JP2004212785A - Microlens array substrate and liquid crystal system using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a microlens array substrate for reducing the influence on the optical characteristics by the distortion of a transparent substrate due to the contraction of a bonding resin. <P>SOLUTION: An inclination of the inside stress due to thermal contraction of the joined resin 73 is set to the thickness of the bonding resin 73 in an optical surface non-forming region 78 at a depth of an optical face 75 or less. As the result, when the thermal contraction generates in the joined resin 73, the plate thickness of a seal region 77 set along the outer peripheral part of the microlens array substrate 70 (facing substrate 20) can be held the substantially same plate thickness as a display region 76 set on the inner periphery. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention uses a microlens array substrate in which a pair of transparent substrates in which an optical surface corresponding to a pixel is arranged in an array on at least one of opposing surfaces is bonded to each other via a bonding resin, and using the microlens array substrate. The present invention relates to a liquid crystal device.
[0002]
[Prior art]
A liquid crystal device is configured by sealing liquid crystal between two substrates such as a glass substrate and a quartz substrate. In a liquid crystal device, active elements such as thin film transistors (hereinafter, referred to as TFTs) are arranged in a matrix on one substrate, a counter electrode is arranged on the other substrate, and sealing is performed between the two substrates. An image can be displayed by changing the optical characteristics of the liquid crystal phase according to the image signal.
[0003]
The TFT substrate on which the TFT is arranged and the opposing substrate arranged to face the TFT substrate are manufactured separately. After both substrates are bonded with high precision in a panel assembly process, liquid crystal is sealed.
[0004]
In the panel assembling process, first, an alignment film is formed on the surface of the TFT substrate and the opposing substrate manufactured in each substrate process, that is, on the surface in contact with the liquid crystal phase of the opposing substrate and the TFT substrate. Is performed. Next, a seal portion serving as an adhesive is formed on one edge of one substrate. The TFT substrate and the opposing substrate are bonded together using a seal portion, and are pressure-bonded and cured while performing alignment. A cutout is provided in a part of the seal portion, and the liquid crystal is sealed through the cutout.
[0005]
By the way, in a counter substrate or the like of this type of liquid crystal device, a microlens is formed corresponding to each pixel in a display area set on the substrate for the purpose of improving optical characteristics by improving an aperture ratio or the like. In some cases, a microscopic array substrate is used.
[0006]
For example, Patent Literature 1 discloses a technique relating to a microlens array substrate using a pair of transparent substrates, and this microlens array substrate is provided with each pixel in a display area on one transparent substrate (lens forming substrate). A corresponding concave or convex optical surface is formed by etching or the like, and the other transparent substrate (cover glass substrate) is bonded to this lens forming substrate via a bonding resin having a different refractive index. Be composed.
[0007]
By the way, in this type of microlens array substrate, it is general that a cover glass substrate is cut and polished for the purpose of further improving optical characteristics and the like. In this case, for example, the cover glass substrate is processed until it becomes a thin plate of about 7 (μm) with respect to the plate thickness of 1 (mm) of the lens forming substrate.
[0008]
[Patent Document 1]
JP 2001-246599 A
[Problems to be solved by the invention]
However, when a microlens array substrate is formed using a transparent substrate (cover glass substrate) that has been processed to be thin as described above, distortion occurs at the edge on the cover glass substrate side due to shrinkage of the bonding resin due to heat treatment. May occur.
[0010]
For example, when a microlens array substrate is used as a counter substrate of a liquid crystal device, the internal bonding resin shrinks due to heat treatment of the alignment film during the panel assembly process, and distortion occurs at the edge on the cover substrate side. In this case, in general, in a liquid crystal device, the bonding portion of the counter substrate to the TFT substrate is set at the edge on the cover substrate side. Therefore, the counter substrate is attached to the TFT substrate with a predetermined alignment via the sealing material. When they are bonded together, the distortion of the cover substrate (transparent substrate) generated on the microlens array substrate results in a change in the cell gap of the liquid crystal device. If the cell gap of the liquid crystal device is disturbed due to such distortion of the transparent substrate, the optical characteristics of the liquid crystal device may be adversely affected.
