JP2004199088A - Base substrate and active matrix substrate for film liquid crystal panel manufacturing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a base substrate and an active matrix substrate for manufacturing a thin and lightweight film liquid crystal panel of an active matrix display type, with superior display quality. <P>SOLUTION: This base substrate is composed of a metallic plated layer separably formed on a surface of a heat-resisting support substrate conductive at least on the surface, and an electrical insulation layer provided on the metallic plated layer. This configuration prevents deformation of the electrical insulation layer by the heat-resisting support substrate of the base substrate, even if the base substrate is held at high temperature of 200-350°C in an active matrix layer forming process onto the electrical insulation layer of the base substrate, to form the active matrix substrate of the present invention. After forming the liquid crystal layer on the matrix layer, unnecessary heat-resisting support substrate is removed by separation to manufacture the film liquid crystal panel. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a base substrate and an active matrix substrate used for manufacturing a liquid crystal panel, particularly, a film-like liquid crystal panel.

  2. Description of the Related Art In recent years, a liquid crystal display (LCD) has been used for a wide range of applications as a power-saving and thin information display device.

  A commonly used liquid crystal display operates by filling a liquid crystal between two substrates and applying a voltage between the two substrates in pixel units to control the optical characteristics of the liquid crystal. Such a liquid crystal display is roughly classified into a segment type display and a matrix type display according to its display form. The segment type display is divided into a bar graph display and a segment number / symbol display. In both cases, static driving is performed when the display amount is small, and multiplex driving is performed when the display amount is large. Further, the matrix type display is divided into a simple matrix type display and an active matrix type display, and both are generally driven by multiplex driving.

  Since the above-described segment-type display and simple-matrix-type liquid crystal display can form pixels simply by providing a transparent electrode having a pattern shape or a stripe shape in accordance with display information on two substrates constituting the liquid crystal display, active pixels can be formed. It can be manufactured at a lower cost than the matrix type display, and is widely used for small information devices such as calculators, watches, electronic organizers, pagers, measuring devices, electronic games, bar graph displays, etc., which have a small amount of display information. In particular, in a liquid crystal display of a segment type display or a simple matrix type display for a small information device, a plastic substrate is used as a substrate in order to improve portability and improve impact resistance against a drop or an external pressing stress.

  On the other hand, in a liquid crystal display of an active matrix type display, an active matrix substrate is used as one of two substrates constituting the liquid crystal display in order to improve display characteristics. 2. Description of the Related Art In recent years, liquid crystal displays have become mainstream in liquid crystal displays having a large amount of display information. In the active matrix substrate described above, a plurality of pixel electrodes are arranged vertically and horizontally on the substrate, and an active element (active element) such as a transistor element or a diode element is connected to each pixel electrode. By turning on / off or intermediately controlling the active elements, the optical characteristics of the liquid crystal for each pixel can be controlled.

  In addition, the above-described liquid crystal displays are roughly classified into a twisted nematic liquid crystal display and a polymer dispersed liquid crystal display depending on the type of liquid crystal used.

  The display method of the twisted nematic liquid crystal display is such that an upper electrode substrate and a lower electrode substrate each having a polarizing plate are arranged on both sides of the twisted nematic liquid crystal, and the orientation of the liquid crystal is changed by applying a voltage to change the polarization of the liquid crystal. Light passing through the plate is transmitted or blocked.

  On the other hand, there has been proposed a reflective liquid crystal display that does not require a backlight for the purpose of reducing power consumption and improving thickness. This liquid crystal display uses a liquid crystal layer filled with a liquid crystal composition in a polymer three-dimensional network. An upper electrode substrate and a lower electrode substrate are provided on both sides of the polymer layer filled with the liquid crystal composition. When no voltage is applied between the electrodes, light is not transmitted because the orientation of the liquid crystal is random, and when a voltage is applied, the orientation of the liquid crystal is uniform and the light is transmitted. This polymer-dispersed liquid crystal display can coat the liquid crystal on the substrate by printing or the like, compared to applying the display method of a twisted nematic liquid crystal display to a reflective display device, and can eliminate the need for using a polarizing plate. Since the reflective layer can be provided on the substrate, and the metal film can be used both as the electrode and the reflective layer, the manufacturing process can be simplified.

  Further, from a different viewpoint, in a general semiconductor device such as a logical operation element or a memory element, various structures are formed in a silicon substrate. On the other hand, in a semiconductor device for driving a liquid crystal display or the like, various structures are formed on a substrate. This is because it is necessary to use a transparent substrate because of a functional requirement as a display, and a silicon substrate cannot be used. For example, in a semiconductor device for driving an active matrix type liquid crystal, an active element such as a transistor element or a diode element of an active matrix includes all components such as a gate electrode, a source electrode, a drain electrode, and a semiconductor layer. It is formed on.

  The active matrix type liquid crystal display described above requires that the active elements of the active matrix substrate used have good performance and quality, but an active matrix substrate having active elements with good performance and quality is manufactured. To do so, it is necessary to heat the substrate to a temperature of 200 to 350 ° C. in the manufacturing process. For this reason, a glass substrate is used for the active matrix substrate from the viewpoint of heat resistance and dimensional stability.Therefore, in the current active matrix type liquid crystal display, when the thickness of the glass substrate is reduced in order to reduce the thickness and weight. There is a problem that it is easily broken.

  On the other hand, if an active element having good performance and quality can be manufactured at a process temperature of about 150 ° C. or less, a plastic substrate (film) can be used instead of a glass substrate. The problem of cracking due to weight reduction is eliminated, and a so-called film liquid crystal display becomes possible. However, the manufacture of active devices at a process temperature of about 150 ° C. or less has not yet reached basic research and is not practical. There are also plastic substrates (films) that can withstand a temperature of about 250 ° C., but they are not practical because of insufficient light transmittance or high cost.

