JP2004096106A - Base pattern formation material for absorbing electrode/wiring material, electrode/wiring forming method, and manufacturing method of image forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To use an aqueous solution of which the handling is easy and the load to an environment is small to easily form an adhesive fine electrode or wiring pattern, thereby improving the stability of a process when used for the manufacturing process of an image forming device. <P>SOLUTION: A base pattern is formed by using a base pattern forming material for absorbing an electrode/wiring material which is a aqueous solution containing a water-soluble metal compound comprising a water-soluble photosensitive resin component, rhodium, bismuth, ruthenium, vanadium, chromium, tin, copper or silicon, and an electrode and wiring are formed by absorbing an organic metal compound into the base pattern and by sintering the same. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to an electrode / wiring material absorbing base pattern forming material used for forming electrodes and wiring, an electrode / wiring forming method using the electrode / wiring material absorbing base pattern forming material, and an electrode / wiring forming method. The present invention relates to a method for manufacturing an image forming apparatus used.

2. Description of the Related Art Conventionally, as a method of forming electrodes and wirings on a substrate, (1) a method of applying a paste containing a conductive material on a substrate by using a screen printing method, and drying and firing the paste (for example, Patent (2) Transfer method (for example, see Patent Document 2), (3) A metal-containing solution is applied to the entire surface of the substrate, dried and fired to form a metal film, and a photoresist or the like is formed. A method in which a predetermined region is covered with a mask and a portion not covered with the mask is removed by etching. (4) A photosensitive material is applied to a metal-containing paste, a desired portion is exposed, and then developed and formed. Method (for example, see Patent Documents 3 and 4), (5) using a coating material containing a water-soluble photosensitive resin, a water-soluble organic metal compound, and an aqueous solvent, coating, drying, exposing, developing, and firing. Method of forming (eg, patent Document 5 reference), and the like are known.

JP-A-8-185818 JP-A-8-236017 JP-A-5-114504 JP-A-8-176177 JP 20012977639 A

However, the method (1) is difficult to apply to fine electrodes and wiring patterns, and the method (2) also has insufficient film thickness uniformity and reproducibility. The method (3) requires the use of a strong acid at the time of etching, particularly when the electrodes and wiring patterns are made of a noble metal such as platinum, because the resist is attacked and the insulating substrate is corroded. It is difficult to form a fine circuit. In addition, since the method (4) uses an organic solvent, explosion-proof equipment is required during the coating, drying, and baking steps, and care must be taken in handling the chemicals used. Since an organic solvent is used, there is a problem of a large environmental load.

On the other hand, the method (5) has an advantage that a fine electrode or a wiring pattern can be easily formed by an aqueous solution using an aqueous solvent that is easy to handle and has a small environmental load. There is a problem that the water-soluble organometallic compound is discarded and the cost increases.

Therefore, the present applicant has made a resin pattern formed of a water-soluble photosensitive resin absorb an aqueous solution of an organometallic compound, and then sinters the resin pattern that has absorbed the aqueous solution of the organometallic compound to form electrodes and wiring. Was previously provided as JP-A-2003-031922.

By the way, according to the above method, fine electrodes and wiring patterns can be formed easily and at low cost without imposing a large environmental load, but the adhesion to the substrate may be insufficient. For this reason, when the above method is used for forming electrodes and wirings of an image forming apparatus, when the ultrasonic cleaning is performed during the manufacturing process, the electrodes and wiring patterns sometimes peel off, and the manufacturing process becomes unstable. There is.

The present invention has been made in view of such a problem, and uses an aqueous solution that is easy to handle and has a small environmental load, and enables easy formation of fine electrodes and wiring patterns with good adhesion, thereby improving image quality. An object of the present invention is to improve the stability of a forming apparatus when used in a manufacturing process.

To achieve the above object, a first aspect of the present invention is a base pattern forming material for absorbing an electrode / wiring material, which is an aqueous solution containing a water-soluble photosensitive resin component and a water-soluble metal compound. Is provided.

A second aspect of the present invention is a base pattern forming step of forming a base pattern on a substrate, an absorption step of absorbing an organic metal compound in the base pattern, and a firing step of firing the base pattern having absorbed the organic metal compound. Wherein the underlayer pattern forming step comprises a step of applying a water-soluble photosensitive resin containing a photosensitive resin component and a water-soluble metal compound on the substrate, and a step of exposing. An object of the present invention is to provide an electrode / wiring forming method.