[0011]
The present invention has been made in view of the above circumstances, and provides a microlens array substrate capable of reducing the influence of distortion of a transparent substrate due to contraction of a bonding resin on optical characteristics, and a liquid crystal device using the same. The purpose is to:
[0012]
[Means for Solving the Problems]
The microlens array substrate according to the present invention has a pair of transparent substrates bonded to each other via a bonding resin, and at least a pixel on a facing surface of one of the pair of transparent substrates. In a microlens array substrate having a plurality of arranged concavely curved optical surfaces, the thickness of the bonding resin in a region where the optical surface is not formed is set to be equal to or less than the depth of the concavely curved optical surface. It is characterized by having done.
[0013]
According to such a configuration, the gradient of the internal stress generated when the bonding resin is thermally contracted can be suppressed, and the microlens array substrate can be contracted substantially uniformly in the thickness direction.
[0014]
The microlens array substrate according to the present invention has a pair of transparent substrates bonded to each other via a bonding resin, and at least a pixel on a facing surface of one of the pair of transparent substrates. In a microlens array substrate having a plurality of convex curved optical surfaces arranged, the thickness of the bonding resin corresponding to the non-formation region of the optical surface, the height of the convex curved optical surface It is characterized in that it is set to twice or less.
[0015]
According to such a configuration, the gradient of the internal stress generated when the bonding resin is thermally contracted can be suppressed, and the microlens array substrate can be contracted substantially uniformly in the thickness direction.
[0016]
The microlens array substrate according to the present invention is arranged corresponding to at least pixels on a pair of transparent substrates bonded to each other via a bonding resin, and at least one of the pair of transparent substrates facing a transparent substrate. A microlens array comprising a plurality of concave curved optical surfaces and a plurality of convex curved optical surfaces arranged on the other surface of the transparent substrate corresponding to the concave curved optical surfaces. In the substrate, the thickness of the bonding resin corresponding to the non-formation region of the optical surface is set to be equal to or less than twice the height of the convex curved optical surface.
[0017]
According to such a configuration, the gradient of the internal stress generated when the bonding resin is thermally contracted can be suppressed, and the microlens array substrate can be contracted substantially uniformly in the thickness direction.
[0018]
The microlens array substrate according to the present invention includes a pair of transparent substrates bonded to each other via a bonding resin, and a plurality of concave curved surfaces arranged corresponding to at least pixels on each of the opposing surfaces of the pair of transparent substrates. Wherein the thickness of the bonding resin corresponding to the non-formation area of the optical surface is set to be equal to or less than the depth of the concave curved optical surface. .
[0019]
According to such a configuration, the gradient of the internal stress generated when the bonding resin is thermally contracted can be suppressed, and the microlens array substrate can be contracted substantially uniformly in the thickness direction.
[0020]
The microlens array substrate according to the present invention includes a pair of transparent substrates bonded to each other via a bonding resin, and a plurality of convex curved surfaces arranged at least corresponding to pixels on each of the opposing surfaces of the pair of transparent substrates. Wherein the thickness of the bonding resin corresponding to the non-formation region of the optical surface is set to be three times or less the height of the convex curved optical surface. Features.
[0021]
According to such a configuration, the gradient of the internal stress generated when the bonding resin is thermally contracted can be suppressed, and the microlens array substrate can be contracted substantially uniformly in the thickness direction.
[0022]
The thickness of the bonding resin corresponding to the non-formation area of the optical surface is 7 μm or less.
[0023]
According to such a configuration, the gradient of the internal stress generated when the bonding resin is thermally contracted can be suppressed, and the microlens array substrate can be contracted substantially uniformly in the thickness direction.
[0024]
A liquid crystal device according to the present invention is characterized by using the microlens array substrate according to any one of claims 1 to 6 as a counter substrate.
[0025]
According to such a configuration, a good setting gap can be realized, and good optical characteristics can be realized.
[0026]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a sectional view of a main part of a microlens array substrate, FIG. 2 is a plan view showing a schematic configuration of a liquid crystal device, and FIG. 3 is a sectional view taken along line HH ′ of FIG. FIG. 4 is a flowchart showing a manufacturing process of the microlens array substrate, and FIG. 5 is a flowchart showing a panel assembling process of the liquid crystal device.
[0027]
First, a schematic configuration of a liquid crystal device will be described with reference to FIGS.
