JP2004204265A5 - - Google Patents
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- Publication number
- JP2004204265A5 JP2004204265A5 JP2002372706A JP2002372706A JP2004204265A5 JP 2004204265 A5 JP2004204265 A5 JP 2004204265A5 JP 2002372706 A JP2002372706 A JP 2002372706A JP 2002372706 A JP2002372706 A JP 2002372706A JP 2004204265 A5 JP2004204265 A5 JP 2004204265A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plating
- thin film
- oxide thin
- metal oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (9)
前記基板ホルダで保持した基板の表面にめっき液を接触させる手段と、
前記基板ホルダで保持しめっき液を接触させた基板の表面に向けて、前記金属酸化薄膜のバンドギャップに対応する波長以下の波長の光を照射する光源とを有することを特徴とするめっき装置。A substrate holder for holding a substrate on which an embedded wiring is formed and a metal oxide thin film having photoelectrochemical reactivity is formed on the exposed surface of the wiring;
Means for bringing the plating solution into contact with the surface of the substrate held by the substrate holder;
A plating apparatus comprising: a light source that emits light having a wavelength equal to or less than a wavelength corresponding to a band gap of the metal oxide thin film toward a surface of the substrate held by the substrate holder and in contact with a plating solution.
前記基板の表面にめっき液を接触させつつ、該表面に向けて光を照射するめっき装置とを有することを特徴とする基板処理装置。An oxide thin film forming apparatus for forming a metal oxide thin film on the exposed surface of the embedded wiring formed on the surface of the substrate;
A substrate processing apparatus comprising: a plating apparatus that irradiates light toward the surface of the substrate while bringing a plating solution into contact therewith.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002372706A JP3938356B2 (en) | 2002-12-24 | 2002-12-24 | Plating method and substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002372706A JP3938356B2 (en) | 2002-12-24 | 2002-12-24 | Plating method and substrate processing apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004204265A JP2004204265A (en) | 2004-07-22 |
| JP2004204265A5 true JP2004204265A5 (en) | 2005-08-25 |
| JP3938356B2 JP3938356B2 (en) | 2007-06-27 |
Family
ID=32811236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002372706A Expired - Fee Related JP3938356B2 (en) | 2002-12-24 | 2002-12-24 | Plating method and substrate processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3938356B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006111938A (en) * | 2004-10-15 | 2006-04-27 | Tokyo Electron Ltd | Electroless plating apparatus |
| CN103184440B (en) * | 2011-12-27 | 2015-12-02 | 比亚迪股份有限公司 | Goods of a kind of surface selective metallization and preparation method thereof |
| JP6188063B2 (en) * | 2012-07-11 | 2017-08-30 | 国立大学法人大阪大学 | Ink composition for forming metal pattern and method for forming metal pattern |
-
2002
- 2002-12-24 JP JP2002372706A patent/JP3938356B2/en not_active Expired - Fee Related
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