JP2004221138A5 - - Google Patents
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- Publication number
- JP2004221138A5 JP2004221138A5 JP2003003631A JP2003003631A JP2004221138A5 JP 2004221138 A5 JP2004221138 A5 JP 2004221138A5 JP 2003003631 A JP2003003631 A JP 2003003631A JP 2003003631 A JP2003003631 A JP 2003003631A JP 2004221138 A5 JP2004221138 A5 JP 2004221138A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003003631A JP2004221138A (en) | 2003-01-09 | 2003-01-09 | Method and apparatus for semiconductor thermal process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003003631A JP2004221138A (en) | 2003-01-09 | 2003-01-09 | Method and apparatus for semiconductor thermal process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004221138A JP2004221138A (en) | 2004-08-05 |
| JP2004221138A5 true JP2004221138A5 (en) | 2005-10-27 |
Family
ID=32894842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003003631A Pending JP2004221138A (en) | 2003-01-09 | 2003-01-09 | Method and apparatus for semiconductor thermal process |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004221138A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303152A (en) * | 2005-04-20 | 2006-11-02 | Fuji Electric Holdings Co Ltd | Apparatus and method for epitaxial deposition |
| JP5120585B2 (en) * | 2006-03-16 | 2013-01-16 | 株式会社Ｉｈｉ | Heat shield for substrate annealing equipment |
| JP5033020B2 (en) * | 2008-02-28 | 2012-09-26 | 三井造船株式会社 | Heat treatment method using induction heating and induction heating apparatus |
| JP5264220B2 (en) * | 2008-03-11 | 2013-08-14 | 三井造船株式会社 | Wafer heat treatment equipment |
| JP4668343B1 (en) * | 2009-09-30 | 2011-04-13 | 三井造船株式会社 | Semiconductor substrate heat treatment equipment |
| JP5647502B2 (en) * | 2010-02-23 | 2014-12-24 | 株式会社日立国際電気 | Heat treatment apparatus, semiconductor device manufacturing method, and substrate processing method. |
| JP5063755B2 (en) | 2010-08-09 | 2012-10-31 | 三井造船株式会社 | Induction heating apparatus and induction heating method |
| JP5127987B1 (en) * | 2012-02-16 | 2013-01-23 | 三井造船株式会社 | Induction heating device |
| KR20240001170A (en) * | 2021-04-26 | 2024-01-03 | 도쿄엘렉트론가부시키가이샤 | Lower electrode apparatus, substrate processing device, and substrate processing method |
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2003
- 2003-01-09 JP JP2003003631A patent/JP2004221138A/en active Pending