JP2004215335A - Smoothing capacitor disposing structure of inverter unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a smoothing capacitor disposing structure of an inverter unit which can secure a long lifetime without introducing a temperature rise even by using a small-sized electrolytic capacitor according to a small current ripple capacity while a vibration input at a vehicle carrying time is surely prevented from being dropped. <P>SOLUTION: The inverter unit I is disposed between the battery 17 of a DC power supply and a multiple shaft multilayer motor M driven by an AC current, and has first DC bus bars 72a, 72b and second DC bus bars 73a, 73b, an IPM 70, and the electrolytic capacitor 74 in an inverter upper case 30. The electrolytic capacitor 74 forms a capacitor inserting groove 35 having a shape similar to the side face of the capacitor and the bottom of the capacitor in the inverter upper case 30. The terminals 74a, 74b of the electrolytic capacitor 74 are disposed on upper surfaces and introduced into the capacitor inserting groove 35, and a capacitor cooling water passage 32 is formed along the side face shape of the capacitor on the outer periphery of the capacitor inserting groove 35. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention belongs to the technical field of a smoothing capacitor arrangement structure of an inverter device that is arranged between a battery as a DC power supply and a rotating electric machine driven by an AC current and performs mutual conversion between a DC current and an AC current.
[0002]
[Prior art]
2. Description of the Related Art A conventional inverter device includes only a plurality of large-capacity electrolytic capacitors as smoothing capacitors for smoothing voltage fluctuations of an input DC power supply (for example, see Patent Document 1).
[0003]
[Patent Document 1]
JP-A-2000-152662 (FIG. 2).
[0004]
[Problems to be solved by the invention]
However, in the conventional inverter device, since the voltage fluctuation of the input DC power supply is smoothed only by the electrolytic capacitor, if the switching of the power module becomes too high in frequency, the electrolytic capacitor becomes a mere resistance element. This makes it impossible to smooth the voltage of the input DC power supply.
[0005]
In other words, there is a problem that the upper limit frequency of the switching frequency band allowed in the power module is limited depending on the frequency characteristics of the electrolytic capacitor used.
[0006]
SUMMARY OF THE INVENTION The present invention has been made in view of the above problem, and it is possible to increase an upper limit frequency of a switching frequency band allowed in a power module and to stabilize an input DC power supply voltage even when the power module is in a high-speed switching state. An object of the present invention is to provide a smoothing capacitor arrangement structure of an inverter device which can be provided.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the smoothing capacitor arrangement structure of the present invention is arranged between a battery as a DC power supply and a rotating electric machine driven by an AC current, and includes a DC bus bar, a power module, and a voltage of an input DC power supply. A smoothing capacitor for smoothing the fluctuation, and an inverter device having in the case,
As the smoothing capacitor, a plurality of large-capacity electrolytic capacitors and a plurality of small-capacity film capacitors having excellent frequency characteristics were used in combination.
[0008]
【The invention's effect】
Therefore, in the smoothing capacitor arrangement structure of the inverter device of the present invention, since the electrolytic capacitor and the film capacitor are used in combination as the smoothing capacitor, the upper limit frequency of the switching frequency band allowed in the power module is increased, and the power module performs high-speed switching. Even in the state, the input DC power supply voltage can be stabilized.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments for realizing the inverter device of the present invention will be described based on examples shown in the drawings.
[0010]
(First embodiment)
[Hybrid system]
FIG. 1 is an overall view of a parallel-type hybrid system to which the inverter device of the first embodiment is applied. In FIG. 1, E denotes an engine, M denotes a multi-axis multilayer motor (rotary electric machine), and G denotes a Ravigneaux-type compound planet. A gear train, D is a drive output mechanism, and I is an inverter device.
[0011]
The engine E is a main power source of the hybrid drive unit. The engine output shaft 5 is connected to the second ring gear R2 of the Ravigneaux-type compound planetary gear train G via a flywheel damper 6 and a multi-plate clutch 7. Have been.
[0012]
The multi-shaft multi-layer motor M is a single motor in appearance, but is a sub power source having two motor generator functions. The multi-axis multi-layer motor M is disposed in a motor chamber defined by a motor cover 1 and a motor case 2 and is fixed to the motor case 2 and has a stator S as a fixed armature wound with a coil, and a stator S And an outer rotor OR having permanent magnets embedded therein and an inner rotor IR having permanent magnets embedded therein, and an outer rotor OR having permanent magnets embedded therein are arranged in three layers coaxially. The first motor hollow shaft 8, which is the output shaft from the inner rotor IR, is connected to the first sun gear S1 of the Ravigneaux type compound planetary gear train G, and the second motor shaft 9, which is the output shaft from the outer rotor OR, , Ravigneaux type compound planetary gear train G is connected to the second sun gear S2.
[0013]
In this multi-shaft multi-layer motor M, since one stator S drives two rotors IR, OR, torque interference must not occur between the respective rotors IR, OR. It is mathematically known that when the frequency of the voltage and the current are different, their inner product becomes zero and no electric power is generated. This is also true of the current and the magnetic flux. Therefore, by changing the number of permanent magnets of each rotor IR, OR, the torque between each rotor IR, OR can be designed to be non-interfering. Also, by making the coil current a composite current, each rotor IR, OR can be controlled independently. As described above, in the multi-axis multilayer motor M of the first embodiment, a six-phase alternating current using a composite current is used as the coil current, the stator S has 18 coils, and the outer rotor OR has 6 pole pairs of permanent magnets. And a configuration in which the inner rotor IR has a three-pole pair of permanent magnets.
[0014]
The Ravigneaux-type compound planetary gear train G is a planetary gear mechanism having a continuously variable transmission function of continuously changing the transmission ratio by controlling the rotation speed of a power source. The Ravigneaux-type compound planetary gear train G is disposed in a gear chamber defined by the gear housing 3 and the front cover 4 and supports a first pinion P1 and a second pinion P2 meshing with each other, and a common carrier C, and a first pinion. Five rotation elements of a first sun gear S1 meshing with P1, a second sun gear S2 meshing with the second pinion P2, a first ring gear R1 meshing with the first pinion P1, and a second ring gear R2 meshing with the second pinion P2 are used. It is configured to have. A multi-plate brake 10 is interposed between the first ring gear R1 and the gear housing 3. An output gear 11 is connected to the common carrier C.
[0015]
The drive output mechanism D is a mechanism from the output gear 11 connected to the common carrier C of the Ravigneaux-type compound planetary gear train G to drive wheels. The drive output mechanism D includes an output gear 11, a first counter gear 12, a second counter gear 13, a drive gear 14, a differential 15, and drive shafts 16L and 16R. . The output rotation and output torque from the output gear 11 pass through the first counter gear 12, the second counter gear 13, the drive gear 14, and the differential 15, and are transmitted from the drive shafts 16L, 16R to drive wheels (not shown). You.
