JP2004103314A - Collector and its manufacturing method - Google Patents

Collector and its manufacturing method Download PDF

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Publication number
JP2004103314A
JP2004103314A JP2002261242A JP2002261242A JP2004103314A JP 2004103314 A JP2004103314 A JP 2004103314A JP 2002261242 A JP2002261242 A JP 2002261242A JP 2002261242 A JP2002261242 A JP 2002261242A JP 2004103314 A JP2004103314 A JP 2004103314A
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Japan
Prior art keywords
active material
conductive resin
current collector
metal foil
resin layer
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JP2002261242A
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JP4267279B2 (en
Inventor
Kenichi Kadowaki
角脇 賢一
Mitsuyuki Wasamoto
和佐本 充幸
Ken Noguchi
野口 研
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Nippon Foil Manufacturing Co Ltd
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Nippon Foil Manufacturing Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13Energy storage using capacitors

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  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Cell Electrode Carriers And Collectors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a collector allowing active material layers to be correctly stacked on and integrated with both its front and back surfaces, and of preventing the active material from falling off in manufacturing a secondary battery or in using it. <P>SOLUTION: In this collector A, front and back conductive resin layers 2 and 3 are stacked on and integrated with both front and back surfaces of metal foil 1; multiple through-holes A1 penetrating to the back surface of the metal foil 1 from the front surface of the resin layer 2 are formed; the active material layers can be stacked and integrated in separate processes on the one-side surface basis because the back-side openings of the through-holes A1 are closed by the resin layer 3; and thereby, the active material layers can simply and surely be stacked on and integrated with both the front and back surfaces of the collector by using a simple facility while correctly adjusting the thicknesses of the active material layers. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、二次電池、コンデンサ、特に、リチウム系二次電池に用いられる集電体及びその製造方法に関する。
【0002】
【従来の技術】
二次電池は、基本的には、正極、負極、正極と負極とを絶縁するセパレータ及び正極と負極との間でイオンの移動を可能にするための電解液で構成されている。そして、上記正極及び負極は、特許文献1に記載されたような多数の貫通孔が貫設された金属箔からなる集電体の両面に、各種活物質を同時に塗布、積層一体化することによって製造されている。
【0003】
しかしながら、上記のように、多数の貫通孔が貫設された金属箔からなる集電体の両面に活物質を同時に塗布するのは、活物質の厚み調整が非常に難しく、設備も複雑になるといった問題点があった。
【0004】
又、上記正極及び負極は、二次電池の作製に際して渦巻き状に巻回された状態に二次電池本体内に収納されるが、この正極及び負極の巻き上げの際に集電体表面から活物質が脱落すると、所望の電気容量を有する二次電池が得られないといった問題点が発生し、更に、二次電池の使用中に集電体表面から活物質が脱落すると、二次電池の充放電容量が徐々に低下するといった問題点が発生し、二次電池の作製の際或いは使用中に、表面に積層一体化させた活物質が脱落しない集電体が所望されていた。
