JP2004153080A - Sealing structure of small electronic component package - Google Patents
Sealing structure of small electronic component package Download PDFInfo
- Publication number
- JP2004153080A JP2004153080A JP2002317632A JP2002317632A JP2004153080A JP 2004153080 A JP2004153080 A JP 2004153080A JP 2002317632 A JP2002317632 A JP 2002317632A JP 2002317632 A JP2002317632 A JP 2002317632A JP 2004153080 A JP2004153080 A JP 2004153080A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- sealing
- small electronic
- component package
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Abstract
Description
【0001】
【発明の属する技術分野】
本発明は極めて小型の主に無線通信機器や携帯電話端末などの移動体通信分野や、映像装置や画像装置などの民生分野に使用される表面実装型の小型電子部品パッケージの封止構造に関する。
【0002】
【従来の技術】
従来の小型電子部品パッケージの材質としては、金属やセラミックや樹脂などが選択され、これらのパッケージを気密して封止するには、一般にリッドと呼ばれる金属製の蓋が、前記の材質のパッケージにシールリングを必要とするシーム溶接や電子ビーム溶接や熱融着やパルスヒートやレーザー溶接などの封止方法をとるのに適した封止構造であることが一般的であった。
【0003】
従来の小型電子部品を先述の封止方法を用いて気密封止する為には、金属蓋側のパッケージの封止部分に相対する部分に、例えばニッケルメッキ層が施された金属蓋の一面上に、図3の様に銀ろうに代表される封止用のろう材が金属蓋の縁に沿ってリング状に付いており、従ってこれらの金属蓋には図4にある様に、ニッケルメッキ層が施された金属蓋の一面上に銀ろう層などの材質の封止材が金属蓋の縁に沿ってリング状につけられている面と、表面にニッケルメッキ層のみが施された面といったように、金属蓋の表裏でその構造に差異があることが一般的であった。
【0004】
一方最近の傾向では、無線通信機器や携帯電話機などの移動体通信分野だけにとどまらず、映像装置や画像装置などの民生分野においても、搭載する部品について非常に急激な市場からの小型化や低背化や、更に加えて軽量化や低価格化の要求があるのが実際である。
【0005】
【特許文献1】
特開平6−140866号公報
【特許文献2】
特開平8−46075号公報
【0006】
【発明が解決しようとする課題】
しかしながら、これらの要求を前述の封止方法を用いた封止構造で満足するには、前記のように気密封止する金属蓋の表裏の構造に差異が有る為に困難に成ってきているのが現状である。一例をあげれば、金属蓋の寸法は厚みを省いて3.2mm×2.5mm程度とその寸法が非常に小型化しており、それに伴いその金属蓋の大きさも小型となり、金属蓋単体の扱いもさらに精密な部品の製作の工程が必要とされてきているのが現状である。金属蓋単体が小型電子部品パッケージにおいて占めるコストの比率も、電子部品パッケージの小型化に伴って大きくなる傾向があり、金属蓋の表裏の構造に差異が無く、また製作工程において表裏の判別を必要としない電子部品パッケージの構造が必要とされていた。
【0007】
本発明は、以上のような技術的背景のもとでなされたものであり、従がってその目的は、金属蓋によって小型の電子部品の気密封止を成す小型電子部品パッケージの封止構造を提供することである。
【0008】
【課題を解決するための手段】
上記の目的を達成するために、本発明は小型電子部品パッケージを金属蓋により気密して封止する封止構造において、小型電子部品パッケージの封止部がタングステンメタライズ層と銀ろうに代表される封止用のろう材の印刷層とニッケルメッキ層と金メッキ層の4つの層から成り、金属蓋の封止部を封止することを特徴とする。
【0009】
また、前記の金属蓋の小型電子部品パッケージの封止部の封止がシーム溶接、または電子ビーム、またはレーザー溶接により封止されることを特徴とする。
【0010】
【発明の実施の形態】
以下に図面を参照しながら本発明の実施の一形態について説明する。
なお、各図においての同一の符号は同じ対象を示すものとする。
【0011】
図1は本発明を説明するためにとりあげた表面実装型の小型電子部品パッケージ1の概略の断面図である。パッケージ1の内部には例えば水晶振動子や発振器などが搭載されて、一般にリッドと呼ばれる金属の蓋が小型電子部品パッケージ1の封止部2に載置されパッケージ1を気密封止する構造となっている。
【0012】
図1のリッドと呼ばれる金属蓋7の母体となる材質の表面はニッケルメッキ層5だけが形成されており、金属蓋7の表裏の構造に差異は無い。また、金属蓋7が小型電子部品パッケージ1の縁部に載置されるパッケージ1の封止部2には図1にあるようにタングステンメタライズ層3と銀ろうに代表される封止用のろう材印刷層4とニッケルメッキ層5と金メッキ層6の4つの層が形成されている。大まかな値であるがタングステンメタライズ層3は10〜50μm、銀ろうに代表される封止用のろう材印刷層4は10〜20μm、ニッケルメッキ層5は3〜6μm、金メッキ層6は0.3〜3μm程度である。図1において4つの層は重なるように図示しているが、実際にはメッキ層であるニッケルメッキ層5は、タングステンメタライズ層3と銀ろうに代表される封止用のろう材印刷層4に被さるように形成されており、更に金メッキ層6は前記のニッケルメッキ層5に被さるように形成されている。封止用のろう材には他にAu−Sn(金錫)やAu−Ge(金ゲルマニウム)などがある。
【0013】
図2に図示するように、前述の4つの層が形成された小型電子部品パッケージ1の封止部2に金属蓋7が載置され、金属蓋7の表面のニッケルメッキ層5と金属蓋7の母体となる材質が少なくともシールリングを必要としないシーム溶接か、電子ビームか、レーザー溶接によって溶融され、直接パッケージの封止部と溶融してパッケージ1を気密して封止される。
【0014】
なお、上記では一例として水晶振動子や発振器を内部に搭載する表面実装型の小型電子部品パッケージとして説明したが、他の電子部品にも本発明を使用することが可能であり、これも本発明の技術的範囲に含まれることは言うまでもない。
【0015】
【発明の効果】
本発明の小型電子部品パッケージの封止構造によれば、表裏の構造に差異のあるリッドと呼ばれる金属蓋を使用する必要が無い為に、大幅にパッケージのコストを低減することが出来る。
【0016】
また、本発明の小型電子部品パッケージの封止構造によれば、金属蓋の表裏を判別する工程を省くことが出来、電子部品の製造コストを低減することが出来る。
【0017】
また、本発明の小型電子部品パッケージの封止構造によれば、電子部品の製造歩留まりを大幅に高めることが出来る。
【図面の簡単な説明】
【図1】本発明を用いる表面実装型の小型電子部品の概略の断面図である。
