JP2004165759A - Camera apparatus and replaceable area sensor module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a camera apparatus which realizes upgrade of a version of an area sensor and easily copes with photographing under various sophisticated functions while reducing the expense burden of a user. <P>SOLUTION: The camera apparatus is provided with an insertion port 121 and a module mount section 120 to mount a replaceable area sensor module 140 to a mobile camera main body 100. Mounting the replaceable area sensor module 140 to the module mount section 120 through the insertion port 121 can set the replaceable area sensor module 140 to a prescribed position of the camera main body and allow a user to take a picture in this state. Then the user can take a picture by using an updated area sensor by replacing the replaceable area sensor module 140. Thus, the user can take a picture under a new function without the need for replacing the camera apparatus itself every time update takes place. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a camera device and an exchangeable area sensor module that can select various area sensors to photograph various subjects.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, for example, in a digital still camera, a high-definition color image can be captured using an area sensor including a CCD solid-state imaging device.
FIG. 8 is a block diagram showing a configuration example of a conventional digital still camera.
This digital still camera includes an imaging lens system 1, a solid-state imaging device 2, an analog circuit 3, an A / D converter 4, a camera signal processing circuit 5, a compression / expansion circuit 6, a storage medium 7, an operation display unit 8, and a control circuit 9. have.
First, a light beam incident from the imaging lens system 1 forms an image on a two-dimensional pixel array of the solid-state imaging device 2. Then, the image signal output of the solid-state imaging device 2 is sent to the analog circuit 3.
The analog circuit 3 performs processes such as CDS (correlated double sampling) and AGC (auto gain control). The image signal processed by the analog circuit 3 is converted from analog data to digital data by the A / D converter 4 and output to the camera signal processing circuit 5.
[0003]
The camera signal processing circuit 5 is a circuit that performs signal processing such as color signal processing, gain control processing, and white balance processing for converting output data of the solid-state imaging device 2 into a video signal.
The compression / decompression circuit 6 is a circuit that compresses or decompresses the image data processed by the camera signal processing circuit 5 and converts the image into a format that can be stored in the storage medium 7. The storage medium 7 is, for example, a memory stick or the like, and is an example of a unit that outputs image data.
The operation display section 8 is used by a user as a man-machine interface to perform various key input operations, display the status of the camera device to the user, and the like.
The control circuit 9 performs overall control of the present camera device, and executes an imaging operation based on a user's instruction.
[0004]
[Problems to be solved by the invention]
By the way, as for the area sensor used in such a digital still camera, various high-performance ones have been developed and commercialized due to the remarkable progress of semiconductor manufacturing technology in recent years. It is expected to be significant.
However, in the above-mentioned conventional digital still camera, since the area sensor is fixedly incorporated in the camera body, the camera body and the area sensor are integrated.
For this reason, when a user attempts to shoot with a newly commercialized area sensor having a high function, it is necessary to purchase a new digital still camera of a new model, and replacement costs increase. there were.
[0005]
Therefore, an object of the present invention is to provide a camera device capable of realizing a version upgrade of an area sensor while easily reducing a user's cost burden, and capable of easily coping with various high-performance photographing, and an exchange type device that can be used for upgrading the camera device. An object of the present invention is to provide an area sensor module.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a module mounting portion for detachably mounting a replaceable area sensor module including a solid-state image sensor on a camera body for photographing a subject, and a replaceable type mounted on the module mounting portion. Connection means for connecting the area sensor module and a circuit unit disposed in the camera body; and control means for controlling a photographing operation by an exchangeable area sensor module mounted on the module mounting unit. I do.
[0007]
Further, the present invention provides a solid-state imaging device which performs shooting of a subject through an imaging optical system provided in the camera device on a module main body detachably mounted on a module mounting portion provided in the camera device, and outputs the shooting result. The image processing apparatus further includes an element, a processing circuit unit that processes an output from the solid-state imaging device, and a connection unit that connects the processing circuit unit and a circuit unit of the camera device.
[0008]
According to the present invention, an exchangeable area sensor module equipped with a solid-state imaging device separately from the camera device is provided, and the exchangeable area sensor module is detachably mounted on the camera device side to execute an imaging operation and output. With the module mounting part that can take out the signal, the old replaceable area sensor module can be replaced with a new replaceable area sensor module at any time, allowing new functions without replacing the camera device itself. An image can be taken using a solid-state imaging device having the following.
Therefore, it is possible to easily realize the upgrade of the area sensor while reducing the burden on the user, and to easily cope with various high-performance photographing.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a camera device and an exchangeable area sensor module according to the present invention will be described.