【0005】
【特許文献1】
特開平11−67217号公報(特許請求の範囲)
【0006】
【発明が解決しようとする課題】
本発明は、表裏面に活物質層を簡単な作業でもって正確に積層一体化させることができ且つ二次電池の作製の際或いは使用中に活物質が脱落することのない集電体及びその集電体の製造方法を提供する。
【0007】
【課題を解決する手段】
請求項1に記載の集電体は、金属箔の表裏面に表裏導電性樹脂層を積層一体化していると共に、表側導電性樹脂層の表面から金属箔の裏面に貫通する多数の貫通孔が形成され、上記貫通孔の裏側開口部が裏側導電性樹脂層によって閉塞されていることを特徴とする。
【0008】
又、請求項2に記載の集電体は、請求項1に記載の集電体において、表裏導電性樹脂層は、合成樹脂中に導電性粒子を散在させてなることを特徴とする。
【0009】
そして、請求項3に記載の集電体の製造方法は、金属箔の表面に多数の貫通孔が形成された表側導電性樹脂層を積層一体化すると共に、金属箔の裏面に裏側導電性樹脂層を積層一体化して積層シートを製造した後、この積層シートにおける表側導電性樹脂層の貫通孔を通じて上記金属箔をエッチング処理し、この金属箔に上記裏側導電性樹脂層に達する貫通孔を貫設することを特徴とする。
【0010】
【作用】
本発明の集電体における貫通孔は、その裏側開口部が裏側導電性樹脂層によって閉塞された状態となっていることから、本発明の集電体の表裏面に活物質層を積層一体化させるに際して、従来の集電体のように表裏面に同時に活物質層を積層一体化させる必要はなく、集電体の片面毎に別々の工程でもって活物質層を簡単に且つ確実に積層一体化させることができる。
【0011】
そして、上記の如く、集電体の片面毎に活物質層を積層一体化させることから、活物質層の厚み精度を向上させることができ、均質な二次電池やコンデンサを得ることができる。
【0012】
更に、上記集電体の表裏面に積層一体化させる活物質層は、表裏導電性樹脂層上に確実に積層一体化され、特に、表側導電性樹脂層上に積層一体化される活物質層は、その一部が貫通孔内に進入、係止した状態となっており、上記集電体の両面に積層一体化させた活物質層は、集電体の巻回時や使用中に不測に脱落するといったことはない。
【0013】
【発明の実施の形態】
本発明の集電体の一例を図面を参照しつつ説明する。集電体Aの金属箔1は、従来から二次電池やコンデンサの集電体に用いられている金属箔と同様のものが用いられ、例えば、アルミニウム箔、アルミニウム合金箔、銅箔、銅合金箔等が挙げられる。なお、上記銅箔は、圧延法により製造された圧延銅箔であっても、電解法により製造された電解銅箔の何れであってもよい。
【0014】
そして、上記金属箔1の厚みは、一般的に8〜30μmであり、リチウム系二次電池に用いる場合、アルミニウム箔にあっては厚みが15〜25μm、銅箔にあっては厚みが10〜20μmのものが好ましい。
【0015】
更に、図1に示したように、上記金属箔1の表面には表側導電性樹脂層2が積層一体化されていると共に、金属箔1の裏面には無孔状の裏側導電性樹脂層3が積層一体化されている。なお、上記無孔状とは、後述する貫通孔A1と同程度の貫通孔が貫設されていないという意味であって、ピンホール等の微細な孔は形成されていてもよい。
【0016】
上記表裏導電性樹脂層2、3は、合成樹脂中に導電性粒子を散在させてなる。上記表裏導電性樹脂層2、3を構成する合成樹脂としては、後述する金属箔1のエッチング処理によって変質したり或いは表裏導電性樹脂層2、3に亀裂や孔を生じさせず且つ金属箔1の表裏面に表裏導電性樹脂層2、3を積層一体化させることができればよく、好ましくは、集電体Aの両面に積層一体化させる活物質層に用いられている合成樹脂と相溶性を有するものがよく、例えば、ポリアミドイミド樹脂、エポキシ樹脂、メラミン樹脂、フェノール樹脂、ウレタン樹脂等の熱硬化性樹脂;フッ素樹脂、ポリオレフィン樹脂、アクリル樹脂、ポリエステル樹脂等の熱可塑性樹脂等が挙げられ、熱硬化性樹脂が好ましく、ポリアミドイミド樹脂がより好ましい。
【0017】
又、上記導電性粒子としては、例えば、ケッチェンブラック、カーボンブラック、アセチレンブラック、グラファイト、カーボンナノチューブ等の炭素系粒子;銀、ニッケル、銅、亜鉛、アルミニウム等の金属系粒子等が挙げられ、炭素系粒子が好ましく、ケッチェンブラック、カーボンブラック、グラファイトがより好ましく、ケッチェンブラック、カーボンブラック及びグラファイトを併用するのが特に好ましい。なお、上記導電性粒子は、単独で用いられても二種以上が併用されてもよい。
【0018】
そして、上記表裏導電性樹脂層2、3中における導電性粒子の散在量は、多いと、金属箔1と表裏導電性樹脂層2、3の密着性が低下することがあり、又、少ないと、表裏導電性樹脂層2、3の導電性が低下することがあるので、合成樹脂100重量部に対して20〜80重量部が好ましい。
【0019】
又、上記表裏導電性樹脂層2、3の厚さは、厚いと、表側導電性樹脂層2上に積層一体化させる活物質層Dの厚さが不均一となることがあり、又、薄いと、裏側導電性樹脂層3の機械的強度が低下し、集電体Aの製造途中で、裏側導電性樹脂層3が脱落することがあるので、0.5〜10μmが好ましい。
【0020】
なお、上記表裏導電性樹脂層2、3中には、物性を損なわない範囲内において、シランカップリング剤、レベリング剤、消泡剤、分散剤、シリカ等の無機粒子、顔料、多官能イソシアネート等の架橋剤等の添加剤を添加してもよい。
【0021】
更に、図1及び図2に示したように、表側導電性樹脂層2の表面から金属箔1の裏面に貫通する多数の貫通孔A1が全面的に形成されて集電体Aが構成されており、この貫通孔A1の裏側開口部は全て、裏側導電性樹脂層3によって閉塞された状態となっている。
【0022】
そして、上記貫通孔A1の平面形状としては、特に限定されず、例えば、円形の他に、三角形、四角形、五角形、六角形等の多角形等が挙げられ、円形、正多角形が好ましく、円形がより好ましい。
【0023】
