JP2004145066A - Optical component and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical component which is usable for a long period of time even when irradiated with hard X rays of ultrahigh luminance, and a device equipped with the optical component. <P>SOLUTION: The optical component is equipped with a solder layer in which a Fresnel zone plate is buried and a support base and an adhesive layer is provided between the solder layer and the support base. Further, no adhesive layer is provided between the Fresnel zone plate and the support base. This optical component has high durability against ray irradiation and is therefore suitably usable to make hard X rays into a micro beam. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an optical component, a method for manufacturing the same, and an apparatus provided with the component.
[0002]
[Prior art]
In recent years, large-scale synchrotron radiation facilities of the third generation, including SPring-8 (Super Photon ring 8 GeV), have started to operate. The third-generation synchrotron radiation facility generally refers to a facility designed to use a light source mainly using an undulator as an insertion light source and to be able to install many insertion light sources in a dedicated accelerator.
[0003]
In order to make the most of the performance of such a third-generation synchrotron radiation facility, it is necessary to use ultra-bright, low-emittance hard X-rays generated from an inserted light source (that is, a small light source, a strong light source, and a parallel light source). It is very important to develop a technology for focusing hard X-rays (near X-rays) until the beam size becomes submicron or smaller. If such a technique can be developed, for example, a scanning X-ray microscope and an imaging X-ray microscope in a hard X-ray region can be put to practical use. By putting such a microscope into practical use, it becomes possible to observe the fine structure of a thick living body in the sub-micron region, etc., and new applications in fields such as medicine and life science are expected. In addition, the technique of spectroscopy and diffraction in a minute area has been developed. For example, a method of performing elemental analysis by analyzing fluorescent X-rays emitted from the sample surface and inside by irradiating an X-ray microbeam; It is expected that methods for obtaining two-dimensional and three-dimensional distribution maps (tomographic images of minute regions) of chemical states (valence of constituent atoms, chemical bonding state, etc.) will be developed for Application to the field is also expected.
[0004]
The use of hard X-rays in the form of microbeams has already reached the level where the beam size becomes submicron when using a second-generation synchrotron radiation facility. The second-generation synchrotron radiation facility generally means a facility mainly using the synchrotron radiation from the polarizing magnet.
[0005]
However, hard X-ray microbeams obtained using the second-generation synchrotron radiation facility have extremely low intensity and are not widely used in practice. In order to realize applications in various fields as described above, third-generation synchrotron radiation facilities such as SPring-8 are also used to generate sub-micron or less microbeams having sufficient intensity. It needs to be developed. For that purpose, for example, it is necessary to develop a high-performance light-collecting element that can withstand irradiation of ultra-high-intensity X-rays in SPring-8.
[0006]
As a general X-ray focusing element, a Fresnel zone plate (hereinafter, sometimes referred to as “FZP”) is used. The FZP is a plate having a group of concentric rings in which layers that transmit X-rays and layers that block X-rays are alternately arranged.
[0007]
At present, FZP manufactured by an electron beam lithography method has been put to practical use, and is used for a microscope using soft X-rays, a spectroscopic microscope, and the like. When a microscope equipped with this FZP is used, a resolution of about 30 nm can be obtained.
[0008]
However, the FZP manufactured by the electron beam lithography cannot be used for an apparatus using hard X-rays having a large transmittance because the thickness is too small.
[0009]
Therefore, in order to obtain a thicker FZP, a laminated Fresnel zone plate (sputtered-sliced FZP, hereinafter sometimes referred to as “s-FZP”) using an evaporation technique such as sputtering has been developed.
[0010]
The s-FZP is manufactured, for example, by the following method (see FIG. 1). First, about 50 to 100 thin film layers are concentrically formed by alternately depositing a layer that transmits X-rays (for example, Cu) and a layer that shields X-rays (for example, Al) on a rotating thin-line substrate. Laminated. The substrate after vapor deposition is embedded in solder or the like, fixed, and then sliced into thin pieces having a thickness of about 1 mm. The obtained flake is fixed to a support such as a graphite plate using an organic adhesive, and further polished until the thickness becomes about 10 to 40 μm. For example, Patent Literature 1, Non-Patent Literature 1, Non-Patent Literature 2, and the like disclose a method of manufacturing a multilayer film for a laminated Fresnel zone plate.
