JP2004143241A5 - - Google Patents
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- JP2004143241A5 JP2004143241A5 JP2002307832A JP2002307832A JP2004143241A5 JP 2004143241 A5 JP2004143241 A5 JP 2004143241A5 JP 2002307832 A JP2002307832 A JP 2002307832A JP 2002307832 A JP2002307832 A JP 2002307832A JP 2004143241 A5 JP2004143241 A5 JP 2004143241A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002307832A JP4162201B2 (ja) | 2002-10-23 | 2002-10-23 | 熱可塑性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002307832A JP4162201B2 (ja) | 2002-10-23 | 2002-10-23 | 熱可塑性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004143241A JP2004143241A (ja) | 2004-05-20 |
| JP2004143241A5 true JP2004143241A5 (ja) | 2005-10-27 |
| JP4162201B2 JP4162201B2 (ja) | 2008-10-08 |
Family
ID=32454136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002307832A Expired - Fee Related JP4162201B2 (ja) | 2002-10-23 | 2002-10-23 | 熱可塑性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4162201B2 (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1666532B1 (en) * | 2003-09-12 | 2014-11-05 | Asahi Kasei Chemicals Corporation | Conductive resin composition and molded object |
| JP5037783B2 (ja) * | 2004-07-02 | 2012-10-03 | キヤノン株式会社 | 樹脂組成物及びそれらを用いて成形された成形体、レンズ鏡筒 |
| JP2006097006A (ja) * | 2004-08-31 | 2006-04-13 | Showa Denko Kk | 導電性樹脂組成物の製造方法及び用途 |
| CN100430441C (zh) * | 2006-07-12 | 2008-11-05 | 扬州大学 | 聚酰胺/石墨纳米导电复合材料及其制备方法 |
| US7947201B2 (en) * | 2008-09-30 | 2011-05-24 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether)/polyamide composition and method of making |
| CN103238382A (zh) * | 2010-10-06 | 2013-08-07 | 因特瓦产品有限责任公司 | 用于提供具有电磁干扰屏蔽的增强复合材料的方法和设备 |
| US10968340B1 (en) * | 2017-01-31 | 2021-04-06 | Eaton Intelligent Power Limited | Electrically conductive, high strength, high temperature polymer composite for additive manufacturing |
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2002
- 2002-10-23 JP JP2002307832A patent/JP4162201B2/ja not_active Expired - Fee Related