[0028]
As shown in FIG. 3, the liquid crystal device 200 is configured by sandwiching a liquid crystal layer 50 between the TFT substrate 10 and the counter substrate 20. The TFT substrate 10 has, for example, a TFT 30 formed on a quartz substrate 60 to form a main part, and the counter substrate 20 has a microlens array substrate 70 (described later) formed with a counter electrode 21 to form a main part. ing. Further, alignment films 16 and 22 as coating films made of polyimide or the like are formed on surfaces of the TFT substrate 10 and the counter substrate 20 that are in contact with the liquid crystal layer 50, respectively. As the liquid crystal layer 50, for example, a TN (twisted nematic) liquid crystal is used, and the liquid crystal molecules are arranged in a state of being twisted by 90 degrees in a state where no voltage is applied.
[0029]
As shown in FIGS. 2 and 3, the liquid crystal device 200 is provided with a rectangular sealing material 52 excluding the liquid crystal injection port 52a along the outer peripheral portion of the substrate. Is fixedly adhered by a sealing material 52. A frame-shaped frame light-shielding layer 53 is provided on the counter substrate 20 along the seal material 52 in a region surrounded by the seal material 52. Further, in a region surrounded by the frame light-shielding layer 53, a lattice-shaped light-shielding layer (not shown) formed in the same process as the frame light-shielding layer 53 is arranged. The liquid crystal is injected through the liquid crystal injection port 52a, and thereafter, the liquid crystal injection port 52a is sealed with the sealing material 54. Accordingly, the liquid crystal layer 50 is held in a region surrounded by the TFT substrate 10, the counter substrate 20, the sealant 52, and the sealant 54.
[0030]
In a region inside the sealing material 52, a plurality of scanning lines (not shown) and a plurality of data lines (not shown) which intersect each other are formed on the TFT substrate 10, and the intersections of these wirings are formed. Each time, a TFT 30 and a pixel electrode connected to the TFT 30 are formed.
[0031]
Further, a data line driving circuit 101 and a plurality of external circuit connection terminals 102 are provided along a side of the TFT substrate 10 in a region outside the sealing material 52, and a scanning line driving circuit 104 is connected to the side adjacent to this side. It is provided along. The scanning line driving circuit 104 and the data line driving circuit 101 are electrically connected to an external circuit connection terminal 102 via a lead wiring. In at least one of the corners of the opposing substrate 20, a conductive material 106 for establishing electric conduction between the TFT substrate 10 and the opposing substrate 20 is provided.
[0032]
Next, the configuration of the microlens array substrate 70 used for the counter substrate 20 of the above-described liquid crystal device 200 will be described.
[0033]
As shown in FIG. 1, the microlens array substrate 70 has a pair of transparent substrates 71 and 72 made of quartz, glass, or the like, and is applied to the opposing surfaces 71a and 72a to join the two transparent substrates 71 and 72 together. And a joining resin 73.
[0034]
In the present embodiment, one of the transparent substrates 71 is used as a lens forming substrate, and is formed of, for example, a substrate having a thickness of 1 (mm). The transparent substrate 71 has a concave portion corresponding to each pixel in a display area 76 (for example, an area corresponding to the frame light-shielding layer 53) defined on the liquid crystal device 200 on a surface 71a facing the other transparent substrate 72. The curved optical surfaces 75 are arranged in an array. Each optical surface 75 is formed by, for example, an etching process such as wet etching, and has a depth of, for example, 7 (μm). Further, on the facing surface 71 a of the transparent substrate 71, an area outside the display area 76 is set as an optical surface non-formation area 78. Here, as shown in FIG. 3, in the liquid crystal device 200 of the present embodiment, a sealing region 77 for the counter substrate 20 with respect to the TFT substrate 10 is set along the outer peripheral portion.
[0035]
The other transparent substrate 72 is used as a cover substrate, and is composed of, for example, a thin substrate having a thickness of 7 (μm).
[0036]
The bonding resin 73 is made of a transparent resin having a refractive index different from that of the transparent substrates 71 and 72, and is interposed on the entire surfaces 71a and 72a of the transparent substrates 71 and 72 to bond them.
[0037]
At this time, the bonding resin 73 is set so that the thickness between the opposing surfaces 71 a and 72 a is equal to or less than the depth of the optical surface 75 in the optical surface non-forming region 78. The setting of the thickness of the bonding resin 73 is such that when the microlens array substrate 70 is subjected to heat treatment, the microlens array substrate 70 is contracted unevenly in the plate thickness direction due to thermal contraction of the bonding resin 73. This is to prevent it.
