JP2004211186A - Etching device, and etching method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an etching device and an etching method by which the surface of an underwater structure can easily be etched by a simple composition. <P>SOLUTION: The etching device where the surface of an underwater structure is etched by remote operation comprises an etching vessel 11, and a cylinder 12 fitted to the etching vessel, and in which a through hole 12a is formed. The hole can be clogged by a valve 15 used for exhausting and recovering an etching liquid. The cylinder can be moved to a horizontal direction by an air cylinder 16B, and the valve can be moved to the horizontal direction by an ar cylinder 16A. The face confronted with a structure 1 is fitted with a cushioning material 20 for retaining airtightness. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an etching apparatus and an etching method used for inspecting a surface property of a structure, and more particularly to an etching apparatus and an etching method effective for a structure installed in water.
[0002]
[Prior art]
Patent Literature 1 discloses an example in which a place where a person cannot easily access or a narrow place is inspected by remote control. In the apparatus described in this document, in order to perform grain boundary etching on the inner surface of the hole, an etching head for ejecting an etching solution is provided at a tip of a cylindrical robot, and a liquid circulation unit for circulating the etching solution is provided. The etching apparatus has control means for controlling supply and discharge of the etching solution to the head, cleaning and drying of the etching surface, temperature control of the etching solution, and the like.
[0003]
Patent Document 2 discloses an example in which a structure or the like installed in water is etched by remote control. In this gazette, in order to measure the degree of sensitization of a metal surface, a housing that detachably and tightly adheres to a metal surface to drain water around the metal surface and hold the polished surface in the air is provided. And a magnifying camera for observing the etched surface. Further, Patent Literature 3 and Patent Literature 4 also disclose a method of inspecting metal surface properties in water.
[Patent Document 1]
Japanese Patent No. 2858049 [Patent Document 2]
JP-A-9-89786 [Patent Document 3]
JP-A-11-271487 [Patent Document 4]
JP 2001-194482 A
[Problems to be solved by the invention]
In any of Patent Documents 1 to 4 described in the section of the prior art described above, a gas-phase space is formed to supply and collect an etching liquid in order to inspect the surface properties of a structure underwater etching. are doing. However, since the formation of the vapor phase space and the supply and recovery of the etchant are all performed by the etching apparatus, there arises a problem that the size of the apparatus main body becomes large and the application to narrow portions and the like is limited. Further, as the size of the apparatus increases, the work procedure becomes complicated, and in the case of an underwater structure where remote control is required, the operability of remote control is reduced.
[0005]
For underwater structures related to nuclear power, it is necessary to form a gas-phase space for etching and make it a closed space, but it is difficult to form a closed space at structural discontinuities such as welds and corners. is there. Therefore, a complicated mechanism is required to form the closed space.
[0006]
The present invention has been made in view of the above-mentioned disadvantages of the related art, and has as its object to etch an underwater structure with a simple configuration. Another object of the present invention is to facilitate inspection of the surface properties of underwater structures. Another object of the present invention is to realize etching with reduced contamination to the surroundings. The present invention aims to achieve at least one of these objects.
[0007]
[Means for Solving the Problems]
The feature of the present invention that achieves the above object is that in an etching apparatus for etching the surface of a structure underwater by remote control, an etching container, a cylinder having a through hole formed movably fitted to the etching container, A valve that can close the hole and is used to discharge and recover the etching solution.
[0008]
In this aspect, it is preferable that an actuator for moving the cylinder is attached to the container, and the actuator is connected to the cylinder. A partitioning means for partitioning the container is provided, and at least one of the sections partitioned by the partitioning means is used for cleaning. The liquid may be held. Further, it is preferable that the etchant is held in a space between the cylinder and the container formed by moving the cylinder.
[0009]
Further, it is preferable to provide a means for releasing gas generated at the time of etching to the outside, and the gas releasing means includes a gas reservoir for temporarily storing gas generated by etching, and a gas release cylinder for moving gas by increasing gas pressure. And a cylinder supporting means for supporting the gas release cylinder, and a check valve for flowing gas generated by etching. Furthermore, it is desirable to provide a cushioning material for buffering the surface unevenness of the structure on the end face of the etching container and facing the structure. Furthermore, an electrode for generating a potential between the structure and the structure via an etching solution may be provided.
