JP2004200721A - Heat radiator for cooling heat generating component - Google Patents

Heat radiator for cooling heat generating component Download PDF

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JP2004200721A
JP2004200721A JP2004074738A JP2004074738A JP2004200721A JP 2004200721 A JP2004200721 A JP 2004200721A JP 2004074738 A JP2004074738 A JP 2004074738A JP 2004074738 A JP2004074738 A JP 2004074738A JP 2004200721 A JP2004200721 A JP 2004200721A
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heat
absorbing plate
generating component
wall surface
cooling
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JP4002249B2 (en
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Masaaki Yamamoto
雅章 山本
Chika Sasaki
千佳 佐々木
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiator for cooling the heat generating component where heat absorption efficiency and radiation characteristics in a heat sink plate are excellent. <P>SOLUTION: In the heat radiator for cooling the heat generating components provided with a heat sink plate 10 which absorbs heat generated from the component 40, a heat pipe 20 which is fixed to the heat sink plate 10 and transports the heat and a fan 30 which radiates the heat absorbed by the heat sink plate 10 to the outside, a wall surface is formed by bending the side section of the heat sink plate 10 and the component 40 is positioned on the internal surface of the heat sink plate 10 which forms the wall surface, and the heat pipe 20 is positioned to allow the longitudinal direction of the heat pipe 20 to be directed from the side of the component 40 to the side of the fan 30. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

本発明は、発熱部品冷却用放熱装置の改良に関するものである。   The present invention relates to an improvement in a heat radiating device for cooling a heat-generating component.

近年、電子機器を構成する電子部品において、ＩＣ、ＬＳＩ等の半導体素子あるいはモジュール等が高密度化、高速化しており、これに伴い使用時の発熱量が大幅に増大してきている。このためにこれらの発熱部品を内部に収納した筐体内の熱を効率よく放熱して発熱部品を冷却するための放熱技術が重要な課題となっている。   2. Description of the Related Art In recent years, in electronic components constituting electronic devices, semiconductor elements such as ICs and LSIs, modules, and the like have been increased in density and speed, and accordingly, the amount of heat generated during use has been greatly increased. For this reason, a heat radiation technique for efficiently radiating heat in a housing in which these heat generating components are housed to cool the heat generating components has become an important issue.

従来、筐体内に収納した発熱部品から発生する熱を筐体外に放熱させて発熱部品を冷却するようにした発熱部品冷却用放熱装置として、図４（イ）（ロ）に示すように、吸熱板１０と、ヒートパイプ２０と、ファン３０とを備えてなるものが使用されている（特許文献１、２）。   Conventionally, a heat-generating component cooling radiator that cools the heat-generating component by radiating heat generated from the heat-generating component housed in the housing to the outside of the housing as shown in FIGS. A device including a plate 10, a heat pipe 20, and a fan 30 is used (Patent Documents 1 and 2).

吸熱板１０は、アルミ板、銅板、マグネシウム板等熱伝導の良い金属板で平らに形成されている。この吸熱板１０は、発熱部品４０（例えばＣＰＵ）の上面に接触して該発熱部品４０からの発熱を吸収するためのものである。吸熱板１０が発熱部品４０に良好に接触するように吸熱板１０には突出した絞り加工部１１が形成してあり、該絞り加工部１１が発熱部品４０の上面に接触している。   The heat absorbing plate 10 is formed flat from a metal plate having good heat conductivity such as an aluminum plate, a copper plate, a magnesium plate, or the like. The heat absorbing plate 10 comes into contact with the upper surface of the heat generating component 40 (for example, CPU) to absorb heat generated from the heat generating component 40. The heat-absorbing plate 10 is formed with a protruding drawn portion 11 so that the heat-absorbing plate 10 is in good contact with the heat-generating component 40, and the drawn portion 11 is in contact with the upper surface of the heat-generating component 40.

ヒートパイプ２０は、吸熱板１０の側面位置に固定されている。符号２１がヒートパイプ２０の固定部であり、吸熱板１０の一部側面を折り曲げることによってヒートパイプ２０を固定している。このヒートパイプ２０は、吸熱板１０で吸熱した熱を後述するファン３０側に熱輸送し、放熱を促進するためのものである。このヒートパイプは、外径が１〜６ｍｍ程度で、作動液として水、フロン、代替フロン、フロリナート等を使用し、銅またはアルミ等で形成されている。   The heat pipe 20 is fixed to a side surface position of the heat absorbing plate 10. Reference numeral 21 denotes a fixing portion of the heat pipe 20, and the heat pipe 20 is fixed by bending a part of the side surface of the heat absorbing plate 10. The heat pipe 20 serves to transport the heat absorbed by the heat absorbing plate 10 to a fan 30 described later to promote heat radiation. This heat pipe has an outer diameter of about 1 to 6 mm, and is made of copper, aluminum, or the like using water, chlorofluorocarbon, alternative fluorocarbon, florinate, or the like as a working fluid.

