JP2004111442A5 - - Google Patents
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- JP2004111442A5 JP2004111442A5 JP2002268313A JP2002268313A JP2004111442A5 JP 2004111442 A5 JP2004111442 A5 JP 2004111442A5 JP 2002268313 A JP2002268313 A JP 2002268313A JP 2002268313 A JP2002268313 A JP 2002268313A JP 2004111442 A5 JP2004111442 A5 JP 2004111442A5
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- inspection
- probe needle
- gas
- inspection apparatus
- semiconductor
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Claims (8)
前記被検査物が載置されるステージを駆動することにより、前記被検査物を前記プローブ針に接続させるステージ駆動手段と、
前記プローブ針の酸化を防止する酸化防止ガスを、前記プローブ針に向け供給するガス供給手段と、
前記ステージ駆動手段からの信号に基づき、少なくとも前記被検査物が前記プローブ針に接続するとき、前記ガス供給手段を駆動して前記プローブ針に酸化防止ガスを供給する制御手段と
を設けたことを特徴とする半導体検査装置。In a semiconductor inspection apparatus that conducts an electrical inspection by connecting a probe needle to an object during inspection,
Stage driving means for connecting the inspection object to the probe needle by driving a stage on which the inspection object is placed;
A gas supply means for supplying an antioxidant gas for preventing the probe needle from being oxidized toward the probe needle;
Control means for driving the gas supply means to supply an antioxidant gas to the probe needle when at least the object to be inspected is connected to the probe needle based on a signal from the stage driving means. A featured semiconductor inspection device.
前記被検査物が前記プローブ針と接続させる領域における酸素濃度を検出する酸素濃度検出手段と、
前記プローブ針の酸化を防止する酸化防止ガスを、前記プローブ針に向け供給するガス供給手段と、
前記酸素濃度検出手段からの信号に基づき、前記領域の酸素濃度が前記プローブ針を酸化させる濃度を超えたとき、前記ガス供給手段を駆動して前記プローブ針に酸化防止ガスを供給する制御手段と
を設けたことを特徴とする半導体検査装置。In a semiconductor inspection apparatus that conducts an electrical inspection by connecting a probe needle to an object during inspection,
Oxygen concentration detection means for detecting an oxygen concentration in a region where the inspection object is connected to the probe needle;
A gas supply means for supplying an antioxidant gas for preventing oxidation of the probe needle toward the probe needle;
Control means for driving the gas supply means to supply an antioxidant gas to the probe needle when the oxygen concentration in the region exceeds the concentration for oxidizing the probe needle based on a signal from the oxygen concentration detection means; A semiconductor inspection apparatus characterized by comprising:
前記プローブ針の酸化を防止する酸化防止ガスを、前記プローブ針に向け供給するガス供給手段と、
前記被検査物が前記プローブ針と接続させる領域における前記酸化防止ガス濃度を検出するガス濃度検出手段と、
前記ガス濃度検出手段からの信号に基づき、前記領域の酸化防止ガス濃度が前記プローブ針の酸化防止を図りうる濃度より低下したとき、前記ガス供給手段を駆動して前記プローブ針に酸化防止ガスを供給する制御手段と
を設けたことを特徴とする半導体検査装置。In a semiconductor inspection apparatus that conducts an electrical inspection by connecting a probe needle to an object during inspection,
A gas supply means for supplying an antioxidant gas for preventing oxidation of the probe needle toward the probe needle;
A gas concentration detecting means for detecting the antioxidant gas concentration in a region where the inspection object is connected to the probe needle;
Based on the signal from the gas concentration detecting means, when the concentration of the antioxidant gas in the region is lower than the concentration capable of preventing the probe needle from being oxidized, the gas supply means is driven to supply the probe needle with the antioxidant gas. And a control means for supplying the semiconductor inspection apparatus.
前記制御手段は、
前記検査時中においては、前記ガス供給手段によるプローブ針に向けた酸化防止ガスの供給を停止することを特徴とする半導体検査装置。In the semiconductor inspection apparatus according to any one of claims 1 to 3,
The control means includes
During the inspection, the semiconductor inspection apparatus stops the supply of the antioxidant gas toward the probe needle by the gas supply means.