[0010]
Another feature of the present invention to achieve the above object is an etching method for remotely etching an underwater structure, comprising an etching container containing an etching solution and a cylinder connected to the container via a valve. The valve is opened while pressing the etching apparatus having an etching device having an underwater structure against the portion to be etched, the cylinder is separated from the portion to be etched, and the etchant stored between the cylinder and the etching container is brought into contact with the portion to be etched, After a lapse of time, the cylinder is moved in the reverse direction, and the etching liquid is collected between the cylinder and the etching container.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the etching apparatus according to the present invention will be described with reference to the drawings. FIG. 1 is a side view of the etching apparatus and a cross-sectional view taken along the line AA. The edge device 10 is attached to the tip of an operation pole 19 that forms a part of a manipulator device (not shown). This is also remotely controlled by a control device (not shown).
[0012]
The etching apparatus 10 has a cylindrical etching container 11 and a cylinder 12 housed inside the container 11. A hole 12a is formed so as to be displaced upward from the center of the cylinder 12. A valve 15 used for discharging or collecting the etching solution is fitted into the hole 12a. The valve 15 is movable in the lateral direction. On the back side of the cylinder 12, an etching solution reservoir 14 for containing an etching solution 13 is formed. That is, the etching liquid reservoir 14 is airtight by the cylinder 12 and the valve 15.
[0013]
The piston 16AA of the air cylinder 16A is connected to the end opposite to the side where the valve 15 is attached to the hole 12a. This air cylinder 16A is attached to the other side surface of the container 11. An air cylinder 16A and another air cylinder 16B in the vertical direction are also attached to this side surface of the container 11. The piston 16BB of the air cylinder 16B is connected to the back of the cylinder 12. The cylinder 12 is movable in the lateral direction of the container 11. An air hose 17 is connected to the air cylinders 16A and 16B, and is remotely driven by air supplied from a driving device (not shown). The lower side surface of the container 11 is attached to a fixing jig 18 having one end connected to an operation pole 19. On a surface of the etching apparatus 10 facing the structure 1, a buffer material 20 having an etching solution discharge and recovery port 22 formed at a position corresponding to the valve 15 is attached. This cushioning material 20 has substantially the same size as the outer diameter of the container 11, and absorbs interference due to unevenness when the unevenness of the structure surface is large.
[0014]
FIG. 2 shows details of the etching operation using the etching apparatus configured as described above. In the present embodiment, the surface of the structure 1 immersed in water is etched by remote control. To remotely control the etching apparatus 10, the lower part of the etching apparatus 10 is mounted on a fixing jig 18, and the fixing jig 18 is mounted on the tip of an operation pole 19. The etching solution reservoir 14 of the etching apparatus 10 is filled with the etching solution 13 in advance. In order to bring the cylinder 12 into contact with the structure 1, the piston 16BB of the air cylinder 16B is extended to the maximum length side, and the cylinder 12 is positioned on the front side of the etching container 11. The piston 16AA of the air cylinder 16A is extended to the maximum length side so that the etching liquid 13 does not leak from the etching liquid reservoir 14, and the etching liquid discharging and collecting port 21 is closed by the etching liquid discharging and collecting valve 15.
[0015]
First, the operation pole 19 is remotely operated using the control device, and the etching device 10 is guided to a position near the etching of the structure 1. Next, the etching apparatus 10 is arranged to face the portion to be etched of the structure 1 (see FIG. 2A). As shown in FIG. 2B, the operation pole 19 is moved in the lateral direction, and the etching apparatus 10 is pressed against the structure 1. Since the cushioning material 20 is disposed on the surface of the etching container 11 on the side that comes into contact with the structure 1, even if there is unevenness on the surface of the structure 1 due to welding excess or the like, the etching container 11 can be used. It is possible to contact the structure 1 without gaps. A sponge, rubber or resin material is used as the cushioning material.
[0016]
While the etching apparatus 10 is pressed against the structure 1, air is supplied to an air cylinder 16 </ b> A connected to the etchant discharge and recovery valve 15. As shown in FIG. 2C, the supplied air causes the piston 16AA of the air cylinder 16A to be retracted to the minimum length side, and accordingly, the etchant discharge and recovery valve 15 moves in the piston axial direction. Since the valve 15 has moved in the axial direction (lateral direction), the hole 12a is opened, the surface of the structure 1 communicates with the etching solution reservoir 14, and the hole 12a is also filled with the etching solution.
[0017]
Thereafter, air is supplied to the air cylinder 16B on the cylinder 12 side. The cylinder 12 pushes the etching solution 13 in the etching solution reservoir 14 by the air supplied to the cylinder 12. At this time, the valve 15 that has closed the hole 12a moves in the axial direction to open the hole 12a, so that the etching solution 13 pressurized by the cylinder 12 passes through the etching solution discharge and recovery port 21, and It is discharged between the etching target part 1 and the etching container 11. Since the etching liquid 13 has moved to the front side of the cylinder 12, the cylinder 12 separates from the structure 1 (see FIG. 2D). The cylinder 12 is retracted from the structure 1 until the cylinder 12 substantially contacts the back of the container 11.
