JP2004199843A - Thin film magnetic head and manufacturing method for thin film magnetic head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the influence of a wire bonding residue produced by performing control of height of an MR element using the result of measurement by a real element detecting system during polishing work is performed. <P>SOLUTION: When a floating surface of a thin film magnetic head is polished to set the height of the MR element at an MR head element to a prescribed value, if the real element detecting system is adopted in which a terminal 18a of the MR head element is wire bonded to a circuit board for measurement and the resistance value of the MR element is directly measured to control the height of the MR element, the wire bonding residue 24a remains at the terminal 18a even if the wire bonding is removed after the polishing work. The surface of the terminal 18a is arranged longitudinally, a peeling tool 25 is made to descend on the wire bonding residue 24a with a prescribed clearance C to peel the wire bonding residue 24a from the surface of the terminal 18a. In this manner, a dimple is generated in the surface of the terminal 18a however the wire bonding residue 24a is eliminated. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a thin-film magnetic head using a magnetoresistive head element as a reproducing head element, and more particularly to a thin-film magnetic head in which the element height of the magnetoresistive head element is controlled with high precision and a thin-film magnetic head. It relates to a manufacturing method.
[0002]
[Prior art]
In recent years, the size and capacity of magnetic disk drives have been reduced, and small magnetic disk drives using disk-shaped recording media (hereinafter simply referred to as disks) of 3.5-inch and 2.5-inch sizes are currently the mainstream. It has become.
[0003]
In such a small magnetic disk device, since the speed of the disk is low, a magnetoresistive head whose reproduction output does not depend on the rotation speed of the disk is provided as a read (reproduction) head element, and a magnetic induction type head is written (recorded). A) A thin film magnetic head having a composite head element structure provided as a head element is used. In an MR head (magnetoresistive head) element, a magnetic head slider (thin film magnetic head) is mounted on an air bearing surface facing a disk to detect a change in the resistance value of the MR (magnetoresistive) element caused by a change in a magnetic field. The structure in which the MR element is exposed and used has the highest reproduction efficiency.
[0004]
As shown in FIG. 8, the magnetic head slider 1 has a configuration in which a head element portion 4 is provided at the rear end of a substrate material 6 and protected by protective aluminum 5. The head element section 4 is provided with a magnetic induction type head element as a write head element and an MR head element as a read head element, and the tips of these head elements are exposed on the air bearing surface 3. In a small magnetic disk drive of the CSS (Contact Start Stop) system, the magnetic head slider 1 is lifted by a very small angle (elevation angle) θ at the tip end by utilizing the dynamic pressure generated by the rotation of the disk 2. The head element 4 is used to record / reproduce data on / from the disk 2 by flying a minute amount (flying amount) d from the surface.
[0005]
In the head element section 4, as shown in FIG. 9, an MR head element 9 is provided on a base material 6 (FIG. 8) made of a hard ceramic material via a base alumina (not shown). And the upper shield film 11. A magnetic induction type head element 8 having an upper shield film 11 as a lower magnetic pole is arranged on the MR head element 9, and the head element portion 4 having such a configuration is covered with a protective alumina 5 (FIG. 8). . In addition, the tip of the magnetic induction type head element 8 and the MR head element 9 are exposed on the floating surface 3 by the polishing process for forming the floating surface 3.
[0006]
The magnetic induction type head element 8 includes an upper magnetic pole 12, an upper shield film 11 as a lower magnetic pole, and a coil 13 provided therebetween. The MR head element 9 has an MR element 9a. And electrodes 14a and 14b connected to both ends of the MR element 9a for data reproduction.
[0007]
In the exposure type MR head element 9 in which the MR element 9a is exposed on the air bearing surface 3, an end of the MR element 9a is exposed on the air bearing surface 3 by polishing a part of the MR element 9a when processing the air bearing surface 3. Let me. Here, the dimension of the MR element 9a in the direction perpendicular to the air bearing surface 3 is referred to as the MR element height h.
[0008]
Next, a method of manufacturing the magnetic head slider 1 and a conventional example of polishing of the flying surface 3 will be described.
[0009]
The magnetic head slider 1 has a magnetic induction type head element and an MR head element formed on a surface of a ceramic wafer by a thin film process. By cutting the wafer having undergone such a process, a row bar in which several tens of magnetic head sliders are linearly connected is obtained. The polishing step for controlling the height h of the MR element is performed in the state of the row bar. By cutting the row bar, the magnetic head slider 1 having the configuration shown in FIG. 9 is obtained.