  Furthermore, a problem in manufacturing an active device on a plastic substrate (film) is that the plastic substrate (film) itself is deformed due to internal stress and bimetal effect of various metal thin films and inorganic thin films formed in the manufacturing process. Since the flatness is impaired, there is a problem that patterning by various photolithography during a necessary process cannot be performed well.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a base substrate and an active matrix substrate for manufacturing a thin, lightweight, active matrix type film liquid crystal panel having excellent display quality. And

  In order to achieve such an object, the present invention provides a base substrate for manufacturing a film liquid crystal panel, wherein a heat-resistant support substrate having at least one surface conductive is provided, and a surface of the heat-resistant support substrate is peeled off. The configuration includes a metal plating layer formed as possible and an electric insulating layer provided on the metal plating layer.

  As a preferred embodiment of the present invention, the electric insulating layer is configured to be a transparent electric insulating layer.

  As a preferred embodiment of the present invention, the transparent electric insulating layer is configured to be an organic glass layer.

  According to the present invention, an active matrix substrate for manufacturing a film liquid crystal panel has a configuration in which an active matrix layer is provided on an electrical insulating layer of any one of the above base substrates.

  According to the present invention, even if the base substrate is maintained at a high temperature (about 200 to 350 ° C.) in the process of forming the active matrix layer on the electrical insulating layer of the base substrate, the transparent substrate is provided by the heat-resistant supporting substrate provided in the base substrate. Since the deformation of the insulating layer and the electric insulating layer is prevented, the active matrix layer can be formed using the manufacturing process technology and equipment of the active element established on the conventional glass substrate as it is. Then, after laminating a transparent conductive film and a transparent substrate on the active matrix layer of the active matrix substrate via a liquid crystal layer, a metal-plated layer is peeled off from the heat-resistant support substrate constituting the base substrate to form a film-like liquid crystal panel. Is obtained. Alternatively, a film-like liquid crystal panel can be obtained by laminating a polymer-dispersed liquid crystal layer and a conductive film on the active matrix layer, and then peeling off the metal plating layer from the heat-resistant support substrate constituting the base substrate. The film liquid crystal panel obtained in this way is equipped with active elements with good performance and quality, so it is excellent in display quality and can be made thin and light.In addition, unlike conventional thin and light liquid crystal displays, glass substrates Since it is not used, there is an effect that it is not broken even if it is thin. Furthermore, in the case of a film liquid crystal panel having a dispersion type liquid crystal layer, the step of injecting liquid crystal can be changed to the step of forming a liquid crystal layer by coating, and the light reflection layer is formed on the substrate without using a polarizing plate. In addition, since the metal film can also be used as the electrode and the reflective layer, the manufacturing process can be simplified, and since the thickness of the applied dispersed liquid crystal layer is uniform, the cell gap can be reduced. Becomes easier. In addition, even if there is a defect such as a pinhole, the electric insulating layer and the metal plating layer sandwiching the dispersion type liquid crystal layer do not have a problem that the liquid crystal oozes out, and also require strength as an outer wall. Since there is no material, there is an effect that the range of material selection is expanded.

  Hereinafter, the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic sectional view showing an example of an active matrix type liquid crystal display (LCD) using one embodiment of the film liquid crystal panel of the present invention. In FIG. 1, a liquid crystal display 1 includes a film liquid crystal panel 11 and polarizing plates 2 and 3 disposed on both outer sides of the film liquid crystal panel 11. The film liquid crystal panel 11 constituting the liquid crystal display 1 has a transparent electric insulating layer 12, an active matrix layer 13 formed on the transparent electric insulating layer 12, and a liquid crystal layer 14 so as to face the active matrix layer 13. And a transparent substrate 16 laminated on the transparent conductive film 15. The active matrix layer 13 and the transparent conductive film 15 are opposed to each other at a predetermined interval via a spacer (indicated by an imaginary line in the figure), and have a thickness of about 5 to 5 made of twisted nematic (TN) liquid crystal therebetween. A liquid crystal layer 14 of about 10 μm is formed. Although not shown in the drawing, an alignment film is provided on the active matrix layer 13 facing the liquid crystal layer 14 and on the transparent conductive film 15. Although omitted in the illustrated example, when a color filter is provided for a color panel, a color filter can be provided between the transparent conductive film 15 and the transparent substrate 16.

  In the above film liquid crystal panel 11, the transparent electric insulating layer 12 is made of an organic glass containing silicon oxide as a main component, silicon nitride or silicon oxide formed by a sputtering method, a CVD method, or the like, or a nitride formed by a reactive evaporation method. Silicon, silicon oxide and shot glass films, transparent heat-resistant polymers such as polyimide and polyamide imide, and coating / firing type coating glass (T2 (firing temperature 450 ° C) manufactured by Tokyo Ohka Kogyo Co., Ltd., low temperature manufactured by Tonen Co., Ltd.) It can be formed by firing type polysilazane (a firing temperature of 250 ° C.) or the like, and organic glass is particularly preferable from the viewpoint of impact resistance. The thickness of such a transparent electric insulating layer 12 is preferably about 0.5 to 10 μm.

  The active matrix layer 13 has a plurality of pixel electrodes arranged in rows and columns. Each pixel electrode has a thin film transistor or a thin film diode using amorphous silicon, or a MIM (metal / insulator) using tantalum or tantalum oxide. An active element such as a (/ metal) element is connected.

  The transparent conductive film 15 is formed of a transparent conductive material such as indium tin oxide (ITO), tin oxide (NESA), and zinc oxide by a known method such as a sputtering method, a vacuum evaporation method, and a CVD method. (Thickness: 200 to 2,000 mm).

  Further, the transparent substrate 16 is made of polyalate, polyethersulfone, polycarbonate, modified acrylic, or polymethyl methacrylate, epoxy, APO (registered trademark), ZEONEX (registered trademark) used as a segment or simple matrix film LCD substrate. ), A film formed by molding a resin such as ARTON (registered trademark), and the thickness is preferably about 100 to 1000 μm.