[0018]
The state shown in FIG. 2D is maintained for a time necessary for the etching. When the surface of the portion to be etched of the structure 1 is corroded, air is supplied to the air cylinder 16B on the cylinder 12 side (see FIG. 2E). Since the piston 16BB of the air cylinder 16B extends, the cylinder 12 pressurizes the etching liquid 13 that has moved to the structure 1 side. The pressurized etchant 13 moves to the back side of the cylinder 12 via the etchant discharge and recovery port 21 and the hole 12a. This operation is continued until all the etching liquid 13 that has moved to the front side of the cylinder 12 returns to the back side of the cylinder. The cylinder 12 moves to the original position.
[0019]
When the etchant 13 returns to the back side of the cylinder 12, air is supplied to the air cylinder 16A. The piston 16AA of the air cylinder 16A extends, moves the etchant discharge and recovery valve 15 in the axial direction of the piston, and closes the hole 12a with the valve 15 (see FIG. 2 (f)). By this operation, the etching liquid 13 can be removed from the portion to be etched of the structure 1, and the etching apparatus 10 can collect the etching liquid 13 used for the etching. When the etching operation is completed, the operation pole 19 is driven by remote control to separate the etching apparatus 10 from the portion to be etched of the structure 1 (see FIG. 2G). Thereafter, the etching apparatus 10 is pulled up to the surface of the water, and the etching solution 13 stored in the etching solution reservoir 14 is collected.
[0020]
According to the present embodiment, etching can be performed without damaging the portion of the structure other than the portion to be etched. Also, the procedure required for the etching operation can be greatly reduced as compared with the conventional case. As a result, work time can be reduced. Further, since the operation steps are simple, operation errors can be reduced. Further, according to the embodiment, since the etching apparatus can be composed of only a small number of components such as a container, a cylinder and a valve, the etching apparatus can be simplified. Further, since the number of parts is small, the device can be downsized. As a result, device manufacturing costs can be reduced. A wide area can be etched at the same cost as in the past.
[0021]
Another embodiment of the present invention is shown in FIG. FIG. 3 is a side view of the etching apparatus according to the present embodiment and a BB cross-sectional view thereof. This embodiment is different from the above embodiment in that a highly viscous solution is used as an etching solution. If the viscosity of the etchant is high, the surface must be cleaned after the etching operation. Therefore, the etching apparatus 10 has a function of discharging and collecting the cleaning liquid in addition to the etching function shown in FIG.
[0022]
Specifically, the inside of the container 11 is divided into upper and lower parts by a partition wall 32, and the same etching parts as shown in FIG. 1 are arranged in the lower part to perform an etching function, and the cleaning parts are arranged in the upper part. Are placed. The etching parts include a cylinder 12b for pressurizing the etching solution 13, a valve 15 fitted in a hole 21b formed in the cylinder 12b, an air cylinder 16A for moving the valve 15 in the axial direction, and a cylinder 12b for moving in the axial direction. An air cylinder 16b to be moved and an air hose 17 for supplying air to each of the air cylinders 16a and 16b are provided. An etching solution reservoir 14b containing an etching solution 13b is formed on the back surface of the cylinder 12b.
[0023]
The cleaning parts arranged in the upper part of the container 11 have the same configuration as the etching parts. That is, the cleaning cylinder 30 is disposed movably with respect to the container 11 on the upper portion of the container 11 partitioned by the partition wall 32. A hole 30b is formed through the cleaning cylinder 30. A cushioning material 20c having a port 34 for discharging and recovering the cleaning liquid is formed on the front side of the cylinder 30 and facing the structure. A valve 31 for discharging and collecting the cleaning liquid is provided so as to be fitted from the back side of the hole 30b of the cylinder 30. The piston 16CC of the air cylinder 16C is connected to the valve 31. The air cylinder 16 </ b> C is mounted on the back side of the container 11. An air cylinder 16D is attached to the container 11 so as to be vertically aligned with the air cylinder 16C. The piston 16DD of the air cylinder 16D is connected to the back of the cylinder 30. The cleaning liquid reservoir formed by the movement of the cylinder 30 is filled with the cleaning liquid 33.