[0010]
In the MR head element 9, since the reproduction output is greatly affected by the MR element height h, it is necessary to precisely control the dimension of the MR element height h. The height h of the MR element is becoming smaller year by year because the sensitivity is increased by making the dimension smaller, and accordingly, the required value of the processing accuracy of the height h of the MR element becomes higher year by year. Tend to. Areal recording density 100Gbit / in ^Two The MR head element mounted on the above-mentioned small magnetic disk device requires a processing accuracy of ± 0.02 mm or less.
[0011]
As a conventional example of a method for controlling and polishing the height h of the MR element, a pattern (resistance detecting element) 17 for measurement is separately provided on the row bar 15 separately from the MR head element in the head element forming step, as shown in FIG. A method of controlling the dimensions by monitoring the height h of the MR element during polishing by in-process by measuring the resistance value of the resistance detection element 17 and converting the resistance value to the MR element height is generally used. is there. As a control method, a polishing platen that rotates during the polishing process so that the MR element height h obtained from the resistance values of the resistance detection elements at several tens of points in the row bar has a uniform distribution throughout the row bar. The height h of the MR element in the row bar is controlled by controlling the load on the row bar to be pressed (for example, see Patent Document 1).
[0012]
As another method, there is known an actual element detection method in which the resistance value of the MR element itself is monitored in-process during polishing (for example, see Patent Document 2).
[0013]
[Patent Document 1]
JP-A-63-191570
[0014]
[Patent Document 2]
JP-A-5-46495
[0015]
[Problems to be solved by the invention]
In the prior art described in Patent Document 1 using the resistance detecting element 17 as shown in FIG. 10, a measurement error occurs due to a difference in dimensions and structure between the resistance detecting element 17 and the MR element 9a or a positional shift. In particular, there is a problem that the distribution of the height h of the MR element cannot be measured with high accuracy, and the measurement error increases.
[0016]
Therefore, the real element detection method as described in Patent Document 2 is the most effective one because it directly measures the resistance of the MR head element 9.
[0017]
In the actual element detection method, the MR head element 9 is electrically connected to the resistance measuring circuit of the polishing apparatus. The connection method is shown in FIG. 10 by using the terminal surfaces 18a and 18b of the MR head element 9. And a relay circuit board for resistance measurement (not shown). In this method, a method is generally employed in which the MR head element 9 or the resistance detecting element 17 is connected to the resistance measurement relay circuit board using wire bonding.
[0018]
However, according to the distribution measurement of the height h of the MR element by the actual element detection method using the wire bonding, since the wire bonding is performed on the terminal surfaces 18a and 18b of the MR head element 9, the following problems occur.
[0019]
That is, (1) when a wire bonding residue adheres to the terminal surfaces 18a and 18b of the MR head element 9, and (2) when the wire material is easily corroded, a cleaning solution or a developing solution used in the manufacturing process of the magnetic head slider. (3) If the bonding property at the interface between the wire bonding residue and the surface of the terminals 18a and 18b of the MR head element 9 is poor, the magnetic head slider may be damaged. There is a possibility that the wire bonding residue may be peeled off during the manufacturing process or in the magnetic disk drive. (4) If the height of the wire bonding residue is high, a problem occurs in the magnetic head slider manufacturing process. (5) The magnetic head After bonding the slider to the suspension, the connection terminals on the suspension and the MR head element 9 are connected. In ball bonding during that, wire bonding residue cause failure of the ball bonding.
[0020]
An object of the present invention is to solve such a problem and to eliminate the influence of wire bonding residues caused by performing the control of the MR element height using the measurement result by the actual element detection method during polishing. And a method of manufacturing the same.
[0021]
[Means for Solving the Problems]
In order to achieve the above object, a thin film head according to the present invention is one in which a wire bonding residue lower than a predetermined height is attached to the surface of a terminal of a magnetoresistive head element.
[0022]
The wire bonding residue is crushed.
[0023]
Further, the thin film head according to the present invention has a circular depression on the surface of the terminal of the magnetoresistive head element.
[0024]
In order to achieve the above object, the present invention provides a method for manufacturing a thin-film magnetic head including a magnetoresistive head element as a reproducing head element, comprising: an electric circuit board for measuring a resistance value; A wire bonding process for connecting the terminals of the head element with wires, and while measuring the resistance value of the magnetoresistive head element using an electric circuit board, the floating surface of the thin-film magnetic head slider is polished to obtain a magnetoresistive effect. Polishing step for setting the element height of the die head element to a predetermined height, and removing the wire bonding wire from the terminal of the magnetoresistive head element for the polished thin film magnetic head, and performing wire bonding of the terminal. Reducing the residue to a predetermined height or less.
[0025]
Further, the thin-film magnetic head is incorporated in a plurality of row bars, and a resistance detecting element for monitoring a resistance value is incorporated between the thin-film magnetic heads of the row bar. A wire is also connected between the substrate and the substrate. In the above-mentioned polishing process, when the element height of the magnetoresistive element is within a predetermined height range, the resistance of the resistance sensing element is measured while the element is being measured. It controls the height.