[0016]
The inverter device I converts a direct current of the battery 17 into a six-phase alternating current by a composite current to drive two rotors of the multi-axis multilayer motor M, and generates electric power by rotating the multi-axis multilayer motor M rotor. A function of converting the six-phase alternating current into a direct current by the composite current and charging the battery 17, and a motor-generator function of using one of the two rotors of the multi-axis multilayer motor M as a motor and using the other rotor as a generator And a device having:
Here, “six-phase alternating current by composite current” means, as shown in FIG. 2, a current based on a frequency synchronized with the number of magnetic poles of the outer rotor OR (Current1) and a current based on a frequency synchronized with the number of magnetic poles of the inner rotor IR. (Current2) and the composite current, and the outer rotor OR shifts the phase by 120 degrees and the inner rotor IR shifts the phase by 60 degrees each in six phases (U phase, U 'phase, V phase, V phase). 'Phase, W phase, W' phase).
[0017]
The inverter device I generates a PWM signal in the motor controller 19 based on a command from the hybrid controller 18, operates by inputting the PWM signal, and performs mutual conversion between a DC current and a composite current as described later. It is configured to include six intelligent power modules (abbreviation: IPM) by a switching circuit to be performed. When one of the two rotors is used as a motor and the other is used as a generator, only the power corresponding to the difference between the motor drive power and the generated power and the reactive power need to flow through the IPM, so that the efficiency can be greatly improved. There is a merit (increase in reactive power increases efficiency, which can be improved).
Here, the "intelligent power module" refers to the miniaturization and low loss of switching elements, modularization of multiple elements in one package, and intelligentization including base (gate) drive circuits and protection functions. And a switching circuit that achieves this.
[0018]
[Coil power supply structure from inverter device to motor]
FIG. 3 is a vertical sectional side view showing the multi-shaft multilayer motor M, and FIG. 4 is a diagram showing a coil power supply structure from the inverter device I to the stator S viewed from the gear chamber side.
[0019]
The coil power supply structure for supplying the six-phase alternating current by the composite current from the inverter device I to the U-phase coil, the V-phase coil, the W-phase coil, the U'-phase coil, the V'-phase coil, and the W'-phase coil of the stator S is as follows. As shown in FIG. 3, a power supply connection terminal 20, a bus bar radial direction laminate 21, a power supply connector 22, and a bus bar axial direction laminate 23 are provided. A resolver 24 that detects the rotation of the inner rotor IR and a resolver 25 that detects the rotation of the outer rotor OR are provided as sensors for detecting the number of rotations, rotation direction, and rotation position of the rotor, which are necessary information in motor control. Have been.
[0020]
As shown in FIG. 4, the power supply connection terminals 20 include a U-phase V-phase W-phase power supply connection terminal set and a U′-phase V′-phase W′-phase power supply connection terminal set. Are arranged and fixed at different positions in the circumferential direction of the motor case 2 defining the gear chamber.
[0021]
The bus bar radial laminated body 21 is disposed in a gear chamber, and three plates made of a conductive material such as copper are radially overlapped with each other via a predetermined gap, and the entirety including the gap is covered with an insulating resin. It is configured by molding into a cross-sectional shape. As shown in FIG. 4, two sets of the busbar radial laminated bodies 21 are arranged at radially outer peripheral positions of the output gear 11 and along the outer diameter shape of the output gear 11. Cooling is ensured by oil scattered in the outer diameter direction.
[0022]
The power supply connector 22 is provided so as to penetrate the partition 2a between the gear chamber and the motor chamber, and connects each phase plate of the bus bar radial direction laminated body 21 to one end of the power supply connector 22 of each phase exposed to the gear chamber. are doing.
[0023]
The bus bar axial direction laminated body 23 is fixed to the front end plate of the stator S, and is axially laminated by interposing an insulating material between each of the ring-shaped phase plates and the neutral point plate. And the whole is sealed with an insulating resin. The power supply connector 22 of each phase is connected to each phase power supply portion protruding inward from the ring-shaped plate, and the coil of each phase of the stator S is connected to the coil connection portion protruded outward from the ring-shaped plate.
[0024]
[Overview of inverter device]
5 is an overall plan view of the inverter device I, FIG. 6 is an overall sectional view of the inverter device I taken along line AA in FIG. 5, and FIG. 7 is an overall sectional view of the inverter device I taken along line BB in FIG. 8 is a bottom view showing the inverter lower case of the inverter device I.
[0025]
As shown in FIG. 5, the inverter device I has an intelligent power module 70 (hereinafter, referred to as IPM 70) having a switching circuit for performing mutual conversion between a DC current and a composite current in a lower left area in the inverter upper case 30. )) Is provided. Six IPMs 70 are provided corresponding to each of the six-phase composite currents, which are divided into two sets of three + 3, and these two sets are vertically opposed to each other.
[0026]
On the DC side of the IPM 70, a DC power supply terminal 71 for receiving DC power from the battery 17 and two sheets (corresponding to a positive electrode and a negative electrode) connecting between the DC power supply terminal 71 and the DC terminal of the IPM 70. ) Are provided with the first DC bus bars 72a, 72b and the second DC bus bars 73a, 73b, and three electrolytic capacitors 74 for smoothing the voltage fluctuation of the input DC power supply under the influence of the IPM 70.
[0027]
On the AC side of the IPM 70, six (corresponding to six phases) AC bus bars 76 for connecting between the AC terminal of the IPM 70 and the AC terminal of the AC power output terminal part 75, And an AC power output terminal section 75 for outputting to the motor M. In the lower right area, which is a marginal space in the inverter upper case 30, a low-pressure driven in-vehicle pump motor inverter 90 and an inverter-driven CUP board are installed. An upper cover 31 is fixed to the upper surface of the inverter upper case 30 so as to cover the whole. An inverter lower case 50 and a lower cover 51 are fixed to the bottom surface of the inverter upper case 30.
[0028]
Therefore, when applying a composite current to the U-phase coil, the V-phase coil, the W-phase coil, the U′-phase coil, the V′-phase coil, and the W′-phase coil of the multi-axis multilayer motor M, the DC power supply terminal 71 , A DC power supply from the battery 17 is input to the IPM 70 via the first DC bus bars 72a, 72b and the second DC bus bars 73a, 73b, and the input DC current is converted into a six-phase AC by a composite current in the IPM 70. Is output through the AC bus bar 76 and the AC power supply output terminal unit 75.
[0029]
As shown in FIGS. 6 and 7, the three electrolytic capacitors 74, the six IPMs 70, and the inverter 90 for the pump motor are cooled by the condenser cooling water passage 32 formed in the inverter upper case 30 and the IPM cooling system. This is performed by forced water cooling that guides cooling water to the water channel 33 and the inverter cooling water channel 34. As shown in FIG. 8, each of the cooling water passages 32, 33, and 34 has a lower case water supply passage 52 and a lower case drainage passage 53 formed in an inverter lower case 50 fixed to the inverter upper case 30 while maintaining water tightness. A water supply pipe 54 is connected to the lower case water supply path 52 and a drain pipe 55 is connected to the lower case drain path 53.