[0011]
In general, the FZP can collect high-energy X-rays as the thickness increases. For example, it has been confirmed that when s-FZP having a thickness of about 40 μm is used, X-rays up to about 83 keV can be collected.
[0012]
However, even if it is s-FZP, it is an element that condenses very strong X-rays, for example, the strongest X-rays (energy: 14.4 keV, ring current: 100 mA) that can be generated in SPring-8. When used, the organic adhesive is degraded by radiation irradiation within 20 minutes or less, and bubbles are generated in the irradiated portion. Therefore, the FZP fixed in a thin solder having a thickness of 40 μm or less may be distorted or the FZP itself may be broken.
[0013]
As a method of solving such a problem, a method of searching for an adhesive having high radiation resistance can be considered.
[0014]
However, at present, no adhesive has been found that has high durability against radiation and does not disturb the wavefront of X-rays.
[0015]
[Patent Document 1] JP-A-2002-196122
[Non-Patent Document 1] Shigeharu Tamura et al., Development of multilayer zone plate for high brightness hard X-ray region-Focusing of 8 to 83 keV high brightness X-ray-Proceedings of the 5th X-ray imaging optical symposium, X-ray Institute of Imaging Optics, 1999, p114-115.
[0017]
[Non-Patent Document 2] Masato Yasumoto et al., Fabrication of multilayer Fresnel zone plate by sputtering using slit, Proceedings of the 61st Autumn Meeting of the Japan Society of Applied Physics, Autumn 2000, published by the Japan Society of Applied Physics, 2000 September 3, 2nd volume, p580
[0018]
[Problems to be solved by the invention]
The present invention has been made in view of the problems of the prior art, and is an optical component that can be used for a long time even when irradiated with ultra-high-intensity hard X-rays, a method for manufacturing the same, and an apparatus including the optical component. The main purpose is to provide.
[0019]
[Means for Solving the Problems]
As a result of intensive studies, the inventor of the present invention has been able to achieve the above object by irradiating a Fresnel zone plate portion with X-rays after bonding a solder layer in which a Fresnel zone plate having a certain thickness or more is embedded to a support table. The inventors have found that parts can be obtained, and have reached the present invention.
[0020]
That is, the present invention relates to the following optical component, a method for manufacturing the same, and an apparatus including the optical component.
1. An optical component comprising a solder layer in which a Fresnel zone plate is embedded and a support, wherein an adhesive layer is provided between the solder layer and the support, and an adhesive is provided between the Fresnel zone plate and the support. Optical parts without layers.
2. 2. The optical component according to the above 1, wherein the Fresnel zone plate has a thickness of 20 to 50 μm.
3. 3. The optical component according to 1 or 2, wherein the support is graphite or beryllium.
4. The adhesive layer is at least one selected from the group consisting of an epoxy resin, a polyester resin, a polyurethane resin, a polyamide resin, a polysulfide resin, an acrylic resin, a polyether resin, a polyimide resin, and a silicone resin. 4. The optical component according to any one of the above items 1 to 3, which is a layer containing a kind of resin.
5. A method for manufacturing an optical component comprising a solder layer in which a Fresnel zone plate is embedded and a support, wherein the solder layer in which the Fresnel zone plate having a thickness of 100 μm or more is bonded to the support using an adhesive. A manufacturing method characterized in that X-rays are applied to the Fresnel zone plate portion of the solder layer to deteriorate the adhesive layer provided between the Fresnel zone plate and the support, and then polished.
6. 2. The production method according to the above 1, wherein the energy of the X-ray to be irradiated is 10 to 100 keV.
7. 3. The method according to 1 or 2 above, wherein a ring current of the X-ray to be irradiated is 70 to 100 mA.
8. 4. The production method according to any one of the above items 1 to 3, wherein the X-ray irradiation time is 2 hours or more.
9. An X-ray microbeam optical system provided with the optical component according to any one of the above 1 to 5 as an X-ray focusing component.
10. An X-ray spectroscopic microscope comprising the optical component according to any one of the above 1 to 5 as an X-ray focusing component.
11. A micro X-ray fluorescence spectrometer comprising the optical component according to any one of the above 1 to 5 as an X-ray focusing component.