[0026]
Further, the method includes a step of crushing the wire bonding residue in order to reduce the wire bonding residue remaining at the terminal of the magnetoresistive head element to a predetermined height or less.
[0027]
Alternatively, in order to reduce the wire bonding residue remaining at the terminal of the magnetoresistive head element to a predetermined height or less, the wire bonding residue remaining at the terminal of the magnetoresistive head element is subjected to a magnetoresistive effect. The method includes a step of removing a wire bonding residue from an interface with the surface of the terminal of the magnetoresistive head element by applying a load in a direction parallel to the surface of the terminal of the head element.
[0028]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, wire bonding used in the embodiments of the present invention will be described.
[0029]
Wire bonding is known to be used for connection between a semiconductor chip and a lead frame, and is roughly classified into two types. One is to use an aluminum wire or a gold wire and apply ultrasonic vibration when the wire is pressed against the work bonding surface to slide between the wire and the work bonding surface. And wedge bonding for welding wires. The features of wedge bonding using an aluminum wire are that wire bonding can be performed on a work bonding surface made of gold or copper and that the bonding strength is relatively high.
[0030]
The other uses a gold wire, heats the bonding surface in advance during bonding, forms a ball by discharging to the tip of the wire, and applies ultrasonic vibration when the ball is pressed against the work bonding surface. As a result, there is ball wire bonding in which the ball is slid between the ball and the work bonding surface, and the ball is welded by heat generated at this time.
[0031]
As a feature of ball wire bonding, since the tip of the capillary, which is a tool for pressing the wire, can be made thin, it can be bonded to a small work bonding surface, and even if the work bonding surface is lower than the reference bonding surface by 1 to 2 mm. And that wire bonding is possible. In addition, in any wire bonding, when using a gold wire, it is necessary to heat not only the thermal welding by ultrasonic vibration but also the bonding target, and it is necessary to gold-plate the work bonding surface. It becomes.
[0032]
It is difficult to heat the thin film magnetic head and the relay circuit board for resistance measurement by the air bearing surface polishing processing for controlling the height h of the MR element of the conventional MR head element, and the relay circuit board for resistance measurement is made of inexpensive copper. Most magnetic head manufacturers use wedge bonding using aluminum wires to provide wiring.
[0033]
In the conventional air bearing surface polishing for controlling the height h of the MR element, since the wire bonding is performed on the resistance detecting element formed at the cut portion, no wire bonding residue remains on the actual product. Although there was no problem with wedge bonding using a real element, the real element type resistance detection method in a magnetic head slider in which a real element type resistance detection element having the same size and shape as a real element in a magnetic head slider was used. Since it is necessary to perform wire bonding on the terminal surface of the magnetic head slider as an actual product, if the wire is removed after the air bearing surface polishing process for controlling the MR element height h, the terminal surface of the magnetic head slider becomes Wire bonding residues remain. In particular, in wedge bonding, a very large residue of 0.04 to 0.06 mm in width and 0.08 to 0.20 mm in length remains. If such a large residue adheres to the terminal surface of the MR head element, it interferes with ball bonding for connecting the connection terminal on the suspension side to the terminal surface of the MR head element after the completion of the magnetic head slider, resulting in poor bonding. Cause. Further, when the material of the residue is aluminum, it may be corroded by a chemical such as a developing solution or a cleaning solution during the process, so that aluminum cannot be attached to the surface of the terminal of the MR head element.
[0034]
From the above, in the present invention, a ball wire bonding method using a gold or gold alloy wire (hereinafter, collectively referred to as a gold wire) is basically adopted. The conditions for gold wire bonding are shown below.
・ Wire bonding equipment: Shinkawa UTC-475BI super
・ First: Magnetic head slider MR element terminal (gold plating)
・ Second: Relay circuit board for resistance measurement (gold plating)
・ Heating of sample: no heating (room temperature)
・ Wire: φ25mm gold wire
Capillary: hole diameter = 33 mm, T value = 152 mm, length = 11.1 mm.
[0035]
Next, an embodiment of the present invention will be described.
1A, 1B, and 1C are process diagrams showing an embodiment of a method of manufacturing a thin-film magnetic head according to the present invention.
[0036]
In any of the embodiments, the air bearing surface 3 is polished by the MR element height control air bearing surface polishing process (step 105) and the bar touch wrap (step 110). In this case, the MR element height control air bearing surface polishing process is a process for mainly controlling the MR element height h, and the bar touch wrap mainly improves the flatness, surface roughness, and PTR of the air bearing surface. It is a process for doing. However, in the bar touch lap, since the flying surface is polished, the row bar 15 is liable to be inclined during the polishing, and an error occurs in the MR element height h even if the processing amount is excessive or insufficient. In order to solve this problem, in the bar touch lap, the height h of the MR element may be measured in-process during polishing to control the inclination of the row bar 15 and control the end point.