【図2】本発明を用いる表面実装型の小型電子部品の概略の斜視図である。
【図3】従来における表裏の構造に差異のある金属蓋の概略の斜視図である。
【図4】従来における電子部品のパッケージをリッドと呼ばれる金属蓋で気密封止する様子を示した概略の断面図である。
【符号の説明】
1 小型電子部品パッケージ
2 封止部
3 タングステンメタライズ層
4 銀ろうに代表される封止用ろう材印刷層
5 ニッケルメッキ層
6 金メッキ層
7 金属蓋[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a sealing structure for a small surface-mounted electronic component package which is mainly used in a mobile communication field such as a wireless communication device or a mobile phone terminal, or a consumer field such as a video device or an image device.
[0002]
[Prior art]
As a material of the conventional small electronic component package, metal, ceramic, resin, or the like is selected, and in order to hermetically seal these packages, a metal lid generally called a lid is attached to a package of the aforementioned material. Generally, a sealing structure suitable for taking a sealing method that requires a seal ring, such as seam welding, electron beam welding, heat fusion, pulse heating, or laser welding, was used.
[0003]
In order to hermetically seal a conventional small electronic component by using the above-described sealing method, for example, a nickel-plated layer is provided on one surface of a metal lid on a portion corresponding to the sealing portion of the package on the metal lid side. In addition, as shown in FIG. 3, a sealing brazing material typified by silver brazing is attached in a ring shape along the edge of the metal lid. Therefore, as shown in FIG. On the one side of the metal lid where the layer was applied, a sealing material of a material such as a silver brazing layer is attached in a ring shape along the edge of the metal lid, and a surface where only the nickel plating layer is applied on the surface As described above, it is common that there is a difference in the structure between the front and back of the metal lid.
[0004]
On the other hand, in recent trends, not only in the mobile communication field such as wireless communication equipment and mobile phones, but also in the consumer field such as video equipment and imaging equipment, the size of mounted components has been drastically reduced from the extremely rapid market. In fact, there is a demand for a reduction in height and, in addition, a reduction in weight and cost.
[0005]
[Patent Document 1]
JP-A-6-140866 [Patent Document 2]
JP-A-8-46075
[Problems to be solved by the invention]
However, it is becoming difficult to satisfy these requirements with a sealing structure using the above-described sealing method due to the difference between the front and back structures of the metal lid to be hermetically sealed as described above. Is the current situation. To give an example, the size of the metal lid has been reduced to about 3.2 mm x 2.5 mm by omitting the thickness, and the size of the metal lid has also become smaller. At present, there is a need for a more precise part manufacturing process. The cost ratio of the metal lid alone in the small electronic component package tends to increase with the miniaturization of the electronic component package, there is no difference in the structure of the metal lid front and back, and it is necessary to distinguish between the front and back in the manufacturing process There was a need for an electronic component package structure that did not.
