficient or the blade may not be gripped. The gripping state of the blade tends to be unstable, for example, the blade is tilted.
[0012]
Patent Literature 1 describes that a straight section and a tapered section are provided in a processing cross section of a blade and a groove to facilitate insertion of the blade and increase gripping force. In addition, it is described that a laser is used as a groove processing method, but there is no specific description. It is considered that it is difficult to laser-process one base material to make the processed cross section of the groove into the above-described shape. Further, it is considered more difficult to make the tapered shape of the blade coincide with the tapered shape of the groove.
[0013]
[Patent Document 1]
JP-A-5-212699
[0014]
The present invention has been made in order to solve such a problem, and an object of the present invention is to make it difficult for the adverse effect of the machining error of the insertion groove to be manifested and to make the blade irrespective of whether it is a new blade or a replacement blade. An object of the present invention is to provide a die-cutting method and a die-cutting manufacturing method that can be easily inserted, have a strong gripping force of the blade, and have high vertical precision of the blade with respect to the substrate.
[0015]
[Means for Solving the Problems]
The above object is achieved by the present invention described below. That is,
The die according to claim 1 of the present invention is a die having a pressing blade for pressing and cutting a sheet-like article, and a substrate having an insertion groove for gripping the pressing blade, wherein the substrate is A plurality of sub-substrates having the insertion grooves formed therein are laminated to have a predetermined thickness.
[0016]
According to the present invention, a laminated substrate having a predetermined thickness is used by laminating a plurality of sub-substrates having insertion grooves. In other words, it is possible to secure a plurality of gripping positions of the press cutting blade, and to eliminate the adverse effect due to the defect in the shape of the processing cross section of the insertion groove. Further, the probability of occurrence of a processing error in the insertion groove at the same location on three or more sub-substrates is low, and the adverse effect is less likely to appear. In addition, the durability of the insertion groove against removal of the blade increases. Therefore, the adverse effect of the machining error of the insertion groove is less likely to appear, regardless of whether the blade is a new blade or a replacement blade, the blade is easily inserted, the gripping force of the blade is strong, and the vertical accuracy of the blade with respect to the substrate is high. Die cutting is provided.
[0017]
According to a second aspect of the present invention, in the above-described first aspect, the insertion groove in each of the sub-substrates has a different groove width depending on a bonding layer in the bonding substrate. It is. ADVANTAGE OF THE INVENTION According to this invention, a cutting blade is grasped with high precision and high intensity | strength in the sub-substrate layer with a narrow groove | channel width, and it becomes easy to insert the cutting blade in the sub-substrate layer with a wide groove | channel width. Design with this configuration is easy, and the reproducibility of characteristics is good.
Therefore, it is easy to insert and insert the blade, the gripping force of the blade is strong, and the die with high vertical precision of the blade with respect to the substrate can be easily designed and manufactured.
[0018]
According to a third aspect of the present invention, in the third aspect, a sub-substrate having a narrow groove width is applied to at least the uppermost layer and the lowermost layer.
According to the present invention, the vertical accuracy of the blade with respect to the substrate is the best.
[0019]
According to a fourth aspect of the present invention, in the die according to any one of the first to third aspects, the insertion groove formed in the sub-substrate has a direction in which the pressing blade is inserted, that is, the thickness of the sub-substrate. The groove width is different in the direction. ADVANTAGE OF THE INVENTION According to this invention, a cutting blade is grasped with high precision and high intensity | strength in the narrow part in the processing cross section of a groove width, and it becomes easy to insert the cutting blade in the wide part in the processing cross section of a groove width. In this configuration, a single insertion groove processing method can be applied to all sub-substrates. Therefore, a cutting die that is easy to insert, has a strong gripping force of the blade, and has high vertical accuracy of the blade with respect to the substrate is manufactured by applying a single insertion groove processing method.
[0020]
A die according to a fifth aspect of the present invention is the die according to the fourth aspect, wherein the surface having the smaller groove width is an outer surface of the substrate. According to the present invention, the vertical accuracy of the blade with respect to the substrate is the best.
[0021]
The method of manufacturing a blank according to claim 6 of the present invention is a method for forming an insertion groove in which a plurality of sub-substrates having a predetermined thickness by bonding are formed such that the insertion grooves coincide with each other on the bonding surface. A step of laminating a plurality of sub-substrates having the insertion grooves so that the insertion grooves coincide with each other and obtaining a substrate as a laminated substrate having a predetermined thickness; and And a pressing blade insertion step of inserting a pressing blade for pressing and cutting the sheet-like article into the groove and causing the substrate to grip the pressing blade.