[0037]
First, a first embodiment shown in FIG. 1A will be described. In the first embodiment, the MR element height control floating surface polishing process (step 105) and the bar touch wrap (step 110) are performed. The height h of the MR element is controlled by the actual element detection method. Accordingly, the wire bonding residue processing step is performed after each of the MR element height control air bearing surface polishing processing and the bar touch wrap.
[0038]
In the following, the bar touch wrapping step (step 110) is performed in the state of the row bar 15 including the embodiment of FIGS. 1B and 1C. Touch lap may be performed in the state of the head slider 1. In this case, step 114 (slider cutting) is inserted before step 108.
[0039]
In FIG. 1A, first, an MR head element, a magnetoresistive head element, a resistance detection element, and the like are formed by a thin film process such as sputtering, ion milling, or photolithography, and a wafer is formed (step 100). The wafer is cut into row bars 15 by slicing using a diamond cutting whetstone as a tool (step 101). As shown in FIG. 10, the row bar 15 is a state in which several tens of the magnetic head sliders 1 are arranged side by side. The size of the row bar 15 is, for example, width: 1.2 mm, length: 40 to 80 mm, and thickness. Length: 0.30 to 0.33 mm. Then, in order to reduce the amount of secondary bending and undulation of the row bar 15 generated in the substrate cutting step, double-sided lap is performed for simultaneously polishing the surface serving as the flying surface of the magnetic head slider and the rear surface thereof (step 102).
[0040]
Next, the row bar 15 is bonded to the polishing jig using wax or the like (step 103), and the terminals 18a and 18b (FIG. 10) of the MR head element 9 and the resistance measurement are measured by a gold wire ball wire bonding apparatus. The relay circuit board is electrically connected (step 104).
[0041]
FIG. 2 is a perspective view showing a state in which the row bar 15 is attached to a polishing jig to perform wire bonding. 19 is a polishing jig, 20 is a relay circuit board for resistance measurement, and 21 is a gold wire.
[0042]
FIG. 3 is an enlarged plan view showing the row bar 15 in FIG. 2, wherein 22a and 22b are terminals of a relay circuit board for resistance measurement, and 23a and 23b are terminals of a magnetic induction type head element 9. The parts corresponding to those in FIGS. 9 and 10 are denoted by the same reference numerals.
[0043]
In FIG. 2, the row bar 15 is fixed to one surface of the polishing jig 19, and the relay circuit board 20 for resistance measurement is fixed to the other surface of the polishing jig 19. Then, as shown in FIG. 3, gold wires 21 are wire-bonded to the terminals 18a, 18b of the MR head element 9 of the fixed row bar 15 and the terminals 22a, 22b of the resistance measurement relay circuit board 20, respectively. The MR head element 9 and the resistance measurement relay circuit board 20 are electrically connected.
[0044]
Here, the gold wires are not connected to the terminals 23a and 23b (connected to the coil 13 in FIG. 9) of the magnetic induction type head element 8, but the connection between the resistance detection element 17 and the resistance measurement relay circuit board 20 is established. In some cases, the connection is made electrically by the gold wire 21. This is because the MR element height h at the time of wafer formation (step 100 in FIG. 5) is 3 mm, so that the resistance measurement range of the actual element detection method is 0 to 3 mm. In the surface polishing process (step 105 in FIG. 1), the polishing is performed for about 10 mm, and in the case of the actual element detection method, the processing is performed for about 7 mm without control. This is because the inclination of the distribution h and the secondary bend may be increased to make correction impossible. Therefore, in this embodiment, the resistance detecting element 17 is also subjected to wire bonding to perform the resistance measurement relay circuit board. 20 and when the height h of the MR element is 2 mm or more, the height h of the MR element is measured by the resistance detecting element 17. When the height h of the MR element is 2 mm or less, the actual element detection method is used. , Which measures the MR element height h.
[0045]
Returning to FIG. 1A, the flying surface 3 (FIG. 9) of the magnetic head slider 1 is polished to control the MR element height h (step 105). This is because, in order to control the height h of the MR element, an uneven load is applied to the row bar 15 in a state of being attached to the polishing jig 19 as shown in FIGS. This is an MR element height control air bearing surface polishing step of controlling the MR element height h by creating a distribution and controlling the distribution of the processing amount. Here, in order to measure the height h of the MR element in-process during the polishing process, an actual element detection method of measuring the resistance value of the MR element 9a itself is adopted.