  The thickness of such a film liquid crystal panel 11 is preferably about 0.5 to 2.0 mm.

  Next, a method for manufacturing a film liquid crystal panel of the present invention will be described with reference to an example of manufacturing the film liquid crystal panel 11 in FIG. FIG. 2 is a process chart for explaining an example of a method of manufacturing the film liquid crystal panel 11 according to the present invention. First, a metal plating layer 7 is formed on a heat-resistant support substrate 6, and a transparent electric insulating layer 12 is formed on the metal plating layer 7 to manufacture a three-layer base substrate 4 (FIG. 2A). . The heat-resistant support substrate 6 only needs to have conductivity on at least one surface (the surface on which the metal plating layer 7 is formed), as long as the shape and dimensions are stable when heated at about 350 ° C. For example, a metal thin film of titanium, chromium, tungsten, tantalum or the like formed on a glass substrate by sputtering or the like, a SUS substrate such as SUS430, Amber 36 (Ni: Fe = 36: 64), Amber 42 (Ni: Fe = 42) : 58), a Kovar alloy (Fe: Ni: Co = 54: 29: 17) substrate, or the like can be used. The thickness of the heat-resistant support substrate 6 is preferably about 1 to 3 mm in the case of a heat-resistant support substrate in which a metal thin film is formed on a glass substrate, and a heat-resistant support substrate made of a SUS substrate, an Invar alloy substrate, a Kovar alloy substrate, or the like. In the case of a conductive support substrate, the thickness is preferably about 0.1 to 0.3 mm. Further, the surface roughness (Rmax) of the surface of the heat-resistant support substrate 6 on which the metal plating layer 7 is formed is preferably 1000 ° or less. The polishing treatment for reducing the surface roughness (Rmax) of the heat-resistant support substrate 6 to 1000 ° or less is performed by a combination of lapping polishing, electrolytic polishing and mechanical polishing (for example, electrolytic polishing by a polishing device manufactured by Nikko Precision Polishing Co., Ltd.). Composite polishing) or the like.

  Further, the metal plating layer 7 has a suitable adhesiveness to the heat-resistant support substrate 6 and can be peeled off, and is made of nickel, copper, chromium, zinc, tin, iron, or the like. It can be appropriately selected from the relationship with the surface material of the heat-resistant support substrate 6, such as an alloy. The thickness of such a metal plating layer 7 is preferably about 1 to 100 μm. Further, it is preferable to reduce the internal stress of the formed metal plating layer 7. For example, in a nickel plating solution, nickel sulfamate is preferable, and a watt bath using nickel sulfate is not preferable because the internal stress is large. Further, in order to reduce the internal stress of the metal plating layer 7, it is preferable to add an additive to the plating solution, for example, brighteners # 61, # 63, # 610, and # 62 manufactured by Ebara Ujilite. As the additive concentration, the brightener # 61 may be replenished as appropriate, # 63 is about 10 to 15 ml / l, # 610 is about 3 to 7 ml / l, and # 62 is about 0.5 to 3 ml / l.

  Note that, as described above, the metal plating layer 7 needs to have appropriate adhesiveness and peelability with respect to the heat-resistant support substrate 6. For example, an invar alloy or a Kovar alloy is used as the heat-resistant support substrate 6. If nickel plating is applied to this as the metal plating layer 6, they cannot be peeled off. In this case, the invar alloy or the Kovar alloy can be peeled by a passivation treatment. As an example of passivation treatment of an Invar alloy or a Kovar alloy, the surface of the alloy is plated with nickel, immersed in dichromic acid for 10 to 30 seconds, washed, and further plated with nickel for the second time. A process in which a nickel plating film is used as a release plating film is possible.

  According to the method for manufacturing a film liquid crystal panel of the present invention, after the above-described base substrate 4 is manufactured, an active matrix layer 13 is formed on the transparent electric insulating layer 12 of the base substrate 4 to obtain an active matrix substrate 5 (FIG. 2 (B)). Even if the base substrate 4 is maintained at a high temperature (about 200 to 350 ° C.) in the active matrix layer forming process, the transparent electric insulating layer 12 is prevented from being deformed by the heat-resistant support substrate 6 included in the base substrate 4. Therefore, the formation of the active matrix layer 13 can be performed using the active element manufacturing process technology and equipment established on the conventional glass substrate as it is.

  On the other hand, a laminate in which a transparent conductive film 15 is formed on one surface of a transparent substrate 16 via a color filter (not shown), and an alignment film (not shown) is further formed on the transparent conductive film 15 is provided. The laminate is manufactured and disposed on the active matrix substrate 5 such that the transparent conductive film 15 faces the active matrix layer 13 via a spacer of a predetermined size and a sealing material (not shown) (FIG. 2 (C)).

  Since there is no high-temperature heating process in the subsequent steps, the heat-resistant support substrate 6 is not required. Therefore, the unnecessary heat-resistant support substrate 6 is peeled off from the metal plating layer 7, and then the metal plating layer 7 is removed by photolithography. Next, a liquid crystal is injected into a gap between the active matrix layer 13 and the transparent conductive film 15 and sealed with a sealing material 19 to form a liquid crystal layer 14 (FIG. 2D), thereby forming a film liquid crystal panel 11.

  FIG. 3 is a schematic sectional view showing another embodiment of the film liquid crystal panel of the present invention. 3, the film liquid crystal panel 21 is formed on a transparent electric insulating layer 22, a metal plating layer 27 provided on one surface of the transparent electric insulating layer 22, and another surface of the transparent electric insulating layer 22. The active matrix layer 23 includes a transparent conductive film 25 provided so as to face the active matrix layer 23 with the liquid crystal layer 24 interposed therebetween, and a transparent substrate 26 laminated on the transparent conductive film 25. That is, the film liquid crystal panel 21 shown in FIG. 3 is different from the film liquid crystal panel 11 shown in FIG. 1 in that a metal plating layer 27 is provided outside the transparent electric insulating layer 22. 27 is provided with a hole 27a corresponding to the pixel.

