JP2004207258A5 - - Google Patents

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Publication number
JP2004207258A5
JP2004207258A5 JP2002341445A JP2002341445A JP2004207258A5 JP 2004207258 A5 JP2004207258 A5 JP 2004207258A5 JP 2002341445 A JP2002341445 A JP 2002341445A JP 2002341445 A JP2002341445 A JP 2002341445A JP 2004207258 A5 JP2004207258 A5 JP 2004207258A5
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JP
Japan
Prior art keywords
light emitting
emitting element
package according
frame
storage package
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Application number
JP2002341445A
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Japanese (ja)
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JP4163932B2 (en
JP2004207258A (en
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Priority to JP2002341445A priority Critical patent/JP4163932B2/en
Priority claimed from JP2002341445A external-priority patent/JP4163932B2/en
Publication of JP2004207258A publication Critical patent/JP2004207258A/en
Publication of JP2004207258A5 publication Critical patent/JP2004207258A5/ja
Application granted granted Critical
Publication of JP4163932B2 publication Critical patent/JP4163932B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Claims (6)

上面に発光素子の搭載部を有する基体と、該基体上に形成され、前記発光素子が収容される貫通孔を有する枠体とを備えた発光素子収納用パッケージにおいて、前記枠体の貫通孔の内面に金属層が被着され、該金属層上にニッケルめっき層および銀めっき層が順次被着されていることを特徴とする発光素子収納用パッケージ。 A substrate having a mounting portion of the light emitting element on the upper surface, is formed on the substrate, the light emitting device package for housing a frame having a through hole through which the light emitting element Ru is accommodated, the through hole of the frame A light emitting element storage package, wherein a metal layer is deposited on an inner surface, and a nickel plating layer and a silver plating layer are sequentially deposited on the metal layer. 前記基体および前記枠体がセラミックスから成ることを特徴とする請求項１記載の発光素子収納用パッケージ。2. The light emitting element storage package according to claim 1, wherein the base body and the frame body are made of ceramics. 前記枠体が白色の酸化アルミニウム質焼結体から成ることを特徴とする請求項２記載の発光素子収納用パッケージ。3. The light emitting element storage package according to claim 2, wherein the frame is made of a white aluminum oxide sintered body. 前記金属層がタングステンおよびモリブデンを含むことを特徴とする請求項１乃至請求項３のいずれかに記載の発光素子収納用パッケージ。4. The light emitting element storage package according to claim 1, wherein the metal layer contains tungsten and molybdenum. 前記貫通孔は、横断面形状が略楕円形であるとともに内面が前記枠体の下面から上面に向けて広がるように傾斜していることを特徴とする請求項１記載の発光素子収納用パッケージ。  2. The light emitting element storage package according to claim 1, wherein the through-hole has a substantially elliptical cross-sectional shape and is inclined so that an inner surface extends from a lower surface to an upper surface of the frame body. 請求項１乃至請求項５のいずれかに記載の発光素子収納用パッケージと、前記搭載部に搭載された発光素子と、該発光素子を覆う透明樹脂とを具備したことを特徴とする発光装置。Emitting device comprising: the light-emitting element storing package according to any one of claims 1 to 5, a light emitting element mounted on the mounting portion, characterized by comprising a transparent resin covering the light emitting element.
JP2002341445A 2002-10-28 2002-11-25 Light emitting element storage package and light emitting device Expired - Fee Related JP4163932B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002341445A JP4163932B2 (en) 2002-10-28 2002-11-25 Light emitting element storage package and light emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002312878 2002-10-28
JP2002341445A JP4163932B2 (en) 2002-10-28 2002-11-25 Light emitting element storage package and light emitting device

Publications (3)

Publication Number Publication Date
JP2004207258A JP2004207258A (en) 2004-07-22
JP2004207258A5 true JP2004207258A5 (en) 2005-10-20
JP4163932B2 JP4163932B2 (en) 2008-10-08

Family

ID=32828189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002341445A Expired - Fee Related JP4163932B2 (en) 2002-10-28 2002-11-25 Light emitting element storage package and light emitting device

Country Status (1)

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JP (1) JP4163932B2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101080097B1 (en) 2004-08-16 2011-11-07 서울반도체 주식회사 Light emitting diode package employing a ceramic body
KR101154801B1 (en) * 2004-12-03 2012-07-03 엔지케이 스파크 플러그 캄파니 리미티드 Ceramic package for receiving ceramic substrate and light emitting device
US7683393B2 (en) * 2004-12-07 2010-03-23 Ngk Spark Plug Co., Ltd. Wiring substrate for mounting light emitting element
US8029152B2 (en) 2005-03-24 2011-10-04 Kyocera Corporation Package for light-emitting device, light-emitting apparatus, and illuminating apparatus
JP4671748B2 (en) * 2005-04-25 2011-04-20 京セラ株式会社 WIRING BOARD FOR LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE
JP4452216B2 (en) * 2005-06-29 2010-04-21 日本特殊陶業株式会社 Ceramic package for light emitting device and method for manufacturing the same
EP2099068A4 (en) 2006-12-28 2011-01-26 Tokuyama Corp Process for producing metallized aluminum nitride substrate
KR100877881B1 (en) 2007-09-06 2009-01-08 엘지이노텍 주식회사 Lighting emitting diode package and fabrication method thereof
JP2009230060A (en) * 2008-03-25 2009-10-08 Seiko Epson Corp Electrophoresis device and electronic device
JP2010199547A (en) 2009-01-30 2010-09-09 Nichia Corp Light emitting device and method of manufacturing same
JP5549428B2 (en) * 2010-06-30 2014-07-16 東芝ライテック株式会社 Light emitting module and lighting apparatus equipped with the same
CN105870288B (en) * 2016-04-27 2018-08-14 天津三安光电有限公司 Light emitting diode and preparation method thereof

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