[0030]
The cooling operation is performed by supplying cooling water from the water supply pipe 54 to the cooling water paths 32, 33, and 34 via the lower case water supply path 52, thereby taking away the heat generated by the three electrolytic capacitors 74 and cooling them. The heat generated by the individual IPMs 70 is taken and cooled, and the heat generated by the pump motor inverter 90 is taken and cooled. Then, the heated cooling water is collected in the lower case drain 53 and discharged from the drain pipe 55.
[0031]
Hereinafter, the configuration, operation, and effect of each of the feature points of the inverter device I of the first embodiment will be described in detail.
[0032]
[IPM power supply side structure]
First, the configuration will be described.
[0033]
As shown in FIGS. 5 and 6, on the power supply side of the IPM 70, three electrolytic capacitors 74 are installed between the DC power supply lead terminal 71 and the DC terminal of the IPM 70, and the DC power supply terminal 71 And the three electrolytic capacitors 74 and the DC terminals of the IPM 70 are connected by first DC bus bars 72a and 72b and second DC bus bars 73a and 73b.
[0034]
The IPM 70 and the electrolytic capacitor 74 are installed on different planes orthogonal to each other, such as installing the IPM 70 on a vertical plane and installing the electrolytic capacitor 74 on a horizontal plane.
[0035]
Further, an electrolytic capacitor 74 provided between the DC power lead-in terminal 71 and the DC terminal of the IPM 70 is coupled to the first DC bus bars 72a and 72b on the DC power lead-in terminal 71 side. As shown in FIG. 5, the first DC bus bars 72a, 72b and the second DC bus bars 73a, 73b constituting the DC bus bar are connected so as to be orthogonal to each other. 77a is provided, and a bolt / nut 77b is provided at a connecting portion between the bus bars 72b, 73b so that the bus bars 72b, 73b can be separated by the bolt / nut 77a, 77b.
[0036]
Next, the operation will be described.
[0037]
When a rotating electric machine driven by a composite current, such as a multi-axis multilayer motor M, is driven by the inverter device, the IPM is supplied with the composite current. Although this composite current is advantageous for inverter efficiency by reducing the average value, the peak current increases, and as shown in FIG. 9, the surge voltage generated when the IPM is turned off also increases.
[0038]
When a large surge voltage is generated, noise appears in other electronic components such as a receiving device such as a radio mounted on a vehicle, which causes a malfunction. For this reason, it is necessary to prevent noise generated from the IPM from leaking outside the inverter.
[0039]
On the other hand, in the first embodiment shown in FIGS. 5 and 6, three electrolytic capacitors 74 are provided between the DC power supply lead-in terminal 71 and the DC terminal of the IPM 70, and the noise generated in the IPM 70 is thereby reduced. Can be attenuated and output from the inverter device I.
[0040]
That is, FIG. 10A shows an equivalent circuit of the IPM power supply side structure of the first embodiment, and FIG. 10B shows that an electrolytic capacitor is installed at a position closer to the IPM as compared with FIG. 10A. The equivalent circuit of the IPM power supply side structure in the case is shown.
In the equivalent circuit of FIG. 10B, an RC filter is formed for a noise source, and the attenuation factor in a high frequency range is -20 [db / dec]. On the other hand, in the equivalent circuit of FIG. 10 (a), an LC filter is configured for a noise source, has an attenuation rate of -40 [db / dec] in a high frequency range, and FIG. Noise can be greatly reduced.
[0041]
In the IPM power supply side structure of the first embodiment, the IPM 70 and the electrolytic capacitor 74 are installed in another space without three-dimensionally intersecting the bottom surface of the inverter upper case 30, so that the cooling space of the electrolytic capacitor 74 is reduced. It is possible to provide. Even if an electrolytic capacitor having a small amount of ripple resistance is used, the cooling can be actively performed to suppress a rise in temperature, which greatly contributes to a longer life.
[0042]
In the IPM power supply side structure of the first embodiment, the first DC bus bars 72a and 72b to which the electrolytic capacitor 74 is connected and the second DC bus bars 73a and 73b to which the IPM 70 is connected can be separated by bolts and nuts 77a and 77b. Has become. This makes it possible to evaluate the withstand voltage of the modules of the second DC bus bars 73a, 73b and the second DC bus bars 73a, 73b, which contributes to the investigation of the cause in a short time when a failure occurs.
[0043]
In the IPM power supply side structure of the first embodiment, since the first DC bus bars 72a, 72b and the second DC bus bars 73a, 73b are orthogonal to each other, it is possible to reduce electromagnetic noise due to current flowing through the bus bars.
That is, FIG. 11A shows the magnetic flux due to the bus bar current when two DC bus bars are set orthogonally as in the IPM power supply side structure of the first embodiment, and FIG. 7 shows magnetic flux due to bus bar current when two DC bus bars are set. In FIG. 11 (b), the magnetic flux due to the current flowing through the DC bus bars crosses each other, and a voltage is easily generated in the other DC bus bar. On the other hand, in FIG. 11A, since no voltage is generated in the direction of the current, the mutual electromagnetic noise can be reduced.
[0044]
Next, effects will be described.
As described above, the following effects can be obtained in the IPM power supply-side structure of the first embodiment.
[0045]
(1) The DC power supply terminal 71 from the battery 17, the electrolytic capacitor 74, and the DC terminal of the IPM 70 are connected in series by the first DC bus bars 72a and 72b and the second DC bus bars 73a and 73b. Due to the inductance of the DC bus bars 72 and 73 and the filtering action of the electrolytic capacitor 74, it is possible to suppress a current change that causes a surge voltage generated when the IPM 70 is turned off. Further, the filter capacity for reducing radio noise, which is usually used, can be reduced, which contributes to cost reduction.
[0046]
(2) On the inverter upper case 30, the power module area in which the IPM 70 is set and the capacitor area in which the electrolytic capacitor 74 is set are set on different planes, so that the electrolytic capacitor 74 can be forcibly cooled. Therefore, even the electrolytic capacitor 74 having a low ripple and a small volume can satisfy the performance by cooling. This contributes to cost reduction.
[0047]
(3) Since the first DC bus bars 72a and 72b connecting the electrolytic capacitor 74 and the second DC bus bars 73a and 73b connecting the IPM 70 can be separated, each module unit is used when evaluating insulation and withstand voltage, which are inverter performances. It is possible to do with. As a result, the time required for a failure or maintenance check can be reduced.
[0048]
(4) Since the first DC bus bars 72a and 72b connecting the plurality of electrolytic capacitors 74 and the second DC bus bars 73a and 73b connecting the plurality of IPMs 70 are installed orthogonal to each other, the first DC bus bars 72a and 72b are connected to the first DC bus bars 72a and 72b. The electromagnetic noise caused by the flowing current and the electromagnetic noise flowing through the second DC bus bars 73a and 73b can be reduced.
[0049]
[Electrolytic capacitor cooling structure]
First, the configuration will be described.