  In such a film liquid crystal panel 21, in the manufacturing method shown in FIG. 2, after removing the unnecessary heat-resistant support substrate 6 from the metal plating layer 7 (FIG. 2D), the metal plating layer 7 is removed. It can be manufactured by flowing it to the subsequent process without performing it. The hole 27a is formed in the metal plating layer 27 by removing the unnecessary heat-resistant support substrate 6 from the metal plating layer 7 and then applying a photoresist on the metal plating layer 27, and applying the photoresist in a desired pattern. A mask layer is formed by exposure and development, and the metal plating layer 27 is etched through the mask layer. By forming the holes in the metal plating layer 27 in this manner, a light-transmitting film liquid crystal panel with high strength can be obtained.

  Next, the reflection type film liquid crystal panel of the present invention having a polymer dispersed liquid crystal layer as a liquid crystal layer will be described.

  FIG. 4 is a schematic sectional view showing another embodiment of the film liquid crystal panel of the present invention. In FIG. 4, the film liquid crystal panel 31 includes an active matrix layer 33 and a conductive film 35 laminated on the active matrix layer 33 with a polymer dispersed liquid crystal layer 34 interposed therebetween.

  The active matrix layer 33 is formed similarly to the active matrix 13 in the film liquid crystal panel 11 described above.

  The polymer-dispersed liquid crystal layer 34 has a curable type and a dispersed type. In the absence of an electric field, the orientation of the liquid crystal is random, so that light is not transmitted. When the electric field is applied, the orientation of the liquid crystal is uniform and the liquid crystal becomes transparent. Things.

  The curable polymer-dispersed liquid crystal layer has a three-dimensional polymer network filled with a liquid crystal composition. This curable polymer-dispersed liquid crystal layer is three-dimensionally applied by screen printing or the like, in which a liquid crystal, a monomer, and a prepolymer are compatible with each other, and cured by irradiating with ionizing radiation (ultraviolet rays, electron beams, etc.). It can be created by forming liquid crystal droplets in a network.

  On the other hand, a dispersed polymer-dispersed liquid crystal layer is a layer in which liquid crystals are simply dispersed in a polymer, and is formed by suspending and dispersing liquid crystals in a water-soluble polymer, preferably polyvinyl alcohol (PVA) in water. And a type in which a liquid crystal is made compatible with a lipophilic polymer such as polymethyl methacrylate (PMMA) or an epoxy resin in an organic solvent, and the liquid crystal is dispersed by removing the organic solvent. is there.

  Usually, the thickness of the polymer-dispersed liquid crystal layer 34 can be about 5 to 30 μm, preferably about 8 to 13 μm.

  Since the film liquid crystal panel 31 is a reflective film liquid crystal panel, the conductive film 35 can be made transparent or opaque depending on the display surface.

  When the conductive film 35 is transparent, for example, a transparent conductive material such as indium tin oxide (ITO), tin oxide (NESA), or zinc oxide is formed by a known method such as a sputtering method, a vacuum evaporation method, and a CVD method. (Thickness: 200 to 2000 mm). When the polymer-dispersed liquid crystal layer 34 is of the above-mentioned dispersion type, the dispersion-type polymer-dispersed liquid crystal layer is formed on the polymer-dispersed liquid crystal layer 34 by forming a transparent conductive material by a sputtering method, a vacuum deposition method, or the like. Since the liquid crystal of 34 is volatilized, it is necessary to form a transparent conductive substance after forming a protective film on the polymer dispersed liquid crystal layer 34. However, when a film on which a transparent conductive material is formed is laminated on the polymer-dispersed liquid crystal layer 34 via an adhesive layer, there is no problem whether the polymer-dispersed liquid crystal layer 34 is of a curable type or a dispersed type. In this case, since a voltage loss occurs if the adhesive layer has a mere adhesive property, it is preferable to use a conductive adhesive layer such as, for example, Anisotropic Conductive Film manufactured by Hitachi Chemical Co., Ltd.

  When the conductive film 35 is opaque, the conductive film 35 can be formed by forming an opaque conductive film by a sputtering method, a vacuum deposition method, a CVD method, or the like, laminating a film on which the conductive film is formed, or printing a conductive resin. .

In addition, a transparent insulating film having an adhesive property is provided outside the active matrix layer 33 of the film liquid crystal panel 31 and / or outside the conductive layer 35 (the side opposite to the side on which the polymer dispersed liquid crystal layer 34 is formed) shown in FIG. A configuration in which short-circuits are prevented by providing a film layer by lamination, and a configuration in which a barrier layer is provided between the conductive layer 35 and the film layer may be adopted. As the transparent insulating film having the above-mentioned adhesive property, an adhesive sheet, for example, SPV-C100 and SPV-367 manufactured by Nitto Denko Corporation, PET transparent 25 manufactured by Dainippon Ink and Chemicals, Inc. may be used. The barrier layer can be formed of ethylene vinyl alcohol copolymer, polyvinyl alcohol, SiO _x , SiN _x organic glass, polyimide, or the like. Further, for the purpose of preventing a short circuit of the conductive film 35 on the outside of the transparent conductive film 35, an organic glass containing silicon oxide as a main component, silicon nitride or silicon oxide formed by an evaporation method, a sputtering method, a CVD method, or the like. Alternatively, a transparent electric insulating layer may be formed by forming a transparent heat-resistant polymer such as polyimide or polyamideimide. Note that the transparent electric insulating layer usually has a barrier property, so that the formation of the barrier layer is unnecessary.

  FIG. 5 is a schematic sectional view showing another embodiment of a reflection type film liquid crystal panel provided with a polymer dispersed liquid crystal layer. In FIG. 5, the film liquid crystal panel 41 includes an electric insulating layer 42, an active matrix layer 43, and a conductive film 45 laminated on the active matrix layer 43 via a polymer dispersed liquid crystal layer 44.