1A and 1B are diagrams showing an outline of a camera device according to the present embodiment, wherein FIG. 1A is a front view, FIG. 1B is a top view, and FIG. 1C is a side view.
2A and 2B are external views showing an example of the replaceable area sensor module according to the present embodiment. FIG. 2A is a front view, and FIG. 2B is a side view. FIG. 3 is an explanatory diagram showing an example of an internal element arrangement of the exchangeable area sensor module shown in FIG.
[0010]
The camera device of the present embodiment is configured as a digital still camera, and is provided with a lens barrel 110 on the front of a portable camera body 100. It should be noted that the lens barrel 110 may be of a type that is integrally fixed to the camera body 100, or may be of a type that is detachable.
In the camera body 100 of the present embodiment, a module mounting section 120 for mounting the replaceable area sensor module 140 is provided substantially at the center of the inside, and further, the replaceable area sensor module is mounted on the upper surface thereof. An insertion slot (slot) 121 for inserting the camera into the camera and a shutter button 127 are provided.
[0011]
Although an example of the configuration of the module mounting section 120 will be described later, the exchangeable area sensor module 140 is positioned and held, and in this positioning state, the center axis of the solid-state imaging device provided in the exchangeable area sensor module 140 is moved to the lens barrel section 110. Of the optical axis.
Further, a connector 122 as a connecting means is provided below the module mounting section 120, and is connected to the connector 142 on the exchangeable area sensor module 140 side, so that the circuit section of the camera body 100 and the exchangeable area sensor module are connected. It is assumed that the circuit unit 140 is electrically connected and various signals are exchanged.
[0012]
The signals exchanged between the camera body 100 and the exchangeable area sensor module 140 mainly include control signals from the camera body 100 to the exchangeable area sensor module 140, and signals from the exchangeable area sensor module 140 to the camera body 100. Module identification information and image output signals.
Further, a configuration in which the power source of the exchangeable area sensor module 140 is taken from the camera body 100 may be adopted.
Further, the connection means is not limited to a contact type connector, and may be a non-contact type connector using wireless communication or the like.
[0013]
Next, the replaceable area sensor module 140 has a plastic card-shaped module main body 140A having a size of, for example, a memory stick, and an imaging unit 144 using a solid-state imaging device is provided at the center of the module main body 140A. In addition, various processing circuits 146 are provided inside. Note that a transparent cap 148 is attached outside the imaging unit 144.
The solid-state imaging device of the imaging unit 144 is, for example, a CCD image sensor or a CMOS image sensor, and captures an image received through the transparent cap 148 and outputs an image signal.
[0014]
The processing circuit 146 includes a circuit for controlling the driving of the imaging unit 144, various ICs for performing signal processing on the image signal from the imaging unit 144, and chip components 146A and 146B. The circuit exchanges signals with the circuits described above and outputs image signals.
The exchangeable area sensor module 140 performs various configurations and processes according to the specifications of the solid-state imaging device and the like, and has a unique number of pixels, a color mode, and a signal processing method (for example, a digital RAW signal, JPEG, or the like). It has.
[0015]
Next, a specific example of the module mounting unit 120 will be described.
FIG. 4 is an explanatory diagram showing the structure of the module mounting section 120 and the operation when the replacement area sensor module 140 is inserted in this example.
First, as shown in FIG. 4A, the module mounting section 120 has a guide frame 130 for guiding the insertion of the exchangeable area sensor module 140, and the exchangeable area sensor module 140 extends along the guide frame 130. Is to be inserted.
At the lower end of the module mounting portion 120, a restricting portion 132 for restricting the lower-limit insertion position of the replaceable area sensor module 140 is formed, and the lower end of the replaceable area sensor module 140 contacts the restricting portion 132. By contact (actually, the receiving member 131 abuts), the exchangeable area sensor module 140 is positioned at the mounting completed position, the electrodes of both connectors come into contact with each other, and the center axis of the solid-state imaging device is moved to the lens barrel 110. Of the optical axis.
[0016]
Further, the module mounting portion 120 is provided with a lock claw 133 for locking the exchangeable area sensor module 140 at the mounting completed position and a lock spring 134 for urging the lock claw 133 in the direction of arrow A.