According to a third aspect of the present invention, there is provided a method of manufacturing an image forming apparatus including a plurality of electron-emitting devices and an image-forming member for forming an image by irradiating an electron beam emitted from the electron-emitting devices. The present invention provides a method for manufacturing an image forming apparatus, characterized in that one or both of them are formed by the second method of the present invention.

The present invention has the following effects.

(1) It is possible to improve the film quality of the electrode pattern and further improve the adhesion, eliminate defects such as film peeling, and form electrodes and wirings at low cost.

(2) Since an organic metal compound (preferably a metal complex having a specific ligand) can be selectively absorbed in a target pattern portion, the use efficiency of the material is significantly improved.

(3) The electrodes and wirings can be formed at low cost by improving the use efficiency.

Hereinafter, the electrode / wiring material absorbing base pattern forming material according to the first embodiment of the present invention, the electrode / wiring forming method according to the second embodiment of the present invention, and the method for manufacturing an image forming apparatus according to the third embodiment of the present invention will be further described in this order. I do.

(1) Electrode and Wiring Material Absorbing Underlayer Pattern Forming Material The electrode and wiring material absorbing underlayer pattern forming material according to the first aspect of the present invention (hereinafter referred to as “underlying material”) comprises a water-soluble photosensitive resin component and rhodium. And a water-soluble metal compound containing bismuth, ruthenium, vanadium, chromium, tin, lead or silicon.

(4) As the photosensitive resin component, a water-soluble resin component can be widely used, but it is preferable to select a resin that does not easily react with the added water-soluble metal compound to form a precipitate or cause gelation.

As the photosensitive resin component, even if the photosensitive resin component has a photosensitive group in the resin structure, a photosensitive agent is mixed with the resin such as a cyclized rubber-bisazide-based resist (cyclorubber-bisazide-based-photoresist). It may be of the type. In any type of photosensitive resin component, a photoreaction initiator or a photoreaction inhibitor can be appropriately mixed.

感光 As the photosensitive resin component used in the present invention, for example, a polyvinyl alcohol-based resin or a polyvinylpyrrolidone-based resin is preferable because good water solubility is easily obtained. Further, even if the coating film soluble in the developing solution is insolubilized in the developing solution by light irradiation after dissolving in a water-based solvent to be described later and then dried (negative type), the coating film insoluble in the developing solution is irradiated with light. (Positive type) solubilized in a developing solution.

The water-soluble metal compound contained together with the water-soluble photosensitive resin component contains rhodium, bismuth, ruthenium, vanadium, chromium, tin, lead or silicon as a metal component, and is formed by firing described below. It functions to improve the adhesion between the electrode / wiring pattern and the substrate. As the metal compound, a water-soluble metal salt containing rhodium, bismuth, ruthenium, vanadium, chromium, tin, lead or silicon, an organic metal compound, or a complex can be used.

(4) The mixing ratio of the metal compound to the photosensitive resin component is preferably 1.0% by weight or more and 20% by weight or less. If the compounding ratio of the metal compound is too large, it is difficult to obtain an electrode / wiring base having a fine pattern, and if the compounding ratio is too small, it is difficult to obtain sufficient adhesion of the obtained electrode / wiring pattern.

下地 The base material according to the first aspect of the present invention is an aqueous solution using an aqueous solvent. Here, the aqueous solvent refers to a solvent containing 50% by weight or more of water. The aqueous solvent is used in an amount of less than 50% by weight, for example, a solvent in which a lower alcohol such as methyl alcohol or ethyl alcohol is added to increase the drying speed, or the dissolution promotion or stability of the above-mentioned photosensitive resin component or metal compound. A component for improving the composition can be added. However, from the viewpoint of reducing the environmental load, the water content is preferably 70% by weight or more, more preferably 90% by weight or more, and most preferably all water.

The underlayer material according to the first aspect of the present invention is such that the underlayer pattern formed in the underlayer pattern forming step described below can absorb an aqueous solution of an organometallic compound described below, Those containing a photosensitive resin component capable of forming an ion-exchangeable base pattern by reacting with a metal component are preferable. By forming this ion-exchange base pattern, the absorption step described later can be made into an ion-exchange absorption step, improving the absorption of the metal component in the organometallic compound component and increasing the material utilization efficiency. Further, an electrode / wiring pattern having a more uniform shape can be formed. As the ion-exchangeable photosensitive resin component, those having a carboxylic acid group are preferable because they are particularly preferable in terms of controlling the shape of the pattern.