  The active matrix layer 43 is formed similarly to the active matrix 13 in the film liquid crystal panel 11 described above.

  The polymer dispersed liquid crystal layer 44 is a liquid crystal layer in which liquid crystal is dispersed in a polymer, similarly to the polymer dispersed liquid crystal layer 34 described above.

  Since the film liquid crystal panel 41 is also a reflection type film liquid crystal panel, one of the electric insulating layer 42 and the conductive film 45 can be made opaque depending on which surface the display surface is. When the electric insulating layer 42 is transparent, for example, organic glass containing silicon oxide as a main component, silicon nitride or silicon oxide formed by an evaporation method, a sputtering method, a CVD method, or the like, a transparent heat-resistant polymer such as polyimide or polyamide It can be formed of imide or the like, and organic glass is particularly preferable from the viewpoint of impact resistance. The thickness of the electric insulating layer 42 is preferably about 0.5 to 10 μm. When the electric insulating layer 42 is opaque, it can be formed by printing an insulating resin or the like in addition to forming the opaque electric insulating layer by a sputtering method, a vacuum evaporation method, a CVD method, or the like. Note that the conductive film 45 can be formed in the same manner as the conductive film 35 described above.

  Further, a transparent insulating film having adhesiveness is laminated on the outside of the transparent conductive layer 45 of the film liquid crystal panel 41 shown in FIG. 5 (the side opposite to the side on which the polymer dispersed liquid crystal layer 44 is formed) to provide a film layer. A configuration in which a short circuit is prevented, and a configuration in which a barrier layer is provided between the conductive layer 45 and the film layer may be employed. The film layer and the barrier layer can be formed in the same manner as in the case of the film liquid crystal panel described above (FIG. 4). Further, for the purpose of preventing a short circuit of the conductive film 45 on the outside of the transparent conductive film 45, an organic glass containing silicon oxide as a main component, silicon nitride or silicon oxide formed by an evaporation method, a sputtering method, a CVD method, or the like. Alternatively, a transparent electric insulating layer may be formed by forming a transparent heat-resistant polymer such as polyimide or polyamideimide. Note that the transparent electric insulating layer usually has a barrier property, so that the formation of the barrier layer is unnecessary.

  FIG. 6 is a schematic sectional view showing another embodiment of a reflection type film liquid crystal panel provided with a polymer dispersed liquid crystal layer. In FIG. 6, a film liquid crystal panel 51 includes an electric insulating layer 52, an active matrix layer 53, a conductive film 55 laminated on the active matrix layer 53 via a polymer dispersed liquid crystal layer 54, and an outer side of the electric insulating layer 52. It consists of the formed metal plating layer 57. By providing the metal plating layer 57 in this way, the film liquid crystal panel 51 has higher strength while having flexibility. Therefore, the electric insulating layer 52 can be formed by selecting from a wider range of materials than in the case of the film liquid crystal panel 41 described above.

  The active matrix layer 53 is formed in the same manner as the active matrix 13 in the film liquid crystal panel 11 described above.

  The polymer dispersed liquid crystal layer 54 is a liquid crystal layer in which liquid crystal is dispersed in a polymer, similarly to the polymer dispersed liquid crystal layer 34 described above.

  Further, the film liquid crystal panel 51 having the above-mentioned metal plating layer 57 may be one in which holes corresponding to pixels are formed in the metal plating layer 57. The formation of the hole in the metal plating layer 57 can be performed in the same manner as the formation of the hole in the metal plating layer 27 of the film liquid crystal panel 21 described above.

  The film liquid crystal panel 51 is a reflection type film liquid crystal panel, and the conductive film 55 is a transparent conductive film because the metal plating layer 57 is provided on the electric insulating layer 52. Further, as described above, when the hole corresponding to the pixel is formed in the metal plating layer 57, one of the electric insulating layer 52 and the conductive film 55 can be made opaque according to the display surface. The conductive film 55 may be formed by laminating a film on which a conductive substance is formed as described above to the polymer-dispersed liquid crystal layer 54 via an adhesive layer.

  Further, a film layer is provided by laminating an adhesive transparent insulating film on the outside of the transparent conductive layer 55 of the film liquid crystal panel 51 shown in FIG. 6 (on the side opposite to the side on which the polymer dispersed liquid crystal layer 54 is formed). A configuration in which a short circuit is prevented and a configuration in which a barrier layer is provided between the conductive layer 55 and the film layer may be employed. The film layer and the barrier layer can be formed in the same manner as the film liquid crystal panel shown in FIG. In order to prevent a short circuit of the conductive film 55 on the outside of the transparent conductive film 55, an organic glass containing silicon oxide as a main component, silicon nitride or silicon oxide formed by an evaporation method, a sputtering method, a CVD method, or the like. Alternatively, a transparent electric insulating layer may be formed by forming a transparent heat-resistant polymer such as polyimide or polyamideimide. Note that the transparent electric insulating layer usually has a barrier property, so that the formation of the barrier layer is unnecessary.

  In the film liquid crystal panel of the present invention having the above-mentioned polymer dispersed liquid crystal layer, the step of injecting the liquid crystal can be changed to the step of forming the liquid crystal layer by coating, and the light reflection can be performed without using a polarizing plate. The layer can be provided on the substrate, and the metal film can be used also as the electrode and the reflective layer, so that the manufacturing process can be simplified. Further, since the thickness of the polymer-dispersed liquid crystal layer laminated on the active matrix layer is uniform, it is easier to make the cell gap uniform. In addition, the electric insulating layer and metal plating layer sandwiching the polymer dispersed liquid crystal layer do not have the problem that the liquid crystal oozes out even if there is a defect such as a pinhole, and the strength of the outer wall is required. Because there is no material, the range of material selection is expanded.