前記プローブ針の酸化を防止する酸化防止ガスを、前記検査台から前記プローブ針に向け供給する構成としたことを特徴とする半導体検査装置。At the time of inspection, in a semiconductor inspection apparatus that performs an electrical inspection by connecting a probe needle to an inspection object mounted on an inspection table,
A semiconductor inspection apparatus characterized in that an antioxidant gas for preventing oxidation of the probe needle is supplied from the inspection table toward the probe needle.
前記検査台に前記被検査物を加熱或いは冷却する温度調整機を設けると共に、該検査台内に前記酸化防止ガスが循環する通路を設け、
前記温度調整機により前記被検査物と共に前記酸化防止ガスが加熱されるよう構成したことを特徴とするものである。The semiconductor inspection apparatus according to claim 5,
A temperature adjuster for heating or cooling the inspection object is provided on the inspection table, and a passage through which the antioxidant gas circulates is provided in the inspection table.
The antioxidant gas is heated together with the inspection object by the temperature adjuster.
前記検査台に設けられる前記酸化防止ガスの噴出し孔を、前記検査台の前記被検査物の装着位置を囲繞する位置に設けたことを特徴とする半導体検査装置。The semiconductor inspection apparatus according to claim 5 or 6,
A semiconductor inspection apparatus, wherein the injection hole for the antioxidant gas provided in the inspection table is provided at a position surrounding the mounting position of the inspection object on the inspection table.
前記検査台から前記プローブ針に向けた前記酸化防止ガスの供給を制御する制御手段を設け、少なくとも前記検査時中においては、前記制御手段により前記プローブ針に向けた酸化防止ガスの供給を停止することを特徴とする半導体検査装置。The semiconductor inspection apparatus according to any one of claims 5 to 7,
Control means for controlling the supply of the antioxidant gas from the inspection table toward the probe needle is provided, and at least during the inspection, the control means stops the supply of the antioxidant gas toward the probe needle. A semiconductor inspection apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002268313A JP2004111442A (en) | 2002-09-13 | 2002-09-13 | Semiconductor inspecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002268313A JP2004111442A (en) | 2002-09-13 | 2002-09-13 | Semiconductor inspecting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004111442A JP2004111442A (en) | 2004-04-08 |
| JP2004111442A5 true JP2004111442A5 (en) | 2005-11-04 |
Family
ID=32266560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002268313A Pending JP2004111442A (en) | 2002-09-13 | 2002-09-13 | Semiconductor inspecting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004111442A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7007408B2 (en) * | 2004-04-28 | 2006-03-07 | Solid State Measurements, Inc. | Method and apparatus for removing and/or preventing surface contamination of a probe |
| JP5599691B2 (en) * | 2010-10-27 | 2014-10-01 | シャープ株式会社 | Semiconductor inspection equipment |
| JP5452640B2 (en) * | 2012-02-07 | 2014-03-26 | シャープ株式会社 | Semiconductor test equipment |
| JP5870188B2 (en) * | 2012-06-18 | 2016-02-24 | シャープ株式会社 | Inspection device |
| JP6084469B2 (en) | 2013-01-28 | 2017-02-22 | 三菱電機株式会社 | Semiconductor evaluation apparatus and semiconductor evaluation method |
| JP6575094B2 (en) * | 2015-03-23 | 2019-09-18 | セイコーエプソン株式会社 | Electronic component conveying device and electronic component inspection device |
| CN113465735A (en) * | 2021-07-11 | 2021-10-01 | Nano科技(北京)有限公司 | Concave structure anti-dewing device for low-temperature measurement of photoelectric detector chip |
| CN116773994B (en) * | 2023-08-21 | 2023-12-01 | 珠海格力电子元器件有限公司 | Wafer test control method, control device, storage medium and electronic equipment |
-
2002
- 2002-09-13 JP JP2002268313A patent/JP2004111442A/en active Pending
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