[0038]
That is, in the microlens array substrate 70 according to the present embodiment, since the transparent substrate 71 has the concave curved optical surface 75 formed in a region corresponding to the display region 76, the bonding resin 73 in this region is formed. The average thickness is relatively thicker than that of the non-optical surface forming region 78. Due to this relative difference in thickness, a local gradient of internal stress is generated in the joining resin during thermal contraction, and the joining resin on the thinner side is drawn to the joining resin on the thicker side. It is considered that such a gradient of the internal stress due to the heat shrinkage is a factor that causes the microlens array substrate 70 to shrink unevenly in the thickness direction when the heat treatment is performed. In view of such a point, as a result of scrutinizing research based on experiments and the like, the present applicant has found that the thickness from the opposing surface 71a of the transparent substrate 71 to the opposing surface 72a of the transparent substrate 72 in the optical surface non-forming region 78. Is set to be equal to or less than the depth of the optical surface 75, the effect of internal stress can be effectively reduced, and the microlens array substrate 70 can be contracted substantially uniformly in the thickness direction during heat treatment. I found that there was. Therefore, based on such research results, in the present embodiment in which the depth of the concave curved optical surface 75 is set to, for example, 7 (μm), the thickness of the bonding resin 73 in the optical surface non-forming region 78 is set. The height is set to 7 (μm) or less.
[0039]
In the present embodiment, the refractive indexes of the transparent substrates 71 and 72 are set to, for example, 1.46, and the refractive index of the bonding resin 73 is set to, for example, 1.6. The function as the microlens array substrate 70 for refracting and condensing the light incident from the 71 side on each optical surface 75 is realized.
[0040]
Next, a manufacturing process of the above-described microlens array substrate 70 will be described with reference to FIG.
[0041]
In step S1, a concave curved optical surface 75 is formed on the prepared transparent substrate 71. In the present embodiment, the prepared transparent substrate 71 has a plate thickness of, for example, 1 (mm) or more, and the optical surface 75 is formed by, for example, wet etching. In this optical surface forming step, first, a mask layer 80 is formed on the entire surface of the transparent substrate 71 by a CVD method, a sputtering method, or the like. Thereafter, a desired pinhole 81 corresponding to the arrangement of the optical surfaces 75 is formed on the formed mask layer 80 by a known photolithography method or the like. Then, after the transparent substrate 71 is immersed in, for example, a mixed aqueous solution of hydrogen fluoride and nitric acid to perform etching corresponding to each pinhole 81, the transparent substrate 71 is immersed in, for example, a mixed aqueous solution of hydrofluoric acid and ammonium fluoride. Then, the mask layer 80 is removed. Thus, the transparent substrate 71 in which the optical surfaces 75 are arranged in an array on the surface 71a facing the transparent substrate 72 is obtained.
[0042]
In a succeeding step S2, a bonding resin 73 is applied to the transparent substrate 71. That is, in step S2, a predetermined amount of the bonding resin 73 is uniformly applied to the entire surface of the transparent substrate 71 facing the transparent substrate 72. Here, the amount of the bonding resin 73 to be applied is determined in advance by an experiment or the like. The distance between the surfaces 71a and 72a is set to an appropriate amount so as to be, for example, 7 (μm) or less.
[0043]
In the following step S3, the transparent substrate 72 is attached to the transparent substrate 71 via the applied bonding resin 73, and the bonding resin 73 is cured while performing alignment. As a result, the transparent substrates 71 and 72 are integrally fixed. At this time, the interval between the opposing surfaces 71a and 72a in the optical surface non-forming region 78 is accurately controlled to, for example, 7 (μm) or less. Here, in the present embodiment, similarly to the transparent substrate 71, the prepared transparent substrate 72 has a plate thickness of, for example, 1 (mm) or more.
[0044]
In the subsequent step S4, the transparent substrates 71 and 72 are polished to desired thicknesses (the transparent substrate 71 is, for example, 1 (mm), and the transparent substrate 72 is, for example, 7 (μm)). Thus, the microlens array substrate 70 of FIG. 1 is configured.
[0045]
Next, a panel assembly process will be described with reference to FIG. The element substrate (TFT substrate) 10 and the counter substrate 20 are manufactured separately. As described above, the opposing substrate 20 is configured using the microlens array substrate 70. In steps S11 and S14, polyimide (PI) to be the alignment films 16 and 22 is applied to the TFT substrate 10 and the counter substrate 20 prepared respectively.