  Next, a method for manufacturing a film liquid crystal panel having a polymer dispersed liquid crystal layer will be described using the film liquid crystal panel shown in FIG. 4 as an example. FIG. 7 is a process chart for explaining an example of a method of manufacturing the film liquid crystal panel 31 according to the present invention. First, a metal plating layer 67 is formed on a heat-resistant support substrate 66 to form a base substrate 64 having a two-layer structure (FIG. 7A). The materials of the heat-resistant support substrate 66 and the metal plating layer 67, and the formation of the metal plating layer 67 on the heat-resistant support substrate 66 are performed by the heat-resistant support substrate 6 of the base substrate 4 having the three-layer structure described above (FIG. 2). , And the same as the metal plating layer 7, and the description is omitted here.

  After manufacturing the base substrate 64, the active matrix layer 33 is formed on the metal plating layer 67 of the base substrate 64 to form an active matrix substrate 65 (FIG. 7B). Even if the base substrate 64 is maintained at a high temperature (about 200 to 350 ° C.) in the active matrix layer forming process, the deformation of the base substrate 64 is prevented by the heat resistant support substrate 66 provided in the base substrate 64. Therefore, the formation of the active matrix layer 33 can be performed using the manufacturing process technology and equipment of the active element established on the conventional glass substrate as it is.

  Next, a polymer dispersed liquid crystal layer 34 in which liquid crystal is dispersed in a polymer is applied on the active matrix layer 33, and a conductive film 35 is formed on the polymer dispersed liquid crystal layer 34 (FIG. 7). (C)).

  Since there is no high-temperature heating process in the subsequent steps, the heat-resistant supporting substrate 66 is not required. Therefore, the unnecessary heat-resistant support substrate 66 is peeled off from the metal plating layer 67, and then the metal plating layer 67 is removed by photolithography to obtain the film liquid crystal panel 31 (FIG. 7D).

  The production of the film liquid crystal panel 41 shown in FIG. 5 is performed in a process shown in FIG. 7 using a base substrate 4 having a three-layer structure as shown in FIG. be able to. Further, the film liquid crystal panel 51 shown in FIG. 6 can be manufactured by forming the film liquid crystal panel 41 as it is without removing the metal plating layer.

  In the method of manufacturing a film liquid crystal panel having the polymer dispersed liquid crystal layer described above, if the conductive film 35 may be opaque, it can be formed by printing a conductive resin or the like. All the steps after the formation (formation of the polymer dispersed liquid crystal layer, formation of the conductive film, etc.) can be applied steps, which can simplify the production process.

Next, the present invention will be described in more detail with reference to examples.
(Example 1)
A metal Ti layer (thickness: 1 μm) was formed on a glass substrate having a thickness of 1 mm by a sputtering method to obtain a heat-resistant support substrate. An Ni plating layer (thickness: 3 μm) was formed on the metal Ti layer of the heat-resistant support substrate by an electroplating method using the following Ni plating solution.

Composition of Ni plating solution: Nickel sulfamate 350 g / l
・ Ebara Eugerite Brightener # 61… timely replenishment ・ Ebara Eugerite Brightener # 63… 10-15ml / l
・ Ebara Eugelight Co., Ltd. Brightener # 610 3-7ml / l
・ Ebara Eugelight Co., Ltd. Brightener # 62… 0.5-3ml / l
・ PH buffer (boric acid)… 40g / l
Further, a normal temperature glass coating agent GA-1 (manufactured by Fine Glass Technology Co., Ltd.) was applied on the Ni plating layer to form a transparent electric insulating layer (thickness: 1 μm) to obtain a three-layer base substrate.

Next, a gate electrode and a pixel electrode were formed on predetermined portions of the transparent electric insulating layer of the base substrate using Cr. Thereafter, a SiN _x layer was formed so as to cover the gate electrode to form a gate insulating layer, and an amorphous silicon (a-Si) layer was formed on the gate electrode via the SiN _x layer. Further, a Cr source electrode is formed so as to be connected to one end of the a-Si layer, and a Cr drain electrode is formed so as to be connected to the other end of the a-Si layer and the pixel electrode, thereby forming a TFT active matrix layer. A substrate was obtained. In forming the active matrix layer, the base substrate was kept at 250 to 350 ° C. for 90 minutes.

  A coating liquid for an alignment film (alignment agent AL-3046 (manufactured by Nippon Synthetic Rubber Co., Ltd.)) and a diluent ACT-608 (Nippon Synthetic Rubber) are applied on the active matrix layer of the active matrix substrate by spinner coating (3000 rpm, 30 seconds). (Manufactured by Co., Ltd.) at a ratio of 5: 3) to form an alignment film (thickness: 800 °). Thereafter, a rubbing treatment was performed under the conditions of a roll rotation speed of 200 rpm and a stage speed of 10 mm / sec.

  On the other hand, polycarbonate (Teijin Chemical Co., Ltd., 400 μm thick) is used as a transparent substrate, and R, G, B colored layers are formed on the transparent substrate by a known pigment dispersion method, dyeing method, electrodeposition method, printing method, or the like. (Thickness: 3 μm) was formed so as to correspond to the above-mentioned pixel electrode, and was used as a color filter. Further, a transparent conductive film (ITO) having a thickness of 1000 ° was formed according to a standard method, and an alignment film (thickness of 800 °) was formed on the transparent conductive film as described above, and a rubbing treatment was performed to produce a laminate.

  Next, a seal layer was formed with a sealant on the active matrix substrate on which the above-described alignment treatment was performed. For the formation of the seal layer, a mixture of 1 g of a sealant (DSK-7221-4 manufactured by Shikoku Chemicals Co., Ltd.) and 20 mg of a spacer (PF-60 manufactured by NEC Corporation) having an average particle diameter of 6 μm is used. And formed by a dispenser device.