[0046]
When the predetermined MR element height h is obtained and the MR element height control air bearing surface polishing step (Step 105) is completed, the gold wires for wire bonding are then connected from the terminals 18a and 18b of the MR head element 9 of the row bar 15. 21 is removed (step 106). This removal is carried out by air blowing, and as a result, wire bonding residues 24a and 24b as shown in FIG. 4 remain on the surfaces of the terminals 18a and 18b of the MR head element 9. The wire bonding residues 24a and 24b are as large as 0.04 to 0.06 mm in diameter and 0.06 to 0.10 mm in height H. Therefore, when the wire bonding residues 24a and 24b are passed as they are to a subsequent process, the wire bonding residues 24a , 24b and the jig in the middle of the process are rubbed, and fine dust of gold is generated to cause metal contamination. In addition, the wire bonding residues 24a, 24b come into contact with the jig in the middle of the process, The wire bonding residues 24a and 24b may be peeled off during the process. Also, in the assembling step (step 115), when the connection terminals of the suspension and the terminals 18a, 18b of the MR head element 9 are connected by ball bonding, the wire bonding residues 24a, 24b come into contact with the balls, resulting in poor connection. Cause.
[0047]
Therefore, in this embodiment, in FIG. 1A, the processing of the wire bonding residue is performed so that the problem caused by the wire bonding residues 24a and 24b attached to the terminals 18a and 18b of the MR head element 9 can be solved (step). 107).
[0048]
Here, the processing of the wire bonding residue will be described.
[0049]
The problem of the wire bonding residues 24a and 24b as shown in FIG. 4 is caused by their high height H of 0.06 to 0.10 mm. Reducing the height H is one solution to this problem. Therefore, as a specific example of the processing of the wire bonding residue (step 107), a method of crushing the wire bonding residues 24a and 24b is adopted. Here, this specific example will be described.
[0050]
First, the row bar 15 (or the magnetic head slider 1) after the wire removal (step 106) shown in FIG. 4 is fixed with the terminals 18a and 18b of the MR head element 9 facing upward. Then, a 60 × 10 × 10 mm rectangular parallelepiped tool (not shown) made of a semiconductor ceramic material (resistance value: 1 MΩ) is dropped onto the wire bonding residues 24 a and 24 b at a low speed. A stopper is provided in advance so that the rectangular parallelepiped tool stops at a position of 0.02 mm from the surfaces of the terminals 18a and 18b of the MR head element 9. The rectangular parallelepiped tool is dropped until it hits the stopper and stops. When the rectangular parallelepiped tool hits the stopper, the rectangular parallelepiped tool is pushed down to crush the wire bonding residues 24a and 24b. Thereafter, the row bar 15 (or the magnetic head slider 1) is taken out.
[0051]
The row bar 15 on which the wire bonding residue has been processed is cut for each magnetic head slider 1 through steps 108 to 114 in FIG. 1A as described later. Alternatively, the processing of the wire bonding residue is performed. The magnetic head slider 1 is subjected to the processing of steps 108 to 113 in FIG. 1A, as will be described later. FIG. 5 shows an embodiment of the thin film magnetic head according to the present invention obtained thereby. FIG. 3A is a plan view, FIG. 3B is a side view, and 24a ′ and 24b ′ are crushed wire bonding residues. Note that the same reference numerals are given to portions corresponding to the above-described drawings, and redundant description will be omitted.
[0052]
4 (a) and 4 (b), the wire bonding residues 24a and 24b shown in FIG. 4 are crushed by the above-described process, so as to have a sufficiently low disk shape, for example, a height H: 0.02 mm. Can be deformed. As a result, contact between the wire bonding residues 24a and 24b and the jig in the middle step is eliminated, so that the problem of metal contamination can be solved and peeling off in the middle step can be prevented. In the assembling step (step 115), when the connection terminals of the suspension are connected to the terminals 18a and 18b of the MR head element 9 by ball bonding, contact between the wire bonding residues 24a and 24b and the balls may be avoided. Connection failure can be avoided.
[0053]
Another specific example of the processing of the wire bonding residue (step 107) is a processing method of removing the wire bonding residues 24a and 24b.
[0054]
In the wire bonding (step 104) in FIG. 1, a ball wire bonding method of a gold wire is used. Usually, in the ball wire bonding method using a gold wire, in order to firmly connect the gold wire to the surfaces of the terminals 18a and 18b of the MR head element 9, the row bar 15 as a work and the terminal 18a of the MR head element 9 are used. , 18b, the higher the temperature of this heating, the more the surface of the terminals 18a, 18b of the MR head element 9 and the gold wire become closer when applying ultrasonic vibration to perform wire bonding. Gold at the contacting interface is softened and easily welded.