[0046]
Next, in Steps S12 and S15, the alignment films 16 and 22 applied to the substrates 10 and 20 are baked at a temperature of, for example, 100 to 200C. At this time, the microlens array substrate 70 constituting the counter substrate 20 is thermally shrunk substantially uniformly in the thickness direction. That is, since the microlens array substrate 70 has a layer made of the bonding resin 73, the microlens array substrate 70 is thermally shrunk in the thickness direction by the heat shrinkage of the bonding resin 73 when the alignment film 22 is fired, as described above. In addition, since the thickness of the bonding resin 73 in the optical surface non-forming region 78 is set to be equal to or less than the depth of the optical surface 75, the gradient of the internal stress generated by the thermal contraction of the bonding resin 73 can be suppressed. As a result, even when thermal contraction occurs in the bonding resin 73, the plate thickness of the seal region 77 set along the outer peripheral portion of the microlens array substrate 70 (the opposing substrate 20) is set to the inner periphery thereof. The thickness of the display region 76 can be maintained substantially the same as that of the display region 76. In other words, the contraction of the sealing region 77 in the thickness direction in the heating step can be made substantially the same as the contraction of the display region 76.
[0047]
Next, in steps S13 and S16, a rubbing process is performed on each of the fired alignment films 16 and 22. Next, in step S17, the element substrate 10 and the opposing substrate 20 are bonded together and pressure-bonded while performing alignment, so that the sealing material 52 is cured. At this time, as described above, since the plate thickness of the seal region 77 is maintained at substantially the same plate thickness as that of the display region 76, the cell gap between the two substrates 10 and 20 can be formed with high precision.
[0048]
Then, in step S18, liquid crystal is sealed from a notch provided in a part of the sealing material 52, the liquid crystal is sealed by closing the notch, and then, in step S19, isotropic processing is performed.
[0049]
According to such an embodiment, by appropriately controlling the thickness of the bonding resin 73 in the optical surface non-formation region 78, the microlens array substrate 70 is contracted in the plate thickness direction by the heat contraction of the bonding resin 73. In this case, the plate thickness of the seal region 77 can be kept substantially the same as that of the display region 76.
[0050]
Therefore, even when the microlens array substrate 70 is used for the counter substrate 20, a good cell gap of the liquid crystal device 200 can be realized, and good optical characteristics can be realized.
[0051]
Next, FIG. 6 relates to a second embodiment of the present invention, and FIG. 6 is a sectional view of a main part showing a microlens array substrate. Note that the present embodiment is different from the first embodiment mainly in that an optical surface 75 is provided on a facing surface 72a of a transparent substrate 72 instead of the facing surface 71a of the transparent substrate 71. In addition, the same components are denoted by the same reference numerals and description thereof is omitted.
[0052]
As shown in FIG. 6, on the opposing surface 72a of the transparent substrate 72, concave curved optical surfaces 75 corresponding to respective pixels in a display area 76 defined in the liquid crystal device 200 are arranged in an array. . Further, on the opposing surface 72 a of the transparent substrate 72, a region outside the display region 76 is set as an optical surface non-formation region 78.
[0053]
Further, the bonding resin 73 is set so that the thickness between the opposing surfaces 71 a and 72 a is equal to or less than the depth of the optical surface 75 in the optical surface non-forming region 78.
[0054]
Also in such an embodiment, by controlling the thickness of the bonding resin 73 in the optical surface non-forming region 78 appropriately, the same effect as in the above-described first embodiment can be obtained.
[0055]
Next, FIG. 7 relates to a third embodiment of the present invention, and FIG. 7 is a sectional view of a main part showing a microlens array substrate. Note that the present embodiment is different from the above-described first embodiment mainly in that a similar optical surface 75 is provided on the opposing surface 72a of the transparent substrate 72 in addition to the opposing surface 71a of the transparent substrate 71. . In addition, the same components are denoted by the same reference numerals, and description thereof is omitted.
[0056]
As shown in FIG. 7, on the opposing surface 72a of the transparent substrate 72, concave curved optical surfaces 75 corresponding to respective pixels in a display area 76 defined in the liquid crystal device 200 are arranged in an array. . Further, on the opposing surface 72 a of the transparent substrate 72, a region outside the display region 76 is set as an optical surface non-formation region 78.