ファン３０は、例えば小型の軸流ファンが使用されており、吸熱板１０の一端側に位置している。すなわち、このファン３０は、吸熱板１０の一端側の筐体５０の壁面に取付けられている。   The fan 30 is, for example, a small axial fan, and is located at one end of the heat absorbing plate 10. That is, the fan 30 is attached to the wall surface of the housing 50 at one end of the heat absorbing plate 10.

なお、前記発熱部品４０、吸熱板１０およびヒートパイプ２０は筐体５０内に配置されているものであり、また筐体５０の中には他の機器（図示せず）が収納されているものである。また筐体５０の一部分には空気流入孔（図示せず）が設けられている。さらに符号６０は発熱部品４０が取付けられたプリント基板を示す。   The heat-generating component 40, the heat-absorbing plate 10, and the heat pipe 20 are disposed in a housing 50, and other devices (not shown) are housed in the housing 50. It is. An air inlet (not shown) is provided in a part of the housing 50. Reference numeral 60 denotes a printed circuit board to which the heat generating component 40 is attached.

上記構成からなる発熱部品冷却用放熱装置は、発熱部品４０からの発熱を吸熱板１０で吸熱すると共にヒートパイプ２０で熱輸送し、これらの熱をファン３０を回転させることによって筐体５０の外に放熱するものである。   The heat-radiating device for cooling a heat-generating component having the above-described configuration absorbs heat generated from the heat-generating component 40 by the heat absorbing plate 10 and transports the heat by the heat pipe 20. To dissipate heat.

実開昭５５−０７５１６２号公報Japanese Utility Model Publication No. 55-075162 特開昭５７−０８４９８９号公報JP-A-57-084989

しかしながら、上記構成の発熱部品冷却用放熱装置は、吸熱板１０が平らに形成されているので、発熱部品４０からの発熱が吸熱板１０の周囲に拡散し易く、このために吸熱板１０での吸熱効率が悪いという問題があった。また吸熱板１０に沿って空気が流れ難くこのために放熱特性が悪いという問題があった。   However, in the heat radiating device for cooling the heat generating component having the above-described configuration, since the heat absorbing plate 10 is formed flat, the heat generated from the heat generating component 40 is easily diffused around the heat absorbing plate 10. There was a problem that heat absorption efficiency was poor. In addition, there is a problem that the air does not easily flow along the heat absorbing plate 10 and thus the heat radiation characteristics are poor.

本発明は上記の如き課題を解決した発熱部品冷却用放熱装置を提供するものであり、その構成は、発熱部品からの発熱を吸熱する吸熱板と、該吸熱板に固定されて熱輸送を行うヒートパイプと、吸熱板で吸熱した熱を外部に放熱するファンを備えてなる発熱部品冷却用放熱装置において、前記吸熱板の側面部を折り曲げて壁面を形成すると共に該壁面を形成した吸熱板の内面上に発熱部品を位置させ、かつ前記ヒートパイプを、前記ヒートパイプの長手方向が前記発熱部品側から前記ファン側に向くように位置させたことを特徴とする発熱部品冷却用放熱装置である。   SUMMARY OF THE INVENTION The present invention provides a heat radiating device for cooling a heat-generating component which solves the above-described problems, and has a heat-absorbing plate that absorbs heat generated from the heat-generating component, and performs heat transport fixed to the heat-absorbing plate. In a heat pipe and a heat radiating device for cooling a heat generating component comprising a fan for radiating heat absorbed by the heat absorbing plate to the outside, the heat absorbing plate is formed by bending a side surface of the heat absorbing plate to form a wall surface and forming the wall surface. A heat radiating device for cooling a heat generating component, wherein a heat generating component is located on an inner surface, and the heat pipe is positioned such that a longitudinal direction of the heat pipe is directed from the heat generating component side to the fan side. .