[0055]
On the other hand, in each embodiment shown in FIG. 1, the row bar 15 as the work and the terminals 18a and 18b of the MR head element 9 are not heated and the room temperature (20 (° C.). As a result, the interface between the gold wire 21 and the terminals 18a and 18b of the MR head element 9 is not completely welded but is partially welded. Even in such an adhesive state, there is no problem in electrical connection, and peeling at the interface between the gold wire 21 and the terminals 18a and 18b of the MR head element 9 hardly occurs by air blow. However, when a load in a direction parallel to the surfaces of the terminals 18a and 18b of the MR head element 9 is applied to the wire bonding residues 24a and 24b, the gold wire 21 and the terminals 18a and 18b of the MR head element 9 are completely removed from their interface. Peel off.
[0056]
FIG. 6 is a view showing another specific example of the wire bonding residue treatment (step 107) for stripping the wire bonding residues 24a and 24b in this manner, wherein 25 is a peeling tool, 25a is a side surface thereof, and FIG. The same reference numerals are given to parts corresponding to the drawings.
[0057]
In the figure, first, the row bar 15 (or the magnetic head slider 1) after wire removal (step 106) is connected to the terminal 18a of the MR head element 9 (here, only the terminal 18a is shown, but the other terminals 18b are not shown). Is fixed horizontally, and a peeling tool 25 made of a semiconductor ceramic (resistance value: 1 MΩ) material is used to remove the wire bonding residue 24 a (here, only the wire bonding residue 24 a is shown, The same applies to the wire bonding residue 24b). At this time, the peeling tool 25 is arranged so that the clearance C between the side surface 25a of the peeling tool 25 and the surface of the terminal 18a of the MR head element 9 is 0.02 mm. Then, the peeling tool 25 is lowered. As a result, a downward load is applied to the wire bonding residue 24a at the moment when the lower end edge of the peeling tool 25 hits the wire bonding residue 24a, whereby the wire bonding residue 24a and the surface of the terminal 18a of the MR head element 9 are formed. The wire bonding residue 24a is peeled off from the interface with the wire bonding residue 24a. Thereafter, the peeling tool 25 is pushed up to take out the row bar 15 (or the magnetic head slider 1).
[0058]
By the above operation, the wire bonding residues 24a and 24b are completely separated from the surfaces of the terminals 18a and 18b of the MR head element 9. FIG. 7 shows the row bar 15 from which the wire bonding residues 24a and 24b are peeled off by performing the processing of steps 108 to 114 in FIG. 1, or the magnetic bar from which the wire bonding residues 24a and 24b are peeled off. Another embodiment of the thin-film magnetic head according to the present invention obtained by performing the processing of steps 108 to 113 in FIG. 1 on the head slider 1 is shown, wherein FIG. 1A is a plan view and FIG. And 26a and 26b are depressions. In addition, parts corresponding to the above-mentioned drawings are denoted by the same reference numerals.
[0059]
In FIGS. 9A and 9B, in the thin-film magnetic head in which the wire bonding residue has been treated by the above-described peeling, the surface of the terminals 18a and 18b of the MR head element 9 has no wire bonding residue and is circular. Only the depressions 26a and 26b of the shape remain.
[0060]
Thus, in this embodiment, the problem of contact between the wire bonding residue and the jig is eliminated, the problem of metal contamination can be solved, and the wire bonding residue does not peel off in the middle of the process. Also, in the assembling process (step 115 in FIG. 1A), when the connection terminals of the suspension are connected to the terminals 18a and 18b of the MR head element 9 by ball bonding, the contact between the wire bonding residue and the ball may be referred to. There is no connection failure.
[0061]
When the wire bonding residue is separated from the surfaces of the terminals 18a and 18b of the MR head element 9 as described above, the bonding wire may be aluminum or an alloy thereof.
[0062]
Returning to FIG. 1A, when the processing of the wire bonding residue (Step 107) is completed, the row bar 15 is fixed to a polishing jig for bar touch wrap via an adhesive elastic body (Step 108). Then, in order to control the height h of the MR element in the next bar touch wrap (step 110), gold wires are wire-bonded to the terminals 18a and 18b of the MR head element 9 as shown in FIG. Is electrically connected to the resistance measurement relay circuit board 20 (step 109).
[0063]
Thereafter, bar touch lap for polishing the air bearing surface is performed (step 110). In the bar touch lap, by improving the polishing accuracy of the floating surface 3, the flatness (crown, camber, twist) of the floating surface 3 and the surface roughness of the floating surface 3 are improved, and the processing step is reduced. However, as described above, in order to suppress the deterioration of the accuracy of the height h of the MR element, an actual element detection method of measuring the resistance value of the MR element 9a itself during polishing is adopted. Is used to measure the height h of the MR element.