12. A micro X-ray tomography apparatus comprising the optical component according to any one of the above 1 to 5 as an X-ray focusing component.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
The present invention is an optical component including a solder layer in which a Fresnel zone plate is embedded and a support, wherein an adhesive layer is provided between the solder layer and the support, and The present invention relates to an optical component having no adhesive layer between them.
[0022]
The thickness of the Fresnel zone plate included in the optical component of the present invention can be appropriately selected depending on the application, the energy of the X-ray used, and the like, but is usually about 10 to 100 μm, and preferably about 20 to 50 μm. .
[0023]
The material of the support is not particularly limited as long as the material has heat resistance and X-ray resistance. For example, graphite, beryllium and the like can be exemplified.
[0024]
The adhesive layer is not particularly limited as long as it is a layer containing an adhesive that is degraded by X-ray irradiation. Examples of the adhesive include an epoxy resin, a polyester resin, a polyurethane resin, a polyamide resin, a polysulfide resin, an acrylic resin (eg, ethyl cyanoacrylate, alkoxyethyl cyanoacrylate, etc.), a polyether resin, and a polyimide resin. Resins such as resins and silicone resins can be used. One of these resins may be used alone, or two or more thereof may be used in combination. For example, commercially available products such as Loctite 420 (registered trademark, LOCTITE 420) and Araldite (registered trademark, ARALDAITE) can be used.
[0025]
The Fresnel zone plate included in the optical component of the present invention is usually rotationally symmetric with respect to the optical axis and has two planes perpendicular to the optical axis. Two planes perpendicular to the optical axis of the Fresnel zone plate are respectively arranged in the same plane as either the front surface or the back surface of the solder layer. Therefore, the Fresnel zone plate and the solder layer usually have the same thickness.
[0026]
Further, the Fresnel zone plate included in the optical component of the present invention has an orbicular zone in which an X-ray blocking layer and an X-ray transmitting layer are alternately stacked on a circular base material on concentric circles.
[0027]
The film thickness of the X-ray blocking layer and the X-ray transmitting layer can be appropriately set according to the use and the like. For example, it can be appropriately set according to the wavelength of the X-ray used at the time of the X-ray microbeam optical system, a desired focal length, and the like. It is known that the theoretical film thickness of the X-ray blocking layer and the X-ray transmitting layer can be calculated as follows. If there is a core line (fine substrate) with a radius r ₀ (mm) at the center of the Fresnel zone plate, the wavelength of the incident X-ray is λ (mm), and the focal length is f (mm). distance r _n from the center of the boundary is represented by the following equation.
[0028]
(Equation 1)
^{_{r n 2 = r 0 2 +}} n · λ · f (n = 1, 2, 3, ..., N) (1)
Number of zones, i.e., the number of annular portions of the layer N, the minimum line width (outermost width, also called Saigairin band width) when the set to [delta] r _N, the beam diameter at the spatial resolution Δ and focal plane 2r h _(FWHM) Is given by the following equation:
[0029]
[Equation 2]
Δ = 1.22 · δr _N
2 r _n = 1.03 · δr _N
Accordingly, spatial resolution: beam diameter at Δ and focal plane: 2r _h is the wavelength of X-rays used, is irrelevant. From these equations, it can be seen that in order to obtain FZP having high resolution, it is necessary to increase the number of layers in the annular zone and narrow the minimum line width. That is, by laminating many thinner layers, a Fresnel zone plate having higher resolution can be manufactured.
[0030]
The outermost annular zone width of the FZP portion included in the optical component of the present invention can be appropriately set according to the use and the like, but is usually about 0.05 to 0.5 μm, preferably 0.05 to 0 μm. 0.3 μm.
[0031]
The diameter of the FZP portion included in the optical component of the present invention can be appropriately set depending on the application and the like, but is usually about 60 to 100 μm, and preferably about 70 to 100 μm. The width of the annular zone portion of the FZP is not particularly limited, but is usually about 15 to 50 μm, and preferably about 15 to 40 μm.
[0032]
The material of the X-ray blocking layer and the X-ray transmitting layer can be appropriately set according to the application, etc., and the extinction coefficient of the X-ray blocking layer at the wavelength of the X-ray used is Is usually about 100 times or more, preferably about 100 to 150 times.