When the replaceable area sensor module 140 is inserted, the lock claw 133 is pushed back by the replaceable area sensor module 140 and retreats. When the replaceable area sensor module 140 reaches the mounting completed position, the lock spring 134 is released. The exchangeable area sensor module 140 is engaged with the engagement portion 140B provided on the exchangeable area sensor module 140 by a spring force, and is pressed toward the regulating portion 132 to lock the exchangeable area sensor module 140 at the mounting completed position.
[0017]
Further, the module mounting section 120 is provided with an operation member 135 for unlocking. The operation member 135 unlocks the replacement area sensor module 140 by displacing the lock claw 133 in the direction opposite to the arrow A by forcibly operating the lock claw 133 against the spring force of the lock spring 134. I do.
Further, the module mounting portion 120 is provided with a discharge spring 136 that urges the exchangeable area sensor module 140 in the discharge direction, and releases the lock of the exchangeable area sensor module 140 by releasing the lock by the operation member 135. Move to Thus, when the operation member 135 is released, the exchangeable area sensor module 140 is ejected from the insertion port 121 of the module mounting section 120, and the exchangeable area sensor module 140 can be exchanged.
In this example, the upper end of the replaceable area sensor module 140 functions as a cover of the insertion port 121 in a state where the replaceable area sensor module 140 is mounted on the module mounting section 120.
[0018]
The above-described module mounting section 120 is merely an example, and various forms can be appropriately selected as the module mounting section according to the grade and specification of the camera device. For example, the lock mechanism and the lock release mechanism of the exchangeable area sensor module 140 may be configured to realize locking and unlocking using electromagnetic elements.
It is also possible to adopt a configuration in which the insertion opening is opened and closed by a lid.
Further, the above-described guide frame 130 itself may be configured to appear and disappear as a mounting tray.
That is, as such specific product specifications, extremely diverse ones have been provided conventionally, and a wide variety of applications are possible.
[0019]
Next, a circuit configuration of a system to which the camera module according to the present embodiment is applied will be described.
FIG. 5 is a block diagram illustrating a circuit configuration example of the camera device according to the present embodiment.
This camera system includes an imaging lens system 201, a solid-state imaging device 202, an analog circuit 203, an A / D converter 204, a camera signal processing circuit 205, a compression / expansion circuit 206, a storage medium 207, an operation display unit 209, and a control circuit 210. Have. The solid-state imaging device 202, analog circuit 203, A / D converter 204, and camera signal processing circuit 205 in the configuration shown in FIG. 5 are elements included in the replaceable area sensor module 140. , 142.
[0020]
First, a light beam incident from the imaging lens system 201 forms an image on a two-dimensional pixel array of the solid-state imaging device 202. Then, the image signal output of the solid-state imaging device 202 is sent to the analog circuit 203.
The analog circuit 203 performs processes such as CDS (correlated double sampling) and AGC (auto gain control). The image signal processed by the analog circuit 203 is converted from analog data to digital data by the A / D converter 204 and output to the camera signal processing circuit 205.
The camera signal processing circuit 205 is a circuit that performs signal processing such as color signal processing, gain control processing, and white balance processing for converting output data of the solid-state imaging device 202 into a video signal.
[0021]
The compression / expansion circuit 206 is a circuit that compresses or decompresses the image data processed by the camera signal processing circuit 205 and converts the image into a format that can be stored in the storage medium 207. The storage medium 207 is, for example, a memory stick or the like, and is an example of a unit that outputs image data.
The operation display unit 209 is a man-machine interface that displays various information to the user from operation keys and a camera device for the user to input various instructions to the camera device.
The control circuit 210 controls the entire camera apparatus, and executes a shooting operation in accordance with an instruction from the operation display unit 209.
[0022]
Further, in the camera device of the present example, since the exchangeable area sensor module 140 is exchanged and used, the control process accompanying the exchange is performed by the control circuit 210.
For example, the control circuit 210 exchanges predetermined identification information (module ID and specification information) with the exchangeable area sensor module 140, decodes the content, and executes the setting of each unit of the camera device based on the decoding result. I do.
In addition, it is also possible for the user to make settings associated with the replacement of the exchangeable area sensor module 140 from the operation display unit 209. In this case, the control circuit 210 uses the input from the operation display unit 209 to control the camera device. The setting of each part is performed.
Further, with the replacement of the replaceable area sensor module 140, information relating to the replaced replaceable area sensor module 140 may be displayed on the operation display unit 209, and processing such as prompting the user to confirm may be performed.
[0023]
Next, a specific example of a solid-state imaging device used in the above-described camera device will be described.
FIG. 6 is an explanatory diagram illustrating an example of a CMOS sensor, and is a configuration example including the solid-state imaging device 202 and the analog circuit 203 illustrated in FIG.