[0022]
ADVANTAGE OF THE INVENTION According to this invention, the die which uses the bonding board | substrate which laminated | attached several sheets of the sub board | substrate in which the insertion groove was formed to predetermined thickness is manufactured. That is, it is possible to secure a plurality of gripping positions of the press cutting blade in the removal of the die, and the adverse effect due to the defect of the shape of the processing cross section of the insertion groove is eliminated. Therefore, there is provided a die-cut manufacturing method in which the blade can be easily inserted, the gripping force of the blade is strong, and the vertical accuracy of the blade with respect to the substrate is high.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described. In general, a die is formed of a pressing blade for pressing and cutting a sheet-like article, and a substrate having an insertion groove for holding the pressing blade. As shown in FIG. 1, the conventional die-cut substrate has a single substrate material with an insertion groove formed therein. On the other hand, as shown in FIG. 2 to FIG. 5, the substrate in the mold release of the present invention is obtained by laminating a plurality of sub-substrates in which insertion grooves are formed in a plurality of substrate materials.
[0024]
Regardless of the configuration, the standard thickness of the substrate is 18 mm. When applying the cutting die to a general platen punching machine, the standard of the height from the platen of the platen punching machine (see FIG. 16) to the tip of the blade edge is 23.6 mm (the height of the press cutting blade; Matches the type height). The thickness of the substrate of 18 mm is a standard thickness such that the cutting edge protrudes moderately (5.6 mm) from the substrate (see FIG. 12).
[0025]
The substrate illustrated in FIG. 2 is a diagram illustrating an example of a substrate in which two sub-substrates having different thicknesses are bonded. As shown in FIG. 2, one sub-substrate has a thickness of 6 mm and the other sub-substrate has a thickness of 12 mm. Then, the thickness of the two bonded substrates is 18 mm.
[0026]
The substrate shown in FIG. 3 is a diagram showing an example of a substrate in which three sub substrates having the same thickness are bonded. As shown in FIG. 3, all the sub-substrates have the same thickness of 6 mm, and the thickness of the three bonded substrates is 18 mm.
[0027]
The substrate shown in FIG. 4 is a diagram illustrating an example of a substrate in which three sub-substrates having different thicknesses are bonded. As shown in FIG. 4, this is a substrate in which a sub-substrate having a thickness of 3 mm, a sub-substrate having a thickness of 6 mm, and a sub-substrate having a thickness of 9 mm are bonded one by one. The thickness of this substrate is 18 mm.
[0028]
The substrate shown in FIG. 5 is a diagram illustrating an example of a substrate in which four sub-substrates having the same thickness are bonded. As shown in FIG. 5, all the sub-substrates have the same thickness of 4.5 mm, and the thickness of the four bonded substrates is 18 mm.
[0029]
As described above, the substrate in the die release of the present invention is obtained by laminating a plurality of sub-substrates having insertion grooves formed in a plurality of substrate materials, and the number of the sub-substrates and the thickness of each sub-substrate. There are no particular restrictions. However, the overall thickness of the substrate obtained by laminating the sub-substrates is set to a predetermined thickness.
[0030]
Further, as a material of such a substrate, steel, resin, plywood, a composite plate in which plywood is sandwiched between steels, and the like can be used. Plywood among them is a material more suitable for cost and ease of production.
[0031]
Next, a shape of a groove to be formed in the substrate in a processed cross section will be described with reference to FIGS.
The substrate shown in FIG. 6 includes a first sub-substrate 61 and a second sub-substrate 62 having two sub-substrates having substantially equal thicknesses. The two sub-substrates have the same drum-shaped shape in the processed cross section of the groove, and are all manufactured by the same processing method.
The shape of the drum coincides with the processed cross section of the groove formed in the processing of forming the groove by the laser cutting device. That is, the drum-shaped shape can be obtained by processing with the laser cutting device.
[0032]
The substrate shown in FIG. 7 is composed of two sub-substrates having a substantially uniform thickness, a first sub-substrate 71 and a second sub-substrate 72. Of the two sub-substrates, the first-layer sub-substrate 71 has a drum-shaped cross section for processing the groove, indicating that the groove is formed by a laser cutting machine. The second-layer sub-substrate 72 has a tapered shape that is wide at the top and narrow at the bottom. In other words, the second-layer sub-substrate 72 coincides with the processed cross section of the groove formed in the processing of forming the groove by rotating the end mill at high speed by the luter. That is, this tapered shape can be obtained by processing with a router.