[0033]
As the X-ray blocking layer, for example, a layer containing a heavy element having a large absorption coefficient such as copper, silver, molybdenum, gold, nickel, and a nickel-chromium alloy can be exemplified. Examples of the X-ray transmission layer include a layer containing a light element having a small absorption coefficient, such as aluminum, carbon, silicon, silicon dioxide (SiO ₂ ), beryllium, and silicon carbide.
[0034]
As a combination of the X-ray blocking layer and the X-ray transmitting layer, for example, a copper layer-aluminum layer, a copper layer-silicon layer, a copper layer-carbon layer, a copper layer-silicon carbide layer, a silver layer-silicon layer, a silver layer-carbon Combinations of layers and the like can be exemplified.
[0035]
Although FZP has an X-ray blocking layer and an X-ray transmitting layer alternately, the number of the combined layers can be appropriately selected depending on the application and the like, and is usually about 30 or more, preferably about 30 or more. Is about 40 to 200 layers.
[0036]
Manufacturing method The optical component of the present invention, for example, after bonding a solder layer embedded with a Fresnel zone plate having a thickness of 100 μm or more to a support using an adhesive, X-rays are applied to the Fresnel zone plate portion. Irradiation can degrade the adhesive layer provided between the Fresnel zone plate and the support, and then can be obtained by polishing to a desired thickness.
[0037]
The energy of the irradiated X-rays is not particularly limited as long as the adhesive can be degraded. For example, the energy can be appropriately set according to the type of the adhesive to be used, but is usually about 10 to 100 keV, and is preferably about 10 to 100 keV. Is about 10 to 20 keV.
[0038]
The X-ray ring current is not particularly limited as long as the adhesive can be degraded, and can be appropriately set according to, for example, the type of the adhesive to be used, but is usually about 50 to 100 mA, and preferably about 50 to 100 mA. It is about 50 to 150 mA.
[0039]
The X-ray irradiation time is not particularly limited as long as the adhesive layer between the Fresnel zone plate and the support is deteriorated, and may be appropriately set according to, for example, the type of the adhesive to be used and the energy of the X-ray. However, it is usually about 2 hours or more, preferably about 2 to 24 hours, more preferably about 8 to 24 hours.
[0040]
The thickness of the Fresnel zone plate when irradiating X-rays is not particularly limited as long as it can withstand X-ray irradiation for deteriorating the adhesive, and is usually about 100 μm or more, preferably about 100 to 400 μm.
[0041]
The method for manufacturing the Fresnel zone plate is not particularly limited as long as the obtained FZP can withstand X-ray irradiation for deteriorating the adhesive layer, but is usually manufactured using an evaporation method such as sputtering. An example of a method for manufacturing a Fresnel zone plate using a vapor deposition method will be described below.
[0042]
First, an X-ray transmitting layer and an X-ray blocking layer are alternately vapor-deposited on the substrate while rotating the thin-line substrate to obtain a concentric multilayer film. Usually, evaporation is performed using two or more evaporation sources.
[0043]
The evaporation method is not limited, and a known evaporation method can be used, and examples thereof include an evaporation method such as a sputtering evaporation method, an electron beam evaporation method, an ion beam sputtering method, and an ion plating method. it can. Of these, the sputtering deposition method is preferred. The deposition conditions such as the deposition pressure, the deposition atmosphere, and the deposition rate are not particularly limited, and known conditions can be appropriately set according to the deposition method, the material of the thin film to be deposited, and the like. Examples of the deposition atmosphere include a vacuum, an inert gas atmosphere (for example, a rare gas such as Ar and He), and an oxidizing atmosphere (for example, O ₂ and air). More specifically, when a multilayer film including an oxide film is manufactured, deposition can be performed in an oxidizing atmosphere. The deposition rate is usually about 0.05 to 2 nm / s, preferably about 0.1 to 1 nm / s. The speed at which the fine linear substrate is rotated is not particularly limited, but is generally about 10 to 100 rotations per minute, preferably about 10 to 50 rotations per minute.