As shown in the figure, the solid-state imaging device of the present example has a pixel section (imaging area section) 310, a constant current section 320, a column signal processing section (column section) 330, and a vertical (V) selection driving means on a semiconductor element substrate 300. 340, a horizontal (H) selection means 350, a horizontal signal line 360, an output processing unit 370, a timing generator (TG) 380, and the like.
[0024]
The pixel portion 310 has a large number of pixels arranged in a two-dimensional matrix, and each pixel is provided with a pixel circuit as shown in FIG. The signal of each pixel from the pixel unit 310 is output to the column signal processing unit 330 through a vertical signal line (not shown) for each pixel column.
In the constant current section 320, a constant current source (not shown) for supplying a bias current to each pixel is arranged for each pixel column.
The V selection driving unit 340 selects each pixel of the pixel unit 310 one row at a time, and drives and controls a shutter operation and a reading operation of each pixel.
[0025]
The column signal processing unit 330 receives a signal of each pixel obtained through a vertical signal line for one row, performs predetermined signal processing for each column, and temporarily holds the signal. For example, CDS (removal of fixed pattern noise caused by variation in the threshold value of the pixel transistor), AGC (auto gain control), and A / D conversion are performed as appropriate.
The H selection unit 350 selects the signals of the column signal processing unit 330 one by one and guides them to the horizontal signal line 260.
The output processing unit 370 performs predetermined processing on the signal from the horizontal signal line 260 and outputs the processed signal to the outside, and has, for example, a gain control circuit and a color processing circuit. Note that, instead of performing the A / D conversion in the column signal processing unit 330, the output processing unit 370 may perform the conversion.
The timing generator 380 supplies various pulse signals and the like necessary for the operation of each unit based on the reference clock.
[0026]
FIG. 6 is an explanatory diagram illustrating an example of a CCD sensor, and is a configuration example including the solid-state imaging device 202 illustrated in FIG.
This solid-state imaging device is provided with a pixel section (imaging area section) 410, a CCD vertical transfer section 420, a CCD horizontal transfer section 430, an output section 440, and the like on a semiconductor element substrate 400.
The pixel section 410 has a large number of pixels 412 arranged in a two-dimensional matrix. A CCD vertical transfer section 420 is provided along each pixel column, and the signal charges accumulated by each pixel 412 are transferred to the CCD vertical transfer section. The data is read out to the side 420 and is sequentially transferred in the vertical direction by driving the CCD vertical transfer unit 420.
[0027]
A CCD horizontal transfer unit 430 is provided at the end of the CCD vertical transfer unit 420, and signal charges transferred from each CCD vertical transfer unit 420 are read out to the CCD horizontal transfer unit 430 for each row, The data is sequentially transferred in the horizontal direction by driving the vertical transfer unit 420.
The output unit 440 receives the signal charge transferred by the CCD vertical transfer unit 420 by an FD, and converts the signal charge into an electric signal by detecting the potential of the FD with an amplifier transistor, and outputs the electric signal.
6 and 7 described above are two examples applicable to a solid-state imaging device, and do not particularly limit the present invention, and various other forms can be adopted. is there.
[0028]
According to the present embodiment as described above, it is possible to replace the exchangeable area sensor modules having different numbers of pixels and different color modes with the same digital still camera.
Therefore, photographing using the function of the newly developed digital still camera area sensor can be easily performed without purchasing the camera itself, and the cost burden is reduced. Further, the amount of discarding the old camera device every time the version is updated can be reduced, and environmental destruction can be suppressed.
[0029]
In the above configuration, the identification signal is exchanged between the camera body 100 and the exchangeable area sensor module 140, and the signal processing in the camera body 100 is switched according to the specification of the exchangeable area sensor module 140 to correspond. However, it is not always necessary to provide such advanced functions, and a configuration may be employed in which a signal from the exchangeable area sensor module 140 is simply received and processing is performed in a specific signal form.
However, in this case, the signal form output from the exchangeable area sensor module 140 is kept constant even when the types of the solid-state imaging device and the signal processing IC on the exchangeable area sensor module 140 are updated. There is a need.
Further, in the above-described example, the example of the digital still camera has been described, but the present invention can be similarly applied to a video camera.
In the above-described example, the exchangeable area sensor module 140 includes the camera signal processing circuit. However, the camera signal processing circuit may be provided on the camera device side.