以上のように、本発明に係る発熱部品冷却用放熱装置は、発熱部品からの発熱を吸熱する吸熱板と、該吸熱板に固定されて熱輸送を行うヒートパイプと、吸熱板で吸熱した熱を外部に放熱するファンを備えてなる発熱部品冷却用放熱装置において、前記吸熱板の側面部を折り曲げて壁面を形成すると共に該壁面を形成した吸熱板の内面上に発熱部品を位置させたことを特徴とするものである。したがって、発熱部品からの発熱を吸熱板で効率よく吸熱することができると共に壁面を形成した吸熱板の内側がダクト機能を有するので吸熱板１０に沿って空気が流れ易くなる。前記吸熱板の側面部を折り曲げて壁面を筒状に形成することにより空気はさらに流れ易くなるうえ、電磁遮蔽効果が得られる。このために放熱特性を向上させることができるという顕著な効果を奏するものである。   As described above, the heat radiating device for cooling a heat generating component according to the present invention includes a heat absorbing plate that absorbs heat generated from the heat generating component, a heat pipe that is fixed to the heat absorbing plate and performs heat transport, In the heat-radiating device cooling heat-radiating device provided with a fan that radiates heat to the outside, the heat-generating component is located on the inner surface of the heat-absorbing plate on which the side surface of the heat-absorbing plate is bent to form a wall surface. It is characterized by the following. Therefore, the heat generated by the heat-generating components can be efficiently absorbed by the heat-absorbing plate, and since the inside of the heat-absorbing plate having the wall surface has a duct function, the air can easily flow along the heat-absorbing plate 10. By bending the side surface of the heat absorbing plate to form the wall surface into a cylindrical shape, the air can flow more easily and an electromagnetic shielding effect can be obtained. Therefore, a remarkable effect that the heat radiation characteristics can be improved is achieved.

上記のように、吸熱板の側面部を折り曲げて壁面を形成すると共に該壁面を形成した吸熱板の内面上に発熱部品を位置させることにより、発熱部品からの発熱を吸熱板で効率よく吸熱することができると共に壁面を形成した吸熱板の内側がダクト機能を有するので吸熱板１０に沿って空気が流れ易くなる。このために放熱特性を向上させることができる。   As described above, the side surface of the heat absorbing plate is bent to form a wall surface, and the heat generating component is located on the inner surface of the heat absorbing plate having the wall surface, so that heat generated from the heat generating component is efficiently absorbed by the heat absorbing plate. In addition, since the inside of the heat absorbing plate having the wall surface has a duct function, air can easily flow along the heat absorbing plate 10. Therefore, the heat radiation characteristics can be improved.

以下本発明の実施の形態を図を参照して説明する。図１は本発明の一実施の形態を示すもので、（イ）平面図、（ロ）は（イ）のＡーＡ線断面図、（ハ）は背面斜視図である。この発熱部品冷却用放熱装置は、吸熱板１０と、ヒートパイプ２０と、ファン３０とを備えている点、吸熱板１０は、アルミ板、銅板、マグネシウム板等熱伝導の良い金属板で形成されていると共に絞り加工部１１が形成されている点、ヒートパイプ２０は、吸熱板１０の側面位置に固定部２１で固定されていると共に外径が１〜６ｍｍ程度で、作動液として水、フロン、代替フロン、フロリナート等が使用され銅またはアルミ等で形成されたものである点、ファン３０は、例えば小型の軸流ファンが使用されており、吸熱板１０の一端側の筐体５０の壁面に取付けられている点は従来の構成と同様であるが、吸熱板１０の側面部を折り曲げて壁面１５を形成すると共に該壁面１５を形成した吸熱板１０の内面上に発熱部品４０を位置させた点に特徴があるものである。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of the present invention, in which (a) is a plan view, (b) is a cross-sectional view taken along line AA of (a), and (c) is a rear perspective view. The heat radiating device for cooling a heat-generating component includes a heat absorbing plate 10, a heat pipe 20, and a fan 30, and the heat absorbing plate 10 is formed of a metal plate having good heat conductivity such as an aluminum plate, a copper plate, and a magnesium plate. The heat pipe 20 is fixed to the side surface of the heat absorbing plate 10 by the fixing part 21 and has an outer diameter of about 1 to 6 mm. For example, a small axial fan is used as the fan 30, and the wall of the housing 50 at one end of the heat absorbing plate 10 is used. Is similar to the conventional configuration, except that the side surface of the heat absorbing plate 10 is bent to form the wall surface 15 and the heat generating component 40 is positioned on the inner surface of the heat absorbing plate 10 on which the wall surface 15 is formed. Was One in which there is a feature to.