[0057]
In addition, the bonding resin 73 is set so that the thickness between the opposing surfaces 71a and 72a is equal to or less than the depth of the concavely curved optical surface 75 in the optical surface non-forming region 78.
[0058]
Here, the thickness of the joining resin 73 between the opposing surfaces 71a, 71a in the optical surface non-forming region 78 is such that the gradient of the internal stress when the joining resin 73 is thermally contracted is suppressed, and the microlens array substrate 70 is formed. Is a thickness suitable for shrinking substantially uniformly in the plate thickness direction, and is derived by an experiment or the like.
[0059]
Also in such an embodiment, by controlling the thickness of the bonding resin 73 in the optical surface non-forming region 78 appropriately, the same effect as in the above-described first embodiment can be obtained.
[0060]
Next, FIG. 8 relates to a fourth embodiment of the present invention, and FIG. 8 is a sectional view of a main part showing a microlens array substrate. Note that, in the present embodiment, a convex curved optical surface 85 is provided on the opposing surface 72a of the transparent substrate 72 instead of on the opposing surface 71a of the transparent substrate 71. Mainly different. In addition, the same components are denoted by the same reference numerals and description thereof is omitted.
[0061]
As shown in FIG. 8, on the opposing surface 72a of the transparent substrate 72, convex curved optical surfaces 85 corresponding to respective pixels in a display area 76 defined in the liquid crystal device 200 are arranged in an array. . Further, on the opposing surface 72 a of the transparent substrate 72, a region outside the display region 76 is set as an optical surface non-formation region 78.
[0062]
Further, the bonding resin 73 is set so that the thickness between the opposing surfaces 71 a and 72 a in the optical surface non-forming region 78 is equal to or less than twice the height of the optical surface 85.
[0063]
Here, the thickness of the bonding resin 73 between the opposing surfaces 71a, 71a in the optical surface non-forming region 78 is such that the gradient of the internal stress when the bonding resin 73 is thermally contracted is suppressed, and the microlens array substrate 70 is formed. Is a thickness suitable for shrinking substantially uniformly in the plate thickness direction, and is derived by an experiment or the like.
[0064]
Also in such an embodiment, by controlling the thickness of the bonding resin 73 in the optical surface non-forming region 78 appropriately, the same effect as in the above-described first embodiment can be obtained.
[0065]
Next, FIG. 9 relates to a fifth embodiment of the present invention, and FIG. 9 is a sectional view of a main part showing a microlens array substrate. Note that, in the present embodiment, a point that a convex curved optical surface 85 is provided on the opposing surface 71a of the transparent substrate 71 instead of the concave curved optical surface 75 is different from the above-described first embodiment. Primarily different. In addition, the same components are denoted by the same reference numerals, and description thereof is omitted.
[0066]
As shown in FIG. 9, a convex curved optical surface 85 corresponding to each pixel in a display area 76 defined in the liquid crystal device 200 is arranged in an array on the opposing surface 71 a of the transparent substrate 71. . Further, on the facing surface 71 a of the transparent substrate 71, an area outside the display area 76 is set as an optical surface non-formation area 78.
[0067]
Further, the bonding resin 73 is set so that the thickness between the opposing surfaces 71 a and 72 a in the optical surface non-forming region 78 is equal to or less than twice the height of the optical surface 85.
[0068]
Here, the thickness of the joining resin 73 between the opposing surfaces 71a, 71a in the optical surface non-forming region 78 is such that the gradient of the internal stress when the joining resin 73 is thermally contracted is suppressed, and the microlens array substrate 70 is formed. Is a thickness suitable for shrinking substantially uniformly in the plate thickness direction, and is derived by an experiment or the like.
[0069]
Also in such an embodiment, by controlling the thickness of the bonding resin 73 in the optical surface non-forming region 78 appropriately, the same effect as in the above-described first embodiment can be obtained.
[0070]
Next, FIG. 10 relates to a sixth embodiment of the present invention, and FIG. 10 is a sectional view of a main part showing a microlens array substrate. Note that, in the present embodiment, instead of the optical surface 75 provided on the opposing surface 71a of the transparent substrate 71, an optical surface 85 having a convex curved surface is provided on the opposing surfaces 71a and 72a of the transparent substrates 71 and 72. Are mainly different from the above-described first embodiment. In addition, the same components are denoted by the same reference numerals and description thereof is omitted.