[0030]
【The invention's effect】
As described above, in the camera device and the exchangeable area sensor module of the present invention, the exchangeable area sensor module provided with the solid-state imaging device separately from the camera device is provided, and the exchangeable area sensor module is provided on the camera device side. The removable area sensor module can be replaced with a new one at any time because a module mounting part is provided that can be detachably mounted to execute an imaging operation and extract output signals. Thus, photographing can be performed using a solid-state imaging device having a new function without replacing the camera device itself.
Therefore, there is an effect that the version up of the area sensor can be easily realized while the burden on the user can be reduced, and it is possible to easily cope with various high-performance photographing and to provide a useful camera system.
[Brief description of the drawings]
FIG. 1 is a front view, a top view, and a side view schematically showing a camera device according to an embodiment of the present invention.
2A and 2B are a front view and a side view showing an example of an exchangeable area sensor module used in the camera device shown in FIG.
FIG. 3 is an explanatory diagram showing an example of an internal element arrangement of the exchangeable area sensor module shown in FIG. 2;
4 is an explanatory diagram showing a structure of a module mounting portion in the camera device shown in FIG. 1 and an operation at the time of inserting a replaceable area sensor module.
FIG. 5 is a block diagram showing an example of a circuit configuration of the camera device shown in FIG.
FIG. 6 is an explanatory diagram illustrating an example of a CMOS sensor.
FIG. 7 is an explanatory diagram showing an example of a CCD sensor.
8 is a block diagram showing an example of a circuit configuration of the camera device shown in FIG.
[Explanation of symbols]
100 camera body, 110 lens barrel part, 120 module mounting part, 121 insertion slot (slot), 122, 142 connector, 140 exchangeable area sensor module, 144 imaging Unit, 146 processing circuit.

Claims (18)

On the camera body that shoots the subject,
A module mounting section for detachably mounting an exchangeable area sensor module including a solid-state imaging device,
Connecting means for connecting a replaceable area sensor module mounted on the module mounting section and a circuit section disposed in the camera body;
Control means for controlling a photographing operation by an exchangeable area sensor module mounted on the module mounting portion,
A camera device comprising: 2. The camera device according to claim 1, wherein the exchangeable area sensor module is formed in a card shape, and the module mounting portion has a slit-shaped insertion hole for inserting the exchangeable area sensor module. 2. The camera device according to claim 1, wherein said connection means is a contact type connector. 2. The camera device according to claim 1, wherein said connection means is a non-contact type connector. 2. The control unit according to claim 1, wherein the control unit decodes a specification of the exchangeable area sensor module obtained through the connection unit, and performs setting of a camera body and control of a photographing operation according to a result of the decoding. Camera device. 2. The camera device according to claim 1, wherein the camera body has a lens barrel including an imaging optical system. The module mounting section positions and holds the exchangeable area sensor module, and a light receiving section of a solid-state imaging device provided in the exchangeable area sensor module and an imaging optical system provided in the camera body are arranged to face each other. The camera device according to claim 6, wherein: 2. The camera device according to claim 1, wherein the camera body has operation means for performing various input operations. 9. The camera device according to claim 8, wherein the control unit performs setting of a camera body and control of a shooting operation based on an instruction input from the operation unit. A module body detachably mounted on a module mounting section provided in the camera device,
A solid-state imaging device that performs imaging of a subject through an imaging optical system provided in the camera device and outputs the imaging result,
A processing circuit for processing the output from the solid-state imaging device,
Connection means for connecting the processing circuit unit and the circuit unit of the camera device;
A replaceable area sensor module comprising: The exchangeable area sensor module according to claim 10, wherein the module main body is formed in a card shape, and is mounted on the module mounting portion through a slit-shaped insertion port of the camera device. The exchangeable area sensor module according to claim 10, wherein the processing circuit section includes an A / D conversion circuit that converts an analog output from the solid-state imaging device into a digital signal and outputs the digital signal. The replacement area sensor module according to claim 10, wherein the processing circuit unit includes a CDS circuit that removes noise from an output from the solid-state imaging device. The replacement area sensor module according to claim 10, wherein the processing circuit unit includes a gain control circuit that controls a gain of an output from the solid-state imaging device. 11. The exchangeable area sensor module according to claim 10, wherein said connection means is a contact type connector. 11. The exchangeable area sensor module according to claim 10, wherein said connection means is a non-contact type connector. The exchangeable area sensor module according to claim 10, wherein the solid-state image sensor is a CCD image sensor. The exchangeable area sensor module according to claim 10, wherein the solid-state imaging device is a CMOS imaging device.

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