[0050]
As shown in FIGS. 5 and 6, the electrolytic capacitor 74 has three capacitor insertion grooves 35 having similar shapes on the side and bottom surfaces of the capacitor formed in the inverter upper case 30, and the electrolytic insertion grooves 35 are formed in the capacitor insertion grooves 35. It is set by inserting the terminals 74a and 74b of the capacitor 74 on the upper surface. The space formed between the outer peripheral surface of the electrolytic capacitor 74 and the groove surface of the capacitor insertion groove 35 is filled with an air layer such as silicon grease to improve the heat transfer performance.
[0051]
As shown in FIGS. 6 and 8, a condenser cooling water passage 32 is formed in the outer peripheral portion of the condenser insertion groove 35 along the shape of three continuous capacitor side surfaces, and cooling water (coolant) is formed in the condenser cooling water passage 32. ) Is supplied to cool the electrolytic capacitor 74 from the side.
[0052]
In the electrolytic capacitor 74, as shown in FIG. 5, the arrangement direction of the positive terminal 74a and the negative terminal 74b is set to be perpendicular to the direction of the current flowing through the first DC bus bars 72a and 72b. By connecting only the + terminal 74a to one first DC bus bar 72a and connecting only the-terminal 74b to the other first DC bus bar 72b, the + terminal 74a and the-terminal 74b are connected to the first DC bus bar 72a, 72b. They are arranged side by side on a straight line parallel to the current direction.
[0053]
Next, the operation will be described.
[0054]
As shown in FIG. 8, the cooling of the electrolytic capacitor 74 is performed by introducing cooling water from the condenser water supply port 56 communicating with the lower case water supply path 52, and flowing through the condenser cooling water paths 32 along the three capacitor side shapes. By discharging the cooling water from the condenser drain port 57 communicating with the lower case drain channel 53, side cooling is performed. Also, as shown in FIG. 6, a lower case drainage channel 53 is disposed at the bottom position of the three continuous electrolytic capacitors 74, so that the cooling water of the lower case drainage channel 53 (bottom surface cooling channel) is used to cool the electrolytic capacitor 74. Bottom cooling is performed at the same time.
[0055]
As shown in FIG. 12, an electrolytic capacitor 74 generally used in an inverter device includes a positive terminal 74a, a negative terminal 74b, an explosion-proof hole 74c, a rubber packing 74d, a bakelite 74e, a paste electrolyte 74f, The structure has a paper 74g and an oxide film 74h.
[0056]
It is said that the life of the electrolytic capacitor 74 is reduced by half when the temperature rises by 10 [degrees], which is a major factor that determines the life of the inverter device I.
[0057]
On the other hand, in the smoothing capacitor arrangement structure of the first embodiment, when the electrolytic capacitor 74 is inserted into the capacitor insertion groove 35 provided in the inverter upper case 30 with both terminals 74a and 74b as upper portions, as described above, By cooling with cooling water from both the side surface and the bottom surface of the electrolytic capacitor 74, a high cooling effect is expected.
[0058]
Further, regarding fixing of the electrolytic capacitor 74, in addition to being inserted into the capacitor insertion groove 35 provided in the inverter upper case 30, a band 74i is provided at a portion shown in FIG. As a result, a sufficient fixing force can be obtained even for a large acceleration input. Further, since the band 74i wound in FIG. 13 is a portion where the rubber packing 74d and the bakelite 74e exist from the structure of the electrolytic capacitor 74 shown in FIG. 12, there is no need to cool down to this portion. By providing both terminals 74a and 74b on the upper surface, the height of the capacitor insertion groove 35 formed in the inverter upper case 30 can be reduced, which is advantageous in terms of material cost and weight.
[0059]
In the electrolytic capacitor cooling structure of the first embodiment, the arrangement direction of the positive terminal 74a and the negative terminal 74b is set in a direction perpendicular to the direction of the current flowing through the first DC bus bars 72a, 72b. This makes it possible to cancel the magnetic flux due to the plus side current and the minus side current everywhere in the first DC bus bars 72a, 72b, thereby reducing the mutual inductance of the first DC bus bars 72a, 72b themselves and reducing the influence of electromagnetic noise. it can.
[0060]
In the cooling structure of the electrolytic capacitor of the first embodiment, the terminals of the same polarity are always arranged on one side, so that the current path can be minimized and the self-inductance can be reduced. In addition, improvement in workability is expected.
[0061]
Furthermore, in the electrolytic capacitor cooling structure of the first embodiment, both terminals 74a and 74b are provided on the upper part, and both terminals 74a and 74b of the electrolytic capacitor 74 are orthogonal to the bus bar current as described above, and The structure in which the same-polarity terminals are provided in the same row can reduce the surge voltage and effectively remove the generated heat. Therefore, the present invention can be applied to an electrolytic capacitor 74 having a low ripple capacitance and a large ESR (equivalent series resistance), that is, an inexpensive electrolytic capacitor 74.
[0062]
Next, effects will be described.
As described above, in the electrolytic capacitor cooling structure of the first embodiment, the following effects can be obtained.
[0063]
(1) Since the side surface of the electrolytic capacitor 74 is cooled by forced water cooling, even a small current ripple capacity can be used without increasing the temperature, that is, with a long life. In addition, the capacitor terminal portion is exposed at the upper part, and since there is a rubber packing 74d, a bakelite 74e, and both terminals 74a and 74b, there is no need for cooling, so that the height of the capacitor insertion groove 35 serving as a cooling cylinder is reduced. Can be shortened.
[0064]
(2) Since the bottom surface of the electrolytic capacitor 74 is also cooled simultaneously with the cooling of the side surface of the electrolytic capacitor 74, a high cooling effect of the electrolytic capacitor 74 can be achieved.
[0065]
(3) Since the terminals 74a and 74b of the electrolytic capacitor 74 are arranged in the vertical direction with respect to the bus bar current, the direction of the current can be made uniform, can be canceled by + and-, and the inductance can be kept small.
[0066]
(4) Since the same-polarity terminals are arranged only on one side, the current density distribution can be made uniform, and the inductance can be reduced as in (2) above. Further, erroneous connection can be avoided by using the same electrode at the same position in order to use a normal electrolytic capacitor 74.
[0067]
[Smoothing capacitor arrangement structure]
First, the configuration will be described.
[0068]
In the inverter device I of the first embodiment, as described above, in addition to the provision of the three electrolytic capacitors 74 on the first DC bus bars 72a and 72b, the film capacitor is connected to the connecting portion of the second DC bus bars 73a and 73b on the IPM 70 side. 78 were provided.
[0069]
As shown in FIG. 14, the film capacitor 78 is formed by soldering the thin plate-shaped bus bars 79 and 80 in advance together with the positive and negative stacked second DC bus bars 73a and 73b to the terminal of the IPM 70 with bolts 81. Are fixed together.
[0070]
That is, the vertically arranged IPM 70 is arranged so that the terminal is on the inside and the heat radiation surface is on the outside, and the U-shaped second DC bus bars 73 a and 73 b are stacked on the positive and negative DC power supply terminals 70 a and 70 b of the IPM 70. Is provided. A film capacitor assembly (FIG. 15) in which a film capacitor 78 is soldered in advance to the thin bus bars 79, 80 is laminated on the positive and negative DC power supply terminals 70a, 70b of the IPM 70 of the second DC bus bars 73a, 73b. It is fixed together with the second DC busbars 73a and 73b in the shape of a letter.