[0071]
As shown in FIG. 10, on each of the opposing surfaces 71a and 72a of the transparent substrates 71 and 72, an optical surface 85 having a convex curved surface corresponding to each pixel in a display area 76 defined in the liquid crystal device 200 is formed in an array. Are arranged. Further, on the opposing surfaces 71a, 72a of the transparent substrates 71, 72, the area outside the display area 76 is set as an optical surface non-formed area 78.
[0072]
In addition, the bonding resin 73 is set so that the thickness between the opposing surfaces 71 a and 72 a in the optical surface non-forming region 78 is three times or less the height of the convexly curved optical surface 85.
[0073]
Here, the thickness of the joining resin 73 between the opposing surfaces 71a, 71a in the optical surface non-forming region 78 is such that the gradient of the internal stress when the joining resin 73 is thermally contracted is suppressed, and the microlens array substrate 70 is formed. Is a thickness suitable for shrinking substantially uniformly in the plate thickness direction, and is derived by an experiment or the like.
[0074]
Also in such an embodiment, by controlling the thickness of the bonding resin 73 in the optical surface non-forming region 78 appropriately, the same effect as in the above-described first embodiment can be obtained.
[0075]
Next, FIG. 11 relates to a seventh embodiment of the present invention, and FIG. 11 is a sectional view of a main part showing a microlens array substrate. In the present embodiment, a convex curved optical surface 85 is provided on the opposing surface 71a of the transparent substrate 71 instead of the concave curved optical surface 75, and a concave surface is formed on the opposing surface 72a of the transparent substrate 72. The main difference from the first embodiment is that a curved optical surface 75 is provided. In addition, the same components are denoted by the same reference numerals, and description thereof is omitted.
[0076]
As shown in FIG. 11, on the opposing surface 71 a of the transparent substrate 71, convex curved optical surfaces 85 corresponding to respective pixels in a display area 76 defined in the liquid crystal device 200 are arranged in an array. . Further, on the facing surface 71 a of the transparent substrate 71, an area outside the display area 76 is set as an optical surface non-formation area 78.
[0077]
On the other hand, on the opposing surface 72 a of the transparent substrate 72, concave curved optical surfaces 75 corresponding to respective pixels in a display area 76 defined in the liquid crystal device 200 are arranged in an array. Further, on the opposing surface 72 a of the transparent substrate 72, a region outside the display region 76 is set as an optical surface non-formation region 78.
[0078]
In addition, the bonding resin 73 is set so that the thickness between the opposing surfaces 71 a and 72 a in the optical surface non-formation region 78 is twice or less the height of the convex curved optical surface 85.
[0079]
Here, the thickness of the joining resin 73 between the opposing surfaces 71a, 71a in the optical surface non-forming region 78 is such that the gradient of the internal stress when the joining resin 73 is thermally contracted is suppressed, and the microlens array substrate 70 is formed. Is a thickness suitable for shrinking substantially uniformly in the plate thickness direction, and is derived by an experiment or the like.
[0080]
Also in such an embodiment, by controlling the thickness of the bonding resin 73 in the optical surface non-forming region 78 appropriately, the same effect as in the above-described first embodiment can be obtained.
[0081]
Next, FIG. 12 relates to an eighth embodiment of the present invention, and FIG. 12 is a sectional view of a principal part showing a microlens array substrate. In the present embodiment, in addition to providing the concave curved optical surface 75 on the opposing surface 71a of the transparent substrate 71, a convex curved optical surface 85 is provided on the opposing surface 72a of the transparent substrate 72. This is different from the above-described first embodiment. In addition, the same components are denoted by the same reference numerals, and description thereof is omitted. As shown in FIG. 12, on the opposing surface 71a of the transparent substrate 71, concave curved optical surfaces 75 corresponding to respective pixels in a display area 76 defined in the liquid crystal device 200 are arranged in an array. . Further, on the facing surface 71 a of the transparent substrate 71, an area outside the display area 76 is set as an optical surface non-formation area 78.
[0082]
On the other hand, on the opposing surface 72 a of the transparent substrate 72, convex curved optical surfaces 85 corresponding to respective pixels in a display area 76 defined in the liquid crystal device 200 are arranged in an array. Further, on the opposing surface 72 a of the transparent substrate 72, a region outside the display region 76 is set as an optical surface non-formation region 78.