上記貫通孔A1の形成形態としては、特に限定されないが、同一形状で且つ同一大きさを有する貫通孔A1が略均一な密度でもって貫設されていることが好ましく、このような形態としては、イ)図2乃び図3に示したような、同一径を有する円形状の貫通孔A10 を前後左右に所定間隔毎に格子状に貫設すると共に、前後左右に互いに隣接する貫通孔A10 、A10 ・・・の中心同士を結んで得られる仮想正方形の重心に中心を合致させた状態に上記貫通孔A10 と同一径を有する貫通孔A11 を貫設してなる形態、ロ)図4及び図5に示したような、同一径を有する円形状の貫通孔A10 を前後左右に所定間隔毎に格子状に貫設すると共に、前後左右に互いに隣接する貫通孔A10 、A10 ・・・の中心同士を結んで得られる仮想長方形の重心に中心を合致させた状態に上記貫通孔A10 と同一径を有する貫通孔A11 を貫設してなる形態が挙げられる。なお、ロ)の貫設形態において、互いに左右方向に隣接する貫通孔A10,A10 間の距離を前後方向に隣接する貫通孔A10 、A10 間の距離よりも長くすると共に、左右方向に隣接する貫通孔A10 、A10 間の距離を貫通孔A10 (A11 )の直径の2倍以上にして、前後方向に隣接する貫通孔A10 、A10 間に貫通孔A11 が入り込んだ状態とならないようにするのが好ましい。
【0024】
上記貫通孔A1の径は、大きいと、集電体Aの機械的強度が低下することがあり、又、小さいと、活物質層Dを貫通孔A1内に進入、係止させることができず、表側導電性樹脂層2と活物質層Dとの間の密着性が低下することがあるので、0.1〜3mmが好ましい。なお、上記貫通孔A1の径は、貫通孔A1が非円形である場合には、この貫通孔A1を包囲し得る最小の仮想真円の直径をいう。
【0025】
更に、上記貫通孔A1、A1間の間隔は、広いと、活物質層Dが貫通孔A1内に進入、係止する度合いが減少し、表側導電性樹脂層2と活物質層Dとの間の密着性が低下することがあり、又、狭いと、集電体Aの機械的強度が低下することがあるので、0.5〜10mmが好ましい。なお、上記貫通孔A1,A1間の間隔とは、貫通孔A1が円形である場合には互いに隣接する貫通孔A1、A1の中心間の平均距離をいい、又、貫通孔が非円形である場合には、この貫通孔A1を包囲し得る最小の仮想真円における互いに隣接する真円の中心間の平均距離をいう。
【0026】
又、上記貫通孔A1の貫設密度は、大きいと、集電体Aの機械的強度が低下することがあり、又、小さいと、活物質層Dが貫通孔A1内に進入、係止する度合いが減少し、表側導電性樹脂層2と活物質層Dとの間の密着性が低下することがあるので、1〜400個/cm2 が好ましい。
【0027】
次に、上記集電体の製造方法を説明する。先ず、図6に示したように、貫通孔の全く形成されていない状態の長尺状の金属箔1’を巻き出して輪転印刷機4に供給し、この巻き出された金属箔1’の表面における幅方向の両端縁部を除いた全面に表側導電性塗料を一定厚みで連続的に塗布した後、この表側導電性塗料が表面に塗布された金属箔1’を加熱装置5に連続的に供給して表側導電性塗料を加熱し、上記金属箔1’の表面の略全面に表側導電性樹脂層2が積層一体化されてなる第一積層シートBを連続的に製造する。なお、上記表側導電性塗料は、バインダーとなる合成樹脂中に導電性粒子を分散させてなる。
【0028】
又、上記表側導電性樹脂層2には、図4及び図5に示したように、同一径を有する円形状の貫通孔21a が前後左右に所定間隔毎に格子状に表側導電性樹脂層2の両面間に亘って貫設されていると共に、前後左右に互いに隣接する貫通孔21a、21a ・・・の中心同士を結んで得られる仮想長方形の重心に中心を合致させた状態に上記貫通孔21a と同一径を有する貫通孔21b が表側導電性樹脂層2の両面間に亘って貫設されている。
【0029】
そして、互いに左右方向に隣接する貫通孔21a,21a 間の距離を前後方向に隣接する貫通孔21a 、21a 間の距離よりも長くすると共に、左右方向に隣接する貫通孔21a 、21a 間の距離を貫通孔21a (21b )の直径の2倍以上にして、前後方向に隣接する貫通孔21a 、21a 間に貫通孔21b が入り込んだ状態とならないように貫設されている。ここで、前後方向とは金属箔1’の巻き出し方向をいい、左右方向とは金属箔1’の表面に沿った前後方向に直交する方向をいう。
【0030】
又、上記表側導電性樹脂層2の幅方向の両端部の夫々には、後述するエッチング後の金属箔が搬送中にその長さ方向に亀裂するのを防止するために、一定幅に亘って貫通孔21a 、21b が形成されていない無孔部分22が形成されている。
【0031】
続いて、上記第一積層シートBを輪転印刷機6に連続的に供給して、上記第一積層シートBの金属箔1’の裏面における幅方向の両端縁部を除いた全面に裏側導電性塗料を連続的に一定厚みで塗布した後、加熱装置7に連続的に供給して上記裏側導電性塗料を加熱し、上記第一積層シートBの金属箔1の裏面の略全面に、無孔状の裏側導電性樹脂層3が積層一体化してなる第二積層シートCを製造し、続いて、上記第二積層シートCの裏側導電性樹脂層2の全面に、第二積層シートCが長さ方向に亀裂するのを防止することを目的として、マスキングフィルムC’を連続的に剥離可能に積層した上でコイル状に連続的に巻き取る(図6及び図7参照)。なお、上記裏側導電性塗料は、バインダーとなる合成樹脂中に導電性粒子を分散させてなり、上記表側導電性塗料と同一のものを用いるのが好ましい。
【0032】
次に、上記コイル状に巻き取った第二積層シートCを連続的に巻き出し、第二積層シートCにおける幅方向の両端縁部を切除した上で、第二積層シートCを酸性浴中に連続的に供給し、上記第二積層シートCにおける表側導電性樹脂層2の多数の貫通孔21a 、21b を通じて露出した金属箔1’部分をエッチング処理し、金属箔1’に表側導電性樹脂層2の貫通孔21パターンに合致した状態に裏側導電性樹脂層3に達する貫通孔、即ち、表側導電性樹脂層2の表面から金属箔1’の裏面に達する(貫通する)貫通孔A1、A1・・・を貫設して集電体Aを製造し、連続的にコイル状に巻き取る(図8参照)。上記集電体Aの貫通孔A1の裏側開口部は全て、裏側導電性樹脂層3によって閉塞されている。なお、上記集電体Aは、その裏面にマスキングフィルムC’が積層された状態のままコイル状に巻回されている。
【0033】
このようにして得られた集電体Aは、図8に示したように、金属箔1の表裏面の全面に表裏導電性樹脂層2、3を積層一体化していると共に、表側導電性樹脂層2の表面から金属箔1の裏面に貫通する多数の貫通孔A1、A1・・・が形成され、上記貫通孔A1の裏側開口部の全てが裏側導電性樹脂層3によって閉塞されている。