[0007]
SUMMARY OF THE INVENTION The present invention has been made in view of the above technical background, and therefore has as its object to provide a sealing structure for a small electronic component package in which a small electronic component is hermetically sealed with a metal lid. It is to provide.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a sealing structure for hermetically sealing a small electronic component package with a metal lid, wherein a sealing portion of the small electronic component package is represented by a tungsten metallization layer and a silver solder. It is composed of four layers of a printing layer of a sealing brazing material, a nickel plating layer and a gold plating layer, and seals a sealing portion of a metal lid.
[0009]
Further, the sealing of the sealing portion of the small electronic component package of the metal lid is sealed by seam welding, electron beam, or laser welding.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described below with reference to the drawings.
Note that the same reference numerals in each drawing indicate the same objects.
[0011]
FIG. 1 is a schematic sectional view of a small electronic component package 1 of a surface mount type taken for explaining the present invention. For example, a crystal resonator or an oscillator is mounted inside the package 1, and a metal lid generally called a lid is placed on the sealing portion 2 of the small electronic component package 1 to hermetically seal the package 1. ing.
[0012]
Only the
[0013]
As shown in FIG. 2, a metal cover 7 is placed on the sealing portion 2 of the small electronic component package 1 on which the above-described four layers are formed, and a
[0014]
In the above description, as an example, a small surface-mount type electronic component package in which a crystal unit and an oscillator are mounted has been described. However, the present invention can be used for other electronic components. It goes without saying that it is included in the technical scope.
[0015]
【The invention's effect】
According to the sealing structure of the small electronic component package of the present invention, it is not necessary to use a metal lid called a lid having a difference in front and back structure, so that the cost of the package can be greatly reduced.
[0016]
Further, according to the small electronic component package sealing structure of the present invention, the step of determining the front and back of the metal lid can be omitted, and the manufacturing cost of the electronic component can be reduced.
[0017]
Further, according to the small electronic component package sealing structure of the present invention, the production yield of electronic components can be greatly increased.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view of a surface-mounted small electronic component using the present invention.
FIG. 2 is a schematic perspective view of a surface-mounted small electronic component using the present invention.
FIG. 3 is a schematic perspective view of a conventional metal lid having a difference in front and back structures.
FIG. 4 is a schematic cross-sectional view showing a state in which a package of a conventional electronic component is hermetically sealed with a metal lid called a lid.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Small electronic component package 2 Sealing part 3
Claims (2)
小型電子部品パッケージの封止部がタングステンメタライズ層とろう材印刷層とニッケルメッキ層と金メッキ層の4つの層から成り、金属蓋の封止部を封止することを特徴とする小型電子部品パッケージの封止構造。In a sealing structure that hermetically seals a small electronic component package with a metal lid,
A small electronic component package in which a sealing portion of the small electronic component package comprises four layers of a tungsten metallization layer, a brazing material printing layer, a nickel plating layer, and a gold plating layer, and seals the sealing portion of the metal lid. Sealing structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002317632A JP3886437B2 (en) | 2002-10-31 | 2002-10-31 | Small electronic component package sealing structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2002317632A JP3886437B2 (en) | 2002-10-31 | 2002-10-31 | Small electronic component package sealing structure |
Publications (2)
Publication Number | Publication Date |
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JP2004153080A true JP2004153080A (en) | 2004-05-27 |
JP3886437B2 JP3886437B2 (en) | 2007-02-28 |
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Family Applications (1)
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JP2002317632A Expired - Fee Related JP3886437B2 (en) | 2002-10-31 | 2002-10-31 | Small electronic component package sealing structure |
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JP (1) | JP3886437B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7671434B2 (en) | 2006-05-31 | 2010-03-02 | Fuji Xerox Co., Ltd. | Electronic component, laser device, optical writing device and image forming apparatus |
CN108031939A (en) * | 2017-11-10 | 2018-05-15 | 武汉凌云光电科技有限责任公司 | A kind of method of laser welding magnetic material |
-
2002
- 2002-10-31 JP JP2002317632A patent/JP3886437B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7671434B2 (en) | 2006-05-31 | 2010-03-02 | Fuji Xerox Co., Ltd. | Electronic component, laser device, optical writing device and image forming apparatus |
CN108031939A (en) * | 2017-11-10 | 2018-05-15 | 武汉凌云光电科技有限责任公司 | A kind of method of laser welding magnetic material |
CN108031939B (en) * | 2017-11-10 | 2020-10-27 | 武汉凌云光电科技有限责任公司 | Method for laser welding of magnetic material |
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JP3886437B2 (en) | 2007-02-28 |
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