[0071]
As shown in FIG. 15, the film capacitor assembly includes a conductive thin bus bar 79 fastened together with the positive second DC bus bar 73a and a conductive thin bus bar fastened with the second negative DC bus bar 73b. 80 and a plurality of film capacitors 78, and terminal-like portions 79 a, 80 a having terminal shapes are provided on the positive and negative conductive thin plate-like bus bars 79, 80 in order to improve the solderability of the film capacitor 78. It is formed so that the terminals of the film capacitor 78 are soldered to the terminal portions 79a and 80a. It goes without saying that soldering can be performed by pressure bonding.
[0072]
Next, the operation will be described.
[0073]
In the case where only the electrolytic capacitor 74 is mounted to smooth the voltage fluctuation of the input DC power supply, if the switching in the IPM 70 becomes too high frequency, the electrolytic capacitor 74 becomes just a resistance element, and the input DC power supply voltage Smoothing becomes impossible. That is, the upper limit of the switching frequency band is limited by the frequency characteristics of the electrolytic capacitor 74.
[0074]
On the other hand, in the smoothing capacitor arrangement structure of the first embodiment, by using a film capacitor 78 having better frequency characteristics than the electrolytic capacitor 74 in combination with the electrolytic capacitor 74, the input in a high-frequency range beyond the range of the electrolytic capacitor 74. The DC power supply voltage can be smoothed, and the above problem can be solved.
[0075]
However, in general, the film capacitor 78 has a small capacity and many small-sized ones in which terminals are connected by soldering, and is used for soldering to the positive and negative second DC bus bars 73a and 73b having a large cross-sectional area to cope with a large current. In order to mount the second DC bus bars 73a and 73b, it is necessary to provide protrusions for soldering on the second DC bus bars 73a and 73b.
[0076]
Therefore, a large number of film capacitors 78 having good frequency characteristics are attached to the positive and negative thin plate-shaped bus bars 79 and 80 having good solderability in advance to form a film capacitor assembly, and the film capacitor assembly is connected to a positive and negative stacked second DC bus bar for power supply. Together with 73a and 73b, the film capacitor 78 is fixed to the IPM 70 with bolts 81, so that a large number of film capacitors 78 can be arranged in the immediate vicinity of the positive and negative DC power supply terminals 70a and 70b of the IPM 70.
[0077]
In this way, by performing the input DC voltage smoothing by the film capacitor 78 together with the electrolytic capacitor 74, as shown in FIG. 16, the input DC voltage at the time of switching in a high-frequency range where the electrolytic capacitor 74 cannot cope is smoothed. Since the film capacitor 78 can be used, the input DC voltage can be stabilized even at the time of high-frequency switching as compared with the related art.
[0078]
Next, effects will be described.
As described above, the following effects can be obtained in the arrangement structure of the smoothing capacitor of the first embodiment.
[0079]
(1) Since the electrolytic capacitor 74, which cannot cope with a high frequency but has a large capacity, and the film capacitor 78 having a small capacitance but excellent in frequency characteristics are used in combination, even in a high-speed switching state in a higher frequency range than before, Thus, the input DC power supply voltage can be stabilized.
[0080]
(2) A film capacitor 78 is soldered in advance to the thin bus bars 79 and 80 having good solderability to form an assembly, and the assembly is bolted to the positive and negative DC power supply terminals 70a and 70b of the IPM 70 together with the second DC bus bars 73a and 73b. 81, the film capacitor 78 can be easily installed in the vicinity of the DC power supply terminals 70a and 70b of the IPM 70 without forming soldering protrusions or the like on the DC bus bar for power supply. Can be.
[0081]
[IPM vertical installation structure]
First, the configuration will be described.
[0082]
As shown in FIG. 17, the six IPMs 70 include three IPMs 70 and three IPMs 70 arranged opposite to each other, and a pair of positive and negative stacked second DC bus bars 73a, 73b for supplying a DC current to the IPMs 70. Each of the IPMs 70 has a wide surface shape so as to fill an area surrounded by the DC power supply terminals 70a and 70b.
[0083]
The six IPMs 70 are arranged substantially vertically so that the cooling surface 70c faces outward, and a pair of positive and negative stacked second DC bus bars 73a and 73b for supplying a DC current to the IPM 70 are formed at both ends of a wide planar shape. By connecting the portion to the IPM 70 by standing up substantially vertically, the cross-sectional shape of the second DC bus bars 73a, 73b is U-shaped as shown in FIG.
[0084]
When the IPM 70 is vertically opposed, one surface for fixing the IPM 70 is provided on the case outer wall 30a of the inverter upper case 30, and the other is provided on the vertical wall 30b inside the case. As shown in FIG. 19, the upper bolt hole 30c and the lower bolt hole 30d to be fixed are provided by penetrating from the case outer wall portion 30a to the inner vertical wall portion 30b.
[0085]
Next, the operation will be described.
[0086]
For example, when a DC current supply bus bar has a planar shape near the electrolytic capacitor, but a thin bar shape near the IPM terminal, the inductance in the DC current supply bus bar increases as the distance from the power supply increases, and the DC power supply system However, the electrical characteristics in the above are not suitable for adding a switching module.
[0087]
Accordingly, if the cooling surface of the IPM is three-dimensionally arranged to increase the component integration rate and the structure that enables the addition of the IPM while suppressing the planar projection area of the inverter device, the surface for cooling the IPM must be three-dimensional. In addition, it is difficult to electrically connect each IPM, to fix the IPM to the inverter case, and to process the case cooling surface, thereby increasing the production cost.
[0088]
On the other hand, in the IPM vertical structure according to the first embodiment, there is provided a configuration of the inverter device I having excellent electric characteristics, good workability at the time of manufacturing, and enabling the three-dimensional arrangement of the IPM 70. Can be.
[0089]
First, a pair of positive and negative stacked second DC bus bars 73a and 73b for supplying a DC current to the IPM 70 has a U-shaped cross section with a wide surface, so that a current path from the DC power supply to the IPM 70 is constituted by a surface. Since the distance is short, low inductance can be realized.
[0090]
That is, the positive and negative stacked DC bus bars that supply a DC current to each IPM 70 are such that the first DC bus bars 72a and 72b of the DC power supply connection portion have a bar shape, and the second DC bus bars 73a and 73b of the connection portion to the IPM 70 have a wide surface. The second DC busbars 73a and 73b, which are DC busbars, have conductance by laminating the wide planar portions. In addition, the distance of the current path from the DC power supply to each IPM 70 is as small as possible, and the distance between the terminals of each IPM 70 can be made substantially equal, so that the second DC bus bar 73a from the DC power supply to the IPM 70 , 73b can be reduced.
[0091]
As described above, since the inductance can be reduced, the voltage fluctuation of the direct current generated at the time of switching of the IPM 70 can be suppressed to be low. Further, since the positive and negative stacked second DC bus bars 73a and 73b themselves have a three-dimensional structure, a portion for connecting the IPM 70 can be made three-dimensional. Therefore, the IPM 70 is realized while maintaining the electrical characteristics of realizing low inductance. Three-dimensional arrangement becomes possible.