【0034】
そして、図9に示したように、上記コイル状の集電体Aを連続的に巻き出し、集電体Aの表面に活物質を連続的に塗布した後に加熱装置8に供給して上記集電体Aの表面に活物質層Dを積層一体化し、片面活物質積層シートE(図10参照)を製造し連続的にコイル状に巻き取る。
【0035】
このように、上記集電体Aは、その全貫通孔A1の他端開口部が裏側導電性樹脂層3によって全面的に閉塞された状態となっていることから、集電体Aの片面のみに活物質を塗布して活物質層Dを積層一体化することができ、集電体Aの表面への活物質層Dの積層一体化を活物質層Dの厚みを正確に調整しつつ簡単に且つ確実に行なうことができる。
【0036】
しかも、上記集電体Aの表面に積層一体化させた活物質層Dの一部を貫通孔A1内に進入、係止させた状態としていることから、上記活物質層Dは上記集電体Aの表面に強固に且つ確実に積層一体化している。
【0037】
次に、図11に示したように、上記片面活物質積層シートEを連続的に巻き出し、片面活物質積層シートEの裏面に積層してあるマスキングフィルムC’を連続的に剥離した後、上記片面活物質積層シートEの裏側導電性樹脂層3上に活物質を連続的に塗布した後に乾燥装置9に供給して上記片面活物質積層シートEの裏面に活物質層Fを積層一体化し、両面活物質積層シートG(図12参照)を連続的に製造することができる。
【0038】
なお、上記表裏導電性樹脂層2、3上に塗布、積層一体化させた活物質は、従来から電極やコンデンサに用いられているものであれば、特に限定されず、例えば、リチウム塩や炭素等の導電性粒子にバインダーである合成樹脂を混合させてなるものである。
【0039】
このように、上記片面活物質積層シートEの裏面のみに活物質を塗布して活物質層Fを積層一体化することができ、片面活物質積層シートEの裏面に活物質層Fを一定厚みに正確に調整しつつ積層一体化させることができる。
【0040】
しかも、両面活物質積層シートGの活物質層D、Fは、表裏導電性樹脂層2、3上に、活物質層D、F中の合成樹脂と、表裏導電性樹脂層2、3を構成する合成樹脂とが熱融着一体化した状態に積層一体化されているので、活物質層D、Fは集電体Aの両面に強固に且つ確実に積層一体化されており、集電体Aをコイル状に巻回したりしても不測に脱落することはない。
【0041】
更に、集電体Aの表側導電性樹脂層2上に積層一体化された活物質層Dは、貫通孔A1内に進入して裏側導電性樹脂層3に達しており、活物質層D中の合成樹脂と、裏側導電性樹脂層3を構成する合成樹脂とが熱融着一体化しており、よって、両面活物質積層シートGの活物質層Dは、集電体Aの表面に更に強固に積層一体化されている。
【0042】
【発明の効果】
請求項1に記載の集電体は、金属箔の表裏面に表裏導電性樹脂層を積層一体化していると共に、表側導電性樹脂層の表面から金属箔の裏面に貫通する多数の貫通孔が形成され、上記貫通孔の裏側開口部が裏側導電性樹脂層によって閉塞されていることを特徴とするので、集電体の片面毎に別々の工程で活物質層を積層一体化させることができ、よって、集電体の両面への活物質層の積層一体化を活物質層の厚みを正確に調整しつつ簡易な設備を用いて簡単に且つ確実に行なうことができる。
【0043】
しかも、集電体の表面に積層一体化させる活物質層の一部を貫通孔内に進入、係止させることができ、集電体上に活物質層を確実に積層一体化させることができる。
【0044】
請求項2に記載の集電体は、請求項1に記載の集電体において、表裏導電性樹脂層は、合成樹脂中に導電性粒子を散在させてなることを特徴とするので、集電体の両面に積層一体化させる活物質中の合成樹脂と、表裏導電性樹脂層を構成する合成樹脂とを熱融着一体化させることによって、集電体の表裏面(両面)に活物質層をより強固に且つ確実に積層一体化させることができる。
【0045】
請求項3に記載の集電体の製造方法は、金属箔の表面に多数の貫通孔が形成された表側導電性樹脂層を積層一体化すると共に、金属箔の裏面に裏側導電性樹脂層を積層一体化して積層シートを製造した後、この積層シートにおける表側導電性樹脂層の貫通孔を通じて上記金属箔をエッチング処理し、この金属箔に上記裏側導電性樹脂層に達する貫通孔を貫設することを特徴とするので、金属箔の表面に多数の貫通孔が貫設された表側導電性樹脂層を、裏面に裏側導電性樹脂層を積層一体化した上で金属箔のエッチング処理を表側導電性樹脂層の貫通孔を通じて行なうといった簡単な作業でもって集電体を製造することができ、従来の集電体の製造方法のように、金属箔の表裏面にエッチング処理のためのマスキングフィルムを剥離可能に積層し、エッチング処理後にマスキングフィルムを剥離するといったような煩雑な作業を行なうことなく、効率良く集電体を製造することができる。
【図面の簡単な説明】
【図1】本発明の集電体の縦断面図である。
【図2】図1の集電体の平面図である。
【図3】図2の部分拡大図である。
【図4】本発明の集電体の他の一例を示した平面図である。
【図5】図4の部分拡大図である。
【図6】本発明の集電体の製造方法で用いられる製造装置の一部を示した模式側面図である。
【図7】裏面にマスキングフィルムが積層された状態の第二積層シートを示した縦断面図である。
【図8】裏面にマスキングフィルムが積層された状態の集電体を示した縦断面図である。
【図9】集電体の表面に活物質層を積層一体化させる装置を示した模式側面図である。
【図10】片面活物質積層シートを示した縦断面図である。
【図11】集電体の裏面に活物質層を積層一体化させる装置を示した模式側面図である。
【図12】両面活物質積層シートを示した縦断面図である。
【符号の説明】
1 金属箔
A1 貫通孔
2 表側導電性樹脂層
21(21a 、21b )貫通孔
3 裏側導電性樹脂層
A 集電体
D、F 活物質層
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a current collector used for a secondary battery and a capacitor, particularly a lithium secondary battery, and a method for manufacturing the same.