[0083]
In addition, the bonding resin 73 is set so that the thickness between the opposing surfaces 71 a and 72 a in the optical surface non-formation region 78 is twice or less the height of the convex curved optical surface 85.
[0084]
Here, the thickness of the joining resin 73 between the opposing surfaces 71a, 71a in the optical surface non-forming region 78 is such that the gradient of the internal stress when the joining resin 73 is thermally contracted is suppressed, and the microlens array substrate 70 is formed. Is a thickness suitable for shrinking substantially uniformly in the plate thickness direction, and is derived by an experiment or the like.
[0085]
Also in such an embodiment, by controlling the thickness of the bonding resin 73 in the optical surface non-forming region 78 appropriately, the same effect as in the above-described first embodiment can be obtained.
[Brief description of the drawings]
FIG. 1 is a sectional view of a principal part of a microlens array substrate according to a first embodiment of the present invention. FIG. 2 is a plan view showing a schematic configuration of a liquid crystal device. FIG. FIG. 4 is a flowchart showing a manufacturing process of a microlens array substrate. FIG. 5 is a flowchart showing a panel assembling process of a liquid crystal device. FIG. 6 is a view showing a second embodiment of the present invention. FIG. 7 is a sectional view of a main part showing a microlens array substrate according to a third embodiment of the present invention. FIG. 8 is a sectional view of a main part showing a microlens array substrate according to a third embodiment of the present invention. FIG. 9 is a cross-sectional view of a main part showing a microlens array substrate according to an embodiment. FIG. 9 is a cross-sectional view of a main part showing a microlens array substrate according to a fifth embodiment of the present invention. According to the embodiment, a micro lens FIG. 11 is a sectional view of a principal part showing an array substrate. FIG. 11 is a sectional view of a principal part showing a microlens array substrate according to a seventh embodiment of the present invention. FIG. 12 is a sectional view of an eighth embodiment of the present invention. Sectional view of main part showing microlens array substrate
70 microlens array substrate 71 transparent substrate 71a opposing surface 72 transparent substrate 72a opposing surface 73 bonding resin 75 optical surface 78 optical non-forming area 85 optical surface 200 liquid crystal device

Claims (7)

A pair of transparent substrates bonded to each other via a bonding resin, and a plurality of concave curved optics arranged corresponding to at least pixels on an opposing surface of one of the pair of transparent substrates. A microlens array substrate having a surface and
A microlens array substrate, wherein a thickness of the bonding resin in a region where the optical surface is not formed is set to be equal to or less than a depth of the concave curved optical surface. A pair of transparent substrates bonded to each other via a bonding resin, and a plurality of convexly curved optics arranged corresponding to at least pixels on a facing surface of one of the pair of transparent substrates. A microlens array substrate having a surface and
A microlens array substrate, wherein a thickness of the bonding resin corresponding to a non-formation area of the optical surface is set to be twice or less a height of the convex curved optical surface. A pair of transparent substrates bonded to each other via a bonding resin, and a plurality of concave curved optical surfaces arranged corresponding to at least pixels on an opposing surface of one of the pair of transparent substrates. A microlens array substrate comprising a plurality of convex curved optical surfaces arranged corresponding to the concave curved optical surface on the opposite surface of the other transparent substrate,
A microlens array substrate, wherein the thickness of the bonding resin corresponding to the non-formation area of the optical surface is set to be twice or less the height of the optical surface on the convex curved surface. A microlens array comprising: a pair of transparent substrates bonded to each other via a bonding resin; and a plurality of concave curved optical surfaces arranged at least corresponding to pixels on respective opposing surfaces of the pair of transparent substrates. On the substrate,
A microlens array substrate, wherein a thickness of the bonding resin corresponding to a non-formation area of the optical surface is set to be equal to or less than a depth of the concave curved optical surface. A microlens array comprising: a pair of transparent substrates bonded to each other via a bonding resin; and a plurality of convexly curved optical surfaces arranged on at least opposing surfaces of the pair of transparent substrates corresponding to pixels. On the substrate,
A microlens array substrate, wherein a thickness of the bonding resin corresponding to a non-formation region of the optical surface is set to be three times or less a height of the convex curved optical surface. The microlens array substrate according to any one of claims 1 to 5, wherein the thickness of the bonding resin corresponding to the non-formation area of the optical surface is 7 µm or less. 7. A liquid crystal device comprising the microlens array substrate according to claim 1 used as a counter substrate.

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