(2) Method for forming electrodes and wirings The method for forming electrodes and wirings according to the second aspect of the present invention includes the following base pattern forming steps (coating step, drying step, exposure step, developing step), absorption step, and The cleaning process and the firing process can be performed.

(2-1) Coating Step The coating step is a step of coating the above-described base material on an insulating substrate on which electrodes and / or wirings are to be formed.

The application of the base material can be performed using various printing methods (screen printing, offset printing, flexographic printing, etc.), spinner method, dipping method, spray method, stamp method, rolling method, slit coater method, inkjet method, and the like. .

(2-2) Drying Step The drying step is a step of drying the coating film by volatilizing the aqueous solvent contained in the base material applied on the substrate in the coating step. Drying of the coating film can be performed at room temperature, but is preferably performed under heating in order to shorten the drying time. The heat drying can be performed using, for example, a windless oven, a drier, a hot plate, or the like, and can be generally performed by placing the film at a temperature of 50 to 100 ° C. for 1 to 30 minutes.

(2-3) Exposure Step The exposure step is a step of exposing the coating film on the substrate, which has been dried in the drying step, along a predetermined electrode and / or wiring pattern.

範 囲 The range of exposure by light irradiation in this exposure step differs depending on whether the photosensitive resin used is a negative type or a positive type. In the case of a negative type which is insolubilized in a developing solution by light irradiation, light is irradiated to a region to be an electrode and / or a wiring (one or both of the electrode and the wiring) and exposed, but the light is solubilized in the developing solution. In the case of the positive type, contrary to the negative type, a region other than a region to be an electrode and / or wiring is irradiated with light to be exposed. The selection of the light-irradiated region and the non-irradiated region can be performed in the same manner as in a method of forming a mask using a normal photoresist.

(2-4) Developing Step In the developing step, the coating film exposed in the above-described exposure step is removed of a coating film in a region other than a region where a desired electrode and / or wiring is to be formed, and the electrode and / or wiring pattern is formed. This is a step of forming a base pattern along the line.

When the photosensitive resin is of a negative type, the coating film that has not been irradiated with light is soluble in the developing solution, and the coating film on the exposed portion that has been irradiated with light is insoluble in the developing solution. The development can be performed by dissolving and removing the coating film of the light irradiation part with a developer. In addition, when the photosensitive resin is a positive type, the coating film that has not been irradiated with light is insoluble in the developing solution, and the coating film on the exposed portion that has been irradiated with light is solubilized in the developing solution. Developing can be performed by dissolving and removing the solubilized light-irradiated coating film with a developer.

現 像 As the developer, the same one as the above-mentioned aqueous solvent can be used.

(2-5) Absorption Step The absorption step is a step of absorbing the organometallic compound into the underlying pattern formed through the above steps.

The absorption of the organometallic compound can be carried out by bringing the aqueous pattern of the organometallic compound into contact with the base pattern and allowing the base pattern to absorb the aqueous solution. This absorption can be performed by any method, such as a dipping method and a spin coating method, as long as the aqueous solution of the organic metal compound can be contact-absorbed to the underlying pattern.

As the organometallic compound, a compound having the same water-solubility as soluble in the same aqueous solvent as described above and capable of forming a metal film by a firing step described later is used. Specifically, for example, complexes of gold, platinum, silver, palladium, copper and the like can be mentioned. Among these, a platinum complex is particularly preferably used because an extremely stable electrode and / or wiring is easily obtained. The complex is preferably a complex whose ligand is a nitrogen-containing compound. In particular, for example, a complex in which a ligand is constituted by one or more of nitrogen-containing compounds having 8 or less carbon atoms, such as alcoholamines such as ethanolamine, propanolamine, isopropanolamine and butanolamine, serinol, TRIS, etc. More preferred.

程度 The degree of absorption of the organometallic compound depends on the contact time with the aqueous solution, the concentration of the organometallic compound in the aqueous solution, the absorption capacity of the underlying pattern, and the like, but can be appropriately selected. In addition, before the contact with the aqueous solution of the organometallic compound, the base pattern can be immersed in water or the like to facilitate absorption of the aqueous solution of the organometallic compound.

(2-6) Cleaning Step In the cleaning step, after the aqueous solution of the organometallic compound is absorbed in the underlying pattern, the excess aqueous solution attached to the underlying pattern or the excess aqueous solution attached to a portion other than the underlying pattern is used. This is the step of removing the solution.