[0002]
[Prior art]
A secondary battery is basically composed of a positive electrode, a negative electrode, a separator for insulating the positive electrode and the negative electrode, and an electrolytic solution for allowing ions to move between the positive electrode and the negative electrode. The positive electrode and the negative electrode are simultaneously coated with various active materials on both surfaces of a current collector made of a metal foil having a large number of through-holes as described in Patent Document 1, and laminated and integrated. Being manufactured.
[0003]
However, as described above, simultaneously applying an active material to both surfaces of a current collector made of a metal foil having a large number of through holes penetrates is very difficult to adjust the thickness of the active material and requires complicated equipment. There was a problem.
[0004]
The positive electrode and the negative electrode are housed in a secondary battery body in a spirally wound state when a secondary battery is manufactured. When the positive electrode and the negative electrode are wound, the active material is removed from the surface of the current collector. If the active material falls off the surface of the current collector during use of the secondary battery, a problem occurs such that a secondary battery having a desired electric capacity cannot be obtained. There has been a problem that the capacity gradually decreases, and there has been a demand for a current collector in which the active material laminated and integrated on the surface does not fall off during the production or use of the secondary battery.
[0005]
[Patent Document 1]
JP-A-11-67217 (Claims)
[0006]
[Problems to be solved by the invention]
The present invention provides a current collector and a current collector in which an active material layer can be accurately laminated and integrated on the front and back surfaces by a simple operation, and the active material does not fall off during production or use of a secondary battery. Provided is a method for manufacturing a current collector.
[0007]
[Means to solve the problem]
The current collector according to claim 1, wherein the front and back conductive resin layers are laminated and integrated on the front and back surfaces of the metal foil, and a large number of through holes penetrating from the front surface of the front side conductive resin layer to the back surface of the metal foil are provided. And a back opening of the through hole is closed by a back conductive resin layer.
[0008]
According to a second aspect of the present invention, in the current collector of the first aspect, the front and back conductive resin layers are formed by dispersing conductive particles in a synthetic resin.
[0009]
The method of manufacturing a current collector according to claim 3, wherein the front side conductive resin layer having a large number of through holes formed on the surface of the metal foil is laminated and integrated, and the back side conductive resin layer is formed on the back surface of the metal foil. After the layers are laminated and integrated to produce a laminated sheet, the metal foil is etched through the through-holes of the front-side conductive resin layer in the laminated sheet, and the metal foil is passed through the through-holes reaching the back-side conductive resin layer. It is characterized in that it is installed.
[0010]
[Action]
Since the through-hole in the current collector of the present invention has a state in which the back side opening is closed by the back side conductive resin layer, the active material layer is integrally laminated on the front and back surfaces of the current collector of the present invention. It is not necessary to simultaneously laminate and integrate the active material layers on the front and back surfaces as in the case of a conventional current collector, but simply and reliably laminate the active material layers in a separate process for each side of the current collector. Can be changed.
[0011]
Further, as described above, since the active material layers are laminated and integrated on each side of the current collector, the thickness accuracy of the active material layers can be improved, and a uniform secondary battery or capacitor can be obtained.
[0012]
Further, the active material layer laminated and integrated on the front and back surfaces of the current collector is surely laminated and integrated on the front and back conductive resin layers, and in particular, the active material layer laminated and integrated on the front conductive resin layer The active material layer, part of which enters and penetrates the through-hole and is locked and integrated on both sides of the current collector, is unpredictable when the current collector is wound or used. There is no such thing as falling off.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
An example of the current collector of the present invention will be described with reference to the drawings. As the metal foil 1 of the current collector A, the same metal foil as that conventionally used for current collectors of secondary batteries and capacitors is used. For example, aluminum foil, aluminum alloy foil, copper foil, copper alloy Foil and the like. The copper foil may be either a rolled copper foil manufactured by a rolling method or an electrolytic copper foil manufactured by an electrolytic method.
[0014]
The thickness of the metal foil 1 is generally 8 to 30 μm. When used for a lithium secondary battery, the thickness is 15 to 25 μm for an aluminum foil and 10 to 25 μm for a copper foil. It is preferably 20 μm.
[0015]
Further, as shown in FIG. 1, a front side conductive resin layer 2 is laminated and integrated on the surface of the metal foil 1, and a non-porous back side conductive resin layer 3 is formed on the back side of the metal foil 1. Are laminated and integrated. The non-porous shape means that a through hole similar to the through hole A1 described below is not provided, and a fine hole such as a pinhole may be formed.
[0016]
The front and back conductive resin layers 2 and 3 are formed by dispersing conductive particles in a synthetic resin. As the synthetic resin constituting the front and back conductive resin layers 2 and 3, the metal foil 1 does not deteriorate due to the etching treatment of the metal foil 1 to be described later or does not cause cracks or holes in the front and back conductive resin layers 2 and 3. It is sufficient that the front and back conductive resin layers 2 and 3 can be laminated and integrated on the front and back surfaces. Preferably, the compatibility with the synthetic resin used for the active material layer laminated and integrated on both surfaces of the current collector A is obtained. Good to have, for example, polyamide-imide resin, epoxy resin, melamine resin, phenolic resin, thermosetting resin such as urethane resin; fluorine resin, polyolefin resin, acrylic resin, thermoplastic resin such as polyester resin and the like, Thermosetting resins are preferred, and polyamideimide resins are more preferred.
[0017]
Examples of the conductive particles include, for example, carbon-based particles such as Ketjen black, carbon black, acetylene black, graphite, and carbon nanotubes; and metal-based particles such as silver, nickel, copper, zinc, and aluminum. Carbon-based particles are preferred, Ketjen Black, carbon black, and graphite are more preferred, and Ketjen Black, carbon black and graphite are particularly preferred. The conductive particles may be used alone or in combination of two or more.