In addition, a spacer layer was applied and formed on the laminate subjected to the above-mentioned orientation treatment. This spacer layer is spinner-coated with a spacer diluent (concentration: 0.2% by weight) obtained by diluting an adhesive spacer having an average particle diameter of 6 μm (XC-610 manufactured by Natco) with a diluent (IPA: water = 1: 1). (2000 rpm, 30 seconds) to form a particle density of 150 to 200 particles / mm ² .

Such an active matrix substrate and a laminate were disposed using a panel cell assembly and manufacturing process established with a conventional glass substrate such that the transparent conductive film side and the active matrix layer side faced each other. As a disposition method, pressure bonding and curing were performed using a pressure bonding jig under the conditions of a pressure of 4 kg / cm ² , a heat treatment of 120 ° C., and an hour. Thereafter, the heat-resistant support substrate is peeled off from the Ni plating layer, and the Ni plating layer is removed by photolithography. Then, a twisted nematic liquid crystal LDP-5034LA (manufactured by Chisso Corporation) is provided in the gap between the active matrix layer and the transparent conductive film. And sealed with a sealant to form a liquid crystal layer, thereby producing a transmission type film liquid crystal panel as shown in FIG. The thickness of this film liquid crystal panel was 0.5 mm.

Using this film liquid crystal panel, a transmission type active matrix type color liquid crystal display (thickness: 1.0 mm) having polarizing films attached to both sides of the panel as shown in FIG. 1 was produced. When a drive circuit was connected to this color liquid crystal display to perform display, it was a liquid crystal display having extremely high display quality equivalent to a color liquid crystal display manufactured using a conventional glass substrate. Further, no change in the characteristics of the active element due to the peeling of the plating layer, and no disconnection or short circuit of various wiring lines were observed.
(Example 2)
After peeling off the heat-resistant support substrate from the metal plating layer, only the portions corresponding to the pixel electrodes in the metal plating layer were removed by photolithography, except that the transmission type film liquid crystal panel (thickness 1) was used. .0 mm).

Using this film liquid crystal panel, an active matrix type color liquid crystal display (1.6 mm thick) was produced. When a drive circuit was connected to this color liquid crystal display to perform display, it was a liquid crystal display having extremely high display quality equivalent to a color liquid crystal display manufactured using a conventional glass substrate. Further, no change in the characteristics of the active element due to the peeling of the plating layer, and no disconnection or short circuit of various wiring lines were observed.
(Example 3)
First, an active matrix layer was formed on the transparent electric insulating layer of the base substrate in the same manner as in Example 1 to produce an active matrix substrate.

  Next, E-44 (manufactured by Merck) was ultrasonically dispersed in a 5% by weight aqueous solution of KP-06 (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., degree of polymerization: about 600, degree of saponification: 71 to 75). , KH-17 (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., polymerization degree: about 1700, saponification degree: 78.5 to 81.5), and finally PVA: liquid crystal = 20: A PVA aqueous solution of the liquid crystal was prepared so as to have a weight ratio of 80 (weight ratio) to obtain a polymer-dispersed liquid crystal.

  Next, the polymer-dispersed liquid crystal was coated on the active matrix layer of the active matrix substrate using a blade coater, heat-treated at 40 ° C. for 1 hour, and dried to form a polymer-dispersed liquid crystal layer having a thickness of 10 μm. Was formed.

  On the other hand, polycarbonate (Teijin Chemical Co., Ltd., 400 μm thick) is used as a transparent substrate, and R, G, B colored layers are formed on the transparent substrate by a known pigment dispersion method, dyeing method, electrodeposition method, printing method, or the like. (Thickness: 3 μm) was formed so as to correspond to the pixel electrodes of the active matrix layer, thereby forming a color filter. Further, a transparent conductive film (ITO) having a thickness of 1000 ° is formed according to a standard method, and an adhesive is applied on the transparent conductive film by spinner coating (3000 rpm, 30 seconds) to form an adhesive layer (thickness: 2 μm). Was prepared.

Such an active matrix substrate and a laminate were disposed in the same manner as in Example 1 such that the polymer dispersed liquid crystal layer side and the transparent conductive film side faced each other. As a disposition method, pressure bonding and curing were performed using a pressure bonding jig under conditions of a pressure of 4 kg / cm ² , a heat treatment of 40 ° C., and an hour. Thereafter, the heat-resistant support substrate was peeled off from the Ni plating layer, and the Ni plating layer was removed by photolithography to produce a dispersion type liquid crystal display (thickness: 3 mm) of a transmission type active matrix type display. When a drive circuit was connected to this liquid crystal display to perform display, it was a liquid crystal display device with extremely high display quality equivalent to a liquid crystal display manufactured using a conventional glass substrate. Further, no change in the characteristics of the active element due to the peeling of the plating layer, and no disconnection or short circuit of various wiring lines were observed.
(Example 4)
After peeling off the heat-resistant support substrate from the metal plating layer, a dispersion type liquid crystal display (thickness: 3 mm) of a reflective active matrix type display was produced in the same manner as in Example 3 except that the metal plating layer was left as it was. When a drive circuit was connected to this liquid crystal display to perform display, it was a liquid crystal display device with extremely high display quality equivalent to a liquid crystal display manufactured using a conventional glass substrate. Further, no change in the characteristics of the active element due to the peeling of the plating layer, and no disconnection or short circuit of various wiring lines were observed.
(Example 5)
First, an active matrix layer was formed on the transparent electric insulating layer of the base substrate in the same manner as in Example 1 to produce an active matrix substrate.

  Next, E-44 (manufactured by Merck) was ultrasonically dispersed in a 5% by weight aqueous solution of KP-06 (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., degree of polymerization: about 600, degree of saponification: 71 to 75). , KH-17 (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., polymerization degree: about 1700, saponification degree: 78.5 to 81.5), and finally PVA: liquid crystal = 20: A PVA aqueous solution of the liquid crystal was prepared so as to have a weight ratio of 80 (weight ratio) to obtain a polymer-dispersed liquid crystal.