This cleaning step uses a cleaning liquid similar to the aqueous solvent in the aqueous solution of the organometallic compound, and immerses the substrate on which the base pattern is formed in the cleaning liquid, or sprays the cleaning liquid on the base on which the base pattern is formed. And so on. The washing step can also be performed by sufficiently shaking off excess aqueous solution by, for example, blowing air or vibrating.

(2-7) Firing Step In the firing step, the underlying pattern (the coating film of the light-irradiated portion in the negative type and the coating film of the non-light-irradiated portion in the positive type) having undergone the absorption step is fired to decompose the organic components in the underlying pattern. This is a step of removing and forming a film of a metal contained as an organometallic compound component.

When the metal film to be formed is a noble metal film, the firing can be performed in the air. However, when the metal film is easily oxidized such as copper or palladium, the firing is performed in a vacuum or deoxygenated atmosphere (for example, nitrogen or the like) Under an inert gas atmosphere).

The baking can be performed by placing the baking at a temperature of 400 ° C to 600 ° C for several minutes to several tens of minutes, although it varies depending on the kind of the organic component contained in the base pattern. The firing can be performed, for example, in a hot air circulation furnace or the like. By this baking, a metal film can be formed on the substrate in a shape along a predetermined electrode and / or wiring pattern.

(4) Method of Manufacturing Image Forming Apparatus The above-described electrode / wiring forming method of the present invention includes a plurality of electron-emitting devices and an image-forming member that forms an image by irradiating an electron beam emitted from the electron-emitting devices. The present invention can be suitably used for a method of manufacturing an image forming apparatus provided. That is, by forming one or both of the electrode and the wiring in the image forming apparatus by the electrode / wiring forming method of the present invention, it is possible to greatly simplify the manufacturing process.

Examples of the electron-emitting device used in the image forming apparatus to be manufactured include a surface conduction electron-emitting device, a field emission (FE) electron-emitting device, and a metal / insulating layer / metal-type (MIM) electron-emitting device. Of these, a cold cathode device is preferred, and among these, a surface conduction electron-emitting device in which device electrodes are easily formed at once by the electrode / wiring forming method of the present invention is preferred. Further, according to the electrode / wiring forming method of the present invention, it is possible to form the wiring necessary for driving each electron-emitting device simultaneously with the device electrode.

画像 The image forming apparatus in the present invention includes, for example, a printer and a copy in addition to a television receiver and a computer display, for example. For example, in the case of a television receiver or a computer display, a phosphor that emits light by irradiation with an electron beam can be used as an image forming member.For example, in the case of a printer or a copy, a latent image can be formed by irradiation of an electron beam as an image forming member. May be used.

Hereinafter, the present invention will be described in more detail with reference to examples, but the examples do not limit the present invention.

Example 1
An aqueous solution of a metal compound (lead acetate) (lead content 1% by weight) and a photosensitive resin component (polyvinyl alcohol containing sodium 4,4′-diazidostilbene-2,2′-disulfonate as a sensitizer) The aqueous solutions were mixed at the following ratio to prepare a base material 1-A.

Metal compound: 10 parts by weight Photosensitive resin component resin: 90 parts by weight (including 10 parts by weight of photosensitive agent)

下地 This base material 1-A was applied to the entire surface of a glass substrate (75 mm × 75 mm × thickness 2.8 mm) with a spin coater, and dried at 80 ° C. for 2 minutes on a hot plate. The thickness of the coating film after drying was 1.34 μm.

Next, using a negative photomask, the coating film was exposed for an exposure time of 30 seconds using an ultrahigh pressure mercury lamp (illuminance = 8.0 mW / cm2) as a light source while maintaining a gap of 30 μm. After the exposure, pure water was used as a developing solution, and the substrate was treated by dipping for 30 seconds to obtain a base pattern patterned into a target pattern.

基板 After the substrate on which the base pattern was formed was immersed in pure water for 30 seconds, it was immersed in an aqueous solution of a tetraplatinum monoethanolamine complex (platinum content: 1% by weight) for 60 seconds. At this time, the aqueous solution was stirred with a stirrer so that the stirring speed was 0.1 m / sec on the underlying pattern.

Thereafter, the substrate was lifted, washed with running water for 5 seconds, drained with air, and dried on a hot plate at 80 ° C. for 3 minutes.

(5) Thereafter, firing was performed at 500 ° C. for 30 minutes in a hot air circulating furnace to form a platinum electrode having a distance between electrodes of 20 μm, a width of 60 μm, a length of 120 μm, and a thickness of 20 nm.

シ ー ト The sheet resistance of this electrode was 200Ω / □.