[0018]
When the scattered amount of the conductive particles in the front and back conductive resin layers 2 and 3 is large, the adhesion between the metal foil 1 and the front and back conductive resin layers 2 and 3 may be reduced. Since the conductivity of the front and back conductive resin layers 2 and 3 may be reduced, it is preferably 20 to 80 parts by weight based on 100 parts by weight of the synthetic resin.
[0019]
If the thickness of the front and back conductive resin layers 2 and 3 is large, the thickness of the active material layer D laminated and integrated on the front side conductive resin layer 2 may be non-uniform or thin. In this case, the mechanical strength of the back-side conductive resin layer 3 is reduced, and the back-side conductive resin layer 3 may fall off during the production of the current collector A.
[0020]
In the above-mentioned front and back conductive resin layers 2 and 3, silane coupling agents, leveling agents, defoamers, dispersants, inorganic particles such as silica, pigments, polyfunctional isocyanates, etc., as long as the physical properties are not impaired. May be added.
[0021]
Further, as shown in FIGS. 1 and 2, a large number of through-holes A1 penetrating from the front surface of the front-side conductive resin layer 2 to the back surface of the metal foil 1 are entirely formed to form the current collector A. In addition, all of the back-side openings of the through-hole A <b> 1 are closed by the back-side conductive resin layer 3.
[0022]
The planar shape of the through-hole A1 is not particularly limited, and examples thereof include, in addition to a circle, a polygon such as a triangle, a quadrangle, a pentagon, and a hexagon, and the like, preferably a circle and a regular polygon, and a circle. Is more preferred.
[0023]
The form of forming the through-hole A1 is not particularly limited, but it is preferable that the through-holes A1 having the same shape and the same size are penetrated with a substantially uniform density. B) As shown in FIGS. 2 and 3, circular through-holes A10 having the same diameter are provided in a grid pattern at predetermined intervals in front, rear, left and right, and through holes A10 adjacent to each other in front, rear, left and right. A10. A form in which a through-hole A11 having the same diameter as the through-hole A10 is penetrated in a state where the center matches the center of gravity of a virtual square obtained by connecting the centers of A10... B) FIGS. As shown in FIG. 5, circular through holes A10 having the same diameter are pierced in a grid pattern at predetermined intervals in front, rear, left and right, and the centers of the through holes A10, A10,. Virtual obtained by connecting Form obtained by penetrated through holes A11 having the same diameter as the through-hole A10 in a state of being matched with the center square of the center of gravity thereof. In the penetrating form b), the distance between the through-holes A10, A10 adjacent in the left-right direction is longer than the distance between the through-holes A10, A10 adjacent in the front-rear direction. The distance between the holes A10, A10 is preferably at least twice the diameter of the through-hole A10 (A11) so that the through-hole A11 does not enter the space between the through-holes A10, A10 adjacent in the front-rear direction. .
[0024]
If the diameter of the through hole A1 is large, the mechanical strength of the current collector A may be reduced. If the diameter is small, the active material layer D cannot enter and be locked in the through hole A1. Since the adhesion between the front-side conductive resin layer 2 and the active material layer D may decrease, the thickness is preferably 0.1 to 3 mm. Note that the diameter of the through hole A1 refers to the diameter of the smallest virtual perfect circle that can surround the through hole A1 when the through hole A1 is non-circular.
[0025]
Furthermore, if the distance between the through holes A1 and A1 is large, the degree of the active material layer D entering and locking into the through hole A1 decreases, and the distance between the front conductive resin layer 2 and the active material layer D decreases. May be reduced, and if the width is too narrow, the mechanical strength of the current collector A may be reduced. The distance between the through holes A1 and A1 means an average distance between the centers of the adjacent through holes A1 and A1 when the through hole A1 is circular, and the through hole is non-circular. In this case, it refers to the average distance between the centers of adjacent perfect circles in the smallest virtual perfect circle that can surround the through hole A1.
[0026]
If the penetration density of the through-hole A1 is large, the mechanical strength of the current collector A may be reduced. If the penetration density is small, the active material layer D enters and locks in the through-hole A1. The degree is reduced, and the adhesion between the front-side conductive resin layer 2 and the active material layer D may be reduced. Therefore, the number is preferably 1 to 400 / cm 2 .
[0027]
Next, a method for manufacturing the current collector will be described. First, as shown in FIG. 6, a long metal foil 1 'in a state where no through-hole is formed is unwound and supplied to the rotary printing press 4, and the unwound metal foil 1' After the front side conductive paint is continuously applied to the entire surface of the surface except for both ends in the width direction at a constant thickness, the metal foil 1 ′ having the front side conductive paint applied to the surface is continuously applied to the heating device 5. And heats the front-side conductive paint to continuously produce a first laminated sheet B in which the front-side conductive resin layer 2 is laminated and integrated over substantially the entire surface of the metal foil 1 '. The front side conductive paint is obtained by dispersing conductive particles in a synthetic resin serving as a binder.
[0028]
As shown in FIGS. 4 and 5, the front conductive resin layer 2 has circular through-holes 21a having the same diameter in a grid pattern at predetermined intervals in front, rear, left and right. Are provided so as to penetrate between the two surfaces of the through-hole 21a, and the center of the virtual rectangle obtained by connecting the centers of the through-holes 21a, 21a,. A through-hole 21 b having the same diameter as 21 a is formed through both surfaces of the front-side conductive resin layer 2.