[0044]
The material of the fine wire substrate is not particularly limited as long as it is a material that can easily form a thin wire with high roundness. For example, gold, silicon-containing gold (silicon content: usually about 1 to 3% by weight), stainless steel Etc. can be used. Gold and silicon-containing gold (silicon content: usually about 1 to 3% by weight) are preferable as the fine line-shaped substrate. The diameter of the fine linear substrate is not particularly limited, but is usually about 20 to 100 μm, preferably about 40 to 60 μm. In a later step, the fine linear substrate is cut perpendicularly to the longitudinal direction of the fine linear substrate. Therefore, the fine linear substrate corresponds to the circular substrate in the FZP included in the optical component of the present invention.
[0045]
When alternately depositing the X-ray blocking layer and the X-ray transmitting layer, it is preferable to use a deposition apparatus provided with a slit between the deposition source and the fine linear substrate. FIG. 4 shows an example of an apparatus provided with a slit. By providing such slits, it is possible to manufacture a multilayer film with less disturbance at the film interface of the multilayer film. A Fresnel zone plate with little disturbance at the multilayer film interface is excellent in spatial resolution, light collection efficiency, and the like.
[0046]
The shape of the structure provided with the slit is not particularly limited, and examples thereof include a cylindrical shape (see FIG. 4), a cylindrical shape such as a prism, and a plate shape such as a flat plate. Among these, a cylindrical shape is preferable, and a cylindrical shape is particularly preferable. By making the slit cylindrical, not only the obliquely incident vapor deposition component but also the wraparound vapor deposition component can be controlled with higher accuracy.
[0047]
The slit is installed so that it can be located on a straight line connecting the evaporation source in use and the fine linear substrate. It is preferable to dispose the slit such that the center line of the slit is included in a plane including the center of the evaporation source and the center line of the fine linear substrate.
[0048]
The slit is provided so that it can be opened toward the evaporation source in use. For example, when manufacturing a multilayer film by using two evaporation sources A and B alternately, when using the evaporation source A, the slit is directed to the evaporation source A, and when using the evaporation source B, the slit is used. To the evaporation source B. For example, when the slit is provided in a cylindrical structure, it is preferable to provide a means capable of rotating the structure, and control the slit to be directed to a deposition source to be used.
[0049]
Furthermore, if necessary, use a vapor deposition device provided with a shutter between the vapor deposition source and the fine linear substrate (for example, between the vapor deposition source and the slit), and close the shutter for the vapor source not used. Is preferred. The number of shutters is not particularly limited. For example, one shutter can be provided for each evaporation source.
[0050]
As a method of controlling each film thickness of the X-ray blocking layer and the X-ray transmission layer, for example, a method of gradually shortening the time for vapor-depositing each layer while keeping the film-forming speed constant, To monitor the amount of vapor deposition and control the slit, shutter, etc. as necessary to perform vapor deposition.
[0051]
Next, the thin wire substrate on which the multilayer film is deposited is embedded and fixed in solder, and then the solder is cut perpendicularly to the length direction of the thin wire substrate together with the solder, so that the solder layer in which the Fresnel zone plate is embedded is removed. obtain. The obtained solder layer is fixed to a support using an adhesive. The solder layer may be cut to a desired thickness by cutting, or may be cut to about 100 μm or more (for example, 500 μm or more), fixed to a support table, and then polished to a desired thickness. Although the melting point of the solder is not particularly limited, it is usually about 170 to 185 ° C.
[0052]
Next, the FZP portion of the solder layer is irradiated with X-rays to degrade the adhesive layer provided between the Fresnel zone plate and the support.
[0053]
After X-ray irradiation, a desired thickness may be obtained by polishing the solder layer in which FZP is embedded. The polished surface of the Fresnel zone plate is preferably as smooth as possible, for example, it is preferable to perform mirror finishing. As the mirror finishing method, for example, a method of performing buff polishing using an abrasive such as SiC fine-grained polishing paper or alumina powder can be exemplified.
[0054]
The optical component of the present invention can be suitably used as a component for collecting X-rays having extremely high energy, for example, hard X-rays of about 20 to 100 keV. For example, an X-ray microbeam optical system as shown in FIG. 3 can be constructed. The X-ray microbeam optical system includes, for example, the optical component of the present invention, an X-ray radiation facility, a monochromatic spectroscope, an X-ray detector, a slit, and a pinhole. Slits, pinholes, detectors, and the like can be fixed using a surface plate or the like. The positions of the slits, pinholes, and the like can be controlled using an electric system control device or the like.