Furthermore, as a result of performing a tape peeling test to measure the adhesion, no peeling of the electrode pattern was observed, which was favorable.

Thereafter, an image forming apparatus was manufactured using this electrode pattern forming method, but no peeling of the electrode pattern was observed even when ultrasonic waves were applied in the cleaning step.

Comparative Example 1
A glass substrate was prepared by adding a solution obtained by adding 0.06% by weight of an amine silane coupling agent ("KBM-603" manufactured by Shin-Etsu Chemical) to a photosensitive resin ("Sanresiner BMR-850" manufactured by Sanyo Kasei). (75 mm × 75 mm × thickness 2.8 mm) was applied over the entire surface by a spin coater, and dried at 45 ° C. for 2 minutes on a hot plate.

Then, using a negative photomask, the light source was brought into contact with the substrate and the mask with an ultra-high pressure mercury lamp (illuminance: 8.0 mW / cm2), and after exposure for 2 seconds, pure water was used as a developing solution. This was treated by dipping for 30 seconds to obtain a target resin pattern. The thickness of the resin pattern was 1.55 μm.

基板 The substrate on which the resin pattern was formed was immersed in pure water for 30 seconds, and then immersed in a tetraplatinum monoethanolamine complex solution (platinum content 1% by weight) for 60 seconds.

Thereafter, the substrate was pulled up, washed with running water for 5 seconds, drained with air, and dried on a hot plate at 80 ° C. for 3 minutes.

(5) Thereafter, firing was performed at 500 ° C. for 30 minutes in a hot air circulating furnace to form a platinum electrode having a distance between electrodes of 20 μm, a width of 60 μm, a length of 120 μm, and a thickness of 20 nm.

シ ー ト The sheet resistance of this electrode was 45Ω / □.

Furthermore, as a result of performing a tape peeling test to measure the adhesion, the electrode pattern was peeled in a part of the substrate because the adhesion of the electrode pattern was unstable.

Thereafter, an image forming apparatus was manufactured using this electrode pattern forming method. When ultrasonic waves were applied in the cleaning step, peeling was observed in some of the electrode patterns.

Example 2
An image forming apparatus was manufactured using the electrode / wiring forming method of the present invention. Hereinafter, the manufacturing procedure will be described with reference to FIGS.

Step 1: A large number of device electrode pairs were formed on a glass substrate 1 having a size of 300 mm × 300 mm × thickness 2.8 mm in the same manner as in Example 1.

素 子 The device electrode pair in the present example was such that a device electrode A having a width of 60 μm and a length of 480 μm was opposed to a device electrode B having a width of 120 μm and a length of 200 μm with a gap between the electrodes of 20 μm. The pitch between the element electrode pairs was 300 μm in the horizontal direction and 650 μm in the vertical direction, and the number of element electrode pairs was 720 × 240, and they were arranged in a matrix. The sheet resistance of a 1 cm × 1 cm platinum film pattern formed simultaneously with the formation of the device electrode pair was 26 Ω / □.

{Circle around (2)} Step 2: An X-directional wiring 2 for connecting one of the device electrodes A of the device electrode pair in each column was provided by a screen printing method. Next, an interlayer insulating layer (not shown in the drawing) having a thickness of 20 μm is provided by a screen printing method, and further, a Y-directional wiring 3 for connecting one of the device electrodes B of the device electrode pair of each row is formed by X. It was attached in the same manner as the directional wiring 2 and baked to form an X directional wiring 2 and a Y directional wiring 3.

Step 3: The substrate 1 on which the X-directional wiring 2 and the Y-directional wiring 3 were formed in the step 2 was washed with pure water.

Step 4: Palladium acetate-monoethanolamine complex is added in an aqueous solution in which polyvinyl alcohol is dissolved at a concentration of 0.05% by weight, 2-propanol at a concentration of 15% by weight, and ethylene glycol at a concentration of 1% by weight to a concentration of about 0.15% by weight of palladium. % To give a pale yellow aqueous solution.

Drops of the aqueous solution were applied to the same location four times by ink-jet method so as to be applied from the device electrodes A and B forming each device electrode pair to the electrode gap between the device electrodes A and B. (Dot diameter = about 100 μm).

The substrate 1 provided with the aqueous solution droplets is fired in a firing furnace at 350 ° C. for 30 minutes to form a palladium thin film 4 between each of the device electrode pairs, which connects between the device electrodes A and B forming the device electrode pair. After that, the substrate 1 was fixed to the rear plate 5.

