JP2004174807A - Process for manufacturing ink jet head unit and ink jet head unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To complete the bonding of a base board and a cover in a short time while using a UV-curing adhesive. <P>SOLUTION: The UV-curing adhesive 31 is applied to at least one bonding part 20a or 21a of a base board 20 provided with an ink jet head and its driver IC connected through a wiring pattern or a cover 21 being bonded to the base board 20 (step 2). The base board 20 and the cover 21 are then pasted together and the adhesive is projected from between the bonding parts 20a and 21a onto the surface of the base board 20 over the entire circumference at the bonding part (step 3). The projected adhesive 31 is irradiated with UV-rays only at the part 31a on the outside of the cover 21 thus curing only that part 31 (step 4). <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an inkjet head unit and an inkjet head.
[0002]
[Prior art]
In a conventional ink jet head unit, an ink jet head and a driver IC mounted with a driving circuit and the like are fixed on a base substrate, and the driver IC and a wiring pattern connecting the ink jet head and the driver IC are covered. Some have a cover fixed thereto.
[0003]
In this case, in order to prevent liquids and solids such as conductive ink from entering the wiring pattern, an ink-resistant adhesive is used as a sealing material between the base substrate and the cover and between the inkjet head and the cover. An agent or silicone is used to cover the entire periphery of the cover.
[0004]
An epoxy adhesive is often used as a sealant between the base substrate and the cover and between the inkjet head and the cover, and a thermosetting epoxy adhesive is used for the adhesive. There are a mold and a cold setting type.
[0005]
Further, as another means, sealing is performed by sandwiching an elastic material between the base substrate and the cover.
[0006]
[Problems to be solved by the invention]
However, when the above-mentioned thermosetting epoxy-based adhesive is used, when electronic components such as a driver IC are mounted on a base substrate, there is a problem that the epoxy resin cannot be cured at a high temperature. In addition, depending on the material of the base substrate and the cover, the member is deformed due to a change in heat during thermosetting. There is also a defect that.
[0007]
On the other hand, when a room temperature curing type epoxy adhesive is used, there is a problem that it takes time until the adhesive is cured.
[0008]
Further, when the space between the base substrate and the cover is sealed by using an elastic material, there is a problem that there is a problem in the hermeticity for completely preventing the intrusion of the liquid.
[0009]
Therefore, if an ultraviolet curable adhesive is used to seal the space between the base substrate and the cover, the sealing effect is high and the curing can be completed in a short time.
[0010]
However, the ultraviolet-curable adhesive can cure only a portion that can be irradiated with ultraviolet light, and when using a cover having a shape with a large number of uneven surfaces, there is a problem that it takes time to apply the cover.
[0011]
An object of the present invention is to enable the bonding between a base substrate and a cover to be completed in a short time while using an ultraviolet curable adhesive.
[0012]
[Means for Solving the Problems]
The present invention provides an ink-jet head and a drive circuit for the same, and a base substrate in which both of them are connected by a wiring pattern, or a cover that is bonded to the base substrate. Apply adhesive. After the application, the base plate and the cover are attached to each other and pressurized, so that the adhesive protrudes from the bonding portion between the two onto the surface of the base plate. Further, ultraviolet rays are applied only to the outside portion of the cover in the protruding adhesive, and only the portion is cured.
[0013]
Therefore, the work of applying an adhesive to bond the base substrate and the cover is performed only by applying an amount of the adhesive to the extent that the adhesive protrudes when the base plate and the cover are bonded and pressed. It is possible to shorten the operation time of the application operation of the coating. Then, by sealing the adhesive, an ink jet head unit can be manufactured in which a liquid or a solid such as a conductive ink does not enter the wiring pattern.
[0014]
Further, the present invention provides a base substrate, an inkjet head provided on the base substrate, a drive circuit of the inkjet head provided on the same surface as the inkjet head on the base substrate, an inkjet head and the drive circuit And a cover that covers the wiring pattern and is adhered to the base substrate. An ultraviolet-curing adhesive is used for bonding the base substrate and the cover, and the adhesive protrudes from the bonding portion between the base plate and the cover onto the surface of the base plate.
[0015]
Therefore, when manufacturing the ink jet head unit, the adhesive may be cured by irradiation of ultraviolet rays only in the outside of the cover out of the protruding adhesive, so that the adhesive is used to adhere the base substrate and the cover. In the operation of applying the adhesive, it is only necessary to apply an amount such that the adhesive protrudes when the base plate and the cover are bonded and pressed, and the operation time of the adhesive application operation can be reduced. Then, by sealing the adhesive, an ink jet head unit can be manufactured in which a liquid or a solid such as a conductive ink does not enter the wiring pattern.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described.