[0024]
The operation of the present embodiment configured as described above will be described below. The etching process is performed in the same manner as the operation of the embodiment shown in FIG. Thereafter, air is supplied from the air hose 17b to the air cylinder 16C to operate the air cylinder 16C to open the hole 30b. Next, the air cylinder 16D is operated to move the cylinder 30 in the piston axial direction (lateral direction). As a result, the cleaning liquid 33 is pushed out from the opening 34 toward the structure 1. When the surface of the structure 1 is cleaned and the etching liquid 13b can be removed, the air cylinder 16C is operated to close the hole 30b with the valve 32. When the hole 30b is closed, the air cylinder 16D is operated to return the cylinder 30 to its original position.
[0025]
This embodiment is suitable for an environment where the remaining of the etchant is a concern, for example, an environment where water quality is strictly controlled, an environment where food is handled, and the like. Further, according to the present embodiment, cleaning after the etching process can be performed with a simple mechanism, so that the etching and cleaning apparatus can be downsized. As a result, the manufacturing cost of the etching apparatus can be reduced.
[0026]
FIG. 4 shows a side view and a CC sectional view of still another embodiment of the present invention. This embodiment is different from the embodiment shown in FIG. 1 in that it has a gas releasing means for removing gas generated during etching. In the etching process, the airtightness between the etching apparatus 10 and the portion to be etched of the structure 1 is prevented from being broken. The degassing means 50 is mounted so as to be located at the uppermost part of the etching apparatus 10 when the etching apparatus 10 is used. A gas vent hole 51 communicating with the inside of the container 11c is formed at the position of the container 11c corresponding to the position where the gas venting means 50 is attached.
[0027]
The degassing means 50 includes a gas reservoir container 56 for accommodating gas generated by etching, a degassing cylinder 52 movably disposed in the container 56, and a cylinder support for pressing the cylinder 52 with a predetermined force. It has a member 53 and a check valve 54 for preventing fluid from entering from outside. The gas reservoir 56 is provided with a gas discharge port 57 for allowing gas to escape in the direction of the arrow 55 to escape to the outside. The cylinder support member 53 generates a force in a direction opposite to the direction in which the gas pressure acts.
[0028]
According to the present embodiment configured as described above, the gas generated by the etching process is guided to the gas releasing means 50 through the gas releasing hole 51. When the gas pressure rises, the gas release cylinder 52 is pushed up. The gas release cylinder 52 is pressed by a cylinder support member 53 with a constant force in a direction opposite to the gas pressure. As the cylinder support member 53, a spring, a hydraulic drive member, or an air drive member is preferably used.
[0029]
As the amount of generated gas increases, the amount of displacement of the gas release cylinder 52 increases. When the displacement amount of the gas release cylinder 52 becomes equal to or more than a predetermined amount, the gas is released from the gas discharge port 57 formed in the gas reservoir container 56 to the outside via the check valve 54. When the gas release cylinder 52 is displaced above the gas discharge port 57 and gas is released, and the gas pressure that has pressed the gas release cylinder 52 decreases, the gas release cylinder 52 is again pressed by the pressing force of the cylinder support member 53. It returns below the gas outlet 57. When the gas continues to be generated, the above operation is repeated in the degassing means 50. Thereby, each time the generated gas reaches a predetermined amount, it is released to the outside of the etching apparatus 10, and the pressure in the etching container 11 is kept constant.
[0030]
When using in an environment where the generated gas cannot be released to the outside, such as when releasing a soluble gas into an environment where water quality is strictly controlled, a balloon-like member that expands and contracts due to gas pressure may be installed. It is preferable to connect a tube for guiding gas to a storage container on the ground. In addition, although airtightness is required for performing the etching treatment, airtightness of the etching container can be ensured even if a gas venting means is attached. Since the degassing means is provided in the etching apparatus, the selection range of the structural material and the sealing material for ensuring the airtightness of the etching apparatus is widened, and the apparatus can be reduced in size and cost.
[0031]
When performing the etching treatment using the etching apparatus shown in each of the above embodiments, the etching liquid may be immersed or the etching liquid may be applied. As another method, there is an electrolytic etching method in which an etching member is immersed in an etching solution to apply a potential. FIG. 5 is a side view and an DD sectional view of an example in which this electrolytic etching is applied to the present invention. Indicated by This embodiment is different from the embodiment shown in FIG. 4 in that an electrolytic etching wiring 60 for applying a potential to the cylinder 12 is attached.