Step 5: A face plate 10 in which a fluorescent film 8 and a metal back 9 are formed on an inner surface of a glass substrate 7 and the rear plate are faced to each other and sealed via a support frame 6 to form an envelope 11. did. A supply / exhaust pipe used for air passage / exhaust was previously bonded to the support frame 6.

Step 6: After evacuating the inside of the envelope to 1.3 × 10 −5 Pa through the supply / exhaust pipe, X-direction terminals Dx1 to Dxn connected to each X-direction wiring 2 and Y-direction terminals connected to each Y-direction wiring 3 Using Dy1 to Dyn, a voltage is applied between the pair of device electrodes in each row, forming is performed for each line to generate a crack of several tens of μm in the palladium thin film 4 between the device electrodes A and B, and surface conduction electron emission is performed. An element was formed.

Step 7: After evacuating the inside of the envelope 11 to 1.3 × 10 −5 Pa, benzonitrile is introduced from the supply / exhaust pipe until the inside of the envelope 11 reaches 1.3 × 10 −2 Pa, and the same as the above-described forming. Then, a pulse voltage was supplied between each element electrode pair to activate carbon deposits in the cracks of the palladium thin film. The pulse voltage was applied to each line for 25 minutes.

Step 8: After sufficiently exhausting the inside of the envelope 11 from the supply / exhaust pipe, further exhausting while heating the entire envelope 11 at 250 ° C. for 3 hours. Finally, the getter is flushed and the supply / exhaust pipe is closed. Sealed.

In this way, a display panel as shown in FIG. 2 was manufactured, and a driving circuit including a scanning circuit, a control circuit, a modulation circuit, a DC voltage source, and the like (not shown) were connected to manufacture a panel-shaped image forming apparatus. .

By applying a predetermined voltage to each of the surface conduction electron-emitting devices in a time-division manner through the X-direction terminals Dx1 to Dxn and the Y-direction terminals Dy1 to Dyn, and applying a high voltage to the metal back 9 through the high-voltage terminal 12, Could be displayed with good image quality.

FIG. 9 is a schematic diagram of an electrode pattern formed in Example 2. FIG. 8 is a schematic diagram illustrating a display panel portion of the image forming apparatus manufactured in the second embodiment.

Explanation of reference numerals

A element electrode B element electrode Dx1 to Dxn X direction terminal Dy1 to Dyn Y direction terminal 1 substrate 2 X direction wiring 3 Y direction wiring 4 palladium thin film 5 rear plate 6 support frame 7 substrate 8 fluorescent film 9 metal back 10 face plate 11 outside Enclosure 12 High voltage terminal

Claims (9)

A base pattern forming step of forming a base pattern on a substrate, an absorption step of absorbing the organic metal compound in the base pattern, and a baking step of firing the base pattern having absorbed the organic metal compound, the base pattern The method for forming an electrode / wiring comprises forming a photosensitive resin containing a water-soluble photosensitive resin component and a water-soluble metal compound on the substrate, and exposing the substrate to light. An underlayer pattern forming material for absorbing electrode / wiring material, which is an aqueous solution containing a water-soluble photosensitive resin component and a water-soluble metal compound. 3. The electrode / wiring forming method or electrode / wiring material absorption according to claim 1, wherein a ratio of the water-soluble metal compound to the photosensitive resin component is 1.0% by weight or more and 20% by weight or less. Base pattern forming material. The electrode or wiring forming method or the electrode according to claim 1, wherein the water-soluble metal compound is a water-soluble metal compound containing rhodium, bismuth, ruthenium, vanadium, chromium, tin, lead, and silicon. Underlayer pattern forming material for wiring material absorption. 4. The method according to claim 1, wherein the organometallic compound is a complex and the ligand is a nitrogen-containing compound. 6. The method according to claim 5, wherein the nitrogen-containing compound is a nitrogen-containing compound having 8 or less carbon atoms. 4. The method according to claim 1, wherein the organometallic compound is a platinum complex. The electrode / wiring forming method or the electrode / wiring material absorbing base pattern forming material according to claim 3, wherein the water-soluble photosensitive resin component is a polyvinyl alcohol-based resin or a polyvinylpyrrolidone-based resin. In a method of manufacturing an image forming apparatus, comprising: a plurality of electron-emitting devices; and an image forming member that forms an image by irradiating an electron beam emitted from the electron-emitting devices, wherein one or both of the electrodes and the wiring are charged. Item 4. A method for manufacturing an image forming apparatus formed by the method according to Item 1 or 3.

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