[0055]
The X-ray radiation facility is not particularly limited. For example, a facility designed to use a light source mainly using an undulator as an insertion light source and to be able to install a large number of insertion light sources in a dedicated accelerator (so-called, 3rd generation synchrotron radiation facility); a facility mainly using synchrotron radiation from a polarizing magnet (a so-called 2nd generation synchrotron radiation facility) can be exemplified. The optical component of the present invention sufficiently functions as a light-collecting component even with X-rays emitted from a third-generation synchrotron radiation facility capable of emitting ultra-high-brightness X-rays.
[0056]
The optical component of the present invention can be used, for example, in an apparatus such as an X-ray spectroscopic microscope such as a scanning type or an imaging type; a micro-fluorescence X-ray analyzer; and a micro X-ray tomography (CT: Computer Tomography) apparatus. It can be suitably used as a light collecting component.
[0057]
【The invention's effect】
The optical component of the present invention has excellent durability against X-ray irradiation. Therefore, it can be suitably used for forming a hard X-ray into a microbeam.
[0058]
【Example】
Hereinafter, the present invention will be described more specifically with reference to Examples of the present invention and Comparative Examples. The present invention is not limited to the following examples.
[0059]
Example 1
While rotating a fine wire-shaped substrate (material: gold, diameter: 50 μm, length: 4 cm), 50 layers of copper and aluminum were alternately laminated on the substrate by sputtering deposition. The vapor deposition conditions were as follows: under an argon atmosphere (pressure: 0.20 Pa), the size of the vapor deposition source: 75 mm in diameter, the distance between the thin linear substrate and the vapor deposition source: 50 mm, and the deposition rate: 0.2 nm / s. The substrate was not heated, but the substrate temperature rose to about 90 to 100 ° C. due to radiant heat. The power applied to the evaporation source was 500 V and 0.6 A for copper, and 480 V and 0.8 A for aluminum. As the slit, a cylindrical slit container having a diameter of 40 mm, a container length of 60 mm and a slit width of 7 mm was used. As shown in FIG. 4, this slit container was set so that the fine linear substrate was positioned at the center of the container. The rotation speed of the fine linear substrate was kept at 15 rotations per minute.
[0060]
First, evaporation was performed using one evaporation source. When the evaporation state from the evaporation source becomes stable, point the slit to the evaporation source so that the center line of the slit is located on the plane formed by the center of one of the evaporation sources and the center line of the fine-line-shaped substrate. Was opened and vapor deposition was started. The amount and rate of vapor deposition were monitored by a film thickness monitor, and the shutter was closed after predicting in advance when the film thickness reached a desired value. This operation was performed alternately for each deposition source. By opening and closing the shutter while monitoring the amount of vapor deposition with a film thickness monitor, the time to evaporate copper or aluminum is gradually reduced while keeping the vapor deposition rate constant. The vapor deposition was performed while controlling the film thickness so that the film thickness became thinner.
[0061]
A thin wire substrate on which an X-ray transmission layer and an X-ray blocking layer are deposited is fixed by embedding in solder (tin-lead alloy, tin: lead [weight ratio] = 60: 40, melting point 180 ° C.), and the length direction of the substrate The entire solder was cut perpendicular to the (rotation axis) to obtain a solder layer having a thickness of about 1 mm in which FZP was embedded. The diameter of the obtained FZP portion was 80 μm, and the width of the orbicular zone was about 20 μm. In the same manner, a solder layer having an FZP portion having an outermost annular zone width of 0.25 μm, 0.16 μm, 0.15 μm, 0.1 μm or 0.08 μ was prepared. Using Loctite 420, the obtained solder layers were bonded to graphite plates each having a thickness of about 1 mm or less. After bonding, the FZP was polished together with the solder layer until the thickness of the solder layer became 150 μm.
[0062]
Next, the Fresnel zone plate portion of the solder layer was irradiated with X-rays (energy: 14.4 keV, ring current: 70 mA) for 8 hours to deteriorate the adhesive layer. No bubbles were generated in the X-ray irradiated part, and the FZP was not distorted or destroyed.
[0063]
Next, the FZP was polished together with the solder using SiC polishing paper until the thickness became 40 μm. The polished surface was mirror-finished using fine abrasive paper of # 4000 to # 8000.