[0032]
In the electrolytic etching, the cushioning material 20 is not attached to the surface of the cylinder 12. Instead, the surface of the cylinder 12 is coated with a material having excellent corrosion resistance, such as platinum, gold, or titanium. In addition, since a current flows between the cylinder 12 as the counter electrode and the structure 1 via the etchant 13, the etching ground 61 is attached to the structure 1.
[0033]
The working procedure of this embodiment is almost the same as that shown in FIG. However, in order to stabilize the current flowing between the cylinder 12 and the structure 1 at the stage (c) or (d) in FIG. Is applied. According to the present embodiment, since the potential between the cylinder and the structure is stabilized, the electrolytic etching can be performed with high work efficiency.
[0034]
Since the etching apparatus of each of the above embodiments is merely screwed to the fixing jig, when creating a replica or the like after the etching is completed, loosen the screw of the fixing jig, remove the etching apparatus, and remove the replica apparatus. Only need to be installed. Therefore, it is possible to completely remote control from the etching process to the replica creation. Also, only one set of operation poles is required, and even when used in a small work space, the etching surface can be easily accessed.
[0035]
【The invention's effect】
According to the present invention, since the etching container is made airtight and the cylinder is loosely fitted in the container, it is possible to move the etching liquid through the cylinder, and the etching can be performed with a simple configuration, and the etching can be performed after the etching. The etching solution can be recovered. Further, the size of the apparatus can be reduced, and the manufacturing cost can be reduced.
[Brief description of the drawings]
FIG. 1 is a side view and a longitudinal sectional view of an embodiment of an etching apparatus according to the present invention.
FIG. 2 is a diagram illustrating an etching method using the etching apparatus shown in FIG.
FIG. 3 is a side view and a longitudinal sectional view of another embodiment of the etching apparatus according to the present invention.
FIG. 4 is a side view and a longitudinal sectional view of still another embodiment of the etching apparatus according to the present invention.
FIG. 5 is a side view and a longitudinal sectional view of still another embodiment of the etching apparatus according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Structure, 10 ... Etching apparatus, 11 ... Etching container, 12 ... Cylinder, 12a ... Through-hole, 13 ... Etching solution, 14 ... Etching solution reservoir, 15 ... Etching solution discharge and collection valve, 16A, 16B ... Air cylinder , 17 ... Air hose, 18 ... Fixing jig, 19 ... Operation pole, 20 ... Buffer material, 21 ... Etching liquid discharge and recovery port, 30 ... Cylinder, 31 ... Cleaning liquid discharge and recovery valve, 32 ... Partition wall, 33 ... Cleaning liquid Pool, 34 opening, 50 gas releasing means, 51 gas releasing hole, 52 cylinder, 53 cylinder support member, 54 check valve, 55 gas releasing direction, 56 gas container, 57 gas outlet , 60 ... wiring, 61 ... ground.

Claims (9)

In an etching apparatus for etching a surface of an underwater structure by remote control, an etching container, a cylinder movably fitted to the etching container and having a through-hole formed therein, and a hole capable of closing the hole and discharging an etching liquid. And a valve used for recovery. The etching apparatus according to claim 1, wherein an actuator for moving the cylinder is attached to the container, and the actuator is connected to the cylinder. 3. The etching apparatus according to claim 2, wherein a partitioning means for partitioning the container is provided, and at least one of the portions partitioned by the partitioning means holds a cleaning liquid. 2. The etching apparatus according to claim 1, further comprising means for discharging gas generated during etching to the outside. The gas releasing means includes: a gas reservoir for temporarily storing gas generated by etching; a gas releasing cylinder for moving gas by increasing gas pressure; a cylinder supporting means for supporting the gas releasing cylinder; and a gas generated by etching. The etching apparatus according to claim 4, further comprising a check valve for flowing the gas. 2. The etching apparatus according to claim 1, wherein a buffer material for buffering the surface unevenness of the structure is provided on a surface facing the structure at the end of the etching container. The etching apparatus according to claim 1, further comprising an electrode for generating a potential between the structure and the structure via an etching solution. The etching apparatus according to claim 2, wherein an etching solution is held in a space between the cylinder and the container formed by moving the cylinder. An etching method for remotely etching an underwater structure, comprising pressing an etching apparatus having an etching container containing an etching solution and a cylinder connected to the container via a valve to an etching target portion of the underwater structure. While the valve is open, the cylinder is separated from the etching target portion by opening the valve, the etching liquid stored between the cylinder and the etching container is brought into contact with the etching target portion, and after a predetermined time has elapsed, the cylinder is moved in the opposite direction, and the etching liquid is transferred to the cylinder. An etching method characterized by collecting between an etching container and an etching container.

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