[0064]
Next, the wire for wire bonding is removed from the terminals 18a and 18b of the MR head element 9 of the row bar 15 (or the magnetic head slider 1) after the polishing process is completed (step 111). Also in this case, as in step 106, the wires are removed by air blowing in order to prevent electrostatic breakdown of the MR element 9a, and the wires adhered to the terminals 18a and 18b of the MR head element 9 in the same manner as in step 107. The bonding residue is processed (step 112). Thereafter, as shown in FIG. 8, in order to cause the magnetic head slider 1 to fly above the rotating disk surface with a flying height d of 10 to 20 nm, a rail is formed on the flying surface by a photolithography process, ion milling, or the like ( Step 113). When the above processing is performed by the row bar 15, the row bar 15 is cut into the magnetic head slider 1 by slicing using a diamond cutting grindstone as a tool (step 114). After the processing of the magnetic head slider is completed, the process proceeds to an assembling process (step 115), and the magnetic head slider 1 is fixed to the suspension with an adhesive, and the terminals 18a and 18b of the MR head element 9 and the terminals of the magnetic induction type head element 8 are connected. The connection terminals 23a and 23b (FIG. 3) and the connection terminals on the suspension side are connected by ball bonding. Then, this is connected to the suspension arm.
[0065]
As described above, it is possible to obtain a magnetic head slider (that is, a thin-film magnetic head) in which the MR element height h is set to a predetermined value with high accuracy and the bonding residue does not influence.
[0066]
In the second embodiment shown in FIG. 1B, the MR element height h is controlled by the real element detection method only in the MR element height control polishing processing (Step 105). At 110), the height h of the MR element is not controlled. For this reason, wire bonding at the terminals 18a and 18b of the MR head element 9 is unnecessary, and therefore, the wire bonding (step 109) and the wire removing process (step 111) in the first embodiment of FIG. ), The wire bonding residue processing (step 112) becomes unnecessary, and the row bar 15 (or the magnetic head slider 1) subjected to the MR element height control processing (steps 103 to 107) is fixed to a jig (step 112). ), A bar touch wrap is performed (step 110), and thereafter, a process of forming a floating surface rail is performed (step 113).
[0067]
As described above, in the second embodiment shown in FIG. 1B, the control of the height h of the MR element is performed with almost the same high accuracy as in the first embodiment shown in FIG. 1A. In addition, the work for wire bonding residue treatment can be reduced, and the time required for it can be reduced.
[0068]
In the third embodiment shown in FIG. 1C, a wire is used for each of the polishing process (step 105) and the bar touch wrap process (step 110) of the flying surface 3 for controlling the MR element height h. The gold wire for bonding is removed (because the processing apparatus differs for each processing), but after the processing steps are completed, the wire bonding residue processing (step 112) is performed collectively. Therefore, the wire bonding residue processing (step 107) after the MR element height control processing step in FIG. 1A is not performed, and the air bearing surface 3 is polished (step 105) for controlling the MR element height h. ) Is completed and the wire removal processing is performed (step 106), and preparations are made for the bar touch wrap (step 110) from step 108.
[0069]
In the third embodiment, the wire bonding performed in step 109 is performed at a position different from the wire bonding position performed in step 104 for the terminals 18a and 18b of the same MR head element 9. In particular, in the case of the row bar 15, the height h of the MR element is necessarily controlled in all the magnetic head sliders 1 by the grinding process of the flying surface of the MR element (step 105) or the bar touch lap (step 112). Therefore, wire bonding may be performed to different MR head elements 9 between the MR element height control air bearing surface polishing processing (step 105) and the bar touch wrap (step 112).
[0070]
As described above, in the third embodiment, the wire bonding residue processing can be collectively performed on the MR element height control air bearing surface polishing processing (step 105) and the bar touch wrap (step 112). Therefore, the labor for the residue treatment is reduced, and the same effect as that of the first embodiment can be obtained.
[0071]
【The invention's effect】
As described above, according to the thin-film magnetic head of the present invention, even if the height of the MR element is controlled by wire bonding to the terminal of the MR head element, the wire bonding residue is reduced to a predetermined height or less. As a result, the MR element height is set with high accuracy, and a stable reproduction output is obtained. In addition, since the wire bonding residue due to the wire bonding to the terminal of the MR head element is low, the wire when the wire is adhered to the suspension is obtained. The influence of the bonding residue can be eliminated, and the situation where the wire bonding residue peels off in the magnetic disk device does not occur.
[0072]
Further, according to the method of manufacturing a thin film magnetic head of the present invention, the height of the MR element can be controlled by the actual element detection method. By employing the element detection method, the wire bonding residue generated on the surface of the terminal of the MR head element can be reduced or eliminated, so that a thin film magnetic head having a high processing yield which is not affected by the wire bonding residue can be obtained.