  Next, the polymer-dispersed liquid crystal was coated on the active matrix layer of the active matrix substrate using a blade coater, heat-treated at 40 ° C. for 1 hour, and dried to form a polymer-dispersed liquid crystal layer having a thickness of 10 μm. Was formed. Thereafter, an adhesive layer (Anisotropic Conductive Film manufactured by Hitachi Chemical Co., Ltd.) was formed on the film on which the transparent conductive film (ITO) of 1000 ° was formed, and this film was bonded to the polymer dispersed liquid crystal layer.

Thereafter, the heat-resistant support substrate was peeled off from the Ni plating layer to produce a polymer dispersion type liquid crystal display (thickness: 3 mm) of a reflection type active matrix type display. When a drive circuit was connected to this liquid crystal display to perform display, it was a liquid crystal display device with extremely high display quality equivalent to a liquid crystal display manufactured using a conventional glass substrate. Further, no change in the characteristics of the active element due to the peeling of the plating layer, and no disconnection or short circuit of various wiring lines were observed.
(Example 6)
A base substrate was produced in the same manner as in Example 1 except that the transparent electric insulating layer was formed of a SiN _x film by plasma CVD, and an active matrix layer was formed on the transparent electric insulating layer of this base substrate in the same manner as in Example 1. Thus, an active matrix substrate was manufactured.

  Next, E-44 (manufactured by Merck) was ultrasonically dispersed in a monomer (Ironic M-1200 manufactured by Toa Gosei Chemical Co., Ltd.) to which 5% of an initiator (Irgacure 184 manufactured by Ciba Geigy Co., Ltd.) was added. Finally, an aqueous monomer dispersion solution of liquid crystal was prepared so that the ratio of monomer: liquid crystal was finally 30:70 (weight ratio).

Next, the above-mentioned monomer-dispersed aqueous solution is applied onto the active matrix layer of the active matrix substrate using a blade coater, and is cured by irradiation with ultraviolet rays (200 mJ / cm ² ). A layer was formed.

  Next, a transparent conductive film (ITO) having a thickness of 1000 ° was formed on the polymer dispersed liquid crystal layer by a sputtering method.

Thereafter, the heat-resistant support substrate was peeled off from the Ni plating layer to produce a polymer dispersion type liquid crystal display (thickness: 3 mm) of a reflection type active matrix type display. When a drive circuit was connected to this liquid crystal display to perform display, it was a liquid crystal display device with extremely high display quality equivalent to a liquid crystal display manufactured using a conventional glass substrate. Further, no change in the characteristics of the active element due to the peeling of the plating layer, and no disconnection or short circuit of various wiring lines were observed.
(Example 7)
In the same manner as in Example 6, a process up to the formation of a transparent conductive film (ITO) having a thickness of 1000 ° on the polymer dispersed liquid crystal layer was performed.

  Next, R, G, and B colored layers (thickness: 3 μm) are formed on the transparent conductive film by a known pigment dispersion method, dyeing method, electrodeposition method, printing method, or the like so as to correspond to the pixel electrodes of the active matrix layer. To form a color filter.

  Thereafter, after the heat-resistant support substrate was peeled off from the metal plating layer, only the portions of the metal plating layer corresponding to the pixel electrodes were removed by photolithography to produce a transmission type film liquid crystal panel (thickness: 1.0 mm). .

  Using this film liquid crystal panel, an active matrix type color liquid crystal display (1.6 mm thick) was produced. When a drive circuit was connected to this color liquid crystal display to perform display, it was a liquid crystal display having extremely high display quality equivalent to a color liquid crystal display manufactured using a conventional glass substrate. Further, no change in the characteristics of the active element due to the peeling of the plating layer, and no disconnection or short circuit of various wiring lines were observed.

  The present invention can be used for producing a power-saving and thin display, for example, a liquid crystal panel in a film form.

FIG. 1 is a schematic sectional view showing an example of an active matrix type liquid crystal display (LCD) using a film liquid crystal panel of the present invention. It is a flowchart for explaining an example of a manufacturing method of a film liquid crystal panel by the present invention. FIG. 4 is a schematic sectional view showing another embodiment of the film liquid crystal panel of the present invention. FIG. 4 is a schematic sectional view showing another embodiment of the film liquid crystal panel of the present invention. FIG. 4 is a schematic sectional view showing another embodiment of the film liquid crystal panel of the present invention. FIG. 4 is a schematic sectional view showing another embodiment of the film liquid crystal panel of the present invention. FIG. 4 is a process chart for explaining another example of the method for manufacturing a film liquid crystal panel according to the present invention.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display 2,3 ... Polarizing plate 4 ... Base substrate 5 ... Active matrix substrate 6 ... Heat resistant support substrate 7 ... Metal plating layer 8 ... Transparent electric insulating layer 11,21 ... Film liquid crystal panel 12,22 ... Transparent substrate Insulating layers 13, 23 Active matrix layers 14, 24 Liquid crystal layer 15, 25 Transparent conductive film 16, 26 Transparent substrate 27 Metal plating layers 31, 41, 51 Film liquid crystal panels 33, 43, 53 Active matrix Layers 34, 44, 54: dispersed liquid crystal layer 35, 45, 55: conductive film 42, 52: electric insulating layer 57: metal plating layer

Claims (4)

In a base substrate for manufacturing a film liquid crystal panel,
At least one surface includes a heat-resistant support substrate having conductivity, a metal plating layer formed releasably on the surface of the heat-resistant support substrate, and an electrical insulating layer provided on the metal plating layer. A base substrate characterized by the above-mentioned.   The base substrate according to claim 1, wherein the electric insulating layer is a transparent electric insulating layer.   The base substrate according to claim 2, wherein the transparent electric insulating layer is an organic glass layer. In an active matrix substrate for manufacturing a film liquid crystal panel,
An active matrix substrate, comprising: an active matrix layer on the electrical insulating layer of the base substrate according to claim 1.

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