[0029]
The distance between the through-holes 21a, 21a adjacent in the left-right direction is longer than the distance between the through-holes 21a, 21a adjacent in the front-rear direction, and the distance between the through-holes 21a, 21a adjacent in the left-right direction is increased. The diameter of the through hole 21a (21b) is set to be twice or more the diameter of the through hole 21a, so that the through hole 21b does not enter between the through holes 21a, 21a adjacent in the front-rear direction. Here, the front-back direction refers to the unwinding direction of the metal foil 1 ', and the left-right direction refers to the direction orthogonal to the front-back direction along the surface of the metal foil 1'.
[0030]
Further, in order to prevent the metal foil after etching, which will be described later, from cracking in the length direction during transportation, each of the both ends in the width direction of the front side conductive resin layer 2 has a predetermined width. A non-porous portion 22 in which the through holes 21a and 21b are not formed is formed.
[0031]
Subsequently, the first laminated sheet B is continuously supplied to the rotary printing press 6 so that the entire surface of the back surface of the metal foil 1 ′ of the first laminated sheet B except for both ends in the width direction is electrically connected to the back side. After the paint is continuously applied with a constant thickness, the paint is continuously supplied to the heating device 7 to heat the back-side conductive paint. A second laminated sheet C formed by laminating and integrating the back conductive resin layer 3 in a shape is manufactured. Subsequently, the second laminated sheet C is formed over the entire surface of the back conductive resin layer 2 of the second laminated sheet C. For the purpose of preventing cracks in the vertical direction, the masking film C 'is continuously laminated in a releasable manner and then continuously wound in a coil shape (see FIGS. 6 and 7). In addition, it is preferable to use the same conductive paint as the front conductive paint in which conductive particles are dispersed in a synthetic resin serving as a binder.
[0032]
Next, the second laminated sheet C wound up in a coil shape is continuously unwound, and after cutting both edges in the width direction of the second laminated sheet C, the second laminated sheet C is placed in an acid bath. The metal foil 1 ′ is supplied continuously, and the metal foil 1 ′ exposed through the many through holes 21 a and 21 b of the front conductive resin layer 2 in the second laminated sheet C is etched. 2 through holes 21 reaching the back conductive resin layer 3 in a state conforming to the pattern of the through holes 21, that is, through holes A 1, A 1 reaching (penetrating) from the surface of the front conductive resin layer 2 to the back surface of the metal foil 1 ′. Are provided to manufacture the current collector A, and the current collector A is continuously wound into a coil shape (see FIG. 8). The backside openings of the through holes A1 of the current collector A are all closed by the backside conductive resin layer 3. The current collector A is wound in a coil shape with the masking film C 'laminated on the back surface.
[0033]
As shown in FIG. 8, the current collector A thus obtained has the front and back conductive resin layers 2 and 3 laminated and integrated on the entire front and back surfaces of the metal foil 1, and also has the front side conductive resin. A large number of through-holes A1, A1,... Penetrating from the surface of the layer 2 to the back of the metal foil 1 are formed, and the entire back-side opening of the through-hole A1 is closed by the back-side conductive resin layer 3.
[0034]
Then, as shown in FIG. 9, the coil-shaped current collector A is continuously unwound, the active material is continuously applied to the surface of the current collector A, and then supplied to the heating device 8 to be collected. The active material layer D is laminated and integrated on the surface of the conductor A, and a single-sided active material laminated sheet E (see FIG. 10) is manufactured and continuously wound into a coil.
[0035]
As described above, since the current collector A has a state in which the other end opening of the entire through hole A1 is completely closed by the back-side conductive resin layer 3, only one surface of the current collector A is provided. The active material layer D can be applied to the surface of the current collector A, and the active material layer D can be easily integrated while accurately adjusting the thickness of the active material layer D. And reliably.
[0036]
Moreover, since a part of the active material layer D laminated and integrated on the surface of the current collector A enters and is locked in the through-hole A1, the active material layer D is A is firmly and reliably laminated and integrated on the surface of A.
[0037]
Next, as shown in FIG. 11, after unwinding the single-sided active material laminated sheet E continuously, and continuously peeling off the masking film C ′ laminated on the back surface of the single-sided active material laminated sheet E, The active material is continuously applied onto the back side conductive resin layer 3 of the single-sided active material laminated sheet E and then supplied to the drying device 9 to laminate and integrate the active material layer F on the back surface of the single-sided active material laminated sheet E. Thus, the double-sided active material laminated sheet G (see FIG. 12) can be manufactured continuously.
[0038]
The active material applied and laminated on the front and back conductive resin layers 2 and 3 is not particularly limited as long as it is conventionally used for an electrode or a capacitor. And a synthetic resin as a binder mixed with such conductive particles.
[0039]
In this manner, the active material can be applied to only the back surface of the single-sided active material laminated sheet E, and the active material layer F can be laminated and integrated. It is possible to integrate the layers while adjusting them accurately.
[0040]
Moreover, the active material layers D and F of the double-sided active material laminated sheet G are composed of the synthetic resin in the active material layers D and F and the front and back conductive resin layers 2 and 3 on the front and back conductive resin layers 2 and 3. The active material layers D and F are firmly and reliably laminated and integrated on both sides of the current collector A because the synthetic resin and the synthetic resin to be thermally fused are integrated. Even if A is wound in a coil shape, it does not fall off unexpectedly.
[0041]
Further, the active material layer D laminated and integrated on the front side conductive resin layer 2 of the current collector A enters the through hole A1 and reaches the back side conductive resin layer 3, and the active material layer D And the synthetic resin constituting the back-side conductive resin layer 3 are heat-sealed and integrated, so that the active material layer D of the double-sided active material laminated sheet G is more firmly attached to the surface of the current collector A. It is laminated and integrated.