[0092]
Also, when a substantially vertical IPM cooling surface is installed in the inverter upper case 30, bolt holes 30c and 30d of the IPM 70 must be formed on the cooling surface of the vertical wall portion 30b provided inside the case. In order to improve the cooling performance, the space between the cooling surface 30e of the case outer wall 30c and the cooling surface 30f of the vertical wall 30b is narrow, and the rear side of the cooling surface 30f of the vertical wall 30b is also reduced as much as possible in the inverter upper case 30. For the purpose of increasing the space, there is not provided enough space to use a drilling tool, so it is difficult to drill a hole in the cooling surface 30f of the vertical wall 30b.
[0093]
On the other hand, by using a drilling tool from the outside of the inverter upper case 30, drilling is performed to penetrate the case outer wall portion 30a and the inner vertical wall portion 30b, so that an upper bolt hole 30c for fixing the IPM 70 and a lower bolt hole are formed. The holes 30d are set collectively, and this problem can be solved.
[0094]
Next, effects will be described.
As described above, the following effects can be obtained in the IPM vertical structure according to the first embodiment.
[0095]
(1) Three IPMs 70, 70, 70 and three IPMs 70, 70, 70 are opposed to each other, and a pair of positive and negative stacked second DC bus bars 73 a, 73 b for supplying a DC current to the IPM 70 is connected to each IPM 70. A wide surface shape that fills the area surrounded by the DC power supply terminals 70a and 70b is excellent in electrical characteristics, workability at the time of manufacturing is good, and the IPM 70 can be three-dimensionally arranged. Can be.
[0096]
(2) Since the cross-sectional shape of the pair of positive and negative stacked second DC bus bars 73a and 73b for supplying a DC current to the IPM 70 is a U-shape in which the peripheral edges at both ends of the wide surface are substantially vertically erected, high electrical characteristics are obtained. Can be three-dimensionally arranged while maintaining the above.
[0097]
(3) Since the upper bolt hole 30c and the lower bolt hole 30d for fixing the vertically opposed IPM 70 are formed by penetrating from the case outer wall 30a to the inner vertical wall 30b, the inverter upper case 30 can be used. The upper bolt hole 30c and the lower bolt hole 30d for fixing the IPM can be easily formed while saving space as much as possible.
[0098]
[IPM cooling structure]
First, the configuration will be described.
[0099]
In the IPM cooling structure, as shown in FIG. 7, an IPM cooling water channel 33 that allows water to flow in the vertical direction without a mechanical joint is provided inside the inverter upper case 30 and the inverter lower case 50 of the inverter device I. And the IPM 70 is arranged vertically.
[0100]
As shown in FIGS. 20 and 21, the IPM cooling water channel 33 is formed in a cast shape of a flat quadrangular pyramid on a case outer wall portion 30a and an inner vertical wall portion 30b provided in the inverter upper case 30. A partition plate 36 separate from the inverter upper case 30 is provided inside the water channel 33. Then, as shown in FIG. 8, the cooling water is supplied from each IPM water supply channel 37 at the bottom of the case, and the cooling water is drained from each drainage channel 38 at the bottom of the case.
[0101]
As shown in FIG. 8, six IPM cooling water channels 33 are provided in the inverter upper case 30, and supply cooling water from a lower case water supply channel 52 of an inverter lower case 59 installed below the inverter upper case 30. The water is distributed in parallel. In addition, the water supply ports 39 communicating with the lower case water supply path 52 and the water supply paths 37 of the respective IPM cooling water paths 33 are orifice ports each defining an inner diameter, and measure the amount of cooling water to distribute and flow water in parallel. In FIG. 8, reference numeral 40 denotes a drain port communicating with the lower case drain channel 53 and the drain channel 38 of each IPM cooling channel 33.
[0102]
As shown in FIG. 22, at the corner of the intersection between the case outer wall portion 30a and the vertical wall portion 30b having the IPM cooling water passage 33 and the outer wall of the inverter upper case 30, the IPM cooling surfaces 30e and 30f are processed. The lightening portions 30g and 30h (escape) are provided in a cast shape so that no fillet remains due to the tool radius.
[0103]
As shown in FIG. 21, the IPM cooling water passage 33 has a shape which rises vertically from the bottom surface of the inverter upper case 30 and is parallel to the water passage from the bottom surface side to a halfway height on the side of the IPM cooling surfaces 30e and 30f where the IPM 70 is mounted. Are provided, and a partition plate 36 is fixed to a rib groove 33c sandwiched between the two convex ribs 33a, 33b.
[0104]
As shown in FIG. 23, the partition plate 36 is provided with a tip bent portion 36a in which the tip of the partition plate 36 is bent to one side, and the bending provided on the side of the inverter upper case 30 on the side in contact with the convex ribs 33a, 33b. An anchor-shaped protrusion 36b and a T-shaped overhang 36c on the side opposite to the anchor-shaped protrusion 36b are provided, and the partition plate 36 can be easily fixed to the IPM cooling water channel 33 simply by inserting the partition plate 36 into the rib groove 33c. Like that.
[0105]
Next, the operation will be described.
[0106]
For example, in order to reduce the installation volume of heat-generating components by arranging the heat-generating components three-dimensionally with a plurality of vertical cooling surfaces, in a structure in which water is simply supplied from the bottom to the vertical cooling water channel, the cooling water reaches the top of the water channel. Convection is difficult to obtain, and a sufficient cooling effect cannot be expected.
[0107]
On the other hand, in the first embodiment, the IPM 70, which is a heat-generating component, has a cooling surface having a plurality of vertical surfaces by employing a vertical IPM cooling structure in which cooling water can be convected to the upper portion by the partition plate 36. A sufficient IPM cooling effect can be achieved while arranging three-dimensionally.
[0108]
That is, the cooling water supplied from the external cooling water passage to the lower case water supply passage 52 via the water supply pipe 54 of the inverter lower case 30 is distributed from the lower case water supply passage 52 to each of the water supply ports 39, and from each of the water supply ports 39 to the inverter upper water supply port 39. By passing through each water supply passage 37 of the case 30, ascending one passage of the IPM cooling water passage 33 formed in an inverted U shape by the partition plate 36, and descending the other passage through an upper gap, The convection surely flows to the upper part of the water channel to cool the IPM 70 which is a heat-generating component. Then, the water passes through each drainage channel 38 of the inverter upper case 30, gathers from each drainage port 40 into the lower case drainage channel 53 of the inverter lower case 50, passes through the water distribution pipe 55 from the lower case drainage channel 53, and returns to the external cooling water channel again. Refluxed.
[0109]
Accordingly, the IPM 70 as the heat-generating component can be vertically arranged, and the mounting amount of the IPM 70 as the heat-generating component can be increased without increasing the bottom area of the inverter upper case 30 and the inverter lower case 50.