The FZP portion of the obtained optical component was irradiated with X-rays (energy: 14.4 keV, ring current: 70 mA). The FZP was not distorted or destroyed even after continuous irradiation for two days or more. The extinction coefficient of copper under these X-ray irradiation conditions was about 100 times that of aluminum.
[0064]
FIG. 2 shows a scanning electron microscope image of a cross section of an optical component having an FZP portion having an outermost annular zone width of 0.25 μm.
[0065]
Comparative Example 1
In the same manner as in Example 1, 50 layers of copper and aluminum were alternately laminated on a fine linear substrate. A thin wire substrate on which an X-ray transmission layer and an X-ray blocking layer are deposited is fixed by embedding in solder (tin-lead alloy, tin: lead [weight ratio] = 60: 40, melting point 180 ° C.), and the length direction of the substrate The entire solder was cut perpendicular to the (rotation axis) to obtain a solder layer in which FZP was embedded. The obtained solder layer was bonded to a 1 mm-thick graphite plate using Loctite 420. Next, the FZP was polished together with the solder layer using SiC polishing paper until the thickness became 40 μm. The polished surface was mirror-finished using fine abrasive paper of # 4000 to # 8000 or an alumina abrasive having a particle size of 2 μm.
[0066]
The FZP portion of the obtained optical component was irradiated with X-rays (energy: 14.4 keV, ring current: 70 mA). When irradiation was performed for about 20 minutes, bubbles were generated in the X-ray irradiation part, and the fixed FZP in the solder was distorted. Furthermore, when X-ray irradiation was continued, FZP was destroyed.
[Brief description of the drawings]
FIG. 1 is a view schematically showing one example of a part of a process of manufacturing a laminated Fresnel zone plate.
FIG. 2 is a scanning electron microscope image of a cross section of the laminated Fresnel zone plate used in Example 1. This Fresnel zone plate has a total of 50 thin layers of copper and aluminum. The width of the outermost zone is 0.25 μm.
FIG. 3 is a diagram schematically showing a hard X-ray microbeam optical system provided with a Fresnel zone plate obtained by the method of the present invention. As the spectroscope, a monocrystal monochromator using a Si (111) plane of a Si crystal was used.
FIG. 4 is a diagram schematically illustrating an example of a vapor deposition apparatus provided with a slit.
FIG. 5 is a diagram schematically showing one embodiment of the optical component of the present invention.

Claims (12)

An optical component having a solder layer and a support base in which a Fresnel zone plate is embedded,
An optical component in which an adhesive layer is provided between a solder layer and a support, and no adhesive layer is provided between the Fresnel zone plate and the support. The optical component according to claim 1, wherein the Fresnel zone plate has a thickness of 20 to 50 μm. The optical component according to claim 1, wherein the support is made of graphite or beryllium. The adhesive layer is at least one selected from the group consisting of an epoxy resin, a polyester resin, a polyurethane resin, a polyamide resin, a polysulfide resin, an acrylic resin, a polyether resin, a polyimide resin, and a silicone resin. The optical component according to claim 1, wherein the optical component is a layer containing a kind of resin. A method for manufacturing an optical component including a solder layer and a support base in which a Fresnel zone plate is embedded,
After bonding the solder layer in which the Fresnel zone plate having a thickness of 100 μm or more is embedded to the support using an adhesive, the Fresnel zone plate portion of the solder layer is irradiated with X-rays, and the A manufacturing method characterized by deteriorating an adhesive layer provided therebetween and then polishing the adhesive layer. The production method according to claim 1, wherein the energy of the irradiated X-ray is 10 to 100 keV. 3. The method according to claim 1, wherein a ring current of the irradiated X-ray is 70 to 100 mA. 4. The method according to claim 1, wherein the X-ray irradiation time is 2 hours or more. An X-ray microbeam optical system provided with the optical component according to claim 1 as an X-ray focusing component. An X-ray spectroscopy microscope comprising the optical component according to claim 1 as an X-ray focusing component. A micro X-ray fluorescence spectrometer comprising the optical component according to claim 1 as an X-ray focusing component. A micro X-ray tomography apparatus comprising the optical component according to claim 1 as an X-ray focusing component.

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