[0017]
FIG. 1 is a longitudinal sectional view of an ink ejection device 1 used in an inkjet head unit 25 (see FIG. 5) according to an embodiment of the present invention. FIG. 2 is a sectional view taken along line AA of FIG. As shown in FIGS. 1 and 2, nozzles 13 for ejecting ink droplets are provided on an orifice plate 18 that forms a plurality of pressure chambers 11 for containing ink. Further, ink is supplied to each pressure chamber 11 from a common ink chamber 16. A vibration plate 14 is formed on the bottom surface of the pressure chamber 11, and a plurality of piezoelectric members 15 are fixed to the lower surface of the vibration plate 14 corresponding to the pressure chamber 11. The vibration plate 14 and the piezoelectric member 15 constitute an actuator of the ink ejection device 1, and the piezoelectric member 15 is electrically connected to an output terminal of the drive circuit 2. The ink supply port 17 is connected to the common ink chamber 16 and supplies ink to the common ink chamber 16 from an ink tank (not shown).
[0018]
Next, a method of manufacturing the inkjet head unit 25 (see FIG. 5) using the ink ejection device 1 will be described with reference to FIGS.
[0019]
(1) Step 1:
As shown in FIG. 3, an ink jet head 19 using the ink ejection device 1 is fixed on a base plate 20 with an epoxy adhesive or the like. The driver IC 22 on which the drive circuit 2 is mounted is also fixed on the same surface of the base plate 20 as the ink jet head 19. The inkjet head 19 is connected to the driver IC 22 via a wiring pattern 23.
[0020]
(2) Step 2:
A cover 21 shown in a perspective view in FIG. 4 is a protection member that covers and protects the driver IC 22 and the wiring pattern 23 on the base plate 20. As shown in FIG. 5, the cover 21 is adhered and fixed on the base plate 20 so as to cover the driver IC 22 and the wiring pattern 23 on the base plate 20.
[0021]
Therefore, first, an ultraviolet-curable adhesive 31 (see FIG. 6) is applied to the adhesive portion 20a or 21a of either the base plate 20 or the cover 21. This operation can be performed, for example, by applying an adhesive around the adhesive portion 21a of the cover 21 with a dispenser.
[0022]
(3) Step 3:
Next, the base plate 20 and the cover 21 are bonded and pressed. Due to this pressurization, the adhesive 31 protrudes onto the surface of the base plate 20 over the entire circumference between the bonding parts 20a and 21a from between the bonding parts 20a and 21a.
[0023]
(4) Step 4:
Due to the pressure in step 3, only the outer portion 31a of the cover 21 of the adhesive 31 protruding onto the surface of the base plate 20 is irradiated with ultraviolet rays to be cured. As a result, the outer portion 31a of the adhesive 31 is cured, and the inner portion 31b remains uncured.
[0024]
Therefore, according to the inkjet head unit 25, the operation of applying the adhesive 31 around the bonding portion 21a of the cover 21 with a dispenser is performed when the base plate 20 and the cover 21 are bonded and pressed, and the adhesive 31 protrudes. Since it is only necessary to apply a small amount, it is possible to shorten the operation time of the operation of applying the adhesive 31. By sealing the adhesive 31, it is possible to manufacture the ink jet head unit 25 in which a liquid or a solid such as conductive ink does not enter the wiring pattern 23 or the driver IC 22.
[0025]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the manufacturing method or the inkjet head unit of the inkjet head unit of this invention, the working time of the application | coating operation of an adhesive can be shortened, even if an ultraviolet curing adhesive is used.
[Brief description of the drawings]
FIG. 1 is a vertical cross-sectional view of an ink ejection device that constitutes an inkjet head unit according to an embodiment of the present invention.
FIG. 2 is a sectional view taken along line AA of FIG.
FIG. 3 is a perspective view of the inkjet head unit before a cover is attached.
FIG. 4 is a perspective view of a cover.
FIG. 5 is a perspective view of an inkjet head unit with a cover attached.
FIG. 6 is a vertical cross-sectional view showing a bonding portion between a cover and a base substrate.
[Explanation of symbols]
19 Inkjet head 20 Base substrate 21 Cover 22 Drive circuit 23 Wiring pattern 25 Inkjet head unit 31 Ultraviolet-curable adhesive 31a Extruded portion of ultraviolet-curable adhesive outside cover 31b Ultraviolet-curable adhesive inside cover Protruding part

Claims (2)

An inkjet head and a drive circuit for the inkjet head are provided, and an ultraviolet curable adhesive is applied to at least one of a base substrate and a cover bonded to the base substrate, both of which are connected by a wiring pattern. The process of
After the application, the base plate and the cover are attached and pressed, and a step of extruding the adhesive onto the surface of the base plate from between the bonded portions of the two,
A step of irradiating ultraviolet rays only to the outside portion of the cover in the protruding adhesive to cure only the portion,
A method for manufacturing an ink jet head unit comprising: A base substrate,
An inkjet head provided on the base substrate,
A drive circuit for the inkjet head provided on the same surface as the inkjet head on the base substrate,
A wiring pattern that connects the inkjet head and the drive circuit,
A cover that covers the wiring pattern and is adhered to the base substrate;
With
An ultraviolet-curable adhesive is used for the bonding, and the adhesive protrudes from the bonding portion between the base plate and the cover onto the surface of the base plate.
Inkjet head unit.

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