[0110]
In addition, by setting the lightening portions 30g and 30h (runaway) in a cast shape at the intersections of the IPM cooling surfaces 30e and 30f of the inverter upper case 30 and the case outer wall, the component integration rate can be increased.
[0111]
In addition, since the inverter upper case 30 has no joining surface (joining surface) between the components constituting the IPM cooling water passage 33, a short circuit accident caused by contact of the cooling water with the high-voltage part can be prevented, and in addition, cooling can be performed. Since the number of parts in the entire waterway is small and it is easy to assemble, the production cost can be reduced.
[0112]
Next, effects will be described.
As described above, the following effects can be obtained in the IPM cooling structure of the first embodiment.
[0113]
(1) The IPM cooling structure allows the water to flow vertically without providing a mechanical joint inside the inverter upper case 30 and the inverter lower case 50 of the inverter device I, and reaches the upper part of the vertical IPM cooling water passage 33. Since the configuration is such that cooling water can be convected, a plurality of IPM cooling surfaces 30e and 30f can be installed, and since the IPM cooling surfaces 30e and 30f are vertical, the IPM 70 serving as a heating element can be vertically arranged. As a result, the cooling area can be increased without increasing the area of the bottom of the inverter upper case 30. As a result, the number of mounted IPMs 70 can be increased without impairing the mountability on the vehicle. In addition, since the space for storing the high-power components that dislike moisture and the IPM cooling water passage 33 for circulating the cooling water are completely separated by casting, the contact of the cooling water with the high-power components can be prevented.
[0114]
(2) Since the partition plate 36 is provided inside the IPM cooling water channel 33 formed by casting, cooling to the upper portion of the vertical IPM cooling water channel 33 is achieved with a simple configuration in which the IPM cooling water channel 33 and the partition plate 36 are combined. Water can be convected.
[0115]
(3) Since the IPM 70, which is a heat-generating component, is separately divided and the IPM cooling water passages 33 are installed, and the amount of cooling water is distributed to each IPM cooling water passage 33 in accordance with the required cooling performance, a parallel circuit configuration is adopted. The individual IPMs 70 can be uniformly cooled without variation.
[0116]
(4) Since the water supply port 39 of the inverter lower case 50 is set as an orifice port for measuring the amount of cooling water according to the cooling performance required for each IPM cooling water passage 33, it is efficiently and appropriately adapted to the six IPMs 70 to be distributed. Cooling performance can be secured.
[0117]
(5) At the intersection of the IPM cooling surfaces 30e and 30f of the inverter upper case 30 and the outer wall of the case, lightening portions 30g and 30h (escape) are set in a cast shape, so that the IPM cooling surfaces 30e and 30f are machined. The IPM 70 can be arranged close to the outer wall of the case only by itself, the dead space generated by the corner R of the casting shape can be eliminated, and the component integration rate can be increased.
[0118]
(6) Since the IPM cooling water channel 33 has a structure in which the rib groove 33c is formed in a cast shape, the partition plate 36 to be installed inside can be fixed without any particular processing, and the rib groove 33c is connected to the heating element. Since it is formed on the side of the IPM cooling surfaces 30e and 30f, the contact area with the cooling water is increased, and the cooling efficiency can be increased.
[0119]
(7) The anchor-shaped projection 36b and the bent end portion 36a of the partition plate 36 provided according to the shape of the casting are fitted only by being inserted by the spring property of the material of the partition plate 36. Is formed by casting in the shape of a casting, and the wedge-shaped partition plate 36 prevents the gap from being inserted too much due to the shape of the partition plate 36. The partition plate 36 can be fixed so as to leave a gap above the IPM cooling water channel 33 without taking any fastening measures such as bonding.
[0120]
[Switching room structure]
First, the configuration will be described.
[0121]
The switching room structure of the first embodiment, as shown in FIGS. 24 and 25, separates the IPM 70, which is a high-voltage circuit, from the IPM drive circuit board 82, which is a low-voltage circuit, and is located very close to a magnetic shield. Placed at a distance. The iron plate serving as the magnetic shielding shield has a frame-shaped base member 83 shown in FIG. 26A and an opening of the base member 83 except for a gap for passing a control line 84 shown in FIG. 26B. , And an IPM drive board 82 is installed on the cover member 85.
[0122]
As shown in FIG. 26A, the base member 83 has a hemmed portion 83b formed by hemming so that the opening 83a does not damage the control line 84 even when the opening 83a contacts the control line 84. Also, in order to maintain the rigidity of the base member 83, a bent portion 83c is formed by bending both ends of the inverter upper case 30 in a direction crossing the IPM cooling surfaces 30e and 30f substantially vertically.
[0123]
As shown in FIG. 26 (b), the cover member 85 forms a hemmed portion 85a by hemming a side portion forming a hole through which the control line 84 passes when it is fitted with the base member 83. The control line 84 is not damaged even if it comes into contact with.
[0124]
Next, the operation will be described.
[0125]
In the switching room structure, the IPM 70 and the first DC bus bars 72a and 72b, the second DC bus bars 73a and 73b, the AC bus bar 76, the electrolytic capacitor 74, and the like are incorporated in the inverter upper case 30, and the IPM 70 is connected to the IPM drive circuit board 82. After the control line 84 is attached, the base member 83 is fixed to the upper surface positions of the case outer wall portion 30a and the vertical wall portion 30b of the inverter upper case 30, and the cover member 85 integrally having the IPM drive circuit board 82 is a cover member. The control line 84 is fixed to the base member 83 such that the control line 84 is arranged in the notch-shaped portion 85, and is finally assembled in the order in which the control line 84 is connected to the IPM drive circuit board 82.
[0126]
For example, when the IPM 70, which is a high-voltage circuit, and the IPM drive circuit board 82, which is a low-voltage circuit, are arranged at a close distance, if the peak current of the IPM 70 becomes large, a surge voltage accompanying a voltage change is likely to occur. When the electric power flows out to an external circuit, the IPM drive circuit board 82, which is a low-voltage circuit in the inverter device I, and the electronic equipment mounted on the vehicle receive noise and malfunction.
[0127]
On the other hand, in the switching room structure of the first embodiment, the IPM 70, which is the source of noise, is electromagnetically isolated from the IPM drive circuit board 82 and other electronic devices that may malfunction due to noise. Therefore, the stable operation of the IPM drive circuit board 82 and the on-vehicle electronic device, the increase of the peak current in the IPM 70, and the high-speed switching can be achieved.
[0128]
In addition, since the IPM 70 as a high-voltage circuit and the IPM drive circuit board 82 as a low-voltage circuit are separated and arranged at a short distance with a magnetic shield interposed therebetween, the IPM 70 as a noise source and the IPM 70 as a noise source may malfunction. The component integration rate with the IPM drive circuit board 82, which is easy to perform, increases, and the inverter device I can be downsized.