[0042]
【The invention's effect】
The current collector according to claim 1, wherein the front and back conductive resin layers are laminated and integrated on the front and back surfaces of the metal foil, and a large number of through holes penetrating from the front surface of the front side conductive resin layer to the back surface of the metal foil are provided. The active material layer can be stacked and integrated in a separate step for each side of the current collector, since the formed, and the back opening of the through hole is closed by the back conductive resin layer. Therefore, the lamination and integration of the active material layers on both surfaces of the current collector can be easily and reliably performed using simple equipment while accurately adjusting the thickness of the active material layers.
[0043]
In addition, a part of the active material layer to be laminated and integrated on the surface of the current collector can enter and lock into the through hole, and the active material layer can be reliably laminated and integrated on the current collector. .
[0044]
The current collector according to claim 2 is the current collector according to claim 1, wherein the front and back conductive resin layers are formed by dispersing conductive particles in a synthetic resin. The synthetic resin in the active material to be laminated and integrated on both sides of the body and the synthetic resin constituting the front and back conductive resin layers are heat-sealed and integrated to form an active material layer on the front and back surfaces (both surfaces) of the current collector. Can be more firmly and reliably laminated and integrated.
[0045]
In the method for manufacturing a current collector according to claim 3, a front-side conductive resin layer having a large number of through-holes formed on a surface of a metal foil is laminated and integrated, and a back-side conductive resin layer is formed on a back surface of the metal foil. After laminating and integrating to produce a laminated sheet, the metal foil is etched through the through hole of the front side conductive resin layer in the laminated sheet, and a through hole reaching the back side conductive resin layer is formed in the metal foil. Since the front conductive resin layer with a large number of through holes formed on the surface of the metal foil and the back conductive resin layer on the back surface are integrated and laminated, the etching process of the metal foil is performed The current collector can be manufactured by a simple operation such as performing through the through hole of the conductive resin layer, and a masking film for etching treatment is formed on the front and back surfaces of the metal foil as in the conventional method of manufacturing the current collector. Peelable stack , Without performing complicated operations such as peeling off the masking film after the etching treatment, it is possible to efficiently manufacture the current collector.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a current collector of the present invention.
FIG. 2 is a plan view of the current collector of FIG.
FIG. 3 is a partially enlarged view of FIG. 2;
FIG. 4 is a plan view showing another example of the current collector of the present invention.
FIG. 5 is a partially enlarged view of FIG. 4;
FIG. 6 is a schematic side view showing a part of a manufacturing apparatus used in the current collector manufacturing method of the present invention.
FIG. 7 is a longitudinal sectional view showing a second laminated sheet in a state where a masking film is laminated on the back surface.
FIG. 8 is a longitudinal sectional view showing the current collector in a state where a masking film is laminated on the back surface.
FIG. 9 is a schematic side view showing an apparatus for laminating and integrating an active material layer on the surface of a current collector.
FIG. 10 is a longitudinal sectional view showing a single-sided active material laminated sheet.
FIG. 11 is a schematic side view showing an apparatus for laminating and integrating an active material layer on the back surface of a current collector.
FIG. 12 is a longitudinal sectional view showing a double-sided active material laminated sheet.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 metal foil A1 through hole 2 front conductive resin layer 21 (21a, 21b) through hole 3 back conductive resin layer A current collector D, F active material layer

Claims (3)

金属箔の表裏面に表裏導電性樹脂層を積層一体化していると共に、表側導電性樹脂層の表面から金属箔の裏面に貫通する多数の貫通孔が形成され、上記貫通孔の裏側開口部が裏側導電性樹脂層によって閉塞されていることを特徴とする集電体。The front and back conductive resin layers are laminated and integrated on the front and back surfaces of the metal foil, and a large number of through-holes are formed from the surface of the front-side conductive resin layer to the back surface of the metal foil. A current collector closed by a backside conductive resin layer. 表裏導電性樹脂層は、合成樹脂中に導電性粒子を散在させてなることを特徴とする請求項1に記載の集電体。The current collector according to claim 1, wherein the front and back conductive resin layers are formed by dispersing conductive particles in a synthetic resin. 金属箔の表面に多数の貫通孔が形成された表側導電性樹脂層を積層一体化すると共に、金属箔の裏面に裏側導電性樹脂層を積層一体化して積層シートを製造した後、この積層シートにおける表側導電性樹脂層の貫通孔を通じて上記金属箔をエッチング処理し、この金属箔に上記裏側導電性樹脂層に達する貫通孔を貫設することを特徴とする集電体の製造方法。After laminating and integrating the front-side conductive resin layer having a large number of through holes formed on the surface of the metal foil, and laminating and integrating the back-side conductive resin layer on the back surface of the metal foil, the laminated sheet is manufactured. 3. The method for producing a current collector according to claim 1, wherein said metal foil is etched through a through hole of said front conductive resin layer, and a through hole reaching said back conductive resin layer is formed in said metal foil.
JP2002261242A 2002-09-06 2002-09-06 Current collector and manufacturing method thereof Expired - Fee Related JP4267279B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009238924A (en) * 2008-03-26 2009-10-15 Fuji Heavy Ind Ltd Method of manufacturing electrode
WO2011122239A1 (en) 2010-03-31 2011-10-06 東洋アルミニウム株式会社 Metal foil for negative electrode collector
KR102092240B1 (en) * 2018-09-19 2020-03-23 한국제이씨씨(주) Porous current collector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009238924A (en) * 2008-03-26 2009-10-15 Fuji Heavy Ind Ltd Method of manufacturing electrode
WO2011122239A1 (en) 2010-03-31 2011-10-06 東洋アルミニウム株式会社 Metal foil for negative electrode collector
KR102092240B1 (en) * 2018-09-19 2020-03-23 한국제이씨씨(주) Porous current collector

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