すなわち、吸熱板１０は側面部に突片が突設され該突片を折り曲げることによって壁面１５が形成されている。この壁面１５は、吸熱板１０の側面部全体に設けることが好ましいが、一部設けられていない部分があってもよい。このように、壁面１５を形成した吸熱板１０の内面上には、発熱部品４０が位置させてある。この発熱部品４０の上面には、吸熱板１０に絞り加工して設けた加工部１１が接触している。   That is, the heat absorbing plate 10 has a projecting piece protruding from the side surface, and the wall is formed by bending the projecting piece. The wall surface 15 is preferably provided on the entire side surface of the heat absorbing plate 10, but may be partially omitted. As described above, the heat generating component 40 is located on the inner surface of the heat absorbing plate 10 on which the wall surface 15 is formed. The processed part 11 formed by drawing the heat absorbing plate 10 is in contact with the upper surface of the heat generating component 40.

上記構成からなる発熱部品冷却用放熱装置は、発熱部品４０からの発熱を吸熱板１０で吸熱すると共にヒートパイプ２０で熱輸送し、これらの熱をファン３０を回転させることによって筐体５０の外に放熱するものである。本発明においては、壁面１５を形成した吸熱板１０の内面上に発熱部品４０を位置させてあるので、発熱部品４０からの発熱を効率良く吸熱板１０で吸熱することができ、また吸熱板１０に壁面１５を形成したので、壁面１５を形成した吸熱板１０の内側がダクト機能を有し、このために吸熱板１０に沿って空気が流れ易くなり、放熱特性を向上させることができるものである。   The heat-radiating device for cooling a heat-generating component having the above-described configuration absorbs heat generated from the heat-generating component 40 by the heat absorbing plate 10 and transports the heat by the heat pipe 20. To dissipate heat. In the present invention, since the heat-generating component 40 is located on the inner surface of the heat-absorbing plate 10 on which the wall surface 15 is formed, heat generated from the heat-generating component 40 can be efficiently absorbed by the heat-absorbing plate 10. Since the wall surface 15 is formed on the inside, the inside of the heat absorbing plate 10 on which the wall surface 15 is formed has a duct function, so that air can easily flow along the heat absorbing plate 10 and heat radiation characteristics can be improved. is there.

図２は本発明の他の実施の形態を示すもので、前記実施の形態と異なる点は、吸熱板１０としてＬ字型の板を使用し、またヒートパイプ２０もＬ字型に曲げた点である。その他は前記実施の形態と同様であるので同一符号を付して説明を省略する。   FIG. 2 shows another embodiment of the present invention, which is different from the above embodiment in that an L-shaped plate is used as the heat absorbing plate 10 and the heat pipe 20 is also bent in an L shape. It is. Other configurations are the same as those of the above-described embodiment, and the same reference numerals are given and the description is omitted.

図３は本発明の更に他の実施の形態を示すもので、前記各実施の形態と異なる点は、吸熱板１０の側面から突設した壁面１５を筒状に形成した点である。この場合発熱部品４０は筒状の壁面１５で覆われた吸熱板１０の内面上に配置するものである。このように壁面１５を筒状に形成し、該筒状の壁面１５で覆われた吸熱板１０の内面上に発熱部品４０を配置するように構成しても、発熱部品４０からの発熱を効率良く吸熱板１０で吸熱することができ、また筒状の壁面１５がダクト機能を有するので、このために吸熱板１０に沿って空気が流れ易くなり、放熱特性を向上させることができるものである。また発熱部品４０を筒状の壁面１５で覆うように構成すると、発熱部品４０を他の機器から静電遮蔽することができるという効果がある。   FIG. 3 shows still another embodiment of the present invention, which is different from the above embodiments in that a wall surface 15 protruding from the side surface of the heat absorbing plate 10 is formed in a cylindrical shape. In this case, the heat-generating component 40 is arranged on the inner surface of the heat-absorbing plate 10 covered by the cylindrical wall surface 15. Even when the wall surface 15 is formed in a cylindrical shape and the heat generating component 40 is arranged on the inner surface of the heat absorbing plate 10 covered by the cylindrical wall surface 15, the heat generated from the heat generating component 40 is efficiently reduced. Since heat can be absorbed well by the heat absorbing plate 10 and the cylindrical wall surface 15 has a duct function, air can easily flow along the heat absorbing plate 10 and heat radiation characteristics can be improved. . When the heat generating component 40 is configured to be covered by the cylindrical wall surface 15, there is an effect that the heat generating component 40 can be electrostatically shielded from other devices.

なお、吸熱板１０の側面から突設する壁面１５の形状は、上記各実施の形態に限定するものではない。また、吸熱板１０には絞り加工部を設けなくてもよい。さらにファン３０は筐体５０の壁面に取付けないで、吸熱板１０の一側面にファン取付け用突片を突設し、該ファン取付け用突片にファン３０を取付けるようにしてもよい。   The shape of the wall surface 15 projecting from the side surface of the heat absorbing plate 10 is not limited to the above embodiments. Further, the heat-absorbing plate 10 does not have to be provided with a drawn portion. Further, the fan 30 may not be mounted on the wall surface of the housing 50, but may be provided with a projecting piece for mounting the fan on one side surface of the heat absorbing plate 10, and the fan 30 may be mounted on the projecting piece for mounting the fan.

本発明に係る発熱部品冷却用放熱装置の一実施の形態を示すもので、（イ）は平面図、（ロ）はＡ−Ａ線断面図、（ハ）は底面斜視図。1 shows an embodiment of a heat radiating device for cooling a heat-generating component according to the present invention, in which (a) is a plan view, (b) is a sectional view taken along line AA, and (c) is a bottom perspective view. 本発明の他の実施の形態を示す底面斜視図。The bottom perspective view showing other embodiments of the present invention. 本発明の更に他の実施の形態を示す斜視図。FIG. 13 is a perspective view showing still another embodiment of the present invention. 従来の発熱部品冷却用放熱装置を示すもので、（イ）は平面図、（ロ）はＢ−Ｂ線断面図。FIG. 3 shows a conventional heat radiating device for cooling a heat-generating component, in which (a) is a plan view and (b) is a cross-sectional view taken along line BB.

符号の説明Explanation of reference numerals

１０ 吸熱板
１５ 壁面
２０ ヒートパイプ
３０ ファン
４０ 発熱部品
５０ 筐体 Reference Signs List 10 heat absorbing plate 15 wall surface 20 heat pipe 30 fan 40 heat generating component 50 housing

Claims (2)

発熱部品からの発熱を吸熱する吸熱板と、該吸熱板に固定されて熱輸送を行うヒートパイプと、吸熱板で吸熱した熱を外部に放熱するファンを備えてなる発熱部品冷却用放熱装置において、前記吸熱板の側面部を折り曲げて壁面を形成すると共に該壁面を形成した吸熱板の内面上に発熱部品を位置させ、かつ前記ヒートパイプを、前記ヒートパイプの長手方向が前記発熱部品側から前記ファン側に向くように位置させたことを特徴とする発熱部品冷却用放熱装置。   A heat-dissipating device cooling heat-dissipating device including a heat-absorbing plate that absorbs heat generated from a heat-generating component, a heat pipe that is fixed to the heat-absorbing plate and performs heat transport, and a fan that radiates heat absorbed by the heat-absorbing plate to the outside. Forming a wall surface by bending a side surface portion of the heat absorbing plate and disposing a heat-generating component on the inner surface of the heat-absorbing plate forming the wall surface, and positioning the heat pipe such that a longitudinal direction of the heat pipe is from the heat-generating component side. A heat radiating device for cooling a heat generating component, wherein the heat radiating device is positioned so as to face the fan. 前記吸熱板の側面部を折り曲げて壁面を筒状に形成したことを特徴とする請求項１記載の発熱部品冷却用放熱装置。   2. The heat radiating device according to claim 1, wherein a side wall of the heat absorbing plate is bent to form a wall.
JP2004074738A 2004-03-16 2004-03-16 Heat dissipation device cooling heat dissipation device Expired - Lifetime JP4002249B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102256470A (en) * 2010-05-17 2011-11-23 奇鋐科技股份有限公司 Heat radiation apparatus and manufacture method thereof
US8107239B2 (en) 2009-02-27 2012-01-31 Kabushiki Kaisha Toshiba Electronic apparatus and cooling fan

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8107239B2 (en) 2009-02-27 2012-01-31 Kabushiki Kaisha Toshiba Electronic apparatus and cooling fan
US8717762B2 (en) 2009-02-27 2014-05-06 Kabushiki Kaisha Toshiba Electronic apparatus and cooling fan
CN102256470A (en) * 2010-05-17 2011-11-23 奇鋐科技股份有限公司 Heat radiation apparatus and manufacture method thereof

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