[0129]
Further, since the control line 84 between the IPM 70 and the IPM drive circuit board 82 can be shortened, the influence of noise on the control line 84 can be reduced. In addition, since the surroundings of the control line 84 are formed by laminating plate materials serving as shields by the hemming process, noise shielding performance is improved. In addition, in a state where the base member 83 and the cover member 85 are overlapped, the entire periphery of the hole through which the control line 84 passes is hemmed, so that the control line 84 is vibrated by the rotation of the engine or the running of the vehicle. The control line 84 is not damaged even if it comes into contact with the shield components (the base member 83 and the cover member 85).
[0130]
Next, effects will be described.
As described above, the following effects can be obtained in the switching room structure of the first embodiment.
[0131]
(1) The IPM 70, which is a high-voltage circuit, and the IPM drive circuit board 82, which is a low-voltage circuit, are separated from each other and placed at a short distance with a magnetic shield interposed therebetween, so that the IPM drive circuit board 82 and on-vehicle electronic devices are stable. The operation and the increase of the peak current and the high-speed switching in the IPM 70 can be compatible. In addition, the component integration rate increases, and the inverter device I can be downsized. Further, since the distance of the control line 84 between the IPM 70 and the IPM drive circuit board 82 exposed to the high-voltage circuit can be reduced, the influence of noise on the control line 84 can be reduced.
[0132]
(2) By the hemming process, a plate material serving as a shield is laminated around the control line 84, and in a state where the base member 83 and the cover member 85 are overlapped, the entire periphery of the hole through which the control line 84 passes is hemmed. Therefore, the noise shielding property is improved, and the control line 84 is not damaged by the vibration of the rotation of the engine or the running of the vehicle.
[0133]
(3) Since the cover member 85, which is a shield component, also serves as a bracket for fixing the IPM drive circuit board 82, the structure in which the IPM 70 and the IPM drive circuit board 82 are arranged at a close distance while blocking noise is reduced. It can be realized with the number of parts, which can contribute to cost reduction.
[0134]
Although the present invention has been described based on the first embodiment, the specific configuration is not limited to the first embodiment, and departs from the gist of the invention according to each claim in the claims. Unless otherwise noted, changes and additions to the design are permitted.
[0135]
For example, in the first embodiment, an example of an inverter device applied to a three-layer multi-axis multilayer motor having two rotors and one stator as a motor has been described. However, two independent synchronous motors having one rotor and one stator and other independent motors have been described. It can also be applied as a motor inverter device.
[Brief description of the drawings]
FIG. 1 is an overall view of a parallel type hybrid system to which an inverter device I of a first embodiment is applied.
FIG. 2 is a diagram illustrating an example of a six-phase alternating current by a composite current converted by the inverter device I of the first embodiment.
FIG. 3 is a vertical sectional side view showing a multi-axis multilayer motor M of a hybrid system to which the inverter device I of the first embodiment is applied.
FIG. 4 is a diagram showing a structure for feeding a coil from the inverter device I of the first embodiment to the stator S of the multi-shaft multilayer motor M as viewed from the gear chamber side.
FIG. 5 is an overall plan view of the inverter device I of the first embodiment.
FIG. 6 is an overall sectional view of the inverter device I according to the first embodiment taken along line AA of FIG. 5;
7 is an overall cross-sectional view of the inverter device I of the first embodiment taken along line BB of FIG. 5;
FIG. 8 is a bottom view showing the inverter lower case of the inverter device I of the first embodiment.
FIG. 9 is a diagram showing surge voltage characteristics at the time of turn-off in the inverter device I of the first embodiment.
FIG. 10 (a) is a diagram showing an equivalent circuit of the IPM power supply side structure of the first embodiment, and FIG. 10 (b) is a diagram showing an electrolytic capacitor compared to the IPM power supply side structure of the first embodiment. FIG. 3 is a diagram showing an equivalent circuit of an IPM power supply-side structure when installed at a position close to a power module.
FIG. 11A is a diagram showing magnetic flux due to bus bar current in the IPM power supply side structure of the first embodiment in which two DC bus bars are arranged orthogonally, and FIG. 11B is a diagram showing two DC bus bars. It is a figure which shows the magnetic flux by the bus-bar electric current when a bus-bar is arrange | positioned in parallel.
FIG. 12 is a sectional view showing an electrolytic capacitor to which the electrolytic capacitor cooling structure of the first embodiment is applied.
FIG. 13 is a view showing an attached state of an electrolytic capacitor to which the electrolytic capacitor cooling structure of the first embodiment is applied.
FIG. 14 is a cross-sectional view of a main part showing the arrangement structure of the smoothing capacitor according to the first embodiment.
FIG. 15 is a diagram showing a film capacitor assembly in the smoothing capacitor arrangement structure of the first embodiment.
FIG. 16 is an impedance characteristic diagram with respect to switching frequency in the smoothing capacitor arrangement structure of the first embodiment using both an electrolytic capacitor and a film capacitor.
FIG. 17 is a plan view showing the power module vertical installation structure of the first embodiment.
FIG. 18 is a longitudinal sectional view showing the power module vertical installation structure of the first embodiment.
FIG. 19 is a cross-sectional view showing bolt holes in a case outer wall portion and a vertical wall portion of the inverter upper case in the inverter device I of the first embodiment.
FIG. 20 is a cross-sectional view showing the power module cooling structure of the first embodiment.
FIG. 21 is a partially cutaway perspective view showing an IPM cooling water channel in the power module cooling structure of the first embodiment.
FIG. 22 is a plan view showing a lightened portion of a portion intersecting with the case outer wall in the power module cooling structure of the first embodiment.
FIG. 23 is a view showing a partition plate in the power module cooling structure of the first embodiment.
FIG. 24 is a sectional view of a principal part showing the switching room structure of the first embodiment.
FIG. 25 is a plan view showing the switching room structure of the first embodiment.
FIG. 26 is a plan view showing a base member and a cover member employed in the switching room structure of the first embodiment.
[Explanation of symbols]
M Multi-axis multilayer motor (rotary electric machine)
17 Battery
30 Inverter upper case (case)
70 IPM (Power Module)
70a, 70b DC power supply terminal
71 DC power lead-in terminal
72a, 72b 1st DC bus bar
73a, 73b 2nd DC bus bar
74 Electrolytic capacitor (smoothing capacitor)
74a capacitor + terminal
74b capacitor terminal
78 Film capacitor (smoothing capacitor)
79,80 Thin bus bar
79a, 80a Terminal part
81 volts

Claims (2)

Inverter device disposed between a battery as a DC power supply and a rotating electric machine driven by an AC current, and having a DC bus bar, a power module, and a smoothing capacitor for smoothing voltage fluctuations of the input DC power supply in a case. At
A smoothing capacitor arrangement structure for an inverter device, wherein a plurality of electrolytic capacitors having a large capacity and a plurality of film capacitors having a small capacity but excellent in frequency characteristics are used in combination as the smoothing capacitor. The smoothing capacitor arrangement structure of the inverter device according to claim 1,
The plurality of film capacitors are assembled by soldering a film capacitor in advance to a thin bus bar having good solderability, and the assembly is bolted together with a DC bus bar to a DC power supply terminal of a power module together with a bolt. Of the smoothing capacitor in the inverter device.

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