[Brief description of the drawings]
FIG. 1 is a process chart showing an embodiment of a method of manufacturing a thin-film magnetic head according to the present invention.
FIG. 2 is an external view showing a row bar attached to a polishing jig after wire bonding in step 104 in FIG. 1;
FIG. 3 is an enlarged plan view showing a connection state of a row bar to a relay circuit board for resistance measurement in FIG. 2;
FIG. 4 is a view showing a state in which wire bonding residues adhere to terminals of the MR head element in step 106 in FIG. 1;
FIG. 5 is a view showing one embodiment of a thin-film magnetic head according to the present invention obtained by the manufacturing method shown in FIG. 1;
FIG. 6 is a diagram showing another specific example of the wire bonding residue processing in steps 107 and 112 in FIG. 1;
7 is a view showing another embodiment of the thin-film magnetic head according to the present invention obtained by the wire bonding residue processing shown in FIG. 6;
FIG. 8 is a diagram schematically showing the attitude of the thin-film magnetic head with respect to a rotating disk.
FIG. 9 is a diagram showing a structure of a thin-film magnetic head.
FIG. 10 is a diagram showing an arrangement of a magnetic head slider in a row bar.
[Explanation of symbols]
1 Thin-film magnetic head (magnetic head slider)
2 disk (recording medium)
3 Floating surface
4 Head element
8 Magnetic induction type head element
9 MR head element (magnetoresistive head element)
9a MR element
15 Rowbar
16 Cutting part
17 Resistance sensing element
18a, 18b Terminal of MR head element
19 Polishing jig
20 Electric circuit board for resistance measurement
21 Gold Wire
24a, 24b, 24a ', 24b' Wire bonding residue
25 peeling tool
26a, 26b Peeling mark of wire bonding residue

Claims (10)

In a thin-film magnetic head having a magnetic induction type head element and a magnetoresistive effect head element,
A thin-film magnetic head, wherein a wire bonding residue lower than a predetermined height is attached to a surface of a terminal of the magnetoresistive head element. The thin-film magnetic head according to claim 1,
A thin film magnetic head, wherein the material of the wire bonding residue is gold or a gold alloy. 3. The thin-film magnetic head according to claim 1, wherein
The thin film magnetic head according to claim 1, wherein the wire bonding residue is crushed. In a thin-film magnetic head having a magnetic induction head element and a magnetoresistive head element,
A thin-film magnetic head characterized in that the surface of the terminal of the magnetoresistive head element has a circular depression. A method for manufacturing a thin-film magnetic head including a magnetoresistive head element as a reproducing head element,
A wire bonding step of connecting a wire between the electric circuit board for measuring the resistance value and the terminal of the magnetoresistive head element,
The flying surface of the thin-film magnetic head slider is polished while measuring the resistance value of the magnetoresistive head element by the electric circuit board, and the element height of the magnetoresistive head element is set to a predetermined height. A polishing process step to be set;
Removing the wire of the wire bonding from the terminal of the magnetoresistive head element to the wire bonding residue of the terminal to a predetermined height or less for the polished thin film magnetic head. A method for manufacturing a thin film magnetic head. The method for manufacturing a thin-film magnetic head according to claim 5,
The thin film magnetic head is incorporated in a plurality of row bars, and a resistance sensing element for monitoring a resistance value is incorporated between the thin film magnetic heads of the row bar,
In the wire bonding step, a wire is also connected between the resistance sensing element and the electric circuit board,
In the polishing step, when the element height of the magnetoresistive head element is within a predetermined height range, the element height of the magnetoresistive head element is measured while measuring the resistance value of the resistance sensing element. A method for manufacturing a thin-film magnetic head, comprising: The method for manufacturing a thin-film magnetic head according to claim 5,
A method for manufacturing a thin-film magnetic head, comprising a step of crushing the wire bonding residue so that the wire bonding residue remaining on the terminal of the magnetoresistive head element is equal to or less than the predetermined height. The method for manufacturing a thin-film magnetic head according to claim 5,
In order to reduce the wire bonding residue remaining at the terminal of the magnetoresistive head element to the predetermined height or less, the wire bonding residue remaining at the terminal of the magnetoresistive head element is compared with the magnetoresistive head element. A step of applying a load in a direction parallel to the surface of the terminal of the head element to peel off the wire bonding residue from an interface with the surface of the terminal of the magnetoresistive head element. Manufacturing method. The method for manufacturing a thin-film magnetic head according to claim 8,
A method for manufacturing a thin-film magnetic head, wherein the material of the wire bonding residue is aluminum or an aluminum alloy. The method for manufacturing a thin-film magnetic head according to claim 1,
A method of manufacturing a thin-film magnetic head, wherein the material of the wire bonding residue is gold or a gold alloy.

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