[0033]
The substrate shown in FIG. 8 is composed of three sub-substrates having a substantially uniform thickness, that is, a first sub-substrate 81, a second sub-substrate 82, and a third sub-substrate 83. The three sub-substrates have the same tapered shape in the processing cross section of the groove, and are all manufactured by the same processing method. This tapered shape coincides with the processing cross section of the groove formed in the processing of forming the groove by rotating the end mill at a high speed by the luter. That is, this tapered shape can be obtained by processing with a router.
[0034]
In the substrate shown in FIG. 8, the surface of the first layer sub-substrate 81 and the third layer sub-substrate 83 with the narrower groove width in the processed cross section (tapered shape) of the groove is defined as the outer surface of the substrate. With this configuration, the push cutting blade is gripped at the two most distant positions close to the outer surface of the substrate, so that the vertical accuracy of the push cutting blade to the substrate is the best. In the example shown in FIG. 8, the surface of the tapered shape of the central second-layer sub-substrate 82 with the smaller groove width is the lower surface of the second-layer sub-substrate 82, but is the upper surface. You may do so.
[0035]
The substrate shown in FIG. 9 includes three first sub-substrates 91, a second sub-substrate 92, and a third sub-substrate 93 having substantially the same thickness. Of the three sub-substrates, the first-layer sub-substrate 91 and the third-layer sub-substrate 93 are tapered in the processing cross-section of the groove, and are formed by rotating the end mill at high speed with a router. Is shown. The second layer sub-substrate 92 has a shape called a drum shape in which the top and bottom are narrow and the middle is bulged. That is, the second layer sub-substrate 92 is a groove formed by the laser cutting device.
[0036]
As shown in FIG. 9, the second layer sub-substrate 92 has a narrow groove width near both sides thereof. That is, the second-layer sub-board 92 can hold the pressing blade at two locations. In the substrate shown in FIG. 8, one sub-sub-substrate is gripped at one location and a total of three locations are gripped. On the other hand, in the substrate shown in FIG. 9, the sub-substrate of the upper and lower layers is gripped at one place each, and the sub-substrate of the center layer is made at two places, for a total of four places. In the substrate shown in FIG. 9, similarly to the substrate shown in FIG. 8, the surface with the smaller groove width in the processed cross section (tapered shape) of the groove of the one-layer sub-substrate 91 and the third-layer sub-substrate 93 is set to And the surface.
[0037]
The substrate illustrated in FIG. 10 includes three sub-substrates having different thicknesses, that is, a first sub-substrate 101, a second sub-substrate 102, and a third sub-substrate 103. The first layer sub-substrate 101 is the thinnest sub-substrate, and the processing cross section of the groove is linear. In other words, it indicates that the groove is formed by a saw. The second-layer sub-substrate 102 is the thickest sub-substrate, and has a shape called a drum shape in which the processed cross section of the groove is narrow vertically and the middle is expanded. That is, it indicates that the groove is formed by the laser cutting device. Also, the third layer sub-substrate 103 has a similar tapered cross section of the groove. In other words, it indicates that the groove is formed by rotating the end mill at high speed by a luter. As described above, the substrate shown in FIG. 10 is a substrate obtained by bonding three sub-substrates having grooves formed by three different processing methods.
[0038]
The processing cross section of the groove of the first layer sub-substrate 101 has a substantially constant groove width in a linear shape, and the groove width is the groove width in the processing cross section of the groove of the second layer sub-substrate 102 and the third layer sub-substrate 103. Is almost the same as the groove width of the narrowest part. That is, a sub-substrate with a narrow groove width is applied to the first-layer sub-substrate 101 as the uppermost layer. Further, the surface with the smaller groove width in the processed cross section (tapered shape) of the groove of the third layer sub-substrate 103 which is the lowermost layer is defined as the outer surface of the substrate.
[0039]
The groove width as an average value can be defined not only in a linear shape but also in various shapes as in the processed cross section of the groove of the first layer sub-substrate 101 shown in FIG. In FIG. 8, three sub-substrates having the same processing cross-sectional shape of the groove are used, and not only the shape but also the average groove width is the same. On the other hand, in FIG. 10, three sub-substrates having different processing cross-sectional shapes of the grooves are used. Generally, not only the shapes but also the average width of the grooves are different unless they are aligned. Although described above as an example also in FIGS. 8 to 10 described above, such shapes and groove widths can be intentionally changed in each sub-substrate to improve the die-cutting characteristics.
[0040]
For example, the groove width of the insertion groove in each of the sub-substrates is made different depending on the layer to be bonded on the substrate. At this time, in the sub-substrate layer having a narrow groove width, the pressing blade can be gripped with high accuracy and high strength. Further, it is possible to easily insert the pressing blade in the sub-substrate layer having a large groove width. Such a configuration facilitates design and improves reproducibility of characteristics. In such a configuration, if a sub-substrate having a narrow groove width is applied to at least the uppermost layer and the lowermost layer, the vertical accuracy of the blade with respect to the substrate can be optimized.
[0041]
Further, for example, the groove width is made different in a direction in which the pressing blade is inserted in the insertion groove formed in the sub-substrate, that is, in a thickness direction of the sub-substrate. This has the same meaning as changing the shape of the processed cross section of the groove. At this time, the pressing blade can be gripped with high precision and high strength in a narrow portion in the processing cross section of the groove width. Further, it is possible to easily insert the press cutting blade in a wide portion in the processing cross section of the groove width. In such a configuration, a single insertion groove processing method, such as using a router, can be applied to all the sub-boards. When the surface having the narrower groove width is set as the outer surface of the substrate, the vertical accuracy of the blade with respect to the substrate can be optimized.
[0042]
In some cases, a blade such as a push-cutting blade used for blanking is tapered on the back side (see FIG. 12). In order to make such blades easy to insert and to hold firmly, it is extremely effective to intentionally change the shape and groove width of the groove in each sub-substrate and to improve the die-cutting characteristics. FIG. 11 shows an example of a processed cross-sectional shape of a groove in a die for gripping a blade having a tapered back side.
[0043]
The substrate shown in FIG. 11 is composed of three sub-substrates having a substantially uniform thickness: a first sub-substrate 111, a second sub-substrate 112, and a third sub-substrate 113. All three sub-substrates have a tapered shape that matches the processing cross section of the groove formed in the processing of forming the groove by rotating the end mill at a high speed with a router. However, the groove width of the narrow portion of the tapered shape on the first layer sub-substrate 111 is 0.7 mm, whereas the groove width of the narrow portion of the tapered shape on the third layer sub-substrate 113 is 0.5 mm.
[0044]
FIG. 12 shows a state in which the blade having a tapered back side is inserted into the insertion groove of the substrate shown in FIG. As shown in FIG. 12, the blade can be strongly gripped at three places.
The groove width can be made different by using end mills having different diameters for grooving or by using a portion of one end mill that is close to the tip and distant from each other for grooving.
[0045]
Hereinabove, the die removal according to the present invention has been described. As is clear from the above description of the method of processing the insertion groove and the layer structure of the punching die, the punching manufacturing method of the present invention will now be summarized and described.
The production of the punching die includes an insertion groove forming process, a sub-substrate bonding process, and a pressing blade insertion process.
First, in the process of forming the insertion groove, the insertion groove is formed so that the insertion grooves coincide with each other on three or more sub-substrates having a predetermined thickness by bonding. In forming the insertion groove, a processing device such as a saw, a laser cutting device, and a luter described above is used.
[0046]
It is required for each mold to have a desired groove pattern when viewed from the surface of the mold. In order to process a required groove pattern, for example, an XY moving mechanism is used. The XY moving mechanism can move the XY table in a pattern controlled by a program. A processing device such as a saw, a laser cutting device, and a luter is fixed to the frame of the XY moving mechanism above the XY table. Further, the sub-substrate is placed and fixed on the XY table. By moving the XY table in a predetermined pattern and performing groove processing, insertion grooves having a desired pattern can be formed on the sub-substrate. Naturally, this pattern is a pattern in which the insertion grooves match on the bonding surface of the sub-substrate.
[0047]
Next, in the sub-substrate laminating process, a substrate as a laminated substrate is obtained in which three or more sub-substrates having the insertion grooves are laminated to have a predetermined thickness so that the insertion grooves match.
For this bonding, an appropriate method is applied depending on the material of the sub-substrate. When the sub-substrate is a plywood made of wood, for example, the bonding is performed using an emulsion-based synthetic adhesive so as not to block the insertion groove.
[0048]
Next, in the process of inserting the cutting blade, a cutting blade for cutting the sheet-like article is inserted into the insertion groove, and the substrate is gripped by the substrate. The push-cutting blade is a typical example of a blade. In this case, a push-cutting blade, a sewing machine blade, a ruled blade, a zipper blade, and the like are inserted into a predetermined insertion groove and gripped.
[0049]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the removal die which concerns on Claim 1 of this invention, the bad influence of the processing error of an insertion groove does not appear easily, it is easy to insert regardless of whether it is a new blade or a replacement blade, and the grip force of a blade And a die having high vertical accuracy of the blade with respect to the substrate.
According to the second aspect of the present invention, it is possible to easily design and manufacture a die that can be easily inserted, has a strong gripping force of the blade, and has a high vertical accuracy of the blade with respect to the substrate.
According to the third aspect of the present invention, the vertical accuracy of the blade with respect to the substrate is the best.
According to the punching die according to the fourth aspect of the present invention, the punching die can be easily inserted, the gripping force of the blade is strong, and the vertical accuracy of the blade with respect to the substrate is high by applying a single insertion groove processing method. Is done.
According to the punching die of the fifth aspect of the present invention, the vertical accuracy of the blade with respect to the substrate is the best.
Further, according to the die making method of the sixth aspect of the present invention, there is provided a die making method in which the blade is easily inserted, the gripping force of the blade is strong, and the vertical precision of the blade with respect to the substrate is high.
[Brief description of the drawings]
FIG. 1 is a diagram showing a substrate in a conventional die for forming an insertion groove in one substrate material.
FIG. 2 is a diagram illustrating an example of a substrate in which two sub-substrates having different thicknesses are bonded to each other.
FIG. 3 is a diagram showing a substrate in a die-cutting type according to the present invention in which three sub-substrates having the same thickness are stuck together.
FIG. 4 is a view showing a substrate in a die-cutting type according to the present invention in which three sub-substrates having different thicknesses are bonded together.
FIG. 5 is a diagram showing a substrate in a die-cutting type according to the present invention in which four sub-substrates having the same thickness are stuck together.
FIG. 6 is a diagram illustrating an example (part 1) of a shape of a groove to be formed in a substrate in a processed cross section.
FIG. 7 is a diagram illustrating an example (part 2) of a shape of a groove formed in a substrate in a processed cross section.
FIG. 8 is a view showing an example (part 3) of a shape of a groove formed in a substrate in a processed cross section.
FIG. 9 is a diagram showing an example (part 4) of a shape of a groove formed in a substrate in a processed cross section.
FIG. 10 is a view showing an example (part 5) of a shape of a groove to be formed in a substrate in a processed cross section.
FIG. 11 is a diagram showing an example of the shape of a processed cross section of a groove in a die for gripping a blade having a tapered back side.
FIG. 12 is a view showing a state where a blade having a back side tapered is inserted into an insertion groove of the substrate shown in FIG. 11;
FIG. 13 is a diagram showing a processed cross section of a groove by a saw.
FIG. 14 is a diagram showing a processing cross section of a groove by a laser cutting device.
FIG. 15 is a diagram showing a processing cross section of a groove by a processing of forming a groove by rotating an end mill at a high speed by a luter.
FIG. 16 is a view showing the structure of a platen punching machine.
FIG. 17 is a diagram showing the relationship between the die and the face plate.
[Explanation of symbols]
61, 71, 81, 91, 101, 111 First-layer sub-substrate
62, 72, 82, 92, 102, 112 Second-layer sub-substrate
83, 93, 103, 113 Third-layer sub-substrate

Claims (6)

A press-cutting blade for press-cutting a sheet-like article, and a die having a substrate formed with an insertion groove for holding the press-cutting blade,
The die is characterized in that the substrate is a laminated substrate having a predetermined thickness by laminating a plurality of sub-substrates having the insertion grooves. 2. The die according to claim 1, wherein the insertion groove in each of the sub-substrates has a different groove width depending on a bonding layer on the bonding substrate. 3. The die according to claim 2, wherein a sub-substrate having a narrow groove width is applied to at least the uppermost layer and the lowermost layer. The die according to any one of claims 1 to 3, wherein the insertion groove formed in the sub-substrate has a different groove width in a direction in which the pressing blade is inserted, that is, in a thickness direction of the sub-substrate. Die removal. The die according to claim 4, wherein the surface having the smaller groove width is an outer surface of the substrate. An insertion groove forming step of forming an insertion groove such that the insertion grooves match on a bonding surface for a plurality of sub-substrates having a predetermined thickness by bonding,
A sub-substrate laminating step of obtaining the substrate as a laminated substrate having a predetermined thickness by laminating a plurality of sub-substrates having the insertion grooves so that the insertion grooves coincide with each other,
A die cutting manufacturing method, comprising: inserting a pressing blade for pressing and cutting a sheet-like article into the insertion groove; and inserting a pressing blade into the